CN211238245U

CN211238245U - TOP type RGBW integrated circuit packaging lamp pearl

Info

Publication number: CN211238245U
Application number: CN202020218247.1U
Authority: CN
Inventors: 魏亚河
Original assignee: Xiamen Xindeco Optoelectronics Co ltd
Current assignee: Xiamen Xindeco Optoelectronics Co ltd
Priority date: 2020-02-27
Filing date: 2020-02-27
Publication date: 2020-08-11
Anticipated expiration: 2030-02-27

Abstract

The utility model relates to a TOP type RGBW integrated circuit encapsulates lamp pearl, including the base plate with set firmly four groups RGBW chip groups on the base plate, the base plate is the square, has on the front of this base plate and is located four weld zones that are used for welding four groups RGBW chips on four corners of base plate respectively, all has the box dam that surrounds this weld zone around each weld zone, has the encapsulation colloid that covers the RGBW chip group in the weld zone that surrounds it in the box dam; all chips on two adjacent welding areas are arranged in a common cathode mode, and a red light chip, a green light chip and a blue light chip on the two adjacent welding areas are arranged in a common anode mode respectively, so that the problems that welding pads are densely arranged at an application end of RGBW lamp beads on an existing display screen, and pixel points are large are solved.

Description

TOP type RGBW integrated circuit packaging lamp pearl

Technical Field

The utility model relates to a LED encapsulates the field, specifically relates to a TOP type RGBW integrated circuit encapsulation lamp pearl.

Background

The RGBW technology is to add w (white) white sub-pixels on the basis of original RGB (red, green, and tile) three primary colors, and becomes a four-color type pixel design, which is a sub-pixel rendering technical mode. The color expression consistency is better under the new pixel arrangement mode, the light transmittance of the liquid crystal panel is greatly improved, and the power consumption is lower when pictures with the same brightness are displayed; and under the condition of the same power consumption, the brightness is greatly improved, so that the picture level is clearer, and the picture is more transparent.

The existing RGBW lamp bead is usually packaged with red, green, blue chips and a white light chip together in the same packaging support, so as to have RGBW function on one lamp bead at the same time, and the structure of the existing RGBW lamp bead can refer to an RGBW four-color patch LED lamp bead disclosed in chinese patent with publication number CN 209691750U. When current RGBW lamp pearl was used on the display screen, each lamp pearl all had six pads, therefore when the application end set up welded circuit board, the pad design was very intensive, caused the problem of continuous tin between the pad easily at reflow soldering's in-process, led to the lamp pearl to become invalid. In addition, because there is the technology clearance between the RGB lamp pearl, the space that every RGB lamp pearl unit occupy is great, therefore the display screen can have great pixel.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a TOP type RGBW integrated circuit encapsulates lamp pearl to RGBW lamp pearl on solving current display screen sets up the intensive and great problem of pixel of pad at the application.

The specific scheme is as follows:

a TOP type RGBW integrated circuit packaging lamp bead comprises a substrate and four groups of RGBW chip groups fixedly arranged on the substrate,

each RGBW chip group comprises a red light chip, a green light chip, a blue light chip and a white light chip;

the substrate is square, a first circuit and a second circuit are respectively arranged on the front surface and the back surface of the substrate, conduction is realized between the first circuit and the second circuit through a plurality of via holes, the first circuit is provided with four welding areas which are respectively positioned on four corners of the substrate and used for welding four groups of RGBW chips, a box dam which surrounds the welding areas is arranged around each welding area, and a packaging colloid which covers the RGBW chip groups in the welding areas which are surrounded by the box dam is arranged in the box dam;

all chips on two adjacent welding areas are arranged by adopting a common cathode, and a red light chip, a green light chip and a blue light chip on the two adjacent welding areas are respectively arranged by adopting a common anode;

eight anode tin bonding pads which are conducted with the chip anode of the RGBW chip set and two cathode tin bonding pads which are conducted with the chip cathode of the RGB chip set are arranged on the second line, and the eight anode tin bonding pads and the two cathode tin bonding pads are arranged in a square shape and are evenly distributed on the peripheral edge of the back surface of the substrate.

In some embodiments, the red light chip, the green light chip, the blue light chip and the white light chip are all flip chips, and the red light chip, the green light chip, the blue light chip and the white light chip in the same RGBW chip group are arranged side by side up and down in the same welding area.

In some embodiments, each of the lands has a black ink isolation layer around it, the black ink isolation layer being such that each land is of equal size.

In some embodiments, four of the lands have a cross-shaped cut-out in the space therebetween.

In some embodiments, the cross section of the cutting groove is an isosceles trapezoid structure with a large opening and a small bottom.

In some embodiments, the cutting grooves have black stripes on the bottom.

In some embodiments, the back side of the substrate is coated with solder resist paint except for six anode tin pads and two cathode tin pads.

In some embodiments, the solder resist paint is divided into a first solder resist paint having a first color and a second solder resist paint having a second color according to the polarity of the substrate back side tin pads.

The utility model provides a TOP type RGBW integrated circuit encapsulation lamp pearl compares with prior art and has following advantage: the utility model provides a TOP type RGBW integrated circuit encapsulation lamp pearl adopts the mode of the integrated encapsulation of four unifications for the lamp pearl size after the encapsulation is little than the total size of four TOP type RGBW lamp pearls, can have less pixel when being applied to on the display screen. In addition, compared with the design of twenty-four welding pads in total of four TOP type RGBW lamp beads in the prior art, the integrated circuit type packaging lamp beads only have ten tin welding pads, the number of soldering pads is greatly reduced, the design of a circuit board at an application end is convenient, in the same area, the density of the tin welding pads is smaller, therefore, the area of the tin welding pads can be designed to be larger, the space between the tin welding pads can be designed to be larger, the design difficulty of the circuit board at the application end is greatly reduced, and the difficulty of reflow soldering of the TOP type RGBW integrated circuit packaging lamp beads is also greatly reduced.

Drawings

Fig. 1 shows a schematic view of the front side of a substrate.

Fig. 2 shows a schematic view of the backside of the substrate.

Fig. 3 shows a circuit diagram of a TOP RGBW integrated circuit packaging lamp bead.

Fig. 4 shows a schematic cross-sectional view of a TOP RGBW integrated circuit packaging lamp bead.

Fig. 5 shows a schematic view of a black spacer layer and a black spacer strip on the front side of a substrate.

Fig. 6 shows a schematic view of a solder resist paint on the backside of a substrate.

Detailed Description

To further illustrate the embodiments, the present invention provides the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the embodiments. With these references, one of ordinary skill in the art will appreciate other possible embodiments and advantages of the present invention. Elements in the figures are not drawn to scale and like reference numerals are generally used to indicate like elements.

The present invention will now be further described with reference to the accompanying drawings and detailed description.

As shown in fig. 1-4, the embodiment provides a TOP RGBW integrated circuit packaging lamp bead, which includes a substrate 1 and four sets of RGBW chip sets 2 fixed on the substrate, where each set of RGB chip set includes a red chip 21, a green chip 22, a blue chip 23, and a white chip 24.

Specifically, referring to fig. 1 and 2, the substrate 1 is a square substrate, and has a first line 11 (a region with a left diagonal hatching in fig. 1) and a second line 12 (a region with a left diagonal hatching in fig. 2) on the front surface and the back surface thereof, respectively, and the first line 11 and the second line 12 are electrically connected to each other. In this embodiment, the substrate 1 is a double-sided Printed Circuit Board (PCB), the first circuit 11 and the second circuit 12 are connected to each other through a plurality of via holes 13 (copper is deposited in the via holes 13), and the double-sided circuit board has a cost advantage compared to the conventional substrate such as a ceramic substrate and EMC used by the lamp bead.

Four bonding pads 110 for bonding the four sets of RGBW chip groups 2 are provided on the first wiring 11, the four bonding pads 110 are respectively provided on four corner regions of the substrate 1, and the four bonding pads 110 are aligned up and down, left and right on the substrate. Each of the lands 110 has a dam 3 (a region with cross hatching on four corner regions in fig. 1) surrounding the surrounding region of the land 110, and the dam 3 has a molding compound 4 therein covering the RGBW chipset 2 in the land 110 surrounded by the dam 3. The box dam 3 can be realized by adopting a compression molding mode, and the packaging colloid 4 in the box dam 3 can be realized by using a dispensing mode.

The second wire 12 has a plurality of solder pads thereon for soldering to the application terminals. Each welding area 110 is provided with four pairs of functional bonding pads, each pair of functional bonding pads is used for welding a chip, the four pairs of functional bonding pads are arranged in parallel in a straight line shape, all the chips on two adjacent welding areas 110 are arranged in a common cathode mode, and the red chips 21, the green chips 22, the blue chips 23 and the white chips 24 on two adjacent welding areas 110 are respectively arranged in a common anode mode, so that the arrangement structure shown in the circuit diagram of fig. 3 is formed. Therefore, eight anode tin pads 121 and two cathode tin pads 122 are formed on the second circuit 12, and ten tin pads are formed in total, and the ten tin pads are arranged in a square shape and evenly distributed on the peripheral edge of the back surface of the substrate 1, so that the stress after soldering is increased, the tin pads are less prone to falling off, the tin consumption is reduced, the tin pads have larger intervals, and the problem of tin connection is not prone to occur between the tin pads when soldering is carried out on an application end.

The TOP type RGBW integrated circuit encapsulation lamp pearl that this embodiment provided encapsulates on same base plate with four sets of RGBW chipsets jointly to glue alone through box dam 3, the some glue region in each RGBW chipset is limited, can be applicable to current automatic point gum machine and carry out automatic point and glue, can guarantee the uniformity of gluing in each box dam 3.

The size of the lamp bead after the integrated packaging is smaller than the total size of four TOP type RGBW lamp beads, and the lamp bead can have smaller pixel points when being applied to a display screen. In addition, compared with the design of twenty-four welding pads in total of four TOP type RGBW lamp beads in the prior art, the integrated circuit type packaging lamp beads only have ten tin welding pads, the number of soldering pads is greatly reduced, the design of a circuit board at an application end is convenient, in the same area, the density of the tin welding pads is smaller, therefore, the area of the tin welding pads can be designed to be larger, the space between the tin welding pads can be designed to be larger, the design difficulty of the circuit board at the application end is greatly reduced, and the difficulty of reflow soldering of the TOP type RGBW integrated circuit packaging lamp beads is also greatly reduced.

In some embodiments, the red light chip 21, the green light chip 22 and the blue light chip 23 are all flip chips, the flip chips are welded and fixed on corresponding functional pads in a solder paste die bonding mode, and a packaging mode without bonding wires is adopted, so that the problem of lamp death caused by wire breakage of bonding wires is effectively solved, and the reliability of lamp beads is greatly improved. The white light chip adopts a white light chip with an inverted structure, the blue light chip with the inverted structure is coated with fluorescent colloid with corresponding color temperature, and partial blue light emitted by the blue light chip excites fluorescent powder in the fluorescent colloid and is mixed with partial blue light to form white light with corresponding color temperature. The white light chip with the flip structure is preferably realized in a CSP (chip Scale package) mode, and the CSP package can have a smaller volume.

Preferably, referring to fig. 5, the areas of sixteen pairs of functional pads in four welding regions 110 are designed to be equal, and each welding region 110 is provided with a black ink isolation layer 14 (double-oblique line hatching area in fig. 5) all around, the black ink isolation layer 14 ensures that the size of the pad brushed with solder paste is completely consistent, after the solder paste is pasted on the RGBW flip chip and is subjected to over-reflow soldering, the tin-eating direction and tin-eating area of the solder paste can be kept consistent, the chip is prevented from being pulled by the solder paste to cause inclination, and further, the defects of open circuit due to insufficient solder are caused, and the reliability of the product is improved.

As another preferable mode, referring to fig. 4 and 5, the dicing grooves 31 (cross hatching areas in fig. 5) are formed in the intervals between the four bonding pads 110 in a cross shape, and the dicing grooves 31 improve the problem of crosstalk between the groups of RGB chips, and do not cause a difference in color due to a difference in viewing angle.

More preferably, the cross section of the cutting groove 31 is an isosceles trapezoid structure with a large opening and a small bottom, so as to further improve the problem of crosstalk between the RGB chips.

Preferably, the bottom of the cutting groove 31 is provided with a black isolation belt 15, the black isolation belt 15 can be realized by coating black ink, and the black isolation belt 15 can ensure that the blackness of the whole bead is higher and the contrast of the whole screen is better.

In some embodiments, referring to fig. 6, solder resist paint is coated on the back surface of the substrate 1 to completely avoid short circuit of connection caused by application of solder paste, and the solder resist paint is divided into a first solder resist paint 16a with a first color and a second solder resist paint 16b with a second color according to the polarity of the solder pad on the back surface of the substrate 1, for example, one side is coated with green paint, and the other side is coated with white paint as a polarity identification mark, so as to avoid the abnormality of misjudgment of the polarity of the patch.

While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. The utility model provides a TOP type RGBW integrated circuit encapsulation lamp pearl which characterized in that: comprises a substrate and four groups of RGBW chip groups fixedly arranged on the substrate,

2. The TOP type RGBW integrated circuit packaging lamp bead of claim 1, characterized in that: the red light chip, the green light chip, the blue light chip and the white light chip are all flip chips, and the red light chip, the green light chip, the blue light chip and the white light chip in the same RGBW chip group are arranged side by side up and down in the same welding area.

3. The TOP type RGBW integrated circuit packaging lamp bead of claim 2, characterized in that: and the periphery of each welding area is provided with a black ink isolation layer, and each welding area is arranged in an equal size through the black ink isolation layer.

4. The TOP type RGBW integrated circuit packaging lamp bead of claim 1, characterized in that: and the intervals among the four welding areas are provided with cross-shaped cutting grooves.

5. The TOP type RGBW integrated circuit packaging lamp bead of claim 4, wherein: the cross section of the cutting groove is of an isosceles trapezoid structure with a large opening and a small bottom.

6. The TOP type RGBW integrated circuit packaging lamp bead of claim 4, wherein: and a black isolation strip is arranged at the bottom of the cutting groove.

7. The TOP type RGBW integrated circuit packaging lamp bead of claim 1, characterized in that: the back of the substrate is coated with solder resist paint except for six anode tin welding pads and two cathode tin welding pads.

8. The TOP type RGBW integrated circuit packaging lamp bead of claim 7, wherein: the solder resist paint is divided into a first solder resist paint with a first color and a second solder resist paint with a second color according to the polarity of the substrate back side tin pad.