CN214625042U - Static self-luminous module - Google Patents

Abstract

The utility model discloses a static self-luminous module, which comprises a PCB board and a plurality of luminous modules; the plurality of light emitting modules are arranged on the PCB and are in conductive connection with the PCB, and each light emitting module comprises a bracket, a driving IC and a plurality of LEDs; this support sets up on the PCB board, the support has a encapsulation space, be provided with the baffle on this support and separate a plurality of holding chambeies of formation with the encapsulation space, each light-emitting module of this product all embeds drive IC, integrate circuit more than 80% inside the module, simplify the degree of difficulty of design and circuit layout greatly, drive IC and a plurality of LED encapsulate simultaneously in the encapsulation space, reduce drive IC and expose the risk by electrostatic breakdown easily in the air, and the line of walking on the reducible PCB board, thereby reduce circuit parasitic capacitance, parasitic inductance is to the interference of circuit, each light-emitting module is solitary maintenance module simultaneously, maintainability is high, and is low in cost, bring convenience for the use.

Description

Static self-luminous module

Technical Field

The utility model belongs to the technical field of the LED technique and specifically relates to indicate a static self-luminous module.

Background

The driving mode of the LED display screen is also called as a scanning mode, which refers to the ratio of the number of lines simultaneously lit to the number of lines in the whole area in a certain display area, and is mainly divided into two modes, namely static driving and dynamic driving. The static drive is to carry out point-to-point control from the output of the drive IC to the pixel point, and the static drive does not need a control circuit, so that the cost is higher than that of the dynamic drive, but the static drive has the advantages of good display effect, good stability, small brightness loss and the like. The dynamic driving is to control the point-to-column between the output of the driving IC and the pixel point, and the dynamic driving needs a control circuit, which is lower in cost than the static driving, but has poor display effect and large brightness loss.

The display screen is formed by splicing a plurality of display modules, the display modules are formed by connecting a plurality of display units in a transverse or longitudinal mode, and each display unit adopts a line-cascade or column-cascade driving mode, so that a driving chip of the display unit can adopt a driving chip with an ultra-small packaging volume, the display units do not need to be scanned and driven one by one, the static driving of the display units is realized, and the display brightness of the screen is improved.

At present, most display units are packaged devices including LED light emitters and driving ICs. With the reduction of the pixel pitch of the LED display screen, the number of packaged devices per unit area is increasing, so that the percentage of packaged devices in the cost of the whole screen is increasing. As long as the density is improved by one level, the increase of the requirement of the lamp beads is improved by about 50 percent. The full-color lamp pearl that present booth apart from adopting mainly is single form, because quantity is huge during the application, and production efficiency is low, appears the quality problem simultaneously easily. And because lamp pearl quantity is huge, before carrying out surface mounting, the design of PCB board will be more complicated, leads to production efficiency further to reduce.

In order to improve the production efficiency and reduce the production cost, the prior art provides an integrated IC surface-mounted RGB-LED package module, specifically, a metal base plate is made into a conductive circuit by etching or stamping, glue is wrapped on the metal base plate by a molding press, a support electrode for die bonding and wire bonding and a position for welding an IC driving module are reserved to form a package support, metal is plated on the package support, an RGB LED chip is die bonded on the support electrode, wire bonding is performed to form physical electrical connection, the IC driving module is welded, then a protective layer is injected on a light emitting unit, and the light emitting unit is cut into single package modules by a cutting machine; the packaging module is mounted on a PCB (printed circuit board), an RGB LED display screen is further manufactured, the light-emitting unit comprises an RGB LED chip fixed on the metal bottom plate, keys and wires for connecting the RGB LED chip and a support electrode, and a protective layer on the RGB LED chip, the keys and the wires for connecting the RGB LED chip and the support electrode, and the packaging module is provided with a plurality of light-emitting units and a common IC (integrated circuit) driving module.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present invention is directed to the deficiency of the prior art, and the main objective of the present invention is to provide a static self-luminous module, which can effectively solve the problems of high complexity, difficult maintenance and high cost of the existing LED lamp.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a static self-luminous module comprises a PCB and a plurality of luminous modules; the plurality of light emitting modules are arranged on the PCB and are in conductive connection with the PCB, and each light emitting module comprises a bracket, a driving IC and a plurality of LEDs; the support is arranged on the PCB and provided with a packaging space, a partition board is arranged on the support to separate the packaging space into a plurality of accommodating cavities, the drive IC card is arranged between the partition boards and located in the packaging space, the drive IC is not higher than the packaging space, the drive IC is arranged on the support and is in conduction connection with the PCB, the LEDs are arranged on the support and are located in the corresponding accommodating cavities, each LED is in conduction connection with the drive IC, and the drive IC and the LEDs are packaged in the packaging space at the same time.

As a preferable scheme, the driving IC is located at the center of the package space, the number of the partition boards is four, the four partition boards partition the package space to form four accommodating cavities, correspondingly, the number of the LEDs is four, the LEDs are respectively located in the four accommodating cavities, and the driving IC card is placed between the four partition boards.

Preferably, the LEDs are full-color LEDs, and the driver IC controls R, G, B data for each full-color LED.

Preferably, the light emitting module is attached to the surface of the PCB.

As a preferable scheme, a plurality of conductive circuits are arranged in the support, and each LED is connected with the driving IC through a corresponding conductive circuit.

Compared with the prior art, the utility model obvious advantage and beneficial effect have, particularly, can know by above-mentioned technical scheme:

each light emitting module of this product all embeds driver IC, inside more than 80% circuit integration to the module, simplify design and circuit layout's the degree of difficulty greatly, driver IC and a plurality of LED encapsulate in the encapsulation space simultaneously, reduce driver IC and expose the risk of being punctured by the static easily in the air, and the line of walking on the reducible PCB board, thereby reduce circuit parasitic capacitance, parasitic inductance is to the interference of circuit, each light emitting module is solitary maintenance module simultaneously, maintainability is high, low cost, bring the facility for the use, furthermore, the chip that this product static control realized is to the point-to-point control of fluorescent tube, the colourity of each lamp can be controlled alone, luminance, promote the display effect, the influence to other fluorescent tubes that conventional display screen caused because the fluorescent tube damages has been avoided, and then influence the display effect.

To illustrate the structural features and functions of the present invention more clearly, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.

Drawings

FIG. 1 is a schematic view of the internal links of the preferred embodiment of the present invention;

FIG. 2 is a schematic diagram of a package according to a preferred embodiment of the present invention;

FIG. 3 is a schematic diagram of a preferred embodiment of the present invention;

FIG. 4 is a schematic diagram of the data signal and clock signal in a preferred embodiment of the present invention;

FIG. 5 is a schematic diagram of a control circuit according to a preferred embodiment of the present invention;

FIG. 6 is an internal block diagram of the preferred embodiment of the present invention;

fig. 7 is a schematic diagram of the arrangement of the pins after sealing in the preferred embodiment of the present invention.

The attached drawings indicate the following:

10. PCB (printed circuit board) 20 and light-emitting module

21. Support 211 and conductive circuit

22. Driver IC 23 and LED

24. Partition 201, enclosure space

2011. An accommodating cavity.

Detailed Description

Referring to fig. 1 to 7, a specific structure of a preferred embodiment of the present invention is shown, which includes a PCB 10 and a plurality of light emitting modules 20.

The plurality of light emitting modules 20 are all arranged on the PCB 10 and are in conductive connection with the PCB 10, and each light emitting module 20 comprises a bracket 21, a driving IC22 and a plurality of LEDs 23; the bracket 21 is arranged on the PCB 10, the bracket 21 has a packaging space 201, and the bracket 21 is provided with a partition plate 24 to partition the packaging space 201 into a plurality of accommodating cavities 2011; the driving IC22 card is disposed between the partitions 24 and located in the package space 201, the driving IC22 is not higher than the package space 201, the driving IC22 is disposed on the support 21 and is in conductive connection with the PCB 10, the LEDs 23 are disposed on the support 21 and are located in the corresponding accommodating cavities 2011, each LED23 is in conductive connection with the driving IC22, the driving IC22 and the LEDs 23 are simultaneously packaged in the package space 201, and the risk that the driving IC22 is easily subjected to electrostatic breakdown when exposed in the air is reduced.

In this embodiment, the light emitting module 20 is attached to the surface of the PCB 10, and has maintainability and controllability, so that the number of traces on the PCB 10 can be reduced, and the interference of the parasitic capacitance and the parasitic inductance of the circuit to the circuit can be reduced; the driving IC22 is located at the center of the package space 201, the number of the partition boards 24 is four, the four partition boards 24 partition the package space 201 to form four accommodating cavities 2011, correspondingly, the number of the LEDs 23 is four, the LEDs are respectively located in the four accommodating cavities 2011 to avoid light crosstalk, and the driving IC22 is clamped between the four partition boards 24; the LED23 is full-color LED, the drive IC22 controls R, G, B data of each full-color LED, and the selection of R, G, B signals is distinguished by data signals; and, a plurality of conductive traces 211 are disposed in the support 21, and each LED23 is electrically connected to the driving IC22 through the corresponding conductive trace 211.

Detailed description the working principle of the present embodiment is as follows:

when in use, the pins of the product are arranged as shown in fig. 7 after being sealed, the pin number "0" is GND which is used for grounding, the pins "1" and "2" are Din0 and Din1 which are communication input end ports respectively, and the pin "3" is VR which is a red lamp power supply end; the internal block diagram of the product is shown in fig. 6, and in the working process, as shown in fig. 4, a clock and data are combined into one input, a clock signal is sent first, and then a data signal is sent; and comparing the data signal with the clock signal by taking the clock signal as a standard, and controlling the output of the duty ratio. The product has 2 input ports, wherein Din0 is a main input port, Din1 is a backup input port, and Din1 is connected with the output of the previous stage circuit, as shown in fig. 5, when a certain circuit cannot normally communicate due to a fault, the normal operation of the circuit connected in series thereafter is not influenced.

The utility model discloses a design focus lies in: each light emitting module of this product all embeds driver IC, inside more than 80% circuit integration to the module, simplify design and circuit layout's the degree of difficulty greatly, driver IC and a plurality of LED encapsulate in the encapsulation space simultaneously, reduce driver IC and expose the risk of being punctured by the static easily in the air, and the line of walking on the reducible PCB board, thereby reduce circuit parasitic capacitance, parasitic inductance is to the interference of circuit, each light emitting module is solitary maintenance module simultaneously, maintainability is high, low cost, bring the facility for the use, furthermore, the chip that this product static control realized is to the point-to-point control of fluorescent tube, the colourity of each lamp can be controlled alone, luminance, promote the display effect, the influence to other fluorescent tubes that conventional display screen caused because the fluorescent tube damages has been avoided, and then influence the display effect.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.

Claims (5)

1. A static self-luminous module is characterized in that: the LED module comprises a PCB and a plurality of light emitting modules; the plurality of light emitting modules are arranged on the PCB and are in conductive connection with the PCB, and each light emitting module comprises a bracket, a driving IC and a plurality of LEDs; the support is arranged on the PCB and provided with a packaging space, a partition board is arranged on the support to separate the packaging space into a plurality of accommodating cavities, the drive IC card is arranged between the partition boards and located in the packaging space, the drive IC is not higher than the packaging space, the drive IC is arranged on the support and is in conduction connection with the PCB, the LEDs are arranged on the support and are located in the corresponding accommodating cavities, each LED is in conduction connection with the drive IC, and the drive IC and the LEDs are packaged in the packaging space at the same time.

2. The module of claim 1, wherein: the driving IC is located in the center of the packaging space, the number of the partition plates is four, the packaging space is divided by the four partition plates to form four containing cavities, correspondingly, the number of the LEDs is four, the LEDs are respectively located in the four containing cavities, and the driving IC card is arranged among the four partition plates.

3. The module of claim 1, wherein: the LEDs are full-color LEDs, and the driver IC controls R, G, B data for each full-color LED.

4. The module of claim 1, wherein: the luminous module is attached to the surface of the PCB.

5. The module of claim 1, wherein: a plurality of conductive circuits are arranged in the support, and each LED is connected with the drive IC in a conduction mode through the corresponding conductive circuit.

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