CN114447192B - Display module manufacturing method, display module and display screen - Google Patents
Display module manufacturing method, display module and display screen Download PDFInfo
- Publication number
- CN114447192B CN114447192B CN202210070751.5A CN202210070751A CN114447192B CN 114447192 B CN114447192 B CN 114447192B CN 202210070751 A CN202210070751 A CN 202210070751A CN 114447192 B CN114447192 B CN 114447192B
- Authority
- CN
- China
- Prior art keywords
- area
- adhesive layer
- light emitting
- display module
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 239000012790 adhesive layer Substances 0.000 claims abstract description 95
- 239000000853 adhesive Substances 0.000 claims abstract description 31
- 230000001070 adhesive effect Effects 0.000 claims abstract description 31
- 230000000903 blocking effect Effects 0.000 claims abstract description 20
- 230000009969 flowable effect Effects 0.000 claims abstract description 11
- 239000003292 glue Substances 0.000 claims description 53
- 239000010410 layer Substances 0.000 claims description 27
- 239000000843 powder Substances 0.000 claims description 15
- 238000007639 printing Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 13
- 229910000831 Steel Inorganic materials 0.000 claims description 6
- 239000010959 steel Substances 0.000 claims description 6
- 238000002834 transmittance Methods 0.000 claims description 6
- 238000007650 screen-printing Methods 0.000 claims description 5
- 239000003086 colorant Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 229920006335 epoxy glue Polymers 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a manufacturing method of a display module, which comprises the steps of covering a first adhesive layer on a first area of a display panel to form a first blocking wall for a second area of the display panel, wherein the first area comprises the upper surface of a light-emitting chip, the first adhesive layer can transmit light rays emitted by the light-emitting chip, and then, adding flowable adhesive on the second area to form a second adhesive layer covering the second area; the first adhesive layer covers the upper surface of the light-emitting chip, so that flowing adhesive can be blocked, and the flowing adhesive is prevented from flowing to the upper surface of the light-emitting chip, so that the light emission of the light-emitting chip is influenced. The invention has the advantages of simple manufacturing process, easy realization, higher manufacturing efficiency and low cost by dividing the area into the packaging adhesive layers. In addition, the invention also discloses a display module manufactured by the manufacturing method and a display screen comprising the display module.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display module manufacturing method, a display module and a display screen.
Background
At present, in the field of Mini-LED RGB full-color display, in order to make the black matrix area of the display module and the ink color of the light emitting chip area as consistent as possible after the light emitting chip is turned off, a mold pressing packaging process is proposed in the prior art, and a black packaging layer is integrally formed on the upper surfaces of the light emitting chip array and the black matrix. However, the molding packaging process has the disadvantages of high difficulty, difficult realization, low efficiency and high molding packaging cost.
Disclosure of Invention
The invention aims to provide a display module manufacturing method, a display module and a display screen, which are low in cost and simple in process.
In order to achieve the above object, the present invention provides a display module manufacturing method, comprising:
providing a display panel, wherein the display panel is provided with light emitting chips, gaps are arranged among the light emitting chips, the display panel is provided with a first area and a second area except the first area, and the first area comprises the light emitting chips as the upper surface of a light emitting surface;
covering a first adhesive layer on the first area to form a first blocking wall for the second area, wherein the first adhesive layer can penetrate light rays emitted by the light emitting chip;
and adding flowable flowing glue in the second area, wherein the first blocking wall blocks the flowing glue from flowing to the first area, so that the flowing glue forms a second glue layer covering the second area.
In some embodiments, the upper surface of the first glue layer protrudes from the upper surface of the second glue layer.
In some embodiments, the covering the first adhesive layer on the first area includes: printing glue on the first area by adopting a steel screen printing process in a vacuum environment; and curing the printing adhesive to obtain the first adhesive layer.
In some embodiments, the light emitting chips on the display panel are arranged in a plurality of rows and columns, and the first region further includes sides of the light emitting chips and gaps between the light emitting chips in the column direction.
In some embodiments, the first area further includes an edge position of the display panel, and the first adhesive layer covers the edge position to form a second blocking wall, where the second blocking wall is used for blocking the flowing adhesive from flowing out of the display panel.
In some embodiments, before the adding of the flowable adhesive in the second region, further comprising: and coating glue on the surface of the display panel, on which the light-emitting chip is arranged, so that the glue adheres the electrode of the light-emitting chip and the surface of the display panel, on which the light-emitting chip is arranged.
In some embodiments, the first glue layer and the second glue layer are black glue layers, and the light transmittance of the first glue layer is greater than that of the second glue layer.
In some embodiments, an upper surface of the second adhesive layer protrudes from an upper surface of the light emitting chip.
In order to achieve the above object, the present invention also provides a display module manufactured by the manufacturing method of the display module.
In order to achieve the above object, the present invention further provides a display screen, which includes at least one display module as described above, and a polarizer is disposed on an upper surface of the display module.
The invention provides a manufacturing method of a display module, which comprises the steps of covering a first adhesive layer on a first area of a display panel to form a first blocking wall for a second area of the display panel, wherein the first area comprises the upper surface of a light-emitting chip, the first adhesive layer can transmit light rays emitted by the light-emitting chip, and then, adding flowable adhesive on the second area to form a second adhesive layer covering the second area; the first adhesive layer covers the upper surface of the light-emitting chip, so that flowing adhesive can be blocked, and the flowing adhesive is prevented from flowing to the upper surface of the light-emitting chip, so that the light emission of the light-emitting chip is influenced. The invention has the advantages of simple manufacturing process, easy realization, higher manufacturing efficiency and low cost by dividing the area into the packaging adhesive layers.
Drawings
FIG. 1 is a schematic diagram of a display module manufacturing process according to an embodiment of the invention;
FIG. 2 is a schematic view illustrating another angle of the manufacturing process of the display module according to an embodiment of the invention;
fig. 3 is a side view showing a partial structure of a display module according to an embodiment of the present invention.
Detailed Description
For a detailed description of the contents, construction features, achieved objects and effects of the present invention, a technical solution of the embodiments of the present invention will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "row", "column", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of description of the present invention and for simplification of description, and thus should not be construed as limitations of the protection content of the present invention.
The following describes the technical scheme of the embodiment of the present invention in detail with reference to the accompanying drawings:
referring to fig. 1 to 3, a method for manufacturing a display module according to an embodiment of the invention includes the following steps S1 to S5.
S1, arranging the light-emitting chips 2 on the substrate 1 by adopting a mass transfer process, and correspondingly welding electrodes (pins) 21 of the light-emitting chips 2 with bonding pads (not shown) on the substrate 1 to obtain the display panel comprising the light-emitting chips 2 and the substrate 1. The light emitting chips 2 on the substrate 1 are arranged with gaps therebetween, and the light emitting chips 2 are arranged in a plurality of rows and columns as shown in fig. 1 (a).
Specifically, the substrate 1 may be a printed circuit board (Printed Circuit Board, PCB board) or the like, the electrode 21 of the light emitting chip 2 is electrically connected with a bonding pad on the substrate 1 through soldering tin, the light emitting chip 2 may be a Mini-LED chip, and may be a red light chip, a blue light chip, a green light chip or the like, for example, the light emitting chip comprises a plurality of pixel points, and each three light emitting chips of a red light chip, a blue light chip and a green light chip form a pixel point to realize RGB full-color display. The light emitting chip 2 may be a flip chip, a front-mounted chip, or a flip chip.
It is understood that the arrangement of the light emitting chips 2 on the upper surface of the substrate 1 is not limited to the mass transfer process, and the light emitting chips 2 may be mounted one by one on the upper surface of the substrate 1 by using, for example, a surface mount device (Surface Mounted Devices, SMD) process according to a preset arrangement rule, so as to obtain the display panel including the light emitting chips 2 and the substrate 1.
S2, glue 3 is applied to the surface 11 (i.e., the upper surface) of the substrate 1 on which the light emitting chip 2 is provided, so that the glue 3 adheres the electrode 21 of the light emitting chip 2 to the surface 11, as shown in fig. 1 and fig. 2 (b). Since the light emitting chip 2 is fixed to the bonding pad on the substrate 1 by solder, the glue 3 is applied to the surface 11, so that the electrode 21 of the light emitting chip 2 is bonded to the bonding pad on the substrate 1 by the glue 3, and the light emitting chip 2 can be further fixed. The glue 3 may be transparent epoxy glue, black epoxy glue, or the like, and the thickness of the glue 3 may be based on the upper surface of the electrode 21 covering all the light emitting chips 2, as shown in fig. 2 (b). In some embodiments, the thickness of the glue 3 is 20-40um, but not limited thereto. When the glue 3 is a black glue, the reflection of light by the electrode 21 can be reduced, so that a better display effect can be obtained.
S3, covering the first adhesive layer 4 on the first area of the display panel to form a first blocking wall for the second area, wherein the first area comprises the upper surface of the light emitting chip 2 on the display panel as a light emitting surface, the first blocking wall is the adhesive layer side surface of the first adhesive layer 4 adjacent to the upper surface of the light emitting chip 2, and can block flowing adhesive in the second area from flowing to the upper surface of the light emitting chip 2 and also block flowing adhesive from flowing to the upper surface of the first adhesive layer 4 deviating from the light emitting chip 2.
In some embodiments, the first region may include the light emitting chips 2 on the display panel as the upper surface of the light emitting surface, the sides of the light emitting chips 2, and the gaps between the light emitting chips 2 in the column direction, and the first adhesive layer 4 covers the upper surface of the light emitting chips 2, the sides of the light emitting chips 2, and the gaps between the light emitting chips 2 in the column direction, so that the flow of the flowing adhesive in the second region can be better blocked, and simultaneously, the first adhesive layer 4 covering the gaps between the sides of the light emitting chips 2 and the light emitting chips 2 can form a diversion trench, which can provide a guiding effect for the flow of the flowing adhesive, as shown in (c) in fig. 1 and 2; the first adhesive layer 4 can transmit the light emitted by the light emitting chip 2.
The "column direction" refers to a direction perpendicular to the "row direction" among the light emitting chips 2 arranged in a plurality of rows and a plurality of columns, and may refer to a direction in which the light emitting chips 2 are arranged as pixels in the display panel, and is not particularly limited to the longitudinal direction.
In some embodiments, the first region may include the light emitting chip 2 on the display panel as the upper surface of the light emitting surface, the side surface of the light emitting chip 2, and the gap between the light emitting chips 2 in each pixel, so that the difficulty of disposing the first adhesive layer 4 on the first region can be reduced.
In some embodiments, the printing paste is printed on the first area using a steel screen printing process in a vacuum environment; then, the printing paste is cured by baking, and the first paste layer 4 is obtained. The steel screen printing is not easy to generate bubbles in the vacuum environment, and the surface of the obtained first adhesive layer 4 is smoother. The printing glue is glue with poor fluidity, and has light uniformity, so that the luminous efficiency of the luminous chip 2 can be improved.
S4, adding flowable flowing glue in a second area of the display panel to enable the flowing glue to be leveled in the second area, wherein in the process, the first blocking wall blocks the flowing glue from flowing to the first area; the flowable adhesive is then cured to form a uniform, flat second adhesive layer 5 covering a second area of the display panel other than the first area, as shown in fig. 1 and 2 (d). At this time, the second adhesive layer 5 and the first adhesive layer 4 form an adhesive layer covering the entire upper surface of the display panel.
The first adhesive layer 4 and the second adhesive layer 5 may be black adhesive layers, so that the surface of the manufactured display module has no obvious regional color difference, and the display module has better aesthetic property, and of course, the first adhesive layer 4 is not limited to the black adhesive layers. The second adhesive layer 5 does not allow light to pass through, so as to better block light on the side surface of the light emitting chips 2 and prevent light color crosstalk between the light emitting chips 2.
To ensure the light blocking effect of the second glue layer 5, in some embodiments, the upper surface of the second glue layer 5 is higher than the upper surface of the light emitting chip 2; meanwhile, to prevent the flowing glue from flowing to the upper surface of the first glue layer 4, the light of the light emitting chip 2 is blocked from being transmitted, and in some embodiments, the upper surface of the second glue layer 5 is equal to or lower than the upper surface of the first glue layer 4.
In some embodiments, the thickness of the second glue layer 5 is 50-150um and the thickness of the first glue layer 4 is 150-400 um.
S5, sticking OCA optical adhesive (optically clear adhesive, OCA) polaroid 6 on the upper surfaces of the first adhesive layer 4 and the second adhesive layer 5, as shown in (e) in fig. 1 and 2.
The first area includes the edge position of the display panel, and in order to prevent the flowing paste from flowing to the edge of the display panel and even out of the display panel, in some embodiments, a second blocking wall (not shown) is further formed at the edge position of the display panel by using the printing paste before step S4 to block the flowing paste. That is, the first adhesive layer 4 includes a first blocking wall extending in a longitudinal direction and a second blocking wall located at an edge position of the display panel.
Here, the "edge position of the display panel" refers to an area other than the area on the display panel where the light emitting chips 2 of the plurality of rows and the plurality of columns are arranged.
In some embodiments, the "edge position of the display panel" refers to several rows and columns of the light emitting chips 2 where the display panel is located at the edge.
In the above embodiment, the first area is the gap between the upper surface of the light emitting chips 2 on the display panel and the light emitting chips 2 in the column direction, and the second area is the chip gap except the gap between the light emitting chips 2 in the column direction, it is understood that the first area may also only include the upper surface of the light emitting chips 2 on the display panel, at this time, the printing glue may still be printed on the first area by using the steel screen printing process, only the pattern of the steel screen needs to be changed to adapt to the size of the upper surface of the light emitting chips 2 and the spacing between the light emitting chips 2, and the flowing glue with good fluidity may still be added in the gap between the light emitting chips 2, and the uniform and flat second glue layer 5 may be obtained by the flowing glue self-leveling method.
In some embodiments, in the off state of the light emitting chip 2, the ink color presented on the upper surface of the second adhesive layer 5 is almost the same as the ink color presented on the upper surface of the first adhesive layer 4, and the appearance is better. Specifically, the chromaticity of the printing adhesive and the flowing adhesive is controlled by controlling the proportion of the black powder in the printing adhesive and the proportion of the black powder in the flowing adhesive based on the base colors of the first area and the second area, so that the sum of the base color of the first area and the chromaticity of the first adhesive layer 4 is equal to the sum of the base color of the second area and the chromaticity of the second adhesive layer 5 as much as possible. For example, the first region has a background color of s1, the printing paste has a black toner ratio (the ratio of black toner to printing paste) of b1, the second region has a background color of s2, the flowable paste has a black toner ratio (the ratio of black toner to flowable paste) of b2, and the relationship between the black toner ratio and the blackness is x, where b1×xs1=b2×x+s2.
Wherein, the higher the chromaticity, the darker the adhesive layer, the better the light absorption, and the worse the light transmittance; conversely, the less light is absorbed, the better the light transmission.
It can be understood that the chromaticity of the base color s1 of the first area is preferably higher than the chromaticity of the base color s2 of the second area, so that when the sum of the chromaticity of the base color of the first area and the chromaticity of the first adhesive layer 4 is equal to the sum of the chromaticity of the base color of the second area and the chromaticity of the second adhesive layer 5, the chromaticity of the first adhesive layer 4 is lower than the chromaticity of the second adhesive layer 5, so as to further ensure that the first adhesive layer 4 does not affect the light transmission of the light emitting chip 2.
Since the printing adhesive has a certain fluidity before being completely cured, the side edge of the first adhesive layer 4 is in a cambered surface shape (curved surface shape) or an inclined surface shape instead of being absolutely perpendicular to the display panel, and likewise, when the flowing adhesive flows to the edge of the first adhesive layer 4 in the self-leveling process, the side edge position of the finally formed second adhesive layer 5 also presents a cambered surface shape due to the action of the surface tension of the adhesive, so that the concave 7 appears at the joint position of the first adhesive layer 4 and the second adhesive layer 5, and therefore, in some embodiments, before step S5, the black adhesive is filled in the concave 7 to form a third adhesive layer, so that the surface of the display module after encapsulation is more flat and beautiful.
In order to better connect the first adhesive layer 4 and the second adhesive layer 5, the ink color of the packaged display module is more uniform, and the ink color presented on the upper surface of the third adhesive layer is between the ink color presented on the upper surface of the first adhesive layer 4 and the ink color presented on the upper surface of the second adhesive layer 5 when the light-emitting chip 2 is in a extinguished state. That is, a1= (V powder/V groove) ×x+s3< = a2, where a1 is the chromaticity of the first region after covering the first adhesive layer 4, that is, a1=b1×x+s1, a2 is the chromaticity of the second region after covering the second adhesive layer 5, that is, a2=b2×x+s2, s1 is the ground color of the first region, b1 is the black powder ratio of the printing adhesive, s2 is the ground color of the second region, b2 is the black powder ratio of the flowing adhesive, and x is the coefficient of relationship between the black powder ratio and the black chromaticity. s3 is the base color of the area where the depressions 7 are located, V powder=m powder/p, m is the mass of black powder in each depression 7, p is the density of black powder, and V groove is the volume of the depression 7, thus obtaining: a1< = (m powder/p V slot) ×s3< = a2.
In some embodiments, the first adhesive layer 4 and the second adhesive layer 5 may be black adhesive layers, and the light transmittance of the first adhesive layer 4 may be greater than that of the second adhesive layer 5, so that the first adhesive layer 4 can transmit light well, and the second adhesive layer 5 can block the ground color of the second area well.
In some embodiments, to ensure consistency of ink color, an ink color layer may be covered on the first adhesive layer 4 and the second adhesive layer 5, where the ink color layer may be adapted to a height difference between the first adhesive layer 4 and the second adhesive layer 5, so that a display panel covered with the ink color layer is planar, and a material with higher chromaticity and higher light transmittance may be selected, so as to compensate for ink color and reduce an influence on light transmittance as much as possible.
In summary, in the method for manufacturing a display module provided by the present invention, a first blocking wall is formed for a second area of a display panel by covering a first adhesive layer 4 on the first area of the display panel, wherein the first area includes an upper surface of a light emitting chip 2, the first adhesive layer 4 can transmit light emitted by the light emitting chip 2, and then a flowable adhesive is added to the second area to form a second adhesive layer 5 covering the second area; the first adhesive layer 4 covers the upper surface of the light emitting chip 2, so that flowing adhesive can be blocked, and the flowing adhesive is prevented from flowing to the upper surface of the light emitting chip 2, thereby affecting the light emitting of the light emitting chip 2. The invention has the advantages of simple manufacturing process, easy realization, higher manufacturing efficiency and low cost by dividing the area to encapsulate the glue layers 4 and 5. In addition, the second adhesive layer 5 does not allow light to pass through, and the second adhesive layer 5 blocks light on the side surface of the light emitting chips 2 to prevent light color crosstalk between the light emitting chips 2. In addition, based on the ground colors of the first area and the second area, the proportion of the black powder in the first adhesive layer 4 and the proportion of the black powder in the second adhesive layer 5 are controlled, so that the ink color presented on the upper surface of the second adhesive layer 5 is almost the same as the ink color presented on the upper surface of the first adhesive layer 4, and the manufactured display module has no obvious ink color difference on the whole upper surface under the condition that the light-emitting chip 2 is in an extinction state, and has better aesthetic property.
The foregoing disclosure is only illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, which is defined by the appended claims.
Claims (9)
1. A method of manufacturing a display module, comprising:
providing a display panel, wherein the display panel is provided with light emitting chips, gaps are arranged among the light emitting chips, the display panel is provided with a first area and a second area except the first area, and the first area comprises the light emitting chips as the upper surface of a light emitting surface;
covering a first adhesive layer on the first area to form a first blocking wall for the second area, wherein the first adhesive layer can penetrate light rays emitted by the light emitting chip;
adding flowable flowing glue in the second area, wherein the first blocking wall blocks the flowing glue from flowing to the first area, so that the flowing glue forms a second glue layer covering the second area, the upper surface of the first glue layer protrudes out of the upper surface of the second glue layer, and the light transmittance of the first glue layer is larger than that of the second glue layer;
and controlling the proportion of the black powder in the first adhesive layer and the proportion of the black powder in the second adhesive layer based on the ground colors of the first area and the second area, so that the ink color presented on the upper surface of the first adhesive layer is the same as the ink color presented on the upper surface of the second adhesive layer.
2. The method of manufacturing a display module of claim 1, wherein the covering the first adhesive layer at the first area comprises:
printing glue on the first area by adopting a steel screen printing process in a vacuum environment;
and curing the printing adhesive to obtain the first adhesive layer.
3. The display module manufacturing method of claim 1, wherein the light emitting chips on the display panel are arranged in a plurality of rows and a plurality of columns, and the first region further includes sides of the light emitting chips and gaps between the light emitting chips in a column direction.
4. The method of manufacturing a display module according to claim 1, wherein the first region further includes an edge position of the display panel, the first adhesive layer covers the edge position to form a second blocking wall, and the second blocking wall is used for blocking the flowing adhesive from flowing out of the display panel.
5. The display module manufacturing method of claim 1, further comprising, prior to adding flowable glue to the second region:
and coating glue on the surface of the display panel, on which the light-emitting chip is arranged, so that the glue adheres the electrode of the light-emitting chip and the surface of the display panel, on which the light-emitting chip is arranged.
6. The method of manufacturing a display module according to claim 1, wherein the first adhesive layer and the second adhesive layer are black adhesive layers.
7. The method of manufacturing a display module according to claim 6, wherein an upper surface of the second adhesive layer protrudes from an upper surface of the light emitting chip.
8. A display module, characterized in that the display module is manufactured using the display module manufacturing method according to any one of claims 1-7.
9. A display screen comprising at least one display module according to claim 8, wherein the display module has a polarizer on its upper surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210070751.5A CN114447192B (en) | 2022-01-20 | 2022-01-20 | Display module manufacturing method, display module and display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210070751.5A CN114447192B (en) | 2022-01-20 | 2022-01-20 | Display module manufacturing method, display module and display screen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114447192A CN114447192A (en) | 2022-05-06 |
| CN114447192B true CN114447192B (en) | 2023-09-19 |
Family
ID=81367686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210070751.5A Active CN114447192B (en) | 2022-01-20 | 2022-01-20 | Display module manufacturing method, display module and display screen |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114447192B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115346971A (en) * | 2022-08-18 | 2022-11-15 | 苏州晶台光电有限公司 | COB module packaging method |
Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102709450A (en) * | 2012-03-16 | 2012-10-03 | 上舜照明（中国）有限公司 | Dimmable COB (chip on board) light source module |
| CN102738370A (en) * | 2012-07-04 | 2012-10-17 | 深圳市聚飞光电股份有限公司 | Led packaging method |
| CN103378226A (en) * | 2012-04-25 | 2013-10-30 | 展晶科技(深圳)有限公司 | Method for manufacturing light emitting diode |
| CN104916763A (en) * | 2015-05-29 | 2015-09-16 | 广州市鸿利光电股份有限公司 | Packaging method for chip scale packaging LED |
| CN105006511A (en) * | 2015-07-29 | 2015-10-28 | 广州市鸿利光电股份有限公司 | LED package method |
| CN106298754A (en) * | 2016-09-30 | 2017-01-04 | 鸿利智汇集团股份有限公司 | The manufacture method of a kind of CSP lamp bead and CSP lamp bead |
| CN107093658A (en) * | 2016-09-30 | 2017-08-25 | 深圳市玲涛光电科技有限公司 | Light-emitting component, backlight source module and electronic equipment |
| CN107799509A (en) * | 2017-12-01 | 2018-03-13 | 广东省半导体产业技术研究院 | A kind of complete micro- LED chip of spectrum white-light and its fluorescent material painting method |
| WO2018077058A1 (en) * | 2016-10-27 | 2018-05-03 | 佛山市国星光电股份有限公司 | Cob display module and manufacturing method therefor, and led device and manufacturing method therefor |
| CN109192847A (en) * | 2018-09-30 | 2019-01-11 | 华南理工大学 | A kind of recection type CSP LED and preparation method thereof |
| CN111640850A (en) * | 2020-06-01 | 2020-09-08 | 江西兆驰光元科技股份有限公司 | LED display device, preparation method thereof and display equipment |
| CN111640849A (en) * | 2020-06-01 | 2020-09-08 | 江西兆驰光元科技股份有限公司 | LED display device, preparation method thereof and display equipment |
| CN111900242A (en) * | 2020-06-24 | 2020-11-06 | 深圳市聚飞光电股份有限公司 | LED light-emitting piece, manufacturing method thereof and display device |
| CN112635624A (en) * | 2020-12-24 | 2021-04-09 | 宁波升谱光电股份有限公司 | LED light source and preparation method thereof |
| CN113054071A (en) * | 2019-12-28 | 2021-06-29 | 王定锋 | Wide lamp belt manufactured by flip LED chip and manufacturing method |
| CN113048409A (en) * | 2019-12-28 | 2021-06-29 | 王定锋 | Wide light bar manufactured by flip LED chip and manufacturing method |
| CN213936188U (en) * | 2021-01-13 | 2021-08-10 | 广州市鸿利显示电子有限公司 | LED display module and display device |
| CN113253519A (en) * | 2021-06-18 | 2021-08-13 | 惠州市聚飞光电有限公司 | Dot-matrix backlight source structure and display device |
| CN113394327A (en) * | 2021-06-11 | 2021-09-14 | 深圳市洲明科技股份有限公司 | Packaging method and packaging structure of LED display screen and LED display screen |
| CN113488456A (en) * | 2021-06-25 | 2021-10-08 | 深圳市华星光电半导体显示技术有限公司 | Display device and manufacturing method thereof |
| CN113782522A (en) * | 2020-06-09 | 2021-12-10 | 佛山市国星光电股份有限公司 | Display module and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102572819B1 (en) * | 2016-02-23 | 2023-08-30 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | Fabricating method for light emitting module and display device |
-
2022
- 2022-01-20 CN CN202210070751.5A patent/CN114447192B/en active Active
Patent Citations (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102709450A (en) * | 2012-03-16 | 2012-10-03 | 上舜照明（中国）有限公司 | Dimmable COB (chip on board) light source module |
| CN103378226A (en) * | 2012-04-25 | 2013-10-30 | 展晶科技(深圳)有限公司 | Method for manufacturing light emitting diode |
| CN102738370A (en) * | 2012-07-04 | 2012-10-17 | 深圳市聚飞光电股份有限公司 | Led packaging method |
| CN104916763A (en) * | 2015-05-29 | 2015-09-16 | 广州市鸿利光电股份有限公司 | Packaging method for chip scale packaging LED |
| CN105006511A (en) * | 2015-07-29 | 2015-10-28 | 广州市鸿利光电股份有限公司 | LED package method |
| CN106298754A (en) * | 2016-09-30 | 2017-01-04 | 鸿利智汇集团股份有限公司 | The manufacture method of a kind of CSP lamp bead and CSP lamp bead |
| CN107093658A (en) * | 2016-09-30 | 2017-08-25 | 深圳市玲涛光电科技有限公司 | Light-emitting component, backlight source module and electronic equipment |
| WO2018077058A1 (en) * | 2016-10-27 | 2018-05-03 | 佛山市国星光电股份有限公司 | Cob display module and manufacturing method therefor, and led device and manufacturing method therefor |
| CN107994109A (en) * | 2016-10-27 | 2018-05-04 | 佛山市国星光电股份有限公司 | A kind of COB display modules and its manufacture method |
| CN107799509A (en) * | 2017-12-01 | 2018-03-13 | 广东省半导体产业技术研究院 | A kind of complete micro- LED chip of spectrum white-light and its fluorescent material painting method |
| CN109192847A (en) * | 2018-09-30 | 2019-01-11 | 华南理工大学 | A kind of recection type CSP LED and preparation method thereof |
| CN113054071A (en) * | 2019-12-28 | 2021-06-29 | 王定锋 | Wide lamp belt manufactured by flip LED chip and manufacturing method |
| CN113048409A (en) * | 2019-12-28 | 2021-06-29 | 王定锋 | Wide light bar manufactured by flip LED chip and manufacturing method |
| CN111640850A (en) * | 2020-06-01 | 2020-09-08 | 江西兆驰光元科技股份有限公司 | LED display device, preparation method thereof and display equipment |
| CN111640849A (en) * | 2020-06-01 | 2020-09-08 | 江西兆驰光元科技股份有限公司 | LED display device, preparation method thereof and display equipment |
| CN113782522A (en) * | 2020-06-09 | 2021-12-10 | 佛山市国星光电股份有限公司 | Display module and manufacturing method thereof |
| CN111900242A (en) * | 2020-06-24 | 2020-11-06 | 深圳市聚飞光电股份有限公司 | LED light-emitting piece, manufacturing method thereof and display device |
| CN112635624A (en) * | 2020-12-24 | 2021-04-09 | 宁波升谱光电股份有限公司 | LED light source and preparation method thereof |
| CN213936188U (en) * | 2021-01-13 | 2021-08-10 | 广州市鸿利显示电子有限公司 | LED display module and display device |
| CN113394327A (en) * | 2021-06-11 | 2021-09-14 | 深圳市洲明科技股份有限公司 | Packaging method and packaging structure of LED display screen and LED display screen |
| CN113253519A (en) * | 2021-06-18 | 2021-08-13 | 惠州市聚飞光电有限公司 | Dot-matrix backlight source structure and display device |
| CN113488456A (en) * | 2021-06-25 | 2021-10-08 | 深圳市华星光电半导体显示技术有限公司 | Display device and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114447192A (en) | 2022-05-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10964674B2 (en) | Micro-LED display panel | |
| AU748146B2 (en) | Contrast enhancement for an electronic display device | |
| CN103208241B (en) | Double-face composite LED (light-emitting diode) display unit plate and packaging method thereof | |
| CN113380776A (en) | Manufacturing method of LED display module | |
| CN112018226A (en) | LED display module and manufacturing method thereof | |
| CN113130466A (en) | LED display module and manufacturing method thereof | |
| CN114639757B (en) | Display module manufacturing method and display module | |
| CN114447192B (en) | Display module manufacturing method, display module and display screen | |
| CN118398746A (en) | LED display panel and manufacturing method thereof | |
| CN210403725U (en) | Light emitting diode packaging assembly | |
| CN109064913B (en) | Embedded integrated line unit based on class stage structure | |
| CN212209495U (en) | LED integrated packaging structure and display | |
| CN111640849A (en) | LED display device, preparation method thereof and display equipment | |
| CN217640573U (en) | LED display module and LED display screen | |
| CN211238245U (en) | TOP type RGBW integrated circuit packaging lamp pearl | |
| CN215834523U (en) | LED light source structure and display device | |
| CN214848669U (en) | High-contrast LED display device and module | |
| CN214541402U (en) | High-density pixel display module | |
| CN213635308U (en) | Display panel and pixel packaging structure | |
| CN111640847A (en) | LED display device, preparation method thereof and display equipment | |
| JP2022544722A (en) | Light-emitting package assemblies, light-emitting modules and display panels | |
| CN214411240U (en) | LED packaging structure, LED module and LED display screen | |
| CN218632090U (en) | Display module and display screen | |
| CN216288444U (en) | LED chip and LED display unit | |
| CN217157595U (en) | LED display module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |