CN218827117U

CN218827117U - LED display module and LED display screen

Info

Publication number: CN218827117U
Application number: CN202222828462.5U
Authority: CN
Inventors: 李强
Original assignee: Shenzhen Haiwenhao Technology Co ltd
Current assignee: Dongguan Chuanqu Electronic Technology Co ltd
Priority date: 2022-10-26
Filing date: 2022-10-26
Publication date: 2023-04-07
Anticipated expiration: 2032-10-26

Abstract

The utility model relates to a LED shows technical field, especially relates to a LED display module and LED display screen. The packaging structure comprises a substrate, wherein a plurality of pixel groups arranged in a row and column mode and a packaging adhesive layer covering each pixel group and the substrate are arranged on the front surface of the substrate; each pixel group comprises a first LED device in a positive 'pin' -shaped arrangement structure and a second LED device in an inverted 'pin' -shaped arrangement structure, and light emitting chips of the first LED device and light emitting chips of the second LED device can be used alternately. The effect of adding pixel points is achieved, the saturation of colors can be increased, and the bright point display and color mixing effects are effectively improved; therefore, the utility model provides a LED display module and LED display screen has effectively improved the saturation that shows bright spot and colour and has promoted the colour mixture effect and promote the price/performance ratio.

Description

LED display module and LED display screen

Technical Field

The utility model relates to a LED shows technical field, especially relates to a LED display module and LED display screen.

Background

With the continuous development of the light emitting diode technology, the LED display screen is increasingly applied to various occasions such as indoor and outdoor. The conventional LED display screen is formed by splicing a plurality of LED display modules, the LED display modules are packaged with arrayed light-emitting units, and compared with the conventional die bonding mode, the LED display modules are generally formed by directly mounting or inserting LED devices on a PCB substrate.

With the improvement of life quality, people have requirements on the definition, the brightness and the imaging effect of the LED display screen. Meanwhile, the product market of the mini LED chip provides possibility for LED products to arrange more dense pixel points. Meanwhile, better display effect, better saturation and higher bright point display requirements become the pursuit of users. Therefore, when the LED display with high-density small spacing is manufactured by the LED device and the LED display module in a matched mode, the saturation of the display effect and the color of the LED display module is improved, the color mixing effect is improved, the cost performance is improved, the number of RGB chips is reduced, and the display effect and the like are not affected.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a LED display module and LED display screen to when solving the LED display of the supporting preparation high density booth interval of LED device and LED display module, how promote the saturation of LED display module display effect and colour and promote the colour mixture effect and promote the price/performance ratio, reduce RGB chip quantity and do not influence display effect scheduling problem.

The utility model provides a LED display module, which comprises a substrate, wherein the front surface of the substrate is provided with a plurality of pixel groups arranged in a row and column mode and an encapsulation adhesive layer covering each pixel group and the substrate; each pixel group comprises a first LED device in a positive 'pin' -shaped arrangement structure and a second LED device in an inverted 'pin' -shaped arrangement structure, and light emitting chips of the first LED device and light emitting chips of the second LED device can be used alternately.

Further, the first LED device includes a first substrate, and a first red chip, a first blue chip, and a first green chip disposed on the first substrate, where a first common pad, a first red chip pad, a first green chip pad, and a first blue chip pad are disposed on a front surface of the first substrate, the first red chip is electrically connected to the first red chip pad, the first blue chip is electrically connected to the first blue chip pad, and the first green chip is electrically connected to the first green chip pad; the anodes or the cathodes of the first red light chip, the first blue light chip and the first green light chip are respectively and electrically connected to the first common electrode bonding pad.

Furthermore, a plurality of first connection pads matched with the first common electrode pad, the first red chip pad, the first green chip pad and the first blue chip pad are arranged on the back surface of the first substrate, and first conductive through holes are formed in positions of the first substrate, which are located between the first common electrode pad and the first connection pad, between the first red chip pad and the first connection pad, between the first green chip pad and the first connection pad, and between the first blue chip pad and the first connection pad; the first conductive via electrically connects the first common pad, the first red chip pad, the first green chip pad, and the first blue chip pad to the matched first connection pad, respectively.

Further, the first red light chip is a red flip chip, the first blue light chip is a blue flip chip, and the first green light chip is a green flip chip; the first red light chip, the first blue light chip and the first green light chip are distributed on the first substrate in a positive 'pin' arrangement.

Further, the second LED device includes a second substrate, and a second red chip, a second blue chip, and a second green chip disposed on the second substrate, wherein a second common electrode pad, a second red chip pad, a second green chip pad, and a second blue chip pad are disposed on a front surface of the second substrate, the second red chip is electrically connected to the second red chip pad, the second blue chip is electrically connected to the second blue chip pad, and the second green chip is electrically connected to the second green chip pad; and the anodes or the cathodes of the second red light chip, the second blue light chip and the second green light chip are respectively and electrically connected to the second common electrode bonding pad.

Furthermore, a plurality of second connection pads matched with the second common electrode pad, the second red chip pad, the second green chip pad and the second blue chip pad are arranged on the back surface of the second substrate, and second conductive through holes are formed in positions of the second substrate, which are located between the second common electrode pad and the second connection pad, between the second red chip pad and the second connection pad, between the second green chip pad and the second connection pad, and between the second blue chip pad and the second connection pad; the second common electrode bonding pad, the second red chip bonding pad, the second green chip bonding pad and the second blue chip bonding pad are electrically connected with the second connecting bonding pad which is matched with the second common electrode bonding pad through the second conductive through hole.

Further, the second red light chip is a red forward chip, the second blue light chip is a blue flip chip, and the second green light chip is a green flip chip; the second red light chip, the second blue light chip and the second green light chip are arranged and distributed on the second substrate in an inverted 'pin' shape.

Furthermore, the substrate further comprises an optical film layer, and the optical film layer covers the packaging adhesive layer.

Furthermore, at least one group of column driving control units for controlling each column of the pixel group and at least one group of row driving control units for controlling each row of the pixel group are arranged on the back surface of the substrate.

The utility model also provides a LED display screen, the LED display screen includes as above-mentioned arbitrary the LED display module.

In the LED display module of the present invention, a plurality of pixel groups arranged in rows and columns are disposed on the front surface of the substrate, and the encapsulation adhesive layer covers each pixel group and the substrate; each pixel group comprises a first LED device in a positive 'pin' shaped arrangement structure and a second LED device in an inverse 'pin' shaped arrangement structure, a first red light chip, a first blue light chip and a first green light chip of the first LED device can be crossed and used with a second red light chip, a second blue light chip and a second green light chip of the second LED device, so that the effect of adding pixel points is achieved, the saturation of colors can be increased, and the bright point display and color mixing effects are effectively improved; thereby, the utility model provides a LED display module and LED display screen has effectively improved the saturation that shows bright spot and colour and promoted colour mixture effect and promotion price/performance ratio.

Drawings

Fig. 1 is a schematic structural diagram of an LED display module according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of a first LED device of an LED display module according to an embodiment of the present invention.

Fig. 3 is a rear view of fig. 2.

Fig. 4 is a side view of fig. 2.

Fig. 5 is a schematic structural diagram of a second LED device of an LED display module according to an embodiment of the present invention.

Fig. 6 is a rear view of fig. 5.

Fig. 7 is a side view of fig. 5.

Fig. 8 is a side view of an LED display module according to an embodiment of the present invention.

Fig. 9 is a top view of an LED display module according to an embodiment of the present invention.

Fig. 10 is a partially enlarged schematic view at a of fig. 1.

Fig. 11 is a partially enlarged schematic view at B of fig. 1.

Detailed Description

In order to make the purpose, technical solution and beneficial effects of the present invention more clearly understood, the present invention is further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In order to explain the technical solution of the present invention, the following description is made by using specific examples.

Referring to fig. 1 to 11, a LED display module according to an embodiment of the present invention includes a substrate 1, the substrate 1 is a PCB, a plurality of pixel groups arranged in rows and columns are disposed on a front surface of the substrate 1, and an encapsulation adhesive layer 2 covers each pixel group and the substrate 1; each pixel group comprises a first LED device 100 in a positive 'pin' -shaped arrangement structure and a second LED device 200 in an inverted 'pin' -shaped arrangement structure, and the light emitting chips of the first LED device 100 and the second LED device 200 can be used alternately, so that the effect of adding pixel points is achieved, the saturation of colors can be increased, and the effects of displaying bright points and mixing colors are effectively improved.

In the first embodiment of the present invention, the first LED device 100 includes a first substrate 10 and a first red chip 11, a first blue chip 12 and a first green chip 13 disposed on the first substrate 10, the front surface of the first substrate 10 is provided with a first common pad 14, a first red chip pad 15, a first green chip pad 16 and a first blue chip pad 17, the first red chip 11 is electrically connected to the first red chip pad 15, the first blue chip 12 is electrically connected to the first blue chip pad 17, and the first green chip 13 is electrically connected to the first green chip pad 16; the anodes or cathodes of the first red chip 11, the first blue chip 12 and the first green chip 13 are electrically connected to a first common pad 14, respectively, and the first common pad 14 may be a common anode pad or a common cathode pad.

In the first embodiment of the present invention, the back surface of the first substrate 10 is provided with a plurality of first connection pads 18 which are matched with the first common electrode pad 14, the first red chip pad 15, the first green chip pad 16 and the first blue chip pad 17, the first substrate 10 is provided with first conductive through holes 19 at positions between the first common electrode pad 14 and the first connection pad 18, between the first red chip pad 15 and the first connection pad 18, between the first green chip pad 16 and the first connection pad 18, and between the first blue chip pad 17 and the first connection pad 18; the first conductive via 19 electrically connects the first common pad 14, the first red chip pad 15, the first green chip pad 16 and the first blue chip pad 17 with the matching first connection pad 18, respectively. The pins of the first red chip 11, the first blue chip 12 and the first green chip 13 can be connected to the first connection pads 18 through the shortest path, so that the power consumption can be reduced, and the first conductive vias 19 can be filled with a conductive medium, and can be filled with or cover the sidewalls of the first conductive vias 19, so that the connection can be realized.

In the first embodiment of the present invention, the first red chip 11 is a red flip chip, the first blue chip 12 is a blue flip chip, and the first green chip 13 is a green flip chip; first red light chip 11, first blue light chip 12 and first green glow chip 13 are positive "article" word and arrange the distribution and set up on first base plate 10, can obtain better luminous effect.

In the first embodiment of the present invention, the second LED device 200 includes a second substrate 20 and a second red chip 21, a second blue chip 22 and a second green chip 23 disposed on the second substrate 20, the front surface of the second substrate 20 is provided with a second common electrode pad 24, a second red chip pad 25, a second green chip pad 26 and a second blue chip pad 27, the second red chip 21 is electrically connected to the second red chip pad 25, the second blue chip 22 is electrically connected to the second blue chip pad 27, and the second green chip 23 is electrically connected to the second green chip pad 26; the anodes or cathodes of the second red chip 21, the second blue chip 22 and the second green chip 23 are electrically connected to a second common electrode pad 24, respectively, and the second common electrode pad 24 may be a common anode pad or a common cathode pad.

In the first embodiment of the present invention, the back surface of the second substrate 20 is provided with a plurality of second connection pads 28 matched with the second common electrode pads 24, the second red chip pads 25, the second green chip pads 26 and the second blue chip pads 27, the second substrate 20 is located between the second common electrode pads 24 and the second connection pads 28, between the second red chip pads 25 and the second connection pads 28, between the second green chip pads 26 and the second connection pads 28, and between the second blue chip pads 27 and the second connection pads 28, and second conductive through holes 29 are disposed on the positions thereof; a second conductive via 29 electrically connects the second common electrode pad 24, the second red chip pad 25, the second green chip pad 26 and the second blue chip pad 27 with a matching second connection pad 28, respectively. The leads of the second red chip 21, the second blue chip 22 and the second green chip 23 can be connected to the second connection pads 28 through the shortest path, so that the power consumption can be reduced, and the second conductive vias 29 can be filled with a conductive medium, and can be filled in or covered on the sidewalls of the second conductive vias 29, so that the connection can be realized.

In the first embodiment of the present invention, the second red light chip 21 is a red front-mounted chip, the second blue light chip 33 is a blue flip chip, and the second green light chip 23 is a green flip chip; the second red light chip 21, the second blue light chip 22 and the second green light chip 23 are arranged and distributed in an inverted 'pin' shape on the second substrate 20, so that a better light emitting effect can be obtained.

In the first embodiment of the present invention, the substrate 1 further includes an optical film layer 3, and the optical film layer 3 covers the encapsulation adhesive layer 2; the contrast ratio of the LED display module can be effectively improved, and the appearance consistency of the LED display module is improved.

In the first embodiment of the present invention, at least one set of column driving control unit 4 for controlling each column of pixel group and at least one set of row driving control unit 5 for controlling each row of pixel group are disposed on the back surface of the substrate 1, and the column driving control unit 4 and the row driving control unit 5 are not limited to the electrical connection with the first LED device 100 and the second LED device 200 in the first embodiment.

The embodiment of the utility model provides a still provide a LED display screen in the second, the LED display screen includes like the LED display module in the first embodiment.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention, and any modifications, equivalents, improvements, etc. made within the spirit and principles of the present invention should be included within the scope of the present invention.

Claims

1. An LED display module, comprising: the packaging structure comprises a substrate, wherein a plurality of pixel groups arranged in a row and column mode and a packaging adhesive layer covering each pixel group and the substrate are arranged on the front surface of the substrate; each pixel group comprises a first LED device in a positive 'pin' -shaped arrangement structure and a second LED device in an inverted 'pin' -shaped arrangement structure, and light emitting chips of the first LED device and light emitting chips of the second LED device can be used alternately.

2. The LED display module of claim 1, wherein the first LED device comprises a first substrate and a first red chip, a first blue chip, and a first green chip disposed on the first substrate, wherein a front surface of the first substrate is provided with a first common pad, a first red chip pad, a first green chip pad, and a first blue chip pad, the first red chip is electrically connected to the first red chip pad, the first blue chip is electrically connected to the first blue chip pad, and the first green chip is electrically connected to the first green chip pad; the anodes or the cathodes of the first red light chip, the first blue light chip and the first green light chip are respectively and electrically connected to the first common electrode bonding pad.

3. The LED display module of claim 2, wherein the back surface of the first substrate is provided with a plurality of first connection pads arranged to match the first common pad, the first red chip pad, the first green chip pad and the first blue chip pad, and the first substrate is provided with first conductive vias at positions between the first common pad and the first connection pad, between the first red chip pad and the first connection pad, between the first green chip pad and the first connection pad, and between the first blue chip pad and the first connection pad; the first conductive via electrically connects the first common pad, the first red chip pad, the first green chip pad, and the first blue chip pad to the matched first connection pad, respectively.

4. The LED display module of claim 3, wherein the first red chip is a red flip chip, the first blue chip is a blue flip chip, and the first green chip is a green flip chip; the first red light chip, the first blue light chip and the first green light chip are distributed on the first substrate in a positive 'pin' arrangement.

5. The LED display module of claim 1, wherein the second LED device comprises a second substrate and a second red chip, a second blue chip, and a second green chip disposed on the second substrate, the front surface of the second substrate having a second common electrode pad, a second red chip pad, a second green chip pad, and a second blue chip pad, the second red chip electrically connected to the second red chip pad, the second blue chip electrically connected to the second blue chip pad, and the second green chip electrically connected to the second green chip pad; and the anodes or the cathodes of the second red light chip, the second blue light chip and the second green light chip are respectively and electrically connected to the second common electrode bonding pad.

6. The LED display module as claimed in claim 5, wherein the second substrate has a plurality of second connection pads on the back surface thereof, the second connection pads being matched with the second common electrode pad, the second red chip pad, the second green chip pad and the second blue chip pad, and the second substrate has second conductive vias at positions between the second common electrode pad and the second connection pads, between the second red chip pad and the second connection pads, between the second green chip pad and the second connection pads, and between the second blue chip pad and the second connection pads; the second common electrode bonding pad, the second red chip bonding pad, the second green chip bonding pad and the second blue chip bonding pad are electrically connected with the second connecting bonding pad respectively through the second conductive through hole.

7. The LED display module of claim 6, wherein the second red chip is a red front-mounted chip, the second blue chip is a blue flip chip, and the second green chip is a green flip chip; the second red light chip, the second blue light chip and the second green light chip are arranged and distributed on the second substrate in an inverted 'pin' shape.

8. The LED display module of claim 1, further comprising an optical film layer on the substrate, the optical film layer overlying the encapsulant layer.

9. The LED display module of claim 1, wherein the back side of the substrate is provided with at least one set of column drive control units for controlling each column of the pixel sets and at least one set of row drive control units for controlling each row of the pixel sets.

10. An LED display screen, characterized in that it comprises an LED display module according to any one of claims 1 to 9.