CN109931511B - Ceramic-based packaged LED light source assembly and assembling process thereof - Google Patents
Ceramic-based packaged LED light source assembly and assembling process thereof Download PDFInfo
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- CN109931511B CN109931511B CN201910097907.7A CN201910097907A CN109931511B CN 109931511 B CN109931511 B CN 109931511B CN 201910097907 A CN201910097907 A CN 201910097907A CN 109931511 B CN109931511 B CN 109931511B
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Abstract
The invention discloses a ceramic-based packaged LED light source assembly and an assembly process thereof, which comprises an aluminum-based circuit board (2) welded with a ceramic-based LED light source, an aluminum light cup (3) and a driving circuit board (4), a connector (1) is arranged above the aluminum-based circuit board and comprises an insulating base (5) and an opening part positioned in the center of the insulating base and used for embedding the aluminum-based circuit board, a conductive metal sheet is embedded on the insulating base at the periphery of the opening part, one end of the conductive metal sheet is provided with a contact part (6) which is downwards exposed out of the bottom of the insulating base, the other end of the conductive metal sheet is provided with a bending part (7) extending towards the lower part of the insulating base, the contact part is electrically connected with the aluminum-based circuit board, the bending part is positioned at the outer side of the aluminum-based circuit board and is electrically connected with the driving circuit board, spring buckles (8) connected with the drive circuit board in a buckling mode are symmetrically distributed at the bottom of the insulating base. The invention has the advantages of greatly improving the assembly efficiency and saving the labor cost.
Description
Technical Field
The invention relates to the field of semiconductor packaging and applied lamps, in particular to a ceramic-based packaged LED light source component and an assembly process thereof.
Background
The LED light source assembly generally used in the current market is shown in figure 1, and comprises an aluminum-based circuit board, a ceramic-based LED light source, an aluminum light cup and a driving circuit board (welded with electronic devices such as resistors, wires and the like), wherein the aluminum-based circuit board is arranged on the driving circuit board through a T-shaped nail, and the aluminum-based circuit board is processed and finished by adopting a conducting hole glue-pouring insulation process due to process requirements, so that the manufacturing and processing process is complex, the yield is low, the production efficiency is low and the cost is high due to limited manufacturing capability of the current process technology; in the assembling process, because 4T-shaped communicating nails are required to be installed, the machine batch operation cannot be realized, manual installation is required, then welding is carried out, and the labor cost is also improved year by year when the installation efficiency is low.
Chinese utility model patent publication No. CN204739443U discloses a high light efficiency LED light source, including aluminium base circuit board, aluminium base circuit board on be equipped with a plurality of LED luminescence units, aluminium base circuit board top be equipped with the light guide dome, LED luminescence unit and aluminium base circuit board all covered by the light guide dome, this LED light source still has the problem that needs to use T type intercommunication nail to install aluminium base circuit board; still like chinese utility model patent publication No. CN203895644U discloses a connector for installation of aluminium base circuit board of LED illumination, its structure includes casing and contact, casing below is provided with two sockets through the parting bead, and the casing both sides are provided with the flange, and the casing top is provided with left recess and right recess, left and right recess interpolation inlay fixedly the contact, socket lateral wall front end be provided with card end groove, this kind of connector structure is complicated for the welding is used for switching on the circuit on aluminium base circuit board, does not make the improvement to aluminium base circuit board and drive circuit board's mounting means.
Disclosure of Invention
The invention aims to solve the technical problems that the existing LED light source assembly is low in assembly efficiency and high in assembly cost due to the fact that an aluminum-based circuit board and a driving circuit board are connected through a T-shaped nail during assembly, and therefore the ceramic-based packaged LED light source assembly and the assembly process thereof are provided.
The technical scheme of the invention is as follows: ceramic matrix encapsulation LED light source subassembly, it is including aluminium base circuit board, aluminium light cup and the drive circuit board that has ceramic matrix LED light source, aluminium base circuit board top is installed and is fixed the connector on the drive circuit board with aluminium base circuit board, the connector includes insulating base and the opening that is located the aluminium base circuit board embedding of the confession of insulating base central authorities, it is equipped with the conducting metal piece to inlay on the outlying insulating base of opening, the one end of conducting metal piece has the contact site that exposes insulating base bottom downwards, the other end of conducting metal piece has the portion of bending that extends to insulating base below, the contact site is connected with aluminium base circuit board electricity, the portion of bending is located the outside of aluminium base circuit board and is connected with the drive circuit board electricity, insulating base bottom still symmetric distribution has the snak link of being connected with drive circuit board buckle.
In the scheme, the contact part is in an arc shape which is bent upwards and warped.
In the scheme, the conductive metal sheet is a copper sheet/alloy metal sheet.
In the scheme, the bending part is cylindrical.
In the scheme, the insulating base is formed by injection molding of engineering plastics.
The assembly process of the ceramic-based packaged LED light source component comprises the following steps: the aluminum-based circuit board welded with the ceramic-based LED light source is placed in an opening part of the insulating base, the contact part is connected and conducted with the aluminum-based circuit board, the insulating base is placed at the bottom of the aluminum cup, the driving circuit board is placed at the bottom of the aluminum cup, the bending part is in contact with the driving circuit board, the spring fastener is connected with the driving circuit board in a buckling mode, and the assembly of the ceramic-based packaged LED light source assembly is completed.
The invention has the beneficial effects that the ceramic-based LED light source is arranged in the aluminum-based circuit board and is in conduction connection through the contact part of the connector, the bending part is in conduction connection with the circuit driving board, the circuit driving board is communicated with an external power supply through a wire, and the spring buckle of the connector is in buckle connection with the circuit driving board, so that the assembly efficiency is greatly improved, and the labor cost is saved.
Drawings
FIG. 1 is a schematic view of an assembly of a prior art ceramic based packaged LED light source module;
FIG. 2 is an assembly schematic of the present invention;
FIG. 3 is a schematic view of the connector of FIG. 2;
FIG. 4 is a schematic view of the connector assembled with an aluminum-based circuit board;
FIG. 5 is a schematic view of the connector assembled with the circuit driver board;
in the figure, 1, a connector, 2, an aluminum-based circuit board, 3, an aluminum light cup, 4, a driving circuit board, 5, an insulating base, 6, a contact part, 7, a bending part, 8 and a spring buckle.
Detailed Description
The technical scheme in the embodiment of the invention is clearly and completely described below with reference to the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments based on the embodiments in the present invention, without any inventive work, will be apparent to those skilled in the art from the following description.
Example 2: the difference from embodiment 1 is that a silver plate is embedded in an insulating base around the opening.
Example 3: the difference from embodiment 1 is that an alloy metal piece is embedded in the insulating base around the opening.
As shown in fig. 2-5, the assembly process of the ceramic-based packaged LED light source assembly comprises the following steps: the aluminum-based circuit board with the ceramic-based LED light source is placed in an opening portion of the insulating base, the contact portion is connected and conducted with the aluminum-based circuit board, the insulating base is placed at the bottom of the aluminum cup, the driving circuit board is placed at the bottom of the aluminum cup, the bending portion is in contact with the driving circuit board, the spring fastener is connected with the driving circuit board in a buckling mode, and assembly of the ceramic-based packaged LED light source assembly is completed.
Claims (6)
1. Ceramic base encapsulation LED light source subassembly, it is including aluminium base circuit board (2), aluminium light cup (3) and drive circuit board (4) that the welding has ceramic base LED light source, characterized by: aluminium base circuit board top is installed and is fixed connector (1) on drive circuit board with aluminium base circuit board, the connector includes insulating base (5) and the opening that is located the aluminium base circuit board embedding of the confession of insulating base central authorities, it is equipped with conductive metal piece to inlay on the outlying insulating base of opening, conductive metal piece's one end has contact site (6) that expose insulating base bottom downwards, conductive metal piece's the other end has the portion of bending (7) that extend to insulating base below, the contact site is connected with aluminium base circuit board electricity, the portion of bending is located aluminium base circuit board's the outside and is connected with drive circuit board electricity, insulating base bottom still symmetric distribution have with drive circuit board buckle connection's snak knot (8).
2. The ceramic based packaged LED light source module of claim 1, wherein said contact portion is in the shape of an arc bent upward and warped.
3. The ceramic based packaged LED light source module of claim 1, wherein said electrically conductive metal sheet is a copper/alloy sheet.
4. The ceramic based packaged LED light source module of claim 1, wherein said bent portion is cylindrical.
5. The ceramic based packaged LED light source module of claim 1, wherein said insulating base is injection molded from an engineering plastic.
6. The process for assembling a ceramic matrix encapsulated LED light source module according to any of claims 1-5, characterized in that it comprises the following steps: the aluminum-based circuit board welded with the ceramic-based LED light source is placed in an opening part of the insulating base, the contact part is connected and conducted with the aluminum-based circuit board, the insulating base is placed at the bottom of the aluminum cup, the driving circuit board is placed at the bottom of the aluminum cup, the bending part is in contact with the driving circuit board, the spring fastener is connected with the driving circuit board in a buckling mode, and the assembly of the ceramic-based packaged LED light source assembly is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910097907.7A CN109931511B (en) | 2019-01-31 | 2019-01-31 | Ceramic-based packaged LED light source assembly and assembling process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910097907.7A CN109931511B (en) | 2019-01-31 | 2019-01-31 | Ceramic-based packaged LED light source assembly and assembling process thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109931511A CN109931511A (en) | 2019-06-25 |
| CN109931511B true CN109931511B (en) | 2020-11-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910097907.7A Active CN109931511B (en) | 2019-01-31 | 2019-01-31 | Ceramic-based packaged LED light source assembly and assembling process thereof |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201741724U (en) * | 2010-06-30 | 2011-02-09 | 富士康(昆山)电脑接插件有限公司 | Luminous diode lead frame |
| CN202501421U (en) * | 2011-12-31 | 2012-10-24 | 东莞安尚崇光科技有限公司 | Electronically-conductive connection structure of LED plane light source |
| CN203162852U (en) * | 2012-12-29 | 2013-08-28 | 东莞安尚崇光科技有限公司 | Buckle mounting type weld-free LED conductive module |
| CN204358481U (en) * | 2014-12-20 | 2015-05-27 | 江门市云达灯饰有限公司 | A kind of LED lamp assembly |
| CN205690093U (en) * | 2016-04-22 | 2016-11-16 | 深圳市丰源达科技有限公司 | A kind of band conductive pin and the LED luminescence component of spot welding bracket and reflector |
| CN205716478U (en) * | 2016-04-22 | 2016-11-23 | 深圳市丰源达科技有限公司 | A kind of LED support luminescence component of band buckle-type reflector |
| CN205806999U (en) * | 2016-04-22 | 2016-12-14 | 深圳市丰源达科技有限公司 | A kind of LED luminescence component of band plastic cement button bit reflector |
| US9791111B1 (en) * | 2016-08-30 | 2017-10-17 | Chicony Power Technology Co., Ltd. | LED lighting device having a prolonged life during high temperature operation |
-
2019
- 2019-01-31 CN CN201910097907.7A patent/CN109931511B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201741724U (en) * | 2010-06-30 | 2011-02-09 | 富士康(昆山)电脑接插件有限公司 | Luminous diode lead frame |
| CN202501421U (en) * | 2011-12-31 | 2012-10-24 | 东莞安尚崇光科技有限公司 | Electronically-conductive connection structure of LED plane light source |
| CN203162852U (en) * | 2012-12-29 | 2013-08-28 | 东莞安尚崇光科技有限公司 | Buckle mounting type weld-free LED conductive module |
| CN204358481U (en) * | 2014-12-20 | 2015-05-27 | 江门市云达灯饰有限公司 | A kind of LED lamp assembly |
| CN205690093U (en) * | 2016-04-22 | 2016-11-16 | 深圳市丰源达科技有限公司 | A kind of band conductive pin and the LED luminescence component of spot welding bracket and reflector |
| CN205716478U (en) * | 2016-04-22 | 2016-11-23 | 深圳市丰源达科技有限公司 | A kind of LED support luminescence component of band buckle-type reflector |
| CN205806999U (en) * | 2016-04-22 | 2016-12-14 | 深圳市丰源达科技有限公司 | A kind of LED luminescence component of band plastic cement button bit reflector |
| US9791111B1 (en) * | 2016-08-30 | 2017-10-17 | Chicony Power Technology Co., Ltd. | LED lighting device having a prolonged life during high temperature operation |
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| Publication number | Publication date |
|---|---|
| CN109931511A (en) | 2019-06-25 |
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Effective date of registration: 20220228 Address after: 244000 No. 3129, Tianmenshan North Road, Tongling Economic and Technological Development Zone, Anhui Province Patentee after: SAICHUANG ELECTRIC (TONGLING) Co.,Ltd. Address before: 244000 695 north section of Taishan Avenue, Tongling economic and Technological Development Zone, Anhui Patentee before: QINGNIAO SEMICONDUCTOR TECHNOLOGY (TONGLING) Co.,Ltd. |
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Address after: 244000 No. 3129, Tianmenshan North Road, Tongling Economic and Technological Development Zone, Anhui Province Patentee after: Guoci Saichuang Electric (Tongling) Co.,Ltd. Address before: 244000 No. 3129, Tianmenshan North Road, Tongling Economic and Technological Development Zone, Anhui Province Patentee before: SAICHUANG ELECTRIC (TONGLING) Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |