CN219591393U - Light-emitting substrate and display device - Google Patents
Light-emitting substrate and display device Download PDFInfo
- Publication number
- CN219591393U CN219591393U CN202320217967.XU CN202320217967U CN219591393U CN 219591393 U CN219591393 U CN 219591393U CN 202320217967 U CN202320217967 U CN 202320217967U CN 219591393 U CN219591393 U CN 219591393U
- Authority
- CN
- China
- Prior art keywords
- light
- chip
- substrate
- emitting
- lamp panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a light-emitting substrate and a display device, wherein the light-emitting substrate comprises a lamp panel and a chip packaging unit arranged on the lamp panel; the chip packaging unit comprises a substrate, an electrode wiring layer, a packaging layer and at least two light emitting chips, wherein the electrode wiring layer is arranged on the substrate; the light emitting chips are arranged on the substrate at intervals and are respectively connected with the electrode wiring layers; the packaging layer is arranged on the substrate and filled around the light-emitting chip; and a via hole is arranged in the packaging layer, a metal filling piece is arranged in the via hole, and the electrode wiring layer is connected with the lamp panel through the metal filling piece. According to the utility model, two or more light emitting chips are arranged on the substrate, and then the lamp panel is assembled by taking the chip packaging unit as a unit, so that the overall processing difficulty of the light emitting substrate is reduced, and the production yield is improved.
Description
Technical Field
The present utility model relates to the field of display technologies, and in particular, to a light emitting substrate and a display device.
Background
With the continuous development of the semiconductor industry, light-emitting diode (LED) chips are increasingly used, and the performance requirements of people on the light-emitting chips are higher. At present, the novel LED chip gradually has the advantages of small volume, high brightness, high contrast, high definition, strong reliability, quick response time, more energy conservation, lower power consumption and the like. In order to meet the requirements of the display screen such as the overall brightness, the uniformity of light and the like in actual use, the number of chips required in the actual manufacturing of the display screen is huge.
However, as the number of the LED chips arranged on the single display back plate is increased, although a better partition effect can be achieved and a better display effect is obtained, the difficulty of the processing technology in the manufacturing process of the display screen is increased, and the production yield of the product is affected.
Accordingly, the prior art is still in need of improvement and development.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present utility model aims to provide a light-emitting substrate, which aims to solve the problems that the number of light-emitting chips arranged on the existing display screen is increased, the processing difficulty is increased, and the production yield of products is affected.
The technical scheme of the utility model is as follows:
the utility model provides a luminous substrate, which comprises a lamp panel and a chip packaging unit arranged on the lamp panel; the chip packaging unit comprises a substrate, an electrode wiring layer, a packaging layer and at least two light emitting chips, wherein the electrode wiring layer is arranged on the substrate; the light emitting chips are arranged on the substrate at intervals and are respectively connected with the electrode wiring layers; the packaging layer is arranged on the substrate and filled around the light-emitting chip; and a via hole is arranged in the packaging layer, a metal filling piece is arranged in the via hole, and the electrode wiring layer is connected with the lamp panel through the metal filling piece.
Optionally, the light panel is divided into a wiring area and at least one transparent light emitting area, and the wiring area is arranged around each transparent light emitting area; the chip packaging units are arranged in one-to-one correspondence with the transparent light-emitting areas, and the chip packaging units emit light through the transparent light-emitting areas.
And one side of the packaging layer, which is far away from the substrate, of the light-emitting substrate is connected with the lamp panel.
Optionally, the chip packaging unit is provided with a plurality of, and a plurality of chip packaging unit arrays are arranged on the lamp panel.
Optionally, the substrate includes a sapphire substrate or a glass substrate.
Optionally, the electrode wiring layer includes a plurality of positive electrode wires and a common negative electrode wire, the negative electrode of each light emitting chip in the chip packaging unit is connected with the common negative electrode wire, and the positive electrode of each light emitting chip in the chip packaging unit is respectively connected with the positive electrode wires in a one-to-one correspondence.
Optionally, the light emitting chip is a blue light chip; or alternatively
The chip packaging unit comprises three light emitting chips, wherein the three light emitting chips are respectively a red light emitting diode chip, a blue light emitting diode chip and a green light emitting diode.
Optionally, the light emitting chip includes at least one of a Mini LED chip, a Micro LED chip, and an organic light emitting diode chip.
Optionally, the packaging layer comprises at least one of a silica gel layer, an epoxy resin layer and a polyurethane layer.
Optionally, the lamp panel comprises a transparent glass lamp panel or a transparent organic polymer lamp panel.
The utility model also provides a display device which comprises a display panel and the light-emitting substrate, wherein the display panel is arranged on the light-emitting side of the light-emitting substrate.
The light-emitting substrate disclosed by the utility model is provided with the lamp panel, the lamp panel is used for bearing the chip packaging unit, the circuit wiring is arranged on the lamp panel to supply power to the chip packaging unit, and the chip packaging unit emits light after being electrified and is used as a backlight source. Two or more than two light emitting chips are arranged in the chip packaging unit at intervals, and the light emitting chips are conducted to emit light through the electrode wiring layer. In the processing process, the chip packaging units are used as units to be arranged on the lamp panel, and the light emitting chips are not required to be arranged on the lamp panel one by one, so that the difficulty of arranging the lamp panel is reduced, the workload is reduced, the repair is easy, and the production yield and the production efficiency of the light emitting substrate are improved.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present utility model, and other drawings may be obtained according to the drawings without inventive effort to those skilled in the art.
FIG. 1 is a schematic diagram of a light-emitting substrate according to the present utility model;
fig. 2 is a bottom view of the chip package unit according to the present utility model.
Description of the drawings: 100-lamp panel; 110-a transparent light-emitting region; 120-wiring area; 200-a chip packaging unit; 210-a substrate; 220-electrode wiring layer; 221-positive electrode wiring; 222-sharing a negative electrode trace; 230-a light emitting chip; 240-encapsulation layer.
Detailed Description
In order to make the present utility model better understood by those skilled in the art, the following description will make clear and complete descriptions of the technical solutions of the embodiments of the present utility model with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1, in an embodiment of the present application, a light emitting substrate is disclosed, which includes a lamp panel 100 and a chip package unit 200 disposed on the lamp panel 100. In actual operation, the chip packaging unit 200 is mounted on the lamp panel 100, so that the circuit trace on the lamp panel 100 is contacted with the conductive terminal in the chip packaging unit 200, and the circuit is conducted. For example, the chip package unit 200 is mounted and fixed on the lamp panel 100 by performing processing on the basis of the lamp panel 100 by a surface mount technology (Surface Mounted Technology, abbreviated as SMT), performing steps of screen printing, dispensing, mounting, curing, and the like, and then is assembled by soldering by a reflow soldering or dip soldering method.
In this embodiment, the chip packaging unit 200 includes a substrate 210, an electrode wiring layer 220, a packaging layer 240, and at least two light emitting chips 230, where the electrode wiring layer 220 is disposed on the substrate 210; the light emitting chips 230 are arranged on the substrate 210 at intervals and are respectively connected with the electrode wiring layers 220; the encapsulation layer 240 is disposed on the substrate 210 and filled around the light emitting chip 230; the encapsulation layer 240 is provided with a via hole, a metal filler is disposed in the via hole, and the electrode wiring layer 220 is connected with the lamp panel 100 through the metal filler.
The light-emitting substrate disclosed in this embodiment is provided with a lamp panel 100 for carrying a chip packaging unit 200, and circuit traces arranged on the lamp panel 100 supply power to the chip packaging unit 200, and the chip packaging unit 200 emits light after being electrified, so as to be used as a backlight source. Two or more light emitting chips 230 are arranged in the chip packaging unit 200 at intervals, and are packaged by the packaging layer 240, and the light emitting chips 230 are conducted to emit light through the electrode wiring layer 220. In the processing process, the chip packaging unit 200 is used as a unit to be punched on the lamp panel 100, and the light emitting chips 230 are not required to be punched on the lamp panel 100 one by one, so that the difficulty of punching the lamp panel 100 is reduced, the workload is reduced, the repair is easy, and the production yield and the production efficiency of the light emitting substrate are improved.
In this embodiment, the package layer 240 is connected to the lamp panel 100 on a side away from the substrate 210. At this time, the electrode trace layer 220 is located at a side of the light emitting chip 230 facing away from the lamp panel 100, so that a metal filler is required for connection. After the light emitting chip 230 is mounted and the package layer 240 is filled, holes are punched in the package layer 240, and metal filling is performed to manufacture a metal filling member, so that the chip package unit 200 is conducted with the circuit wiring on the lamp panel 100, thereby stably supplying power and stably operating the light emitting substrate. Meanwhile, the packaging layer 240 wraps the metal filling member, so as to play a role in protection. In some embodiments, the chip package unit 200 is connected to the lamp panel 100 through a substrate 210, which is not limited herein.
As another implementation manner of this embodiment, it is disclosed that a plurality of the chip packaging units 200 are provided, and a plurality of the chip packaging units 200 are arranged in an array on the lamp panel 100. The plurality of chip packaging units 200 are arranged in an array manner, so as to make the brightness of the light emitted from each area on the lamp panel 100 tend to be consistent, and improve the uniformity of the light emitted, so as to enhance the display effect.
As one implementation of the present embodiment, the chip packaging unit 200 is disclosed as being disposed on the backlight surface of the lamp panel 100, and emits light toward the light emitting surface of the lamp panel 100; the chip packaging unit 200 is arranged on the backlight surface of the lamp panel 100, when light is emitted, the lamp panel 100 needs to pass through the lamp panel 100, the lamp panel 100 has a certain thickness, the transmission of light in the lamp panel 100 is different from the transmission in the air, the lamp panel 100 can be used as a layer of light-transmitting medium, the light-emitting uniformity of the chip packaging unit 200 is improved, and the whole light-emitting substrate can obtain better light-emitting effect.
As shown in fig. 1, the lamp panel 100 is divided into a routing area 120 and at least one transparent light-emitting area 110, and the routing area 120 is disposed around each transparent light-emitting area 110; the chip packaging units 200 are disposed in one-to-one correspondence to the transparent light-emitting areas 110, and the chip packaging units 200 emit light through the transparent light-emitting areas 110. The transparent light-emitting region 110 is provided to facilitate light emission, so that light emitted from the chip packaging unit 200 is emitted normally from the light-emitting surface of the lamp panel 100. The circuit traces of the lamp panel 100 are arranged in the trace area 120, so that the light beam emitted by the chip packaging unit 200 can be avoided, and the problem of light blocking is avoided.
The process flow of the chip packaging unit 200 is as follows: firstly, exposing and developing the substrate 210 to manufacture an electrode wiring layer 220; then, the light emitting chip 230 is mounted on the substrate 210 and connected with the electrode trace layer 220; then filling around the light emitting chip 230 to manufacture the encapsulation layer 240; finally, holes are punched on the top surface of the encapsulation layer 240, and conductive metal is filled as a metal filling member, so as to extend to the electrode wiring layer 220. When the chip packaging unit 200 is mounted on the lamp panel 100, both the surface of the light emitting chip 230 facing away from the substrate 210 and the surface of the packaging layer 240 facing away from the substrate 210 are in contact with the lamp panel 100, or the surface of the packaging layer 240 facing away from the substrate 210 is in contact with the lamp panel 100, and the circuit trace on the lamp panel 100 is conducted with the conductive metal filled in the packaging layer 240, so that the conduction with the electrode trace layer 220 is realized.
In this embodiment, when the chip packaging unit 200 is manufactured, the top surface of the packaging layer 240 is filled to be flush with the top surface of the light emitting chip 230, so that when the chip packaging unit 200 is connected with the lamp panel 100, the top surface of the light emitting chip 230 can be in close contact with the lamp panel 100, which is beneficial to obtaining a better light emitting effect. In other embodiments, the encapsulation layer 240 covers the light emitting chip 230, and is attached to the lamp panel 100 through the encapsulation layer 240.
As another implementation of this embodiment, the substrate 210 is disclosed to include a sapphire substrate or a glass substrate. The sapphire substrate has good stability, large hardness and long service life as a bearing structure; the glass substrate has good transparent effect, low manufacturing cost and easy obtainment.
In this embodiment, the sapphire substrate or the glass substrate may be used to carry the electrode trace layer 220, the light emitting chip 230, the packaging layer 240, etc., which is beneficial to manufacturing the chip packaging unit 200 with stable structure and good light emitting effect.
It should be noted that, in the present embodiment, the type of the substrate 210 is merely exemplified, but the scope of the present utility model is not limited thereto, and other types of substrates 210 are also intended to be within the scope of the present utility model as equivalents of the inventive concept as long as the technical effects disclosed herein can be achieved.
As shown in fig. 2, as another implementation manner of this embodiment, the electrode wiring layer 220 includes a plurality of positive electrode wirings 221 and a common negative electrode wiring 222, the negative electrode of each light emitting chip 230 in the chip packaging unit 200 is connected to the common negative electrode wiring 222, and the positive electrodes of each light emitting chip 230 in the chip packaging unit 200 are respectively connected to the positive electrode wirings 221 in a one-to-one correspondence manner. In this embodiment, a common negative electrode wire 222 is disposed and contacts with the negative electrode terminals of all the light emitting chips 230 at the same time, and is controlled by the same electrode signal after being connected in series; the positive electrode of each light emitting chip 230 is individually controlled by providing an individual lead wire, thereby improving the control capability of the local brightness of the display screen.
In this embodiment, the electrode wiring layer 220 disclosed in this embodiment may also be provided with a common positive electrode wiring 221, which is in contact with the positive electrode pin of each light emitting chip 230, and the brightness of all the light emitting chips 230 is controlled simultaneously by the same electrode signal.
As another implementation of this embodiment, the light emitting chip 230 is disclosed to include one or more of a red light emitting diode chip, a blue light emitting diode chip, and a green light emitting diode chip. Specifically, the light emitting chip 230 is a blue light chip; or the chip packaging unit 200 includes three light emitting chips 230, and the three light emitting chips 230 are red light emitting diode chips, blue light emitting diode chips, and green light emitting diode chips, respectively. When the light emitting chip 230 is a blue light chip, it is used as a backlight source after an optical film is added. In the actual manufacturing process, more than two blue light emitting diode chips can be selected to be arranged in parallel, so that the display effect of the chip packaging unit 200 is enhanced. The chip packaging unit 200 includes three light emitting chips 230, where the three light emitting chips 230 are respectively a red light emitting diode chip, a blue light emitting diode chip and a green light emitting diode chip, and can be used as a backlight source or a direct display, which is not limited herein.
As another implementation manner of this embodiment, it is disclosed that the light emitting chip 230 includes at least one of a Mini LED chip, a Micro LED chip, and an organic light emitting diode chip. According to actual production requirements and use requirements, the chip packaging unit 200 in the present embodiment can assemble different types of light emitting chips 230 to achieve the use requirements of display screens with appropriate light emitting efficiency, brightness, resolution, and the like.
As another implementation of this embodiment, the encapsulation layer 240 includes at least one of a silicone layer, an epoxy layer, and a polyurethane layer. The organic matters such as silica gel, epoxy resin and polyurethane can block lateral light emission of the light emitting chip 230, avoid the condition that the adjacent light emitting chips 230 are mutually interfered during working, improve the light emitting efficiency of the chip packaging unit 200 and enhance the display effect. If the light emitting chips 230 in the chip package unit 200 are different colors, the package layer between the light emitting chips 230 is black to prevent crosstalk.
It should be noted that, in the present embodiment, the type of the encapsulation layer 240 is only exemplified, but the protection scope of the present utility model is not limited thereto, and other types of encapsulation layers 240 can be used as equivalents of the inventive concept as long as the technical effects disclosed in the present utility model can be achieved.
As another implementation of the present embodiment, the lamp panel 100 is disclosed to include a transparent glass lamp panel 100 or a transparent organic polymer lamp panel 100. The lamp panel 100 is set as a transparent glass lamp panel 100 or a transparent organic polymer lamp panel 100, such as a polymethyl methacrylate lamp panel 100, which is beneficial to light transmission and improves the luminous efficiency of the luminous substrate.
The utility model also discloses a display device which comprises a display panel and the light-emitting substrate, wherein the display panel is arranged on the light-emitting side of the light-emitting substrate.
In summary, the present utility model discloses a light-emitting substrate, which includes a lamp panel 100 and a chip packaging unit 200 disposed on the lamp panel 100; the chip packaging unit 200 includes a substrate 210, an electrode wiring layer 220, a packaging layer 240, and at least two light emitting chips 230, wherein the electrode wiring layer 220 is disposed on the substrate 210; the light emitting chips 230 are arranged on the substrate 210 at intervals and are respectively connected with the electrode wiring layers 220; the encapsulation layer 240 is disposed on the substrate 210 and filled around the light emitting chip 230; the encapsulation layer 240 is provided with a via hole, a metal filler is disposed in the via hole, and the electrode wiring layer 220 is connected with the lamp panel 100 through the metal filler. The lamp panel 100 is used for bearing the chip packaging unit 200, circuit wires are arranged on the lamp panel 100 to supply power to the chip packaging unit 200, and the chip packaging unit 200 emits light after being electrified to serve as a backlight source. Two or more light emitting chips 230 are arranged in the chip packaging unit 200 at intervals, are packaged by the packaging layer 240, and conduct the light emitting chips 230 to emit light through the electrode wiring layer 220. In the processing process, the chip packaging unit 200 is used as a unit to be punched on the lamp panel 100, and the light emitting chips 230 are not required to be punched on the lamp panel 100 one by one, so that the difficulty of punching the lamp panel 100 is reduced, the production workload is reduced, and the production yield and the production efficiency of the light emitting substrate are improved.
It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other.
It should be noted that the specific structure and working principle of the present utility model are described by taking the light-emitting substrate as an example, but the application of the present utility model is not limited to the light-emitting substrate, and the present utility model can also be applied to the production and use of other similar workpieces.
It is to be understood that the utility model is not limited to the precise arrangements and instrumentalities shown in the drawings, which have been described above, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the utility model is limited only by the appended claims.
The foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the utility model are intended to be included within the scope of the utility model.
Claims (10)
1. The light-emitting substrate is characterized by comprising a lamp panel and a chip packaging unit arranged on the lamp panel; the chip packaging unit includes:
a substrate;
the electrode wiring layer is arranged on the substrate;
at least two light emitting chips are arranged on the substrate at intervals and are respectively connected with the electrode wiring layer;
the packaging layer is arranged on the substrate and filled around the light-emitting chip;
and a via hole is arranged in the packaging layer, a metal filling piece is arranged in the via hole, and the electrode wiring layer is connected with the lamp panel through the metal filling piece.
2. The light-emitting substrate according to claim 1, wherein the lamp panel is divided into a wiring region and at least one transparent light-emitting region, the wiring region being disposed around each of the transparent light-emitting regions; the chip packaging units are arranged in one-to-one correspondence with the transparent light-emitting areas, and the chip packaging units emit light through the transparent light-emitting areas.
3. A light emitting substrate according to claim 1 or 2, wherein a side of the encapsulation layer remote from the substrate is connected to the lamp panel.
4. The light-emitting substrate according to claim 1 or 2, wherein a plurality of the chip packaging units are provided, and a plurality of the chip packaging unit arrays are provided on the lamp panel.
5. The light-emitting substrate according to claim 1 or 2, wherein the substrate comprises a sapphire substrate or a glass substrate.
6. A light-emitting substrate according to claim 3, wherein the electrode trace layer comprises a plurality of positive electrode traces and a common negative electrode trace, the negative electrode of each light-emitting chip in the chip packaging unit is connected to the common negative electrode trace, and the positive electrodes of each light-emitting chip in the chip packaging unit are respectively connected to the positive electrode traces in a one-to-one correspondence.
7. The light-emitting substrate according to claim 1 or 2, wherein the light-emitting chip is a blue light chip; or alternatively
The chip packaging unit comprises three light emitting chips, wherein the three light emitting chips are respectively a red light emitting diode chip, a blue light emitting diode chip and a green light emitting diode.
8. The light emitting substrate of claim 1, wherein the light emitting chip comprises at least one of a Mini LED chip, a Micro LED chip, an organic light emitting diode chip.
9. The light emitting substrate of claim 1, wherein the lamp panel comprises a transparent glass lamp panel or a transparent organic polymer lamp panel.
10. A display device comprising a display panel and the light-emitting substrate according to any one of claims 1 to 9, the display panel being provided on a light-emitting side of the light-emitting substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320217967.XU CN219591393U (en) | 2023-02-14 | 2023-02-14 | Light-emitting substrate and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320217967.XU CN219591393U (en) | 2023-02-14 | 2023-02-14 | Light-emitting substrate and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219591393U true CN219591393U (en) | 2023-08-25 |
Family
ID=87697282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320217967.XU Active CN219591393U (en) | 2023-02-14 | 2023-02-14 | Light-emitting substrate and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219591393U (en) |
-
2023
- 2023-02-14 CN CN202320217967.XU patent/CN219591393U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108807356B (en) | Four-in-one mini-LED module, display screen and manufacturing method | |
| US8395178B2 (en) | Light emitting device package and method of fabricating the same | |
| US8154033B2 (en) | LED device and method of packaging the same | |
| US7683539B2 (en) | Light emitting device package and method for manufacturing the same | |
| EP3531451B1 (en) | Rgb-led packaging modules and display screen formed thereof | |
| KR100793338B1 (en) | Light emitting diode module | |
| CN100563002C (en) | The encapsulating structure of light-emitting diode chip for backlight unit and method thereof | |
| CN103608921A (en) | LED array having embedded LED and method therefor | |
| CN213546315U (en) | Light-emitting unit | |
| CN112735286A (en) | LED lamp bead | |
| CN112397487B (en) | Light emitting device, manufacturing method thereof, display screen comprising light emitting device and lighting fixture | |
| CN219591393U (en) | Light-emitting substrate and display device | |
| KR100575431B1 (en) | Light-emitting diode display device and method thereof | |
| CN216671632U (en) | Integrated packaged high-power LED | |
| CN113314511A (en) | LED display module and LED display screen | |
| CN211295128U (en) | Integrated chip, full-color integrated chip and display panel | |
| CN114334935A (en) | LED backlight source and manufacturing method thereof | |
| CN215220751U (en) | LED light source, lighting device and display device | |
| CN214625042U (en) | Static self-luminous module | |
| CN214312474U (en) | LED luminous glass curtain wall | |
| KR20090001169A (en) | Light emitting diode package and array of the same | |
| CN214312473U (en) | LED lamp bead | |
| CN215069017U (en) | LED display screen based on static self-luminous module | |
| CN213905210U (en) | Luminous keyboard backlight assembly and luminous keyboard | |
| CN219642835U (en) | Multicolor LED filament light source |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |