CN201741724U - Luminous diode lead frame - Google Patents
Luminous diode lead frame Download PDFInfo
- Publication number
- CN201741724U CN201741724U CN2010202437937U CN201020243793U CN201741724U CN 201741724 U CN201741724 U CN 201741724U CN 2010202437937 U CN2010202437937 U CN 2010202437937U CN 201020243793 U CN201020243793 U CN 201020243793U CN 201741724 U CN201741724 U CN 201741724U
- Authority
- CN
- China
- Prior art keywords
- pin
- conducting wire
- wire frame
- led conducting
- protuberance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Abstract
The utility model relates to a luminous diode lead frame which is assembled on a printed circuit board and includes a rubber seat provided with a hollow function area, and a plurality of metal pins; the metal pins are exposed in the function area in a spacing way and extend out of the rubber seat; a plug foot used for being inserted into the printed circuit board is arranged on the metal pin; and the plug foot is provided with an extruding part and a through hole penetrating the extruding part. The luminous diode lead frame does not need surface welding, can greatly improve assembling convenience, can be instantly inserted and used, and is easy to be repaired and replaced.
Description
[technical field]
The utility model relates to a kind of LED conducting wire frame, the LED conducting wire frame of especially a kind of ease of assembly and dismounting.
[background technology]
Light-emitting diode is a kind of solid-state semiconductor element, is different from the osram lamp principle of luminosity, and it is luminous to belong to cold light, and only the minimum electric current of need just can be luminous.Light-emitting diode not only have life-span length, power saving, durable, shatter-proof, firm, be fit to volume production, volume is little and reacts advantage such as fast, widespread usage multinomial product in life more, as: the indicator light of backlight, information and the consumption electronic products of mobile phone, Personal Digital Assistant (PDA) product, industrial instrument equipment, automobile with meter lamp and brake light and large-scale advertisement billboard etc.
Existing LED conducting wire frame generally includes rubber base, two metal pins, luminescence chip and two leads.Rubber base has the functional areas of hollow form, and the metal pin is embedded in the rubber base, and wherein the metal pin partly is exposed to the bottom, functional areas, and part is extended the relative both sides of rubber base, and is bent to the rubber base bottom surface with the contact as successive process along the rubber base outside.
The metal pin of existing LED conducting wire frame is welded on the printed circuit board (PCB) by scolding tin or other material, needs welding equipment or other machinery, and its processing procedure is comparatively loaded down with trivial details.In the process of welding, can produce a large amount of heat effects to rubber base, make it be heated flavescence and reduce its luminous efficiency, but also can stay thermal stress, shorten the useful life of LED conducting wire frame.Suppose that the LED conducting wire frame finished of welding in use breaks down or when damaging, maintenance and the process of changing are all comparatively loaded down with trivial details.
Therefore, necessary existing LED conducting wire frame is improved to overcome the aforementioned disadvantages of prior art.
[utility model content]
The purpose of this utility model is to provide a kind of ease of assembly and dismantles LED conducting wire frame to printed circuit board (PCB).
The purpose of this utility model is achieved through the following technical solutions: a kind of LED conducting wire frame, be assembled on the printed circuit board (PCB), it comprises: be provided with the rubber base of hollow functional areas and be exposed at interval number of metal pin in the functional areas, this metal pin is provided with and extends to the outer pin of rubber base, and this pin extends straight down and is provided with the perforation that plugs the protuberance in the printed circuit board (PCB) and run through protuberance.
The both sides of described protuberance on the pin Width protrude out.The width of described protuberance horizontal direction is wider than the width of pin horizontal direction.Described metal pin also comprises installation portion and from the kink of installation portion to outside extension of rubber base and downward bending, described pin extends downwards from kink.Described printed circuit board (PCB) is provided with through hole, and the lateral margin of described through hole is coated with metal level, protuberance conflict metal level.
The purpose of this utility model can also realize by another kind of technical scheme: a kind of LED conducting wire frame, be assembled on the printed circuit board (PCB), it comprises: be provided with the rubber base of hollow functional areas and be exposed at interval number of metal pin in the functional areas, described metal pin is provided with and extends to the outer pin of rubber base, and this pin is provided with the protuberance that plugs in the printed circuit board (PCB).
Compared to prior art, the pin of the metal pin of the utility model LED conducting wire frame need not surface soldered, can directly be assembled in the printed circuit board (PCB), can significantly improve the convenience of assembling, plug and play and for ease of maintenaince reach replacing.
[description of drawings]
Fig. 1 is assembled in the stereogram of printed circuit board (PCB) for the utility model LED conducting wire frame.
Fig. 2 is the exploded view of the utility model LED conducting wire frame and printed circuit board (PCB).
Fig. 3 is the part exploded view of the utility model LED conducting wire frame and printed circuit board (PCB).
Fig. 4 is the end view of the utility model LED conducting wire frame.
Fig. 5 is assembled in the cutaway view of printed circuit board (PCB) along the A-A line LED conducting wire frame of Fig. 1.
[embodiment]
See also Fig. 1 to shown in Figure 5, the utility model is a kind of LED conducting wire frame 100, and it comprises the rubber base 1 of insulation and is immobilizated in pair of metal pin 2 in the rubber base 1.This LED conducting wire frame 100 is assembled on the printed circuit board (PCB) 5.
See also Fig. 2 to shown in Figure 4, rubber base 1 roughly is rectangular structure, by the plastics ejection formation on metal pin 2.Rubber base 1 outside forms external glue wall 11, and the middle part of rubber base 1 is arranged with the functional areas 10 that form hollow form downwards, and these functional areas 10 are oblong-shaped, also can be toroidal, elliptical shape or other is polygon-shaped.
Metal pin of the present utility model 2 forms in the punch forming mode by conducting metals such as copper or copper alloys.Described metal pin 2 is embedded in the rubber base 1, and each metal pin 2 all has part to be found in the bottom of functional areas 10.Described metal pin 2 comprises the installation portion 20 that is positioned at 10 bottoms, functional areas, extends and along a pair of kinks 21 of external glue wall 11 bending downwards of rubber base 1 and a pair of pin 22 that extends straight down from kink 21 to rubber base 1 is outside from installation portion 20.Wherein, luminescence chip 3 is assembled in the wherein upper surface of metal pin 2, by lead 4 luminescence chip 3 and metal pin 2 is electrically connected.See also shown in Figure 4ly, pin 22 comprises protuberance 220 that the both sides on its Width protrude out and the perforation 221 that runs through this protuberance 220.The width of protuberance 220 horizontal directions is wider than the width of pin 22 horizontal directions.
See also Fig. 2 and shown in Figure 5, be assembled with LED conducting wire frame 100 on the printed circuit board (PCB) 5, printed circuit board (PCB) 5 is provided with the through hole 50 that runs through, and the lateral margin of through hole 50 is coated with the metal level 500 that conducting function is provided.When encapsulating, the metal pin 2 of LED conducting wire frame 100 is inserted in the through hole 50 of printed circuit board (PCB) 5 from top to bottom, in the process that metal pin 2 moves down, the protuberance 220 of the pin 22 of metal pin 2 is under pressure and produces slight distortion by being provided with of perforation 221, after assembling is finished, the metal level 500 of the protuberance 220 conflict through holes 50 of metal pin 2 produces with printed circuit board (PCB) 5 and electrically connects, and can effectively LED conducting wire frame 100 be fixed on the printed circuit board (PCB) 5.If in using the process of LED conducting wire frame 100, break down or when damaging, only need problematic LED conducting wire frame 100 is extracted from the through hole 50 of printed circuit board (PCB) 5, change a new LED conducting wire frame 100 again and get final product.
The pin 22 of the metal pin 2 of LED conducting wire frame 100 of the present utility model directly is assembled in the through hole 50 of printed circuit board (PCB) 5, can significantly improve the convenience of assembling, plug and play and for ease of maintenaince reach replacing.Because LED conducting wire frame 100 adopts the mode of straight cutting, exempted this process of welding, rubber base 1 can not reduce the brightness of sending light because of the flavescence of being heated, can not stay thermal stress yet, thereby guarantee the useful life of LED conducting wire frame 100, can also effectively reduce the height of LED conducting wire frame 100 integral body.
Claims (10)
1. LED conducting wire frame, be assembled on the printed circuit board (PCB), it comprises: be provided with the rubber base of hollow functional areas and be exposed at interval number of metal pin in the functional areas, it is characterized in that: described metal pin is provided with and extends to the outer pin of rubber base, and this pin extends straight down and is provided with the perforation that plugs the protuberance in the printed circuit board (PCB) and run through protuberance.
2. LED conducting wire frame as claimed in claim 1 is characterized in that: the both sides of described protuberance on the pin Width protrude out.
3. LED conducting wire frame as claimed in claim 2 is characterized in that: the width of described protuberance horizontal direction is wider than the width of pin horizontal direction.
4. LED conducting wire frame as claimed in claim 3 is characterized in that: described metal pin also comprises installation portion and from the kink of installation portion to outside extension of rubber base and downward bending, described pin extends downwards from kink.
5. LED conducting wire frame as claimed in claim 1 is characterized in that: described printed circuit board (PCB) is provided with through hole, and the lateral margin of described through hole is coated with metal level, protuberance conflict metal level.
6. LED conducting wire frame, be assembled on the printed circuit board (PCB), it comprises: be provided with hollow functional areas rubber base and be exposed at interval metal pin in the functional areas, it is characterized in that: described metal pin is provided with and extends to the outer pin of rubber base, and this pin is provided with the protuberance that plugs in the printed circuit board (PCB).
7. LED conducting wire frame as claimed in claim 6 is characterized in that: the both sides of described protuberance on the pin Width protrude out.
8. LED conducting wire frame as claimed in claim 7 is characterized in that: the width of described protuberance horizontal direction is wider than the width of pin horizontal direction.
9. LED conducting wire frame as claimed in claim 8 is characterized in that: described pin also comprises the perforation that runs through protuberance.
10. LED conducting wire frame as claimed in claim 9 is characterized in that: described metal pin also comprises installation portion and from the kink of installation portion to outside extension of rubber base and downward bending, described pin extends downwards from kink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202437937U CN201741724U (en) | 2010-06-30 | 2010-06-30 | Luminous diode lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202437937U CN201741724U (en) | 2010-06-30 | 2010-06-30 | Luminous diode lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201741724U true CN201741724U (en) | 2011-02-09 |
Family
ID=43557002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202437937U Expired - Fee Related CN201741724U (en) | 2010-06-30 | 2010-06-30 | Luminous diode lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201741724U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102683563A (en) * | 2011-03-10 | 2012-09-19 | 富士康(昆山)电脑接插件有限公司 | Lead frame for luminous chip |
| CN109931511A (en) * | 2019-01-31 | 2019-06-25 | 青鸟半导体科技(铜陵)有限公司 | Ceramic base encapsulated LED light source component and its packaging technology |
-
2010
- 2010-06-30 CN CN2010202437937U patent/CN201741724U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102683563A (en) * | 2011-03-10 | 2012-09-19 | 富士康(昆山)电脑接插件有限公司 | Lead frame for luminous chip |
| CN109931511A (en) * | 2019-01-31 | 2019-06-25 | 青鸟半导体科技(铜陵)有限公司 | Ceramic base encapsulated LED light source component and its packaging technology |
| CN109931511B (en) * | 2019-01-31 | 2020-11-06 | 青鸟半导体科技(铜陵)有限公司 | Ceramic-based packaged LED light source assembly and assembling process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110209 Termination date: 20120630 |