CN218632090U - Display module and display screen - Google Patents
Display module and display screen Download PDFInfo
- Publication number
- CN218632090U CN218632090U CN202222848418.0U CN202222848418U CN218632090U CN 218632090 U CN218632090 U CN 218632090U CN 202222848418 U CN202222848418 U CN 202222848418U CN 218632090 U CN218632090 U CN 218632090U
- Authority
- CN
- China
- Prior art keywords
- bonding pad
- led chip
- pad
- display module
- negative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model discloses a display module and a display screen, wherein the display module comprises a substrate, a black conductive connecting layer and a LED chip, and the front side of the substrate is provided with a positive bonding pad and a negative bonding pad; the black conductive connecting layer is respectively arranged on the positive electrode bonding pad and the negative electrode bonding pad and covers the positive electrode bonding pad and the negative electrode bonding pad; the LED chip comprises a positive electrode and a negative electrode, wherein the positive electrode and the negative electrode are respectively fixed on the positive bonding pad and the negative bonding pad through black conductive connecting layers and are respectively and electrically connected with the positive bonding pad and the negative bonding pad. The utility model discloses a black electrically conducts the articulamentum and covers anodal pad and negative pole pad for anodal pad and the unable reflection light of negative pole pad avoid influencing display module's luminous effect, are favorable to improving display module's contrast.
Description
Technical Field
The utility model relates to a LED shows technical field, especially relates to a display module and display screen.
Background
With the rapid development of the LED display technology, the LED display screen is widely applied to various scenes in life, and the requirements of people On the display effect of the LED display screen are more and more strict, so that the LED display screen has smaller pixel point spacing, the COB (Chip On Board) packaging technology is widely applied to the manufacturing process of the LED display screen.
COB packaging technology is directly integrated the LED chip on the PCB board, and its advantage lies in can realizing littleer pixel interval, directly improves the resolution ratio of LED display screen, and the heat that produces also can be through the PCB board effluvium in the use, and heat dispersion is better. However, since the metal pads corresponding to the electrodes of the LED chip need to be disposed on the PCB, when the LED chip emits light or is irradiated by external light, the metal pads reflect the light, and thus the contrast ratio is low during display.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a display module and display screen covers anodal pad and negative pole pad through black electrically conductive articulamentum for anodal pad and the unable reflection light of negative pole pad avoid influencing display module's luminous effect, are favorable to improving display module's contrast.
In order to achieve the above object, the utility model discloses a display module, include:
the front surface of the substrate is provided with a positive electrode bonding pad and a negative electrode bonding pad;
the black conductive connecting layer is respectively arranged on the positive electrode bonding pad and the negative electrode bonding pad and covers the positive electrode bonding pad and the negative electrode bonding pad;
the LED chip comprises a positive electrode and a negative electrode, the positive electrode is connected with the negative electrode through the black conductive connecting layer, the positive electrode is fixed on the positive bonding pad and the negative bonding pad respectively, and the positive bonding pad is electrically connected with the negative bonding pad.
Optionally, a black coating is provided on the front surface of the substrate on which the LED chip is fixed, and the black coating at least covers the region except for the positive electrode bonding pad, the negative electrode bonding pad, and the LED chip.
Optionally, the height of the top surface of the black coating is greater than or equal to the height of the top surfaces of the positive electrode pad and the negative electrode pad.
Optionally, the display module further comprises a lens, and the lens wraps at least the front surface and the side surface of the LED chip.
Optionally, the lens is a rubber bead, and an outer surface of the rubber bead is in a convex lens shape.
Optionally, a black coating is provided on the front surface of the substrate on which the LED chip is fixed, and the black coating covers at least an area except for the positive electrode pad, the negative electrode pad, and the lens.
Optionally, the display module further includes a transparent insulating packaging adhesive layer, the insulating packaging adhesive layer is disposed on the front surface of the LED chip fixed on the substrate, and covers the positive pad, the negative pad, the black conductive connecting layer and the LED chip.
Optionally, a black light-transmitting layer is arranged on the top surface of the insulating packaging adhesive layer, and the black light-transmitting layer covers all regions of the top surface of the insulating packaging adhesive layer.
Optionally, the number of the LED chips is multiple, the number of the positive pads and the number of the negative pads are the same as the number of the LED chips, and each LED chip corresponds to one positive pad and one negative pad.
In order to achieve the above object, the present invention also provides a display screen, including the display module as described above.
The utility model discloses a display module includes the base plate, black electrically conductive articulamentum and LED chip, wherein, be equipped with anodal pad and negative pole pad on the front of base plate, and black electrically conductive articulamentum covers the top surface at anodal pad and negative pole pad respectively, the anodal electrode and the negative pole electrode of LED chip are fixed with anodal pad and negative pole pad respectively through black electrically conductive articulamentum, and because black electrically conductive articulamentum has electrically conductive characteristic, consequently can produce between electrode and the pad and be connected. The utility model discloses a black electrically conducts the articulamentum and has both acted as the effect of solder, realized absorbing the irradiant function on the pad again, but black electrically conducts the articulamentum direct coating on anodal pad and negative pole pad, be favorable to reducing the loaded down with trivial details degree to the requirement of processing procedure technology and reduction technology, when the unable reflection light of anodal pad and negative pole pad, can avoid influencing display module's luminous effect, be favorable to improving display module's contrast, and then can obtain better display effect under lower display brightness, be favorable to reducing the consumption.
Drawings
Fig. 1 is a schematic structural diagram of a display module according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a display module according to another embodiment of the present invention.
Fig. 3 is a schematic view of a manufacturing process of a display module according to an embodiment of the present invention.
Fig. 4 is a flowchart illustrating a method for manufacturing a display module according to an embodiment of the present invention.
Detailed Description
In order to explain the technical contents, structural features, objects and effects of the present invention in detail, the following description is made with reference to the accompanying drawings.
Referring to fig. 1 and 3, the present invention discloses a display module, which includes a substrate 1, a black conductive connection layer 5 and an LED chip 4, wherein a positive pad 2 and a negative pad 3 are disposed on the front surface of the substrate 1; the black conductive connecting layer 5 is respectively arranged on the positive electrode bonding pad 2 and the negative electrode bonding pad 3 and covers the positive electrode bonding pad 2 and the negative electrode bonding pad 3; the LED chip 4 comprises a positive electrode and a negative electrode, wherein the positive electrode and the negative electrode are respectively fixed on the positive bonding pad 2 and the negative bonding pad 3 through black conductive connecting layers 5 and are respectively electrically connected with the positive bonding pad 2 and the negative bonding pad 3.
The utility model discloses a display module includes base plate 1, black conductive connection layer 5 and LED chip 4, wherein, be equipped with anodal pad 2 and negative pole pad 3 on base plate 1's the front, and black conductive connection layer 5 covers respectively at anodal pad 2 and negative pole pad 3, the anodal electrode and the negative pole electrode of LED chip 4 are fixed with anodal pad 2 and negative pole pad 3 respectively through black conductive connection layer 5, and because black conductive connection layer 5 has the electrically conductive characteristic, consequently can produce the electricity between electrode and the pad and be connected. The utility model discloses a black conductive connection layer 5 had both acted as the effect of solder, realized absorbing the irradiant function on the pad again, and black conductive connection layer 5 can direct coating on anodal pad 2 and negative pole pad 3, be favorable to reducing the requirement to the processing procedure technology and reduce the loaded down with trivial details degree of technology, when anodal pad 2 and the unable reflection light of negative pole pad 3, can avoid influencing display module's luminous effect, be favorable to improving display module's contrast, and then can obtain better display effect under lower display brightness, be favorable to reducing the consumption.
It can be understood that the substrate 1 has a plate-shaped structure, and a surface thereof for fixing the LED chip 4 is a front surface, which is a light emitting surface and is disposed toward the display direction.
Specifically, the black conductive connection layer 5 is formed by black conductive silver paste, and the black conductive silver paste may be a material obtained by adding melanin to conductive silver paste, or may be a material obtained by adding black iron powder to conductive silver paste.
Referring to fig. 3, specifically, the number of the LED chips 4 is multiple, the number of the positive electrode pads 2 and the number of the negative electrode pads 3 are the same as the number of the LED chips 4, and each LED chip 4 corresponds to one positive electrode pad 2 and one negative electrode pad 3.
The types of the LED chips 4 include a red LED chip, a blue LED chip, and a green LED chip. The red LED chip, the blue LED chip, and the green LED chip may form a pixel unit that can emit illumination of different colors by mixing red light, blue light, and green light.
Specifically, the plurality of LED chips 4 are regularly arranged on the substrate 1 to form an array of LED chips 4, and the array of LED chips 4 has the same row pitch and the same column pitch.
In this application, LED chip 4 is flip chip, directly is connected with the positive negative pad electricity on the base plate 1 through positive negative electrode, does not need the bonding wire operation, reduces the area that every LED chip 4 occupy the pad.
Referring to fig. 2, in some embodiments, a black coating 6 is disposed on the front surface of the substrate 1 to which the LED chip 4 is fixed, and the black coating 6 covers at least an area except the positive electrode pad 2, the negative electrode pad 3, and the LED chip 4. By arranging the black coating 6 on the front surface of the substrate 1, the illumination irradiated on the front surface of the substrate 1 can be absorbed, the contrast of the display module is further improved, and the black coating 6 can cover the color of the substrate 1, which is beneficial to improving the ink color consistency between the LED chip 4 and the surface of the substrate 1.
It is understood that the black coating 6 may be a cured epoxy black glue, or other black materials with insulating properties, and the application is not limited thereto.
Specifically, the positive electrode pad 2 and the negative electrode pad 3 have a sheet-like structure, and when they are provided on the front surface of the substrate 1, they may be recessed on the front surface of the substrate 1 or may be raised on the front surface of the substrate 1; and when positive pad 2 and negative pole pad 3 locate the positive of base plate 1 and the top surface is on the surface of base plate 1, the height that highly is greater than or more than or equal to the top surface of positive pad 2 and negative pole pad 3 of black coating 6 to shield the side of positive pad 2 and negative pole pad 3, avoid the side reflection illumination of positive pad 2 and negative pole pad 3, influence the display effect.
Preferably, in order to avoid the black coating 6 from blocking the normal light emission of the LED chip 4, the black coating 6 may be disposed to have a top surface flush with the top surfaces of the positive electrode pad 2 and the negative electrode pad 3, wherein the top surfaces of the positive electrode pad 2 and the negative electrode pad 3 are the side surfaces that are electrically connected to the electrodes of the LED chip 4.
Referring to fig. 1 and 2, in some embodiments, the present invention further includes a lens 9, the lens 9 at least covers the front and the side of the LED chip 4, the lens 9 can be formed by a transparent insulating material with high transmittance, the LED chip 4 can be protected by covering the lens 9, and the illumination of the LED chip 4 can be transmitted through the lens 9, and the lens 9 further has a refraction effect, when the illumination emitted by the LED chip 4 is transmitted through the lens 9, the illumination is refracted in a direction away from the LED chip 4, so as to enlarge an illumination angle.
It is understood that the shape of the lens 9 is not limited in particular, and may be cubic, convex, irregular, etc.
Preferably, the lens 9 may be lenticular in order to avoid the refracted illumination being blocked by the lens 9.
Preferably, the lens 9 is a glue bead, which may be a transparent glue bead, formed by dripping a glue bead on the LED chip 4. The glue beads can wrap the front and the side of the LED chip 4 and can also flow into the middle of two pins on the bottom surface of the LED chip 4, so that the LED chip 4 is stabilized, and the glue beads are convenient to manufacture.
Referring to fig. 1, in this embodiment, since the lens 9 is disposed, the black coating can only cover the front surface of the substrate 1 except for the lens 9 and the positive electrode pad 2 and the negative electrode pad 3, and the lens 9 is disposed to prevent the black coating from being applied to the LED chip 4.
Referring to fig. 1 to 3, in some embodiments, the present invention further includes a transparent insulating packaging adhesive layer 7, the insulating packaging adhesive layer 7 is disposed on the front surface of the substrate 1 fixed with the LED chip 4, and covers the positive electrode bonding pad 2, the negative electrode bonding pad 3, the black conductive connecting layer 5 and the LED chip 4. The electronic components on the front surface of the substrate 1 are packaged through the insulating packaging glue layer 7, so that air is isolated, and the electronic components on the front surface of the substrate 1 are prevented from being affected with damp or being damaged due to dust particles.
Specifically, the insulating packaging adhesive layer 7 can be formed by molding or spraying epoxy adhesive, and the top surface thereof is a horizontal plane and the height thereof exceeds the height of the LED chip 4, so as to completely package the LED chip 4, avoid oxidation of the LED chip 4 and prolong the service life.
Referring to fig. 1 and 2, further, a black transparent layer 8 is disposed on the top surface of the insulating packaging adhesive layer 7, and the black transparent layer 8 covers all areas of the top surface of the insulating packaging adhesive layer 7. The black light-transmitting layer 8 can improve the surface uniformity of the module and improve the contrast.
Specifically, the black transparent layer 8 may be a black transparent film adhered to the top surface of the insulating packaging adhesive layer 7, or may be a black transparent adhesive coated on the top surface of the insulating packaging adhesive layer 7.
The following describes a manufacturing process of the display module according to the present invention with reference to fig. 3 and 4:
s1, providing a substrate 1, wherein a positive electrode bonding pad 2 and a negative electrode bonding pad 3 are arranged on the front surface of the substrate 1, and black conductive adhesive is printed on the positive electrode bonding pad 2 and the negative electrode bonding pad 3 in a steel mesh printing mode to form a black conductive connecting layer 5;
s2, fixing the LED chip 4 on the positive electrode bonding pad 2 and the negative electrode bonding pad 3 corresponding to the substrate 1 in a mass transfer mode;
s3, carrying out lens glue packaging on the LED chip 4, wherein the packaging mode can be steel mesh printing or glue dispensing;
s4, arranging epoxy black glue on the front surface of the substrate 1 in a dispensing manner, and covering the areas except the lens glue, the positive electrode bonding pad 2 and the negative electrode bonding pad 3 to form a black coating 6;
s5, forming a transparent insulating packaging adhesive layer 7 on the front surface of the substrate 1 in an epoxy adhesive mould pressing mode;
and S6, adhering a black light-transmitting film or coating black light-transmitting glue on the top surface of the insulating packaging glue layer 7 to form a black light-transmitting layer 8.
Referring to fig. 1 and 2, in some embodiments, the sequence of step S3 and step S4 may be interchanged, and when step S4 precedes step S3, the coverage area of the epoxy black glue may be the area of the front surface of the substrate 1 except for the LED chip 4, the positive pad 2 and the negative pad 3, so that the black coating 6 may cover the vacant area of the front surface of the substrate 1 as much as possible. Whereas step S3 precedes step S4, which is advantageous for protecting the LED chip 4 during the step of forming the black coating 6.
The utility model also discloses a display screen, include as above display module.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, which is defined by the appended claims.
Claims (10)
1. A display module, comprising:
the front surface of the substrate is provided with a positive electrode bonding pad and a negative electrode bonding pad;
the black conductive connecting layer is respectively arranged on the positive electrode bonding pad and the negative electrode bonding pad and covers the positive electrode bonding pad and the negative electrode bonding pad;
the LED chip comprises a positive electrode and a negative electrode, wherein the positive electrode and the negative electrode pass through the black conductive connecting layer and are respectively fixed on the positive bonding pad and the negative bonding pad, and are respectively electrically connected with the positive bonding pad and the negative bonding pad.
2. The display module of claim 1,
the LED packaging structure is characterized in that a black coating is arranged on the front face, fixed with the LED chip, of the substrate, and at least covers the regions except the positive bonding pad, the negative bonding pad and the LED chip.
3. The display module of claim 2,
the height of the top surface of the black coating is greater than or equal to the height of the top surfaces of the positive electrode bonding pad and the negative electrode bonding pad.
4. The display module of claim 1,
the LED chip comprises an LED chip and is characterized by further comprising a lens, wherein the lens at least wraps the front surface and the side surface of the LED chip.
5. The display module of claim 4,
the lens is a rubber bead, and the outer surface of the rubber bead is in a convex lens shape.
6. The display module of claim 4,
the LED chip comprises a substrate and is characterized in that a black coating is arranged on the front face of the substrate, wherein the LED chip is fixed on the front face of the substrate, and the black coating at least covers the regions except the positive electrode bonding pad, the negative electrode bonding pad and the lens.
7. The display module of claim 1,
the LED packaging structure is characterized by further comprising a transparent insulating packaging adhesive layer, wherein the insulating packaging adhesive layer is arranged on the front face of the LED chip, the substrate is fixed on the front face of the LED chip, and covers the positive bonding pad, the negative bonding pad, the black conductive connecting layer and the LED chip.
8. The display module of claim 7,
and a black euphotic layer is arranged on the top surface of the insulating packaging adhesive layer and covers all areas of the top surface of the insulating packaging adhesive layer.
9. The display module of claim 1,
the LED chip structure comprises a plurality of LED chips, wherein the number of the LED chips is consistent with that of the LED chips, and each LED chip corresponds to one anode bonding pad and one cathode bonding pad.
10. A display screen comprising a display module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222848418.0U CN218632090U (en) | 2022-10-27 | 2022-10-27 | Display module and display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222848418.0U CN218632090U (en) | 2022-10-27 | 2022-10-27 | Display module and display screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218632090U true CN218632090U (en) | 2023-03-14 |
Family
ID=85474554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222848418.0U Active CN218632090U (en) | 2022-10-27 | 2022-10-27 | Display module and display screen |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218632090U (en) |
-
2022
- 2022-10-27 CN CN202222848418.0U patent/CN218632090U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102157506A (en) | Light emitting device | |
| CN108878622B (en) | LED packaging structure, backlight module and display device | |
| JP2009206261A (en) | Semiconductor light-emitting device | |
| CN113130466A (en) | LED display module and manufacturing method thereof | |
| CN114220902B (en) | LED light source assembly and manufacturing method thereof | |
| CN212209495U (en) | LED integrated packaging structure and display | |
| CN110289347A (en) | Mould LED display module and its manufacturing method | |
| CN218632090U (en) | Display module and display screen | |
| CN211238290U (en) | CSP packaging structure and lamp strip based on CSP packaging structure | |
| US11024780B2 (en) | LED light tube | |
| CN216671632U (en) | Integrated packaged high-power LED | |
| CN211238246U (en) | RGBW integrated circuit encapsulation lamp pearl | |
| CN211957678U (en) | LED lamp bead, LED module and LED display screen | |
| CN113053865A (en) | LED chip assembly, LED device and manufacturing method thereof | |
| CN210398448U (en) | Four-side light-emitting light source with large light-emitting angle and backlight module | |
| CN210402971U (en) | Four-side light emitting source and backlight module | |
| CN207398144U (en) | A kind of LED component, display module and display screen | |
| CN206282882U (en) | LED package assemblings | |
| CN214672662U (en) | N-in-one LED packaging device and LED display module | |
| CN110911540A (en) | CSP packaging structure, manufacturing method and light bar based on CSP packaging structure | |
| CN218582959U (en) | Backlight module | |
| CN211238245U (en) | TOP type RGBW integrated circuit packaging lamp pearl | |
| CN214753824U (en) | N-in-one LED packaging device and LED display module | |
| CN114447192B (en) | Display module manufacturing method, display module and display screen | |
| CN217086562U (en) | Packaging device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |