CN208270887U - A kind of liquid crystal display backlight module - Google Patents
A kind of liquid crystal display backlight module Download PDFInfo
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- CN208270887U CN208270887U CN201820781973.7U CN201820781973U CN208270887U CN 208270887 U CN208270887 U CN 208270887U CN 201820781973 U CN201820781973 U CN 201820781973U CN 208270887 U CN208270887 U CN 208270887U
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Abstract
A kind of liquid crystal display backlight module, the utility model include circuit clad, circuit communication layer, light emitting diode arrangement layer, fluorescent powder glue-line, transparent protective layer.Using light emitting diode as point light source, coating phosphor gel is changed between area source and each light emitting diode without using printed circuit board (PCB) the utility model, directly passes through circuit communication.The utility model, without using expensive printed circuit board and mating high-precision die bond, eutectic solder reflow device, production efficiency is more improved because being not necessarily to die bond and eutectic Reflow Soldering, the production cycle is shortened, reduces production cost in preparation process.
Description
Technical field
The utility model relates to semiconductor module group encapsulation technology fields, and in particular to be applied in liquid crystal display (LCD)
LED backlight module packaging technology.
Background technique
People's life is constantly come into as mobile phone tends to screen enlarging and virtual reality technology (VR), industry differentiates display screen
Rate (ppi) and service life are proposed requirements at the higher level.Although OLED display screen colour gamut is broader, there are service life and large scale
Support the disadvantages of insufficient.Existing display resolution can be both greatly improved in backlight display field in small size light emitting diode,
It can satisfy from wearable device to the various display field demands such as very little large screens up to a hundred, and the high, function by light-emitting diode luminance
The features such as consuming low, self-luminous, fast response time, material settling out, long service life, either in quality compared with OLED, contrast or
It has a clear superiority in price totle drilling cost.
Size of components is smaller in LED backlight mould group production process, the skill high-efficient, at low cost at present, yield is good
Art route is still in the exploratory stage.According to the prediction of foreign organization Yole, it is expected to backlight industry production value in 2025 up to 32.9 hundred million
Dollar.Market application prospect is huge, but how to realize that flood tide light-emitting diode component shifts, is precisely mutual with printed circuit plate electrode
Join, overcome key technical problems of the problems such as thermal expansion and failure in reflow process as industry development.And use existing hair
Optical diode is precisely arranged in printed circuit board, Reflow Soldering is welded as the technology path of core, either production capacity or yield control
System aspect, all suffers from huge challenge.
Utility model content
The utility model aim is to propose a kind of liquid crystal display (LCD) backlight source module, has high reliablity, waterproof
The features such as property is strong.
The utility model include circuit clad, circuit communication layer, array format arrangement several light emitting diodes, fluorescence
Arogel layer, transparent protective layer；Each light emitting diode is arranged in same layer, and the electricity of ipsilateral arrangement is arranged between light emitting diode
Road connection floor is coated with circuit clad outside each circuit communication layer jointly, luminous the two of the other side of circuit clad
Fluorescent powder glue-line is coated in pole pipe jointly, the outside of fluorescent powder glue-line is arranged in transparent protective layer.
It is well known that fluorescent powder can not only have been made to fail for the steam in environment but also the series-parallel circuit that can harm under microsize can
By property.The utility model, which is provided with transparent protective layer and circuit clad, can play the role of completely cutting off steam, both protect fluorescence
Powder improves connection circuit reliability between diode again.Connection circuit and fluorescent powder etc. are in entirety between the utility model diode
Sealing state, therefore can effectively promote backlight module integral waterproofing performance.
The utility model can make to shine with connection route in backlight module without using printed circuit board (PCB)
Protection circuit communication is formed between diode.
The light emitting diode of the utility model go out light can be monochromatic (such as blue) be also possible to polychrome (such as it is red, green,
It is blue).
The transparent protective layer is with a thickness of 5 μm~2000 μm.If the thickness of transparent protective layer is greater than 2000 μm, then greatly
Other space of components are occupied, are unfavorable for that device is lightening, is not approved by consumer.If the thickness of transparent protective layer is less than 5 μm, no
Good supporting role can be played, can have an adverse effect to subsequent preparation process yield, increase bad output.
The surface of the transparent protective layer is transparent protective layer roughened layer.
In the fluorescent powder glue-line towards the surface of transparent protective layer be phosphor gel roughened layer.It is fluorescent powder glue-line, transparent
Protective layer interface surface can not only increase ply adhesion, but also light emission rate can be improved by roughening, reduce light source particle
Sense, plays the role of diffuser plate.
In order to be conducive to heat conduction, reduce module temperature, improve product reliability, the utility model in circuit communication layer and
Heat dissipation channel, such as heat release hole, heat-conducting glue etc. are equipped in circuit clad.
Less than 2000 μm, each lumination of light emitting diode face size is less than the row, column spacing of the adjacent light emitting diode
1mm.The outstanding problem that backlight faces is that light source has granular sensation, therefore to use scattering sheet etc. to be scattered processing to light,
According to existing experience, if the row, column spacing of light emitting diode is greater than 2000 μm, the backlight assembly general obtained after processing
There is serious granular sensation, is unable to satisfy existing professional standard, cannot use.
Lumination of light emitting diode face size such as larger than 1mm, device display resolution (ppi) can reduce, and not meet display
The trend that screen industry resolution ratio is gradually increased causes not approved by consumer compared with existing industry product in competitive disadvantages.
The characteristics of the utility model:
(1) without using expensive printed circuit board and mating high-precision die bond, eutectic solder reflow device；Improve production
Efficiency shortens the production cycle, reduces production cost, avoiding the yield loss in Reflow Soldering process.
(2) product design flexibility and high reliablity are conducive to complicated circuit and product differentiation using photoetching, evaporation coating technique
Design.
(3) printed circuit board is not used, mould group integral thickness is thinner than the product of prior art route production, it is light to meet product
Thinning trend, more other mould groups have saved valuable design space.
(4) mould group integrated degree is high, is not required to separately add diffuser plate, is convenient for assembling production and subsequent replacement and waterproof performance is excellent
It is good.
Detailed description of the invention
Fig. 1 to 2 is the utility model process flow diagram.
Fig. 3 is a kind of structural schematic diagram of the utility model product.
Fig. 4 is another structural schematic diagram of the utility model product.
Specific embodiment
Following description provides the explanation of embodiment, illustrates detail., it is clear that detail in reality production
Change all should belong in the utility model scope.
It is as follows in conjunction with 1 to 3 specific implementation process of attached drawing:
Example one:
1, multiple light emitting diodes 1 are fixed on to the upper surface of fixed film 2 according to design spacing with array, in fixed film
Tight coating fluorescent powder glue-line 3 in the state of being positioned at microscope carrier.As shown in Figure 1.
The row, column spacing of light emitting diode should be less than 2000 μm, and each lumination of light emitting diode face size is less than 1mm.
Fluorescent powder glue-line can be realized using method, the method for the bonding even method of multiple coating of hot pressing.
2, after drying to fluorescent powder glue-line 3, transparent protective layer 4 is coated on fluorescent powder glue-line 3, as shown in Figure 2.
Transparent protective layer can be layered, be accumulated and to be formed using multi-layer resinous or unlike material interval, overall thickness be 5 μm~
2000 μm, light emission rate can be improved, refraction, reflecting interface preferably realize diffusing reflection, and light source module group uniformity of luminance can be improved, drops
Low light source granular sensation.
3, after to transparent protective layer 4 and fluorescent powder glue-line 3 thoroughly drying, fixed film 2 is separated.
4, by overturning, downward by transparent protective layer.
5, on the electrode surface of each light emitting diode, circuit communication layer 5 is made using processes such as photoetching, vapor depositions.Also
It can be coated with one layer of thermal plastic insulation on circuit communication layer 5, be conducive to device and radiate.
6, circuit clad 6 is covered after circuit communication layer 5, as shown in Figure 3.
Also it can be coated with one layer of thermal plastic insulation in 6 outer surface of circuit clad, be conducive to device and radiate.
7, the product formed is as shown in Figure 3:
Each light emitting diode 1 is arranged in same layer, and the circuit communication layer of ipsilateral arrangement is arranged between light emitting diode 1
5, it is coated with circuit clad 6 jointly outside each circuit communication layer 5, the light emitting diode 1 in the other side of circuit clad 6
On be coated with fluorescent powder glue-line 3 jointly, the outside of fluorescent powder glue-line 3 is arranged in transparent protective layer 4.
Example two:
1, multiple light emitting diodes 1 are fixed on to the upper surface of fixed film 2 according to design spacing with array, in fixed film
Tight coating fluorescent powder glue-line 3 in the state of being positioned at microscope carrier.
The row, column spacing of light emitting diode should be less than 2000 μm, and each lumination of light emitting diode face size is less than 1mm.
Fluorescent powder glue-line can be realized using method, the method for the bonding even method of multiple coating of hot pressing.
2, after being dried to fluorescent powder glue-line 3, in order to improve light emission rate, expand light-emitting angle, also to 3 surface of fluorescent powder glue-line
Roughening treatment is carried out, then coats transparent protective layer 4 on the fluorescent powder surface glue-line 3a of roughening.
Transparent protective layer can be layered, be accumulated and to be formed using multi-layer resinous or unlike material interval, overall thickness be 5 μm~
2000 μm, light emission rate can be improved, refraction, reflecting interface preferably realize diffusing reflection, and light source module group uniformity of luminance can be improved, drops
Low light source granular sensation.
3, right in order to improve light emission rate, expand light-emitting angle after to transparent protective layer 4 and fluorescent powder glue-line 3 thoroughly drying
4 surface of transparent protective layer carries out roughening treatment, forms roughening transparent protective layer 4a.
Then fixed film 2 is separated.
4, by overturning, downward by transparent protective layer.
5, on the electrode surface of each light emitting diode, circuit communication layer 5 is made using processes such as photoetching, vapor depositions.Also
It can be coated with one layer of thermal plastic insulation on circuit communication layer 5, be conducive to device and radiate.
6, circuit clad 6 is covered after circuit communication layer 5, as shown in Figure 3.
Also it can be coated with one layer of thermal plastic insulation in 6 outer surface of circuit clad, be conducive to device and radiate.
7, multiple heat dissipation channels, such as heat release hole 6a or heat-conducting glue are opened up on circuit communication layer 5 and circuit clad 6,
It is connected to the outer end of each heat release hole 6a with external world's formation, in favor of device heat dissipation.
8, the product formed is as shown in Figure 4:
The circuit communication layer 5 of ipsilateral arrangement is set between each light emitting diode 1, is wrapped jointly outside each circuit communication layer 5
It is covered with circuit clad 6, the heat release hole 6a being in communication with the outside is set in circuit communication layer and circuit clad.
It is coated with fluorescent powder glue-line 3 jointly on the light emitting diode 1 of the other side of circuit clad 6, towards transparent guarantor
3 surface of fluorescent powder glue-line of sheath 4 is phosphor gel roughened layer 3a, and the outside of fluorescent powder glue-line 3 is arranged in transparent protective layer 4,
And the surface of transparent protective layer 4 is roughening transparent protective layer 4a.
Claims (6)
1. a kind of liquid crystal display backlight module, including circuit clad, circuit communication layer, several light emitting diodes, fluorescence
Arogel layer, transparent protective layer；Each light emitting diode is arranged in same layer, and the electricity of ipsilateral arrangement is arranged between light emitting diode
Road connection floor is coated with circuit clad outside each circuit communication layer jointly, luminous the two of the other side of circuit clad
Fluorescent powder glue-line is coated in pole pipe jointly, the outside of fluorescent powder glue-line is arranged in transparent protective layer.
2. backlight module according to claim 1, it is characterised in that the transparent protective layer is with a thickness of 5 μm~2000 μm.
3. backlight module according to claim 1 or claim 2, it is characterised in that the surface of the transparent protective layer is transparent protective layer
Roughened layer.
4. backlight module according to claim 1, it is characterised in that towards the table of transparent protective layer in the fluorescent powder glue-line
Face is phosphor gel roughened layer.
5. backlight module according to claim 1, it is characterised in that heat dissipation is arranged in circuit communication layer and circuit clad
Channel.
6. backlight module according to claim 1, it is characterised in that the row, column spacing of the adjacent light emitting diode is less than
2000 μm, each lumination of light emitting diode face size is less than 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820781973.7U CN208270887U (en) | 2018-05-24 | 2018-05-24 | A kind of liquid crystal display backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820781973.7U CN208270887U (en) | 2018-05-24 | 2018-05-24 | A kind of liquid crystal display backlight module |
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| Publication Number | Publication Date |
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| CN208270887U true CN208270887U (en) | 2018-12-21 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108594531A (en) * | 2018-05-24 | 2018-09-28 | 扬州中科半导体照明有限公司 | A kind of liquid crystal display backlight module and production method |
-
2018
- 2018-05-24 CN CN201820781973.7U patent/CN208270887U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108594531A (en) * | 2018-05-24 | 2018-09-28 | 扬州中科半导体照明有限公司 | A kind of liquid crystal display backlight module and production method |
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