CN219642835U - Multicolor LED filament light source - Google Patents

Abstract

The multicolor LED filament light source relates to the technical field of LED filaments and comprises a bracket substrate, wherein an LED chip set is arranged on the bracket substrate, and at least one group of LED chip sets is arranged on the bracket substrate; the LED chip set comprises a plurality of LED chips and a substrate circuit, wherein the LED chips are electrically connected through the substrate circuit, and the substrate circuit comprises a front circuit and a back circuit. According to the utility model, the partial circuit is arranged on the back surface of the substrate, so that the width of the filament is reduced, and the luminous effect of the filament lamp is optimized.

Description

Multicolor LED filament light source

Technical Field

The utility model relates to the technical field of LED filaments, in particular to a multicolor LED filament light source.

Background

At present, the multicolor WRGB filament lamp is widely focused on due to the characteristics of changeable colors, adjustable color temperatures and wide application occasions, but is limited by the technical level, and a multipath circuit is required to be arranged if multicolor and multicolor temperature adjustment are required at present. However, due to the increase of circuits on the substrate, the width of the lamp filament is greatly increased, so that when the product is used for lighting the single-channel LED chip set, the whole lamp filament only partially emits light, the visual effect is poor, and the attractiveness of the lamp filament is reduced.

There is a need to develop a multi-color LED filament light source to solve the problems of the prior art.

Disclosure of Invention

The utility model aims to provide a multicolor LED filament light source, which solves the problem that the filament width is greatly increased due to the increase of circuits on a substrate in the background technology by arranging part of circuits on the back surface of the substrate.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the multicolor LED filament light source comprises a bracket substrate, wherein an LED chip set is arranged on the bracket substrate, and at least one group of LED chip sets is arranged on the LED chip set; the LED chip set comprises a plurality of LED chips and a substrate circuit, wherein the LED chips are electrically connected through the substrate circuit, and the substrate circuit comprises a front circuit and a back circuit.

Further, a plurality of circuit via holes are formed in the support substrate, and the front side circuit and the back side circuit are electrically connected through the circuit via holes.

Further, the LED chip sets include one or more of a white light chip set, a red light chip set, a green light chip set, or a blue light chip set.

Further, the LED chip sets are provided with more than two groups, the arrangement mode of the LED chip sets comprises staggered arrangement or parallel arrangement, and the colors of different LED chip sets are the same or different.

Further, the LED chip set comprises a plurality of light emitting chips, and the number of the light emitting chips of different LED chip sets is the same or different.

Further, the light emitting CHIP includes at least one or more of a CSP package or a CHIP package.

Further, both ends of the support substrate are provided with metal terminals.

Further, the left end of the support base plate is provided with at least one metal terminal, and the right end of the support base plate is also provided with at least one metal terminal.

Further, the support substrate comprises a flexible substrate, and the flexible substrate is made of any one of FPC, glass fiber board, flexible metal substrate or high polymer board.

Further, the LED chip set further comprises an encapsulation glue layer, wherein the encapsulation glue layer covers the front surface and/or the back surface of the support substrate, and the encapsulation glue layer covers the LED chip set.

Compared with the prior art, the utility model has the beneficial effects that: the utility model reduces the circuits arranged on the front surface of the substrate, shortens the width of the filament, saves the production cost, and ensures that the light-emitting area of the filament has a thin and narrow effect and has better light-emitting effect compared with the prior art that the circuits are only arranged on the front surface of the substrate.

And when the LED chip group is provided with more than one group, the product enables the luminous effect of the lamp filament when being lighted to be more similar to that of a single-path product by shortening the width of the lamp filament, and the luminous effect is more excellent. When the single-channel LED chip group emits light, the lamp filament width is reduced, so that the product has the visual effect of overall light emission, and the attractiveness of the product is improved.

Other features and advantages of the present utility model will be disclosed in the following detailed description of the utility model and the accompanying drawings.

Drawings

FIG. 1 is a schematic overall structure of the first embodiment;

FIG. 2 is an enlarged view of a partial structure of the first embodiment;

FIG. 3 is a schematic overall structure of the second embodiment;

fig. 4 is a partial structure enlarged view of the second embodiment;

FIG. 5 is a schematic overall structure of the third embodiment;

FIG. 6 is an enlarged view of a partial structure of the third embodiment;

FIG. 7 is a schematic overall structure of the fourth embodiment;

fig. 8 is a partial structure enlarged view of the fourth embodiment;

fig. 9 is a schematic view of a cross-section of a cover of an encapsulation glue layer.

The figure indicates: 1. a support substrate; 2. a front side circuit; 3. a back side circuit; 4. a circuit via; 5. a metal terminal; 6. a white light chipset; 7. a red light chipset; 8. green light chip set; 9. a blue light chipset; 10. and (5) packaging the glue layer.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

The multicolor LED filament light source comprises a bracket substrate 1, wherein an LED chip set is arranged on the bracket substrate 1, and at least one group of LED chip sets is arranged on the LED chip set; the LED chip set comprises a plurality of LED chips and a substrate circuit, wherein the LED chips are electrically connected through the substrate circuit, the substrate circuit comprises a front circuit 2 and a back circuit 3, the front circuit 2 is arranged on the front surface of the support substrate 1, and the back circuit 3 is mainly arranged on the back surface of the support substrate 1. Optionally, a plurality of circuit via holes 4 are provided on the support substrate 1, and the front circuit 2 and the back circuit 3 are electrically connected through the circuit via holes 4. In this embodiment, the width of the stand substrate 1 is preferably less than or equal to 2.2mm.

The support substrate 1 comprises a flexible substrate, and the material of the flexible substrate can be any one of FPC, glass fiber board, flexible metal substrate or high polymer board.

The LED chip comprises a support substrate 1, and is characterized by further comprising an encapsulation glue layer 10, wherein the encapsulation glue layer 10 covers the front surface of the support substrate 1, and the encapsulation glue layer 10 covers the LED chip set. Optionally, the encapsulation glue layer 10 covers the support substrate 1.

One or more metal terminals 5 are arranged at both ends of the support substrate 1, and the LED chip set is electrically connected with the metal terminals 5.

Preferably, 4 groups of LED chip sets are disposed on the support substrate 1. Each LED chip group consists of a plurality of light emitting chips. The LED chip sets comprise a white light chip set 6, a red light chip set 7, a green light chip set 8 and a blue light chip set 9. The white light chip set 6 is composed of a plurality of white light LED chips, the red light chip set 7 is composed of a plurality of red light LED chips, the green light chip set 8 is composed of a plurality of green light LED chips, and the blue light chip set 9 is composed of a plurality of blue light LED chips.

Example 1

As shown in fig. 1 and 2, the LED chip set includes, from front to back, a white light chip set 6, a red light chip set 7, a green light chip set 8, and a blue light chip set 9, where the white light chip set 6 includes a plurality of white light LED units, and from left to right, the white light LED unit one, the white light LED unit two, the white light LED unit three, and so on. The front side circuit 2 is provided with segments and the back side circuit 3 is also provided with segments. The white light LED unit comprises three white light LED chips, anodes of the three white light LED chips of the white light LED unit are respectively and electrically connected with the first front circuit and the metal terminal 5 at the left end of the support substrate 1 through the first front circuit, cathodes of the three white light LED chips of the white light LED unit are respectively connected with the first back circuit, and in the embodiment, the first back circuit is connected with cathodes of the three white light LEDs through the circuit through holes 4. And the first back circuit is connected with the second front circuit through the circuit through hole 4, and the second front circuit is arranged on the front surface of the bracket substrate 1 and is respectively connected with the anodes of the three white light LED chips of the second white light LED unit. The positive electrode and the negative electrode can be exchanged. Alternatively, the red light chip set 7, the green light chip set 8 and the blue light chip set 9 are connected in the same or similar manner to the white light chip set 6.

In this embodiment, a metal terminal 5 is disposed at the left end of the support substrate 1, and four metal terminals 5 are disposed at the right end of the support substrate 1.

Example two

As shown in fig. 3 and 4, the white LED chips and the red LED chips are alternately arranged, and optionally, the white LED chips are electrically connected with the metal terminals 5 at the left and right ends of the support substrate 1 through the front circuit 2, and the red LED chips are electrically connected with the metal terminals 5 at the left and right ends of the support substrate 1 through the back circuit 3. Optionally, the green LED chip and the blue LED chip are arranged in parallel.

Example III

As shown in fig. 5 and 6, two metal terminals 5 are disposed at the left end of the support substrate 1, and four metal terminals 5 are disposed at the right end of the support substrate 1. Alternatively, one left-hand metal terminal 5 is connected to one LED chip set, and the other left-hand metal terminal 5 is connected to the other LED chip set.

Example IV

As shown in fig. 7 and 8, two metal terminals 5 are disposed at the left end of the support substrate 1, and three metal terminals 5 are disposed at the right end of the support substrate 1. Alternatively, one left-end metal terminal 5 is connected with the anodes of the four LED chip sets, and the other left-end metal terminal 5 is connected with the cathodes of one of the LED chip sets. The three right-hand metal terminals 5 are respectively connected with the cathodes of the remaining three LED chip sets.

The number of chips of each path is not required when the chips are arranged in parallel, and the number of the 2 groups of chips is the same or different by 1 when the chips are arranged in a staggered mode.

Preferably, the white light LED CHIP is a CSP package or a CHIP package, the red light LED CHIP is also a CSP package or a CHIP package, and the blue light LED CHIP and the green LED CHIP are common LED CHIPs. The CSP package or the CHIP package is used, the CHIP is not required to be subjected to glue dispensing and other treatments, the glue proportioning procedure is reduced, the process complexity is reduced, and the width of the substrate is reduced. And the CSP package or the CHIP package is used, so that the production procedures can be reduced, the production period can be shortened, and the product yield can be improved.

Optionally, the metal terminal 5 and the substrate may be in contact with each other through lamination, or may be adhered together through conductive adhesive or solder paste.

The utility model provides a multicolor LED filament light source which has the advantages of simple structure, convenient use and high reliability.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.

Claims (10)

1. The multicolor LED filament light source is characterized by comprising a bracket substrate, wherein an LED chip set is arranged on the bracket substrate, and more than two groups of LED chip sets are arranged; the LED chip set comprises a plurality of LED chips and a substrate circuit, wherein the LED chips are electrically connected through the substrate circuit, the substrate circuit comprises a front circuit and a back circuit, and the width of the support substrate is smaller than or equal to 2.2mm.

2. The multi-color LED filament light source of claim 1, wherein the carrier substrate is provided with a plurality of circuit vias, and the front side circuit and the back side circuit are electrically connected through the circuit vias.

3. The multi-color LED filament light source of claim 1, wherein the LED chip set comprises one or more of a white light chip set, a red light chip set, a green light chip set, or a blue light chip set.

4. The multi-color LED filament light source of claim 3, wherein the arrangement of the LED chip sets comprises a staggered arrangement or a parallel arrangement, and the colors of different LED chip sets are the same or different.

5. The multi-color LED filament light source of claim 4, wherein the LED chip sets comprise a plurality of light emitting chips, the number of light emitting chips of different LED chip sets being the same or different.

6. The multi-color LED filament light source of claim 5, wherein the light emitting CHIP comprises at least one or more of a CSP package or a CHIP package.

7. The multi-color LED filament light source of any one of claims 1-6, wherein both ends of the carrier substrate are provided with metal terminals.

8. The multi-color LED filament light source of claim 7, wherein the left end of the carrier substrate is provided with at least one metal terminal and the right end of the carrier substrate is also provided with at least one metal terminal.

9. The multi-color LED filament light source of claim 8, wherein the support substrate comprises a flexible substrate, the flexible substrate being any one of FPC, cello board, flexible metal substrate, or high molecular polymer board.

10. The multi-color LED filament light source of claim 8, further comprising an encapsulation glue layer covering the front and/or back of the carrier substrate, the encapsulation glue layer covering the LED chip set.