CN118398746A - LED display panel and manufacturing method thereof - Google Patents
LED display panel and manufacturing method thereof Download PDFInfo
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- CN118398746A CN118398746A CN202410187612.XA CN202410187612A CN118398746A CN 118398746 A CN118398746 A CN 118398746A CN 202410187612 A CN202410187612 A CN 202410187612A CN 118398746 A CN118398746 A CN 118398746A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to an LED display panel and a manufacturing method thereof, wherein the LED display panel comprises a substrate; the pixel points are arranged on the substrate and comprise a plurality of LED chips emitting blue light, red light and green light; the black glue forming layer is positioned in the area between the LED chips, the ejection light surface of each LED chip is exposed out of the black glue forming layer, and the black glue forming layer is concave between the LED chips; and the light-transmitting glue forming layer is arranged above the black glue forming layer, covers the black glue forming layer and the ejection light surface of each LED chip, and consists of at least two layers of sub-glue layers. Therefore, the black glue molding layer can be prevented from covering the ejection light surface of the LED chips as much as possible, the light-emitting effect among the LED chips can be better avoided, and the contrast ratio and the yield can be further improved.
Description
The application relates to a split application of an application patent application with the application date of 2021, 12-month and 21-date, the application number of CN202111571638.7 and the application name of 'LED light source component and manufacturing method thereof'.
Technical Field
The invention relates to the field of display, in particular to an LED display panel and a manufacturing method thereof.
Background
COB (Chip On Board) LEDs (Light-Emitting diodes) and COG (Chip On Glass) LEDs are used as an active Light Emitting display technology, and have the advantages of high brightness and wide color gamut. Under the condition of limited maximum brightness, the minimum brightness of the LED screen is reduced, and the key for improving the contrast is formed.
With the reduction of the pixel spacing, the proportion of the display area occupied by the LED chips in the COB LED display screen is larger and larger, and the size of a bonding pad for welding electrodes of the LED chips on a PCB (Printed Circuit Board ) is difficult to match with the size of the LED chips. After the LED chip is welded on the PCB through the bonding pad, part of the bonding pad is not covered by the LED chip, and in the welding process, the adopted welding tin paste is changed into silver after being melted and covered on the surface of the bonding pad, and the silver has the light reflection characteristic, so that the display screen is not black enough in the black screen, namely, the contrast of the display screen is reduced, and the display effect is affected.
Disclosure of Invention
In view of the above-mentioned drawbacks of the related art, the present invention is directed to an LED display panel and a method for manufacturing the same, which aim to improve contrast and yield, and at the same time, to ensure that a black glue molding layer does not cover an ejection light surface of an LED chip as much as possible, and to better avoid crosstalk light effects between the LED chips.
An LED display panel including a substrate; the pixel points are arranged on the substrate and comprise a plurality of LED chips emitting blue light, red light and green light; the black glue forming layer is positioned in the area between the LED chips, the ejection light surface of each LED chip is exposed out of the black glue forming layer, and the black glue forming layer is concave between the LED chips; and the light-transmitting glue forming layer is arranged above the black glue forming layer, covers the black glue forming layer and the ejection light surface of each LED chip, and consists of at least two layers of sub-glue layers.
According to the LED display panel provided by the invention, the ejection light surface of each LED chip is exposed out of the black glue forming layer, the black glue forming layer is concave between the LED chips, and the light-transmitting glue forming layer is formed by at least two layers of sub glue layers, so that the black glue forming layer can be ensured not to cover the ejection light surface of the LED chip as much as possible, the influence of light crosstalk between the LED chips can be better avoided, and the contrast ratio and the yield can be further improved.
The invention also provides a manufacturing method of the LED display panel, which comprises the following steps: providing a substrate, and arranging a plurality of pixel points on the substrate, wherein the pixel points comprise a plurality of LED chips for emitting blue light, red light and green light;
providing a bearing film, arranging a light-transmitting glue forming layer on the bearing film, and arranging a black glue forming layer on the light-transmitting glue forming layer to form a packaging glue layer;
And pressing the packaging adhesive layer onto the substrate in an upward bearing film mode so that the ejection light surface of each LED chip is exposed out of the black adhesive forming layer, the black adhesive forming layer is concave between the LED chips, the transparent adhesive forming layer covers the black adhesive forming layer and the ejection light surface of each LED chip, and in the pressing process, the transparent adhesive forming layer and the black adhesive forming layer are in a semi-solidified state.
According to the manufacturing method of the LED display panel, as the ejection light surface of the LED chip is exposed out of the black glue forming layer, the light emitting rate of the LED chip can be improved, and the power consumption and the heat productivity of the LED chip can be reduced; in addition, the black glue molding layer has certain viscosity, so that the black glue molding layer can be reliably combined with the substrate main body and the LED chip, the air tightness can be improved, and better protection can be formed on the LED chip; meanwhile, gaps between the substrate main body and the LED chip and the like can be fully filled by utilizing the fluidity of the black glue forming layer in the pressing process, so that the contrast ratio can be further improved.
Drawings
FIG. 1 is a schematic diagram of a display panel according to the related art;
fig. 2 is a schematic structural diagram of an LED light source assembly according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a second structure of an LED light source assembly according to an embodiment of the present invention;
fig. 4-1 is a schematic diagram III of an LED light source assembly according to an embodiment of the present invention;
fig. 4-2 is a schematic structural diagram of an LED light source assembly according to an embodiment of the present invention;
fig. 5 is a schematic diagram of an LED light source assembly according to an embodiment of the present invention;
FIG. 6 is a front perspective view of an LED light source assembly according to an embodiment of the present invention;
Fig. 7 is a schematic structural diagram of an LED light source assembly according to an embodiment of the present invention;
Fig. 8 is a schematic flow chart of a manufacturing method of an LED light source assembly according to an embodiment of the present invention;
fig. 9-1 is a schematic structural diagram of a package assembly according to an embodiment of the present invention;
FIG. 9-2 is a schematic view of a substrate assembly according to an embodiment of the present invention;
Fig. 9-3 are schematic structural views of a substrate chuck according to an embodiment of the present invention;
FIGS. 9-4 are schematic views illustrating a structure of a substrate assembly fixed to a substrate holder according to an embodiment of the present invention;
fig. 9-5 are schematic structural diagrams of a package assembly attached to a substrate assembly according to an embodiment of the present invention;
fig. 9-6 are schematic structural diagrams illustrating pressing of a package assembly onto a substrate assembly according to an embodiment of the present invention;
fig. 9-7 are schematic structural diagrams of a package assembly according to an embodiment of the present invention after being pressed onto a substrate assembly;
fig. 9-8 are schematic structural views of an electronic component provided on a back surface of a substrate main body according to an embodiment of the present invention;
FIG. 10-1 is a schematic view of another substrate assembly according to an embodiment of the present invention;
FIG. 10-2 is a schematic view of another substrate holder according to an embodiment of the present invention;
FIG. 10-3 is a schematic view of another substrate assembly according to an embodiment of the present invention secured to a substrate holder;
fig. 10-4 are schematic structural views of another package assembly attached to a substrate assembly according to an embodiment of the present invention;
Fig. 10-5 are schematic structural diagrams illustrating pressing of another package assembly onto a substrate assembly according to an embodiment of the present invention;
fig. 10-6 are schematic structural diagrams of another package assembly according to an embodiment of the present invention after being pressed onto a substrate assembly.
Detailed Description
In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
In the related art, after an LED chip is welded on a PCB board through a bonding pad, part of the bonding pad is not covered by the LED chip, and in the welding process, the adopted welding tin paste is changed into silver after being melted and covers the surface of the bonding pad, and the silver has the light reflection characteristic, so that the display screen is not black enough in the black screen, the contrast of the display screen is reduced, and the display effect is affected. For example, referring to fig. 1, after the LED chip 102 is soldered on the PCB 101, the solder paste becomes silver after being melted and covers the surface of the solder pad to form a silver outer surface 1011, and the contrast of the display screen manufactured by using the LED light source assembly shown in fig. 1 is low due to the reflective characteristic of silver, so that the display effect is poor.
Based on this, the present invention is intended to provide a solution to the above technical problem, the details of which will be described in the following examples.
The embodiment also provides an LED light source assembly with better contrast, as shown in fig. 2, which includes a substrate, a plurality of LED chips 2 and a packaging adhesive layer 3, wherein:
The substrate in the embodiment can be used as a display backboard when being applied to the display field; and when applied to the field of illumination, the light source can be used as an illumination substrate. The substrate in this embodiment includes a substrate body 1, and the substrate body 1 may be made of a rigid material, for example, but not limited to, a phenolic paper laminate, an epoxy paper laminate, a polyester glass felt laminate, an epoxy glass cloth laminate, a BT resin board, and a glass board; the substrate body 1 may be made of a flexible material, and for example, but not limited to, a polyester film, a polyimide film, and a fluorinated ethylene propylene film may be used. In some examples, corresponding circuits may be integrally provided in the substrate body 1 or on the substrate body 1 according to application requirements, for example, may include, but not limited to, circuits connected to the LED chip, driving circuits, and the like. Pads (not shown in the figure) on the front surface of the substrate body 1; it should be understood that the number of pads and the arrangement manner on the front surface of the substrate body 1 in this embodiment can be flexibly set according to the application requirements. For example, a plurality of pads may be provided, and the plurality of pads may be arranged in an array on the substrate body 1, or may be arranged alternately between pads of adjacent rows, or the like. In some examples of this embodiment, the bonding pad may be made of, but not limited to, copper, silver, gold, etc. In this embodiment, the pads on the front surface of the substrate body 1 may be used for, but not limited to, electrical connection with the electrodes of the LED chip. In addition, the LED chips in the embodiment may include at least one of Mini LED chips, micro LED chips, and common LED chips or large-sized LED chips with a size larger than that of the Mini LED chips from the size classification; the distribution of the electrodes of the LED chips can comprise at least one of flip-chip LED chips, forward-mounted LED chips and vertical LED chips.
Referring to fig. 2, each LED chip 2 in the present embodiment is provided on the front surface of the substrate body 1, and the electrode of each LED chip 2 is electrically connected to a corresponding pad on the front surface of the substrate body 1. It should be understood that the electrodes of the LED chip 2 in this embodiment may be electrically connected to the corresponding pads through, but not limited to, conductive paste or solder paste. When a solder paste is used, the solder paste may be, but is not limited to, a lead-containing solder alloy such as a tin-lead (Sn-Pb) based alloy, a tin-lead-bismuth (Sn-Pb-Bi) based alloy, or a tin-lead-silver (Sn-Pb-Ag) based alloy; lead-free solder alloys such as tin-silver (Sn-Ag) based alloys, tin-bismuth (Sn-Bi) based alloys, tin-zinc (Sn-Zn) based alloys, tin-antimony (Sn-Sb), tin-silver-copper (Sn-Ag-Cu) based alloys, or tin-bismuth-silver (Sn-Bi-Ag) based alloys may also be used.
Referring to fig. 2, the encapsulation adhesive layer 3 in the present embodiment includes a black adhesive layer 31 and a light-transmitting adhesive layer 32 disposed on the black adhesive layer 31; the encapsulation layer 3 in the present embodiment is formed by pressing the LED chips 2 on the front surface of the substrate body 1 after they are disposed on the front surface of the substrate body 1. After lamination, the black adhesive layer 31 of the encapsulation adhesive layer 3 covers the area between the LED chips 2 and the bonding pads on the front surface of the substrate body 1, the ejection surface of each LED chip 2 is exposed out of the black adhesive layer 31, and the light-transmitting adhesive layer 32 covers the black adhesive layer 31 and the ejection surface of each LED chip 2. Therefore, after the LED chip 2 is soldered to the corresponding bonding pad on the front surface of the substrate body 1, the black adhesive layer 31 is covered on the surface of the bonding pad, which is black, and compared with the existing solder paste covered on the surface of the bonding pad, the embodiment can absorb the incident light by utilizing the black optical characteristic, thereby avoiding the bonding pad from reflecting light due to the silver on the surface, and improving the contrast ratio. And the ejection light surface of each LED chip 2 is exposed out of the black glue layer 31, so that the light emitting rate of the LED chip 2 can be improved, and the power consumption and the heating value of the LED chip 2 can be reduced. And because the black glue layer 31 also covers the areas between the LED chips 2 on the front surface 1 of the substrate, the contrast of the LED light source assembly is reduced due to reflection of light in the areas outside the bonding pads on the front surface of the substrate main body 1, and the display or illumination effect can be further improved. And it is not necessary to set the substrate body 1 to black by additionally spraying a black ink layer or the like on the front surface thereof, the manufacturing process can be simplified, the manufacturing cost can be reduced, and the thickness of the display panel can be reduced by omitting the black ink layer. In addition, the black adhesive layer adopted in the embodiment has certain viscosity, so that the black adhesive layer is easier to combine with the substrate main body and the LED chip, the air tightness can be improved, and the LED chip can be better protected; meanwhile, gaps between the substrate main body and the LED chip and the like can be fully filled by utilizing the fluidity of the black adhesive layer in the pressing process, so that the contrast ratio can be further improved.
In this embodiment, after the LED chip 2 is disposed on the front surface of the substrate body 1, a surface of the LED chip 2 close to the front surface of the substrate body 1 is a bottom surface of the LED chip 2, a surface opposite to the bottom surface is an ejection surface of the LED chip 2, and a surface between the bottom surface and the ejection surface of the LED chip 2 is a side surface of the LED chip 2.
In some examples of the present embodiment, the black glue layer 31 may cover the side surface of the LED chip 2 entirely, and only the ejection surface of the LED chip 2 is exposed, for example, as shown in fig. 2. And in some application scenarios, as shown in fig. 2, the black glue layer 31 may be flush with the whole of each LED chip 2. In other applications, the area where the black glue layer 31 is attached to each LED chip 2 is flush with the LED chip 2, and other areas are lower than the LED chip 2, for example, as shown in fig. 4-1.
In other examples of the present embodiment, the black glue layer 31 may cover only a portion of the side surface of the LED chip 2 near the bottom surface of the LED chip 2, and the portion of the side surface of the LED chip 2 near the light emitting surface thereof is exposed to the black glue layer 31, that is, the black glue layer 31 may cover only a portion of the side surface of the LED chip 2. For example, referring to fig. 3, the arrangement mode can make a part of light emitted from the side surface of the LED chip 2 directly emit without passing through the black glue layer 31, so that the contrast ratio of the LED light source assembly is improved, and the light extraction rate of the LED chip 2 is further improved.
In the present embodiment, in order to avoid the influence of crosstalk between the LED chips as much as possible and to improve the contrast, the black matrix layer 31 may be provided to cover the sides of the LED chips 2 as much as possible. In some process flows, when the black glue layer 31 covers all the sides of each LED chip 2, the black glue layer 31 easily covers at least a portion of the light-emitting surface of each LED chip 2, resulting in low light-emitting efficiency and poor display effect. To avoid this problem, in the present embodiment, the outer surface of the region of the black matrix layer 31 around each LED chip 2 may be provided as an inclined surface or a curved surface; the inclined surface or curved surface may be, but is not limited to, a surface of the black matrix layer 31 that is in a semi-cured state while the black matrix layer 31 is pressed through the corresponding LED chip 2 during the lamination process with the front surface of the substrate body 1, and is hung on the side surface of the LED chip 2. The top of the inclined surface or curved surface can be flush with the ejection light surface of the LED chip 2, or can be lower than the ejection light surface of the LED chip 2. Therefore, the black glue layer 31 can be prevented from covering the ejection light surface of the LED chip 2 as much as possible, so that the side surface of the LED chip 2 is covered as much as possible on the basis of low light-emitting efficiency, the light-emitting effect among the LED chips is better avoided, and the contrast ratio and the yield are further improved.
For example, as shown in fig. 4-1, in the black glue layer 31 formed on the front surface of the substrate body 1, the outer surface 311 of the area around each LED chip 2 is a curved surface, and the curved surface in this example may be, but is not limited to, an arc surface, a combination of a plurality of arc surfaces or a combination of an arc surface and an inclined surface, or other irregular curved surfaces, which will not be described in detail herein. Referring to fig. 4-1, the top of the curved surface is flush with the ejection surface of the LED chip 2 in this example, and the ejection surface of the LED chip 2 may be the same. As another example, referring to fig. 4-2, the outer surface 311 of the area around each LED chip 2 of the black matrix layer 31 is an inclined surface, and the inclined surface may be a plane or an inclined surface composed of a plurality of inclined surfaces. And referring to fig. 4-2, the top of the inclined surface is lower than the ejection surface of the LED chip 2 in this example, and may be flush with the ejection surface of the LED chip 2.
The thickness of the black gel layer 31 in this embodiment may be flexibly set according to the application requirement, for example, in one example, the thickness of the black gel layer 31 may be, but is not limited to, 5 μm to 200 μm. Where μm is here in units of micrometers. The thickness of the black glue layer 31 in this embodiment is the thickness of the black glue layer 31 before being pressed onto the substrate body 1. In this embodiment, in order to ensure the light absorption effect of the black matrix layer 31, a black matrix layer with a light transmittance ranging from 0% to 30% may be used. In the present embodiment, the black glue layer 31 may be made of various black insulating glue materials, such as, but not limited to, insulating glue with carbon black. While the projection view of the front surface of the substrate body 1 of the LED light source assembly shown in fig. 2 to 5 (i.e., the orthographic projection view of the LED light source assembly) is shown with reference to the drawing, on this projection view, other areas (including pads) on the front surface of the substrate body 1 are covered with the black matrix layer 31 except for the ejection light surface of the LED chip 2 exposed to the black matrix layer 31.
In this embodiment, the LED light source assembly includes the light-transmitting adhesive layer 32 that can further protect each LED chip 2. And light conversion material or diffusion material can be added into the light-transmitting glue layer 32 according to the requirement so as to adjust and improve the luminous effect of the LED light source assembly. In this example, the light transmittance of the light-transmitting adhesive layer 32 may be, but is not limited to, 30% to 100%, and the thickness thereof may be 5 μm to 300 μm. The light-transmitting glue layer 32 in this embodiment may be a compound glue layer formed by at least two sub-glue layers, or may be a single-layer glue layer with a single-layer glue layer structure. In some application scenarios, the light-transmitting glue layer 32 may include at least one of a transparent glue layer, a diffusion glue layer mixed with diffusion particles, or a luminescence conversion glue layer provided with a light conversion particle or QD (Quantum Dots) film.
In some examples of this embodiment, referring to fig. 5, the LED light source assembly may further include a transparent protective film 33 covering the light-transmitting glue layer 32. The arrangement of the transparent protective film 33 can further improve the protective performance of the LED light source assembly. And the thickness of the transparent protective film in the present embodiment can also be flexibly set according to the need, for example, but not limited to, 10 μm to 300 μm. It should be understood that the transparent protective film 33 shown in fig. 5 may also be provided on the LED light source assembly shown in fig. 2 and 3. The transparent protective film 33 in this example may be a double-check layer structure composed of at least two sub-adhesive layers, or may be a single-layer structure; and the transparent protective film 33 may employ, but is not limited to, a transparent adhesive layer or a plastic sheet, etc.
In another example in the present embodiment, referring to fig. 7, the LED light source assembly further includes an electronic component 4 disposed on the back surface of the substrate body 1, where the disposed electronic component may include, but is not limited to, a driving chip, a resistor, a capacitor, and the like, and may be specifically selected according to application requirements. Of course, in still another example of the present embodiment, the pads, the LED chip 2, and the encapsulation adhesive layer 3 may be provided on the back surface of the substrate body 1 as required with reference to the front surface of the substrate body 1. The LED light source assembly is an LED light source assembly with two sides emitting light. In some application scenarios of the present example, other electronic components besides the LED chip 2 may be flexibly disposed on the front and/or back of the substrate body 1, where the disposed electronic components may include, but are not limited to, a driving chip, a resistor, a capacitor, and the like, and may be specifically selected according to application requirements.
In some examples of the present embodiment, when the LED light source assembly shown in fig. 6 is used as a display panel, in order to realize color display, one pixel point in the LED light source assembly may be set to support emission of red light, green light, and blue light, so that in the present example, at least a part of the plurality of LED chips 2 may emit red light, at least a part of green light, and a part of blue light. For example, the LED chip 2 may include, but is not limited to, a blue LED chip, a red LED chip, a green LED chip. In some application scenarios, the blue and green LED chips may be gallium nitride based LED chips, while the red LED chip may be gallium arsenide based LED chips. In other examples, all the LED chips 2 in the LED light source assembly may be blue LED chips, and in order to make a part of the LED chips emit green light and red light, a corresponding light conversion layer may be disposed on the light emitting surfaces of the LED chips 2. It should be understood that only the case where one pixel supports light of three colors of red, green, and blue is described above, but in some examples, the LED chip 2 at one and the same pixel may emit at least one of cyan, white, and yellow light in addition to light of three colors of red, green, and blue. The set of LED chips disposed at the same pixel point may be referred to as one light emitting unit in this embodiment, as shown by reference a in fig. 6. Therefore, in some examples of the present embodiment, three LED chips 2 are included in one light emitting unit, and in other examples, a greater number of LED chips may be included in one light emitting unit. In fig. 6, other areas (including pads) on the front surface of the substrate body 1 are covered by the black matrix layer 31 except the ejection surface of the LED chip 2 exposed from the black matrix layer 31, so that the display contrast of the display panel can be improved when the display panel is used as the display panel.
In order to facilitate understanding, the present embodiment also provides a method for manufacturing an LED light source assembly, please refer to fig. 8, which includes but is not limited to:
s801: and manufacturing a substrate assembly and a packaging assembly.
In this embodiment, fabricating the substrate assembly includes providing a substrate body with each LED chip disposed on a front surface of the substrate body; in some examples, the electronic component may also be disposed on the back surface of the substrate body, that is, the electronic component may be disposed on the back surface of the substrate body before the surface of the package assembly provided with the black matrix layer is bonded to the front surface of the substrate body. Of course, in other examples, the electronic component may be disposed on the back surface of the substrate body after the encapsulation adhesive layer is formed on the front surface of the substrate body.
In this embodiment, manufacturing the package assembly includes providing a carrier film, providing a light transmissive adhesive layer on the carrier film, and then providing a black adhesive layer on the light transmissive adhesive layer. It should be understood that the process of disposing the light-transmitting adhesive layer on the carrier film and disposing the black adhesive layer on the light-transmitting adhesive layer in this embodiment may be flexibly selected, for example, but not limited to, coating, silk-screen printing, molding, etc.
It should be understood that the substrate assembly and the package assembly may be manufactured simultaneously in this embodiment, or the substrate assembly may be manufactured first and then the package assembly may be manufactured. Or procurement of substrate components and/or packaging components directly from upstream.
It should be understood that the light-transmitting adhesive layer and the black adhesive layer sequentially disposed on the carrier film in this step may be in a cured state, and then heated during the lamination process of the light-transmitting adhesive layer and the front surface of the substrate main body, so that the light-transmitting adhesive layer and the black adhesive layer are converted from the cured state to the semi-cured state. Of course, the light-transmitting adhesive layer and the black adhesive layer which are sequentially arranged on the bearing film in the step can be in a semi-cured state, so that the subsequent direct pressing of the light-transmitting adhesive layer and the black adhesive layer on the front surface of the substrate main body is facilitated, a hot pressing mode can be adopted for the pressing at the moment, other pressing modes can be adopted, and the repeated description is omitted.
S802: and pressing the surface of the packaging assembly, which is provided with the black adhesive layer, with the front surface of the substrate main body, wherein in the pressing process, the light-transmitting adhesive layer and the black adhesive layer which are sequentially arranged on the bearing film are in a semi-cured state, the ejection light surfaces of the LED chips are gradually exposed out of the black adhesive layer, and the light-transmitting adhesive layer covers the black adhesive layer and the ejection light surfaces of the LED chips.
In one example of the present embodiment, the surface of the package assembly provided with the black glue layer may be pressed with the front surface of the substrate body by, but not limited to, hot pressing. At this time, the surface of the packaging component provided with the black glue layer can be attached to the front surface of the substrate main body, the packaging component is heated and pressure towards the substrate main body is applied, the packaging component is pressed towards the substrate main body, and in the pressing process, the transparent glue layer and the black glue layer are in a semi-melting state and are subjected to pressure towards the substrate main body, so that the ejection light surface of each LED chip is gradually exposed (i.e. penetrates out of the black glue layer).
In some examples of the present embodiments, to improve yield and manufacturing efficiency, a substrate holder may be provided, where the substrate holder is provided with a receiving cavity adapted to a substrate assembly. When the surface of the packaging component, which is provided with the black glue layer, is pressed with the front surface of the substrate main body, the substrate main body can be fixed on the substrate clamp, after the substrate main body is fixed in the accommodating cavity of the substrate clamp, the back surface of the substrate main body faces the bottom of the accommodating cavity, and the front surface of the substrate main body and each LED chip face the top opening of the accommodating cavity so that the surface of the packaging component, which is provided with the black glue layer, is attached. In this example, when the electronic components are disposed on the back surface of the substrate body before the surface of the package assembly provided with the black glue layer is pressed against the front surface of the substrate body, the bottom of the accommodating cavity is further provided with accommodating grooves corresponding to the electronic components, and after the substrate assembly is fixed on the substrate fixture, the electronic components are located in the corresponding accommodating grooves. Therefore, the substrate clamp adopted in the embodiment has a simple structure, is convenient to manufacture and has low cost.
According to the manufacturing method, as the black adhesive layer adopted in the embodiment has certain viscosity, the black adhesive layer is easier to combine with the substrate main body and the LED chip, the air tightness can be improved, and better protection can be formed on the LED chip; meanwhile, gaps between the substrate main body and the LED chip and the like can be fully filled by utilizing the fluidity of the black adhesive layer in the pressing process, so that the contrast ratio can be further improved.
In the embodiment, the light-transmitting adhesive layer and the black adhesive layer are sequentially arranged on the bearing film and pressed on the substrate main body at one time, so that compared with the mode that the black adhesive layer is firstly arranged on the substrate main body and then the light-transmitting adhesive layer is arranged on the black adhesive layer, the process can be simplified, the manufacturing efficiency is improved, and the manufacturing cost is reduced; and the transparent adhesive layer and the black adhesive layer are pressed on the substrate main body at one time, so that the integrity of the black adhesive layer and the transparent adhesive layer is better, and the pressing density is improved. In addition, the black ink layer is not required to be additionally arranged on the front surface of the substrate main body in a black mode, so that the manufacturing process can be further simplified, the manufacturing cost can be reduced, and meanwhile, the thickness of the display panel can be reduced due to the fact that the black ink layer is omitted.
In some examples of this embodiment, the carrier film in the package assembly may be directly set as a transparent protective film, in this example, after the face of the package assembly provided with the black glue layer is pressed against the front surface of the substrate main body, the carrier film may be retained, and the retained carrier film is the transparent protective film formed on the transparent glue layer, so that the carrier film does not need to be removed, and an additional transparent protective film is not required to be manufactured on the transparent glue layer, which can further simplify the manufacturing process, improve the manufacturing efficiency and reduce the cost.
Of course, in other examples of this embodiment, after the surface of the package assembly provided with the black glue layer is pressed against the front surface of the substrate main body, the carrier film may be removed, and then one or more prefabricated films are sequentially attached to the transparent glue layer to form the transparent protective film. Of course, the transparent protective film may also be formed on the light-transmitting adhesive layer by, but not limited to, coating, molding, screen printing, or printing. And in this example the carrier film may also be replaced by a carrier substrate.
For easy understanding, this embodiment will be described below by taking two manufacturing methods of the LED light source assembly illustrated in fig. 7 as examples.
An exemplary fabrication method is shown with reference to fig. 9-1 through 9-8, which includes, but is not limited to:
s901: the package assembly shown in fig. 9-1 was fabricated.
For example, in one example, the membrane carrying the membrane 34 (which may be a transparent business card) is first laid flat. The thickness of the carrier film 34 ranges from 10 μm to 300 μm and the thickness uniformity ranges from 1% to 10%. The light transmittance ranges from 30% to 100%. Two layers of glue are then placed in sequence on the carrier film 34. Firstly, setting light-transmitting glue to form a light-transmitting glue layer 32, wherein the thickness range of the light-transmitting glue layer 32 is 5-300 mu m. The thickness uniformity ranges from 1% to 10% and the light transmittance ranges from 30% to 100%. And then a black glue layer 31 is formed on the light-transmitting glue layer 32, wherein the thickness range of the black glue layer 31 is 5-200 mu m, the thickness uniformity range is 1-10%, and the light transmittance range is 0-30%. The resulting package assembly structure is shown in fig. 9-1. The black glue layer 31 and the light-transmitting glue layer 32 formed in S901 in this example may be in a semi-cured state or in a cured state.
In this example, the specific value of the thickness of the black glue layer 31 can be set flexibly on the basis that the black glue layer 31 covers as many sides of the LED chip 2 as possible under the condition that the black glue layer 31 does not cover the ejection light surface of the LED chip 2 as much as possible, resulting in low light emitting efficiency. Therefore, in the process of pressing the black glue layer 31 against the front surface of the substrate body 1, the outer surface 311 formed by the portion of the black glue layer 31 in the semi-cured state, which is hung on the side surface of the LED chip 2 when the black glue layer 31 is extruded to pass through the corresponding LED chip 2, is an inclined surface or a curved surface, so as to better avoid the influence of light crosstalk between the LED chips, and further improve the contrast ratio and the yield.
S902: the substrate assembly shown in fig. 9-2 was fabricated.
In one example, the die bonding of the LED chip 2 is completed on the front surface of the substrate body 1. In this example, the LED chip 2 may be transferred onto the front surface of the substrate body 1 by using various chip transfer methods (for example, bulk transfer method), the LED chip 2 may be, but not limited to, a front-mounted, flip-chip or vertical LED chip, and the light emitting color of the LED chip 2 may include at least one of red, green, blue, white, and the like. The pitch of the LED chips 2 is 200 μm to 1000 μm.
S903: the substrate holder 5 shown in fig. 9-3 was fabricated.
Referring to fig. 9-3, the substrate holder 5 in this example includes a receiving cavity 51 adapted to the substrate assembly, and a receiving groove for receiving the electronic component 4 is not provided at the bottom of the receiving cavity 51 in this example. In this embodiment, the substrate holder may be made of metal, ceramic or other materials, which are not described herein.
S904: the manufactured substrate assembly is fixed to the substrate holder 5, and one state after the fixing is shown in fig. 9 to 4. The substrate holder 5 fixes the substrate assembly to maintain the substrate assembly in a stationary state.
S905: one surface of the package assembly provided with the black glue layer 31 is attached to the front surface of the substrate body 1, and one state after attachment is shown in fig. 9-5.
S906: the package assembly is heated and pressure towards the substrate main body 1 is applied, the package assembly is pressed towards the substrate main body 1, and in the pressing process, the black glue layer 31 is heated to be in a semi-melted state, and meanwhile, the package assembly is subjected to the pressure towards the substrate main body 1, so that the ejection light surface of each LED chip 2 is gradually exposed (i.e. penetrates out of) the black glue layer 31, and the outer surface 311 formed by the part hung on the side surface of the LED chip 2 is an inclined surface or a curved surface. See fig. 9-6 and fig. 9-7.
S907: referring to fig. 9 to 8, after the black glue layer 31, the light-transmitting glue layer 32, and the like are cured, the substrate holder 5 is removed, and the electronic component 4 is disposed on the back surface of the substrate main body 1.
Another example fabrication method is shown with reference to fig. 10-1 to 10-6, which includes, but is not limited to:
S1001: the substrate assembly shown in fig. 10-1 was fabricated.
S1001: the substrate assembly shown in fig. 10-1 was fabricated.
In this example, it includes completing die bonding of the LED chip 2 on the front surface of the substrate body 1, and disposing the electronic component 4 on the back surface of the substrate body 1.
S1002: the substrate holder 5 shown in fig. 10-2 was fabricated.
Referring to fig. 10-2, the substrate holder 5 in this example includes a housing cavity 51 adapted to the substrate assembly, and a housing groove 52 for housing the electronic component 4 is provided at the bottom of the housing cavity 51 in this example.
S1003: the manufactured substrate assembly in fig. 10-1 is fixed on the substrate clamp 5 shown in fig. 10-2, and in a state after fixing, referring to fig. 10-3, the electronic component 4 on the back surface of the substrate main body 1 is accommodated in the accommodating groove 52, and the substrate clamp 5 fixes the substrate assembly, so that the substrate assembly can be kept in a stable state.
S1004: the surface of the package assembly (the package assembly shown in fig. 9-1 is still used in this example) provided with the black glue layer 31 is attached to the front surface of the substrate main body 1, and one state after attachment is shown in fig. 10-4.
S1005: the package assembly is heated and pressure towards the substrate main body 1 is applied, and the package assembly is pressed towards the substrate main body 1, and in the pressing process, the black glue layer 31 is heated to be in a semi-melted state, and meanwhile, the package assembly is subjected to the pressure towards the substrate main body 1, so that the ejection light surface of each LED chip 2 is gradually exposed (i.e. penetrates out of) the black glue layer 31, as shown in fig. 10-5 and fig. 10-6.
S1007: after the black glue layer 31, the light-transmitting glue layer 32, and the like are cured, the substrate holder 5 is removed, and the LED light source assembly shown in fig. 7 is obtained.
In the application scenario in the present embodiment, in the manufacturing methods of the two examples described above, when the carrier film 34 is directly provided as the transparent protective film 33, the transparent protective film 33 may be left. When the carrier film 34 is not provided as the transparent protective film 33, the transparent protective film 33 may be provided on the light-transmitting adhesive layer 32 after the carrier film 34 is removed after the black adhesive layer 31 is pressed onto the substrate main body 1. Of course, the carrier film 34 may also be removed in this example when making the LED light source assembly shown in fig. 2-4.
Therefore, the manufacturing method of the LED light source assembly provided by the embodiment can adopt a film production process, the ejection smooth surface of the LED chip in the COB LED technology is exposed out of the black glue layer in a pressing mode, the adopted black glue layer has certain viscosity, is easier to combine with the substrate main body and the LED chip, can improve air tightness, and can form better protection for the LED chip; meanwhile, gaps between the substrate main body and the LED chips and the like can be fully filled by utilizing the fluidity of the black adhesive layer in the pressing process, so that other areas except the LED chips are fully filled with black on the front surface of the substrate main body, and the contrast ratio can be further improved. And the light-transmitting adhesive layer covers the ejection light surface of the LED chip, so that the light-transmitting loss rate is reduced.
In addition, since it is not necessary to set the substrate body to black by additionally spraying a black ink layer or the like on the front surface thereof, the manufacturing process can be simplified, the manufacturing cost can be reduced, and the thickness of the display panel can be reduced by omitting the black ink layer.
Meanwhile, the transparent protective film is further arranged on the light-transmitting adhesive layer, so that the display performance of the COB LED can be optimized, and the protection effect is improved. Therefore, the LED light source assembly and the manufacturing method thereof provided by the embodiment have the advantages of high contrast, low COB LED light transmittance loss and high protection.
It should be understood that the LED light source assembly provided in this embodiment may be widely applied to electronic devices with display screens, such as mobile phones, notebook computers, tablet computers, intelligent wearable products, eye-protecting products, vehicle terminals, advertisement display terminals, etc., and may also be widely applied to various lighting devices for indoor lighting and outdoor lighting.
It is to be understood that the invention is not limited in its application to the examples described above, but is capable of modification and variation in light of the above teachings by those skilled in the art, and that all such modifications and variations are intended to be included within the scope of the appended claims.
Claims (7)
1. An LED display panel, comprising:
A substrate;
the pixel points are arranged on the substrate and comprise a plurality of LED chips which emit blue light, red light and green light;
The black glue forming layer is positioned in the area between the LED chips, the ejection light surface of each LED chip is exposed out of the black glue forming layer, and the black glue forming layer is concave between the LED chips; and
The light-transmitting glue forming layer is arranged above the black glue forming layer, the light-transmitting glue forming layer covers the black glue forming layer and the ejection light surface of each LED chip, and the light-transmitting glue forming layer is composed of at least two layers of sub-glue layers.
2. The LED display panel of claim 1, wherein the black glue molding layer and the light-transmitting glue molding layer are press-molded on the front surface of the substrate body.
3. The LED display panel of claim 1, wherein the thickness of the black matrix layer is 5 μm to 200 μm, and the light transmittance of the black matrix layer is not higher than 30%;
And/or the thickness of the light-transmitting glue forming layer is 5-300 mu m, and the light transmittance of the light-transmitting glue forming layer is not lower than 30%.
4. The LED display panel of claim 1, wherein the outer surface of the black glue molding layer in the area around each LED chip is an inclined surface or a curved surface, and the top of the inclined surface or the curved surface is lower than the ejection surface of the LED chip.
5. The LED display panel of claim 1, further comprising a transparent protective film overlying the light transmissive glue molding layer.
6. The LED display panel of claim 5, wherein the transparent protective film has a thickness of 10 μm to 300 μm.
7. The manufacturing method of the LED display panel is characterized by comprising the following steps of:
providing a substrate, and arranging a plurality of pixel points on the substrate, wherein the pixel points comprise a plurality of LED chips for emitting blue light, red light and green light;
Providing a bearing film, arranging a light-transmitting glue forming layer on the bearing film, and arranging a black glue forming layer on the light-transmitting glue forming layer to form a packaging glue layer;
and pressing the packaging adhesive layer onto the substrate in an upward manner by the bearing film so that the ejection light surfaces of the LED chips are exposed out of the black adhesive forming layer, the black adhesive forming layer is concave between the LED chips, the transparent adhesive forming layer covers the black adhesive forming layer and the ejection light surfaces of the LED chips, and in the pressing process, the transparent adhesive forming layer and the black adhesive forming layer are in a semi-cured state.
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|---|---|---|---|
| CN202410187612.XA CN118398746A (en) | 2021-11-05 | 2021-12-21 | LED display panel and manufacturing method thereof |
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| CN202111308127 | 2021-11-05 | ||
| CN202111571638.7A CN114220902B (en) | 2021-11-05 | 2021-12-21 | LED light source assembly and manufacturing method thereof |
| CN202410187612.XA CN118398746A (en) | 2021-11-05 | 2021-12-21 | LED display panel and manufacturing method thereof |
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