CN220106534U - LED lamp bead and display device - Google Patents

Abstract

The utility model relates to an LED lamp bead and a display device, which comprises: the first plate surface of the substrate is provided with a first chip, a third chip and two second chips which are distributed in a matrix, the light-emitting colors of the four chips are different, and the positions of the two second chips are diagonally arranged; the first plate surface of the substrate is provided with first electrode bonding pads corresponding to the four chips respectively, the first electrodes of the four chips are electrically connected with the corresponding first electrode bonding pads, and all the first electrode bonding pads are electrically connected through first conductive circuits; the first plate surface of the substrate is provided with independent second electrode bonding pads corresponding to the four chips respectively, and the second electrodes of the four chips are electrically connected with the corresponding second electrode bonding pads; the second plate surface of the substrate is provided with a common welding leg and independent welding legs, each second electrode bonding pad is electrically connected with each corresponding independent welding leg, and the common welding legs are electrically connected with the first conductive circuit. The large pixel density can be realized without further reducing the distance between the LED lamp beads, and the wiring difficulty can be reduced.

Description

LED lamp bead and display device

Technical Field

The utility model relates to the technical field of LED display, in particular to an LED lamp bead and a display device.

Background

At present, the requirements of the market on LED display effect are gradually improved, the requirements on the pixel density and the pixel point spacing of display are higher and higher, and the high PPI and the low pixel point spacing become the most urgent requirements of the future market.

In the related art, the conventional scheme of increasing the pixel density and reducing the dot pitch is to continuously reduce the distance of the chip, so that the distance of each RGB chipset is continuously reduced, but the wiring difficulty of the chip is increasingly greater along with the continuous reduction of the distance of the RGB chipset.

Therefore, there is a need to design a new LED lamp and display device to overcome the above-mentioned problems.

Disclosure of Invention

The embodiment of the utility model provides an LED lamp bead and a display device, which are used for solving the problem that the distance between RGB (red, green and blue) chip sets in the related technology is continuously reduced, and the wiring difficulty of chips is increased.

In a first aspect, there is provided an LED lamp bead, comprising: the LED display device comprises a substrate, wherein a first plate surface of the substrate is provided with a first chip, a third chip and two second chips which are distributed in a matrix, the luminous colors of the first chip, the second chip and the third chip are different, and the positions of the two second chips are diagonally arranged; the first plate surface of the substrate is provided with independent first electrode bonding pads corresponding to the first chip, the second chip and the third chip respectively, the first electrodes of the first chip, the second chip and the third chip are electrically connected with the corresponding first electrode bonding pads, and all the first electrode bonding pads are electrically connected through first conductive circuits; the first plate surface of the substrate is provided with independent second electrode bonding pads corresponding to the first chip, the second chip and the third chip respectively, and the second electrodes of the first chip, the second chip and the third chip are electrically connected with the corresponding second electrode bonding pads; the second plate surface of the substrate is provided with a common welding leg, each second electrode welding pad is provided with an independent welding leg correspondingly, each second electrode welding pad is electrically connected with each corresponding independent welding leg, and the common welding leg is electrically connected with the first conductive circuit.

In some embodiments, the first chip is fixed to one of the first electrode pads through conductive adhesive, so that the first electrode of the first chip is electrically connected with the first electrode pad; the second chip is arranged at intervals with the corresponding first electrode bonding pad, and the first electrode of the second chip is electrically connected with the first electrode bonding pad through a wire; the third chip is arranged at intervals with the corresponding first electrode bonding pad, and the first electrode of the third chip is electrically connected with the first electrode bonding pad through a wire.

In some embodiments, the first surface of the substrate is provided with four fixing pads arranged in a matrix, the four fixing pads are in one-to-one correspondence with the first chip, the two second chips and the third chip, and the four fixing pads are electrically connected with all the first electrode pads through the first conductive circuit; the first electrode bonding pad electrically connected with the first chip is one of the fixed bonding pads; the second chip and the third chip are fixed to the corresponding fixing pads through insulating glue.

In some embodiments, the connection lines of the first chip, the third chip and the two second chips enclose a rectangular area, and the first electrode pad and the first conductive line are located in the rectangular area.

In some embodiments, the distance between the first chip and the second chip is equal to the distance between the third chip and the second chip.

In some embodiments, the substrate is provided with a plurality of conductive holes, the conductive holes penetrate through a first plate surface and a second plate surface of the substrate, the first plate surface of the substrate is provided with a plurality of second conductive lines, and the second plate surface of the substrate is provided with a third conductive line and a plurality of fourth conductive lines; one end of one of the conductive holes is electrically connected with the first electrode pad through the first conductive line, and the other end of the conductive hole is electrically connected with the common welding pin through the third conductive line; the rest of the conductive holes are electrically connected with the corresponding second electrode pads through the second conductive lines and are electrically connected with the corresponding independent welding pins through the fourth conductive lines.

In some embodiments, the first plate surface of the substrate is provided with a first ink layer, the first ink layer covers the first conductive circuit, the second conductive circuit and the conductive hole, and an uncovered area is left between the edge of the first ink layer and the edge of the substrate; the first plate surface of the substrate is also encapsulated with colloid, the colloid covers the first ink layer, and the colloid fills the uncovered area.

In some embodiments, the first ink layer separates the first chip, the second chip, and the third chip from one another; the second board surface of the substrate is provided with a second ink layer, the second ink layer covers the third conductive circuit, the fourth conductive circuit and the conductive hole, and the second ink layer separates the common soldering leg and each independent soldering leg.

In some embodiments, the four independent fillets include a first independent fillet, two second independent fillets, and a third independent fillet, the two second independent fillets being diagonally arranged; the four second electrode bonding pads comprise a first second electrode bonding pad, two second electrode bonding pads and a third second electrode bonding pad, the first second electrode bonding pad is electrically connected with the first independent welding pin and the first chip, the second electrode bonding pad is electrically connected with the second independent welding pin and the second chip, and the third second electrode bonding pad is electrically connected with the third independent welding pin and the third chip; one of the second independent welding pins is arranged in the same row with the common welding pin and the third independent welding pin, and is positioned on the same side of the substrate with one of the second electrode bonding pad and the third electrode bonding pad; the other second independent welding leg and the first independent welding leg are arranged in the same row, and are positioned at the other side of the substrate together with the other second electrode bonding pad and the first electrode bonding pad.

In a second aspect, a display device is provided, which includes a plurality of the LED light beads described above.

The technical scheme provided by the utility model has the beneficial effects that:

the embodiment of the utility model provides an LED lamp bead and a display device, wherein a first chip, two second chips and a third chip which are arranged in a matrix are arranged in each LED lamp bead, the luminous colors of the first chip, the second chip and the third chip are different, and the positions of the two second chips are arranged in opposite angles, so that after a plurality of LED lamp beads are arranged together, each independent chip can carry out color complementation through a circle of chips with other colors around the independent chip to form a pixel, the density of the pixel can be improved, and the large pixel density can be realized without further reducing the distance between the LED lamp beads; and all first electrode bonding pads are connected together through the first conductive circuit, so that the number of wiring can be reduced as much as possible, electroplating difficulty is reduced, and manufacturing difficulty is reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic top view of an LED lamp bead according to an embodiment of the present utility model;

FIG. 2 is a schematic top view of a substrate according to an embodiment of the present utility model;

FIG. 3 is a schematic bottom view of a substrate according to an embodiment of the present utility model;

fig. 4 is a schematic structural diagram of a substrate provided with a first ink layer according to an embodiment of the present utility model;

fig. 5 is a schematic structural diagram of a substrate provided with a second ink layer according to an embodiment of the present utility model;

fig. 6 is a schematic front view of an LED lamp bead according to an embodiment of the present utility model;

fig. 7 is a schematic diagram of circuit driving of an LED lamp bead according to an embodiment of the present utility model;

fig. 8 is a schematic structural view of a related art display device;

fig. 9 is a schematic structural diagram of a display device according to an embodiment of the present utility model;

fig. 10 is a schematic diagram of the structure of fig. 9 for forming 16 pixels.

In the figure:

100. LED lamp beads;

1. a substrate; 11. a first electrode pad; 12. a first conductive line; 13. a second electrode pad; 131. a first second electrode pad; 132. a second electrode pad; 133. a third second electrode pad;

14. a common fillet; 15. independent welding legs; 151. a first individual fillet; 152. second independent welding legs; 153. third independent welding legs;

16. a fixing pad; 17. a second conductive line; 18. a third conductive line; 19. a fourth conductive line;

2. a first chip; 3. a second chip; 4. a third chip;

5. a conductive hole; 6. a first ink layer; 7. a second ink layer; 8. uncovered areas; 9. and (5) colloid.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The embodiment of the utility model provides an LED lamp bead and a display device, which can solve the problem that the distance of an RGB chip set is continuously reduced and the wiring difficulty of chips is increased in the related art.

Referring to fig. 1, an LED lamp bead 100 according to an embodiment of the present utility model includes: the first board surface of the substrate 1 is provided with a first chip 2, a third chip 4 and two second chips 3 which are distributed in a matrix, namely, the number of the first chip 2 and the number of the third chip 4 can be one, the number of the second chips 3 is preferably two, the luminous colors of the first chip 2, the second chip 3 and the third chip 4 are different, the luminous colors of the two second chips 3 are the same, the positions of the two second chips 3 are diagonally arranged, the first chip 2 and the third chip 4 are diagonally arranged, and the first chip 2, the two second chips 3 and the third chip 4 are respectively positioned at four angular positions of a rectangle; the first board surface of the substrate 1 is provided with independent first electrode pads 11 corresponding to the first chip 2, the second chip 3 and the third chip 4, that is, each chip is provided with an independent first electrode pad 11, the first electrodes of the first chip 2, the second chip 3 and the third chip 4 are electrically connected with the corresponding first electrode pads 11, and all the first electrode pads 11 are electrically connected through first conductive wires 12; the first board surface of the substrate 1 is provided with independent second electrode pads 13 corresponding to the first chip 2, the second chip 3 and the third chip 4 respectively, that is, each chip is provided with independent second electrode pads 13, the second electrode pads 13 are mutually arranged at intervals, and the second electrodes of the first chip 2, the second chip 3 and the third chip 4 are electrically connected with the corresponding second electrode pads 13; the second board surface of the substrate 1 is provided with a common soldering leg 14, and each second electrode pad 13 is provided with an independent soldering leg 15, each second electrode pad 13 is electrically connected with each corresponding independent soldering leg 15, and the common soldering leg 14 is electrically connected with the first conductive circuit 12, so that the common soldering leg 14 is electrically connected with the first electrode of each chip. Wherein the first pole and the second pole are opposite in polarity.

In this embodiment, since the first chip 2, the two second chips 3 and the third chip 4 are arranged in a matrix in each LED lamp bead 100, the light-emitting colors of the first chip 2, the second chip 3 and the third chip 4 are different, and the positions of the two second chips 3 are diagonally arranged, after a plurality of LED lamp beads 100 are arranged together, each independent chip can be color-supplemented by a circle of chips with other colors around the independent chip to form a pixel, that is, each independent chip can form a pixel, four chips can form four pixels, and under the condition that the distance between two adjacent LED lamp beads 100 is unchanged, the two adjacent LED lamp beads 100 can form 8 pixels, so that the pixel density can be improved, and the large pixel density can be realized without further reducing the distance between the LED lamp beads 100; and through setting up independent first utmost point pad 11 and each chip electricity and be connected through first conductive line 12 with first utmost point pad 11 and public leg 14 electricity, can realize that the first utmost point of a plurality of chips all is connected to a public leg 14 electricity, through setting up independent second utmost point pad 13 and corresponding chip electricity and be connected, can realize that each chip is connected with independent leg 15 electricity, wherein, with all first utmost point pads 11 electricity are connected together through first conductive line 12, can reduce the quantity of wiring as far as possible in the design, simultaneously, because the electroplating is needed in the circuit board preparation technology, connect as far as possible a plurality of first utmost point pads 11, can reduce the electroplating degree of difficulty, reduce the preparation degree of difficulty of circuit board, reduce the cost of manufacture, when a plurality of LED lamp beads 100 link together and form the display device, can reduce the wiring degree of difficulty between the different lamp beads when the display device forms, the use degree of difficulty of customer end is reduced.

In some embodiments, referring to fig. 1, the first chip 2 is fixed to one of the first electrode pads 11 by conductive adhesive, so that the first electrode of the first chip 2 is electrically connected to the first electrode pad 11; the second chip 3 is arranged at intervals with the corresponding first electrode bonding pad 11, and the first electrode of the second chip 3 is electrically connected with the first electrode bonding pad 11 through a wire; the third chip 4 is spaced from the corresponding first electrode pad 11, and the first electrode of the third chip 4 is electrically connected to the first electrode pad 11 through a wire. That is, in this embodiment, the first chip 2 may be a vertical chip, such as an R chip, the electrode has an upper-lower structure, the upper electrode may be an anode or a cathode, the lower electrode may be a cathode or an anode, the first chip 2 may be directly placed on the first electrode pad 11 and fixed to the first electrode pad 11 by a conductive adhesive at the bottom thereof, and the conductive adhesive may be a silver adhesive, an anisotropic conductive adhesive, or the like; the second chip 3 and the third chip 4 can be arranged at intervals with the corresponding first electrode bonding pad 11, the second chip 3 can be a G chip, the third chip 4 can be a B chip, the G chip and the B chip are in a horizontal structure, the electrodes are arranged left and right on the top layer, the semicircular electrodes in the figure can be cathodes or cathodes, and the circular electrodes can be anodes or anodes. Of course, in other embodiments, the second chip 3 may be configured as a chip of another color, such as a B chip.

Referring to fig. 2, in some alternative embodiments, the first surface of the substrate 1 is provided with four fixing pads 16 arranged in a matrix, the four fixing pads 16 are in one-to-one correspondence with the positions of the first chip 2, the two second chips 3 and the third chip 4, and the four fixing pads 16 are electrically connected with all the first electrode pads 11 through the first conductive lines 12; the first electrode pad 11 electrically connected to the first chip 2 is one of the fixing pads 16; the second chip 3 and the third chip 4 are fixed to the corresponding fixing pads 16 by insulating glue. In the present embodiment, one of the fixing pads 16 is provided as the first-pole pad 11, and the number of the first-pole pads 11 can be reduced.

Further, referring to fig. 1, in some embodiments, the connection lines between the first chip 2, the third chip 4 and the two second chips 3 enclose a rectangular area, and the first electrode pad 11 and the first conductive line 12 are located in the rectangular area. In this embodiment, the first chip 2, the second chip 3 and the third chip 4 are arranged at intervals, and the first electrode pad 11 and the first conductive line 12 are arranged in a rectangular area formed by the intervals, so that the free area can be fully utilized for arranging the lines.

Preferably, as shown in fig. 1, the distance between the first chip 2 and the second chip 3 is equal to the distance between the third chip 4 and the second chip 3 in terms of structural design. Wherein the distance between the center of the first chip 2 and the center of one of the second chips 3 is D1, the distance between the center of the first chip 2 and the center of the other second chip 3 is D2, the distance between the center of the third chip 4 and the center of one of the second chips 3 is D3, the distance between the center of the third chip 4 and the center of the other second chip 3 is D4, d1=d2=d3=d4, and the equidistant arrangement in this embodiment is to satisfy the use principle of pixel multiplexing. Of course, in other embodiments, the distances may also be set to be unequal.

Wherein, D1 in the present embodiment is a distance between centers of two fixing pads 16 corresponding to the first chip 2 and one of the second chips 3, D2 is a distance between centers of two fixing pads 16 corresponding to the first chip 2 and the other of the second chips 3, D3 is a distance between centers of two fixing pads 16 corresponding to the third chip 4 and one of the second chips 3, and D4 is a distance between centers of two fixing pads 16 corresponding to the third chip 4 and the other of the second chips 3.

Referring to fig. 2, in some embodiments, the substrate 1 is provided with a plurality of conductive holes 5, the conductive holes 5 penetrate through a first plate surface and the second plate surface of the substrate 1, the first plate surface of the substrate 1 is provided with a plurality of second conductive traces 17, and the second plate surface of the substrate 1 is provided with a third conductive trace 18 and a plurality of fourth conductive traces 19 (see fig. 3); one end of one of the conductive holes 5 is electrically connected with the first electrode pad 11 through the first conductive line 12, and the other end is electrically connected with the common soldering leg 14 through the third conductive line 18; the remaining conductive vias 5 are electrically connected to the respective second electrode pads 13 via the second conductive traces 17 and to the respective individual fillets 15 via the fourth conductive traces 19. In this embodiment, the substrate 1 is provided with five conductive holes 5, one conductive hole 5 is located at a middle position of the substrate 1, the other four conductive holes 5 are distributed around the conductive hole 5 at the middle position in an array manner, the conductive holes 5 located at the middle position are connected with the first conductive circuit 12, and the positions of the other four conductive holes 5 are in one-to-one correspondence with the positions of the four second electrode pads 13, so as to be electrically connected with the four second electrode pads 13. By providing the conductive holes 5 and the conductive lines to realize connection of the pads and the fillets on the two faces of the substrate 1, the line connection structure can be simplified.

The conductive lines, the bonding pads and the bonding pins can be etched to form corresponding lines and bonding pad structures on the front surface (i.e. the first board surface) of the substrate 1 and corresponding functional bonding pins and lines on the back surface (i.e. the second board surface) through the exposure and development process of the PCB. The front and back circuits are connected through 5 conductive holes 5, so that the front and back circuits are conducted.

Further, referring to fig. 4, in some embodiments, the first plate surface of the substrate 1 may be provided with a first ink layer 6, the first ink layer 6 covering the first conductive traces 12, the second conductive traces 17 and the conductive vias 5, and leaving an uncovered area 8 between the edge of the first ink layer 6 and the edge of the substrate 1; the first plate surface of the substrate 1 is further encapsulated with a gel 9 (see fig. 6), the gel 9 covers the first ink layer 6, and the gel 9 fills the uncovered area 8. Through the structural design of the first ink layer 6, the air tightness of the LED lamp bead 100 can be enhanced, the water vapor climbing path is prolonged, and the reliability of a product is improved. The colloid 9 encapsulated on the substrate 1 can be epoxy glue or silica gel, and the specific combination mode can be modes of hot press combination, mould pressing, 3D printing, colloid 9 printing and coating and the like. The thickness of the colloid 9 can be controlled between 300 and 600um, preferably 350um.

In this embodiment, the first ink layer 6 leaves an uncovered area 8 with a corresponding distance at the edge of the substrate 1, so that after the entire substrate 1 is encapsulated by the subsequent colloid 9, the distance that water vapor in air is immersed into the pad area from the space between the first plate surface of the substrate 1 and the colloid 9 is prolonged, the water vapor is immersed from the space between the first plate surface and the colloid 9, and the water vapor is changed into the water vapor which can only be immersed into the pad area after passing through the colloid 9 and the first ink layer 6, so that the overall immersion path of the water vapor is prolonged; meanwhile, the design of the first ink layer 6 is not limited to this one way, and the surrounding of each chip can be designed to form a wrapping area, so that the light-emitting independence between each light-emitting chip is enhanced, and meanwhile, the light mixing height between different light-emitting chips is changed and the light efficiency crosstalk between different light-emitting chips is reduced through the adjustment of the thickness of the ink layer (such as after the ink is added).

Further, the first ink layer 6 is arranged around each bonding pad and can be in a front-back bilateral symmetry structure, so that the black first ink layer 6 covers most of the non-bonding pad positions, the thickness of the first ink layer 6 can be controlled to be 10-100um, preferably 25um, the LED lamp beads 100 can be enabled to be darker, the contrast of the LED lamp beads 100 when being lighted is increased, and meanwhile, leads between a chip and bonding pads are not affected; meanwhile, a distance needs to be set between the first ink layer 6 and the edge of the substrate 1, the distance can be controlled to be 20-100um, preferably 80um, and the actual distance needs to be set according to the center distance between the two fixing pads 16, for example, when the value of D (i.e. D1, D2, D3 or D4) is 0.9mm, the distance between the first ink layer 6 and the edge of the substrate 1 is preferably 80um, and when the value of D is 0.48mm, the distance between the first ink layer 6 and the edge of the substrate 1 is preferably 50um.

Referring to fig. 4, in some embodiments, the first ink layer 6 separates the first chip 2, the second chip 3, and the third chip 4 from one another such that the first chip 2, the second chip 3, and the third chip 4 are independent of one another, reducing crosstalk; referring to fig. 5, the second plate surface of the substrate 1 is further provided with a second ink layer 7, the second ink layer 7 covers the third conductive trace 18, the fourth conductive trace 19 and the conductive via 5, and the second ink layer 7 separates the common pad 14 and each of the individual pads 15. The second face of base plate 1 also sets up the one deck printing ink layer in this embodiment, can cover naked circuit for the circuit does not contact with external direct, reduces the risk of damage, can also add one deck white identification mark on second printing ink layer 7 simultaneously for discernment specific direction, when can avoiding the customer end to use, the bad that the wrong use of product direction leads to.

Referring to fig. 5, in some alternative embodiments, four of the individual fillets 15 include a first individual fillets 151 (i.e., r+ in the drawing), two second individual fillets 152 (i.e., g+ and G' +) in the drawing, and a third individual fillets 153 (i.e., b+ in the drawing), the two second individual fillets 152 being diagonally arranged, the two second individual fillets 152 corresponding to the positions of the two second chips 3, the first individual fillets 151 corresponding to the positions of the first chips 2, and the third individual fillets 153 corresponding to the positions of the third chips 4; the four second electrode pads 13 include a first second electrode pad 131, two second electrode pads 132, and a third second electrode pad 133, where the first second electrode pad 131 electrically connects the first individual bonding pad 151 with the first chip 2, the second electrode pad 132 electrically connects the second individual bonding pad 152 with the second chip 3, and the third second electrode pad 133 electrically connects the third individual bonding pad 153 with the third chip 4; one of the second independent fillets 152 (i.e., g+ in the drawing) is aligned with the common fillets 14 (i.e., c+ in the drawing), and the third independent fillets 153 (i.e., b+ in the drawing) are aligned on the same row and on the same side of the substrate 1 as one of the second and third second electrode pads 132, 133, i.e., all are aligned on the front side of the substrate 1; the other second independent solder leg 152 (G' +) is arranged in the same row as the first independent solder leg 151 (r+) and is located on the other side of the substrate 1, i.e. on the rear side of the substrate 1, with the other second electrode pad 132 and the first and second electrode pads 131. This arrangement allows the conductive lines that electrically connect the pads to the fillets to be made relatively short.

Further, as can be seen in fig. 5, for symmetry in welding, an empty fillet NC is also provided between the first individual fillet 151 (i.e., r+ in the drawing) and the other of the second individual fillets 152 (i.e., G' + in the drawing).

Referring to fig. 7, which shows a schematic diagram of circuit driving, by connecting the cathodes of 4 chips and independently leading out the 4 anodes, the 5 solder feet can independently control the corresponding chips to emit light, and the common cathode structure is controlled; the anodes of the 4 chips are connected, and the 4 cathodes are led out independently, so that the 5 welding legs can control the corresponding chips to emit light independently, and the control of the common anode structure is realized.

Referring to fig. 10, an embodiment of the present utility model further provides a display device, which may include a plurality of the LED lamp beads 100 described above.

Referring to fig. 8, in a related art, a 16 real pixel (RGB is a set of real pixels) arrangement structure of a 4*4 array, fig. 9, a 4 real pixel (RGGB is a set of real pixels) arrangement structure of a 2×2 array, and fig. 10, a 16 virtual pixel display structure of a 4*4 array, which is implemented by performing an arithmetic operation on the 4 real pixels of the 2×2 array, each pixel may implement a display of a virtual image pixel of RGB by performing color complementation with other colors around, for example, a green light (G) chip of a second row and a second column in fig. 10 may form a virtual pixel by performing color complementation with a round of 2R chips, 2B chips, and 4G chips around.

In the related art, the virtual pixel scheme is commonly used for liquid crystal and OLED display, and by implementing the virtual pixels (sub-pixels), the virtual pixels (sub-pixels) can be generated by the algorithm by using the same number of real pixels, so that the display effect of higher PPT or lower dot pitch is displayed. Meanwhile, the display effect is acceptable for human eyes, and the application scene is wider. For example, a structure originally designed with 0.92 resolution can achieve a display effect with 0.46 resolution. In the application field of the LEDs, an application scheme of the virtual pixels is realized in a COB scheme, but in the COB display scheme, the requirement on the yield of chip transfer is high, the COB of the real pixels can not be repaired for the defects of few pixels, the influence caused by the COB of the real pixels can be ignored, but in the COB display of the virtual pixels, the defects of 1 pixel point can cause the display defects of peripheral 4 pixel points, the display effect is influenced, and meanwhile, the COB display scheme is difficult to isolate the individual pixels against light-crosstalk and difficult to process the light emission of the pixels. For the COB display scheme, 1 pixel point is bad, a whole COB module needs to be replaced, and maintenance is difficult, and the display device provided by the embodiment can realize control of a single LED lamp bead, so that only the single LED lamp bead needs to be replaced. In addition, the LED lamp beads in the display device provided by the embodiment are provided with the ink layer, and the light mixing height between different light emitting chips can be changed and the light efficiency crosstalk between the chips can be reduced through the adjustment of the thickness of the ink layer (such as after the ink is added).

In the description of the present utility model, it should be noted that the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present utility model and simplifying the description, and are not indicative or implying that the apparatus or element in question must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present utility model. Unless specifically stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

It should be noted that in the present utility model, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The foregoing is only a specific embodiment of the utility model to enable those skilled in the art to understand or practice the utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. An LED light bead, characterized in that it comprises:

the LED lamp comprises a substrate (1), wherein a first plate surface of the substrate (1) is provided with first chips (2), third chips (4) and two second chips (3) which are distributed in a matrix, the luminous colors of the first chips (2), the second chips (3) and the third chips (4) are different, and the positions of the two second chips (3) are diagonally arranged;

the first plate surface of the substrate (1) is provided with independent first electrode bonding pads (11) corresponding to the first chip (2), the second chip (3) and the third chip (4), first electrodes of the first chip (2), the second chip (3) and the third chip (4) are electrically connected with the corresponding first electrode bonding pads (11), and all the first electrode bonding pads (11) are electrically connected through first conductive circuits (12);

the first plate surface of the substrate (1) is provided with independent second electrode pads (13) corresponding to the first chip (2), the second chip (3) and the third chip (4), and the second electrodes of the first chip (2), the second chip (3) and the third chip (4) are electrically connected with the corresponding second electrode pads (13);

the second plate surface of the substrate (1) is provided with a common welding leg (14), each second electrode welding pad (13) is provided with an independent welding leg (15), each second electrode welding pad (13) is electrically connected with each corresponding independent welding leg (15), and the common welding leg (14) is electrically connected with the first conductive circuit (12).

2. The LED light bulb of claim 1, wherein:

the first chip (2) is fixed on one of the first electrode bonding pads (11) through conductive adhesive, so that a first electrode of the first chip (2) is electrically connected with the first electrode bonding pad (11);

the second chip (3) is arranged at intervals with the corresponding first electrode bonding pad (11), and the first electrode of the second chip (3) is electrically connected with the first electrode bonding pad (11) through a wire;

the third chip (4) is arranged at intervals with the corresponding first electrode bonding pad (11), and the first electrode of the third chip (4) is electrically connected with the first electrode bonding pad (11) through a wire.

3. The LED light bulb of claim 2, wherein:

the first plate surface of the substrate (1) is provided with four fixing pads (16) which are arranged in a matrix, the four fixing pads (16) are in one-to-one correspondence with the first chip (2), the two second chips (3) and the third chip (4), and the four fixing pads (16) are electrically connected with all the first electrode pads (11) through the first conductive circuits (12);

-said first polar pad (11) electrically connected to said first chip (2) is one of said anchor pads (16);

the second chip (3) and the third chip (4) are fixed to the corresponding fixing pads (16) by insulating glue.

4. The LED light bulb of claim 1, wherein:

the first chip (2), the third chip (4) and the two second chips (3) are connected to form a rectangular area, and the first electrode bonding pad (11) and the first conductive circuit (12) are located in the rectangular area.

5. The LED light bulb of claim 1, wherein:

the distance between the first chip (2) and the second chip (3) is equal to the distance between the third chip (4) and the second chip (3).

6. The LED light bulb of claim 1, wherein:

the substrate (1) is provided with a plurality of conductive holes (5), the conductive holes (5) penetrate through a first plate surface and a second plate surface of the substrate (1), the first plate surface of the substrate (1) is provided with a plurality of second conductive circuits (17), and the second plate surface of the substrate (1) is provided with a third conductive circuit (18) and a plurality of fourth conductive circuits (19);

one end of one conductive hole (5) is electrically connected with the first electrode pad (11) through the first conductive line (12), and the other end is electrically connected with the common welding pin (14) through the third conductive line (18);

the remaining conductive vias (5) are electrically connected to the respective second electrode pads (13) by the second conductive tracks (17) and to the respective individual fillets (15) by the fourth conductive tracks (19).

7. The LED light bulb of claim 6, wherein:

a first plate surface of the substrate (1) is provided with a first ink layer (6), the first ink layer (6) covers the first conductive circuit (12), the second conductive circuit (17) and the conductive hole (5), and an uncovered area (8) is reserved between the edge of the first ink layer (6) and the edge of the substrate (1);

the first plate surface of the substrate (1) is also encapsulated with a colloid (9), the colloid (9) covers the first ink layer (6), and the colloid (9) fills the uncovered area (8).

8. The LED light bulb of claim 7, wherein:

the first ink layer (6) separates the first chip (2), the second chip (3) and the third chip (4) from each other;

the second plate surface of the substrate (1) is provided with a second ink layer (7), the second ink layer (7) covers the third conductive line (18), the fourth conductive line (19) and the conductive hole (5), and the second ink layer (7) separates the common soldering leg (14) and each independent soldering leg (15).

9. The LED light bulb of claim 1, wherein:

the four independent welding legs (15) comprise a first independent welding leg (151), two second independent welding legs (152) and a third independent welding leg (153), and the two second independent welding legs (152) are diagonally arranged;

the four second electrode pads (13) comprise a first second electrode pad (131), two second electrode pads (132) and a third second electrode pad (133), the first second electrode pad (131) is electrically connected with the first independent welding pin (151) and the first chip (2), the second electrode pad (132) is electrically connected with the second independent welding pin (152) and the second chip (3), and the third second electrode pad (133) is electrically connected with the third independent welding pin (153) and the third chip (4);

one of the second independent welding pins (152) is arranged in the same row with the common welding pin (14) and the third independent welding pin (153), and is positioned on the same side of the substrate (1) with one of the second electrode bonding pads (132) and the third electrode bonding pad (133);

the other second independent welding pins (152) and the first independent welding pins (151) are arranged in the same row, and are positioned on the other side of the substrate (1) together with the other second electrode bonding pads (132) and the first electrode bonding pads (131).

10. A display device comprising a plurality of LED beads according to any one of claims 1-9.