CN104485323B - Lead frame and semiconductor package body - Google Patents
Lead frame and semiconductor package body Download PDFInfo
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- CN104485323B CN104485323B CN201410831214.3A CN201410831214A CN104485323B CN 104485323 B CN104485323 B CN 104485323B CN 201410831214 A CN201410831214 A CN 201410831214A CN 104485323 B CN104485323 B CN 104485323B
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- support plate
- support bar
- lead frame
- bearing
- shaped hollow
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Abstract
The present invention relates to lead frame and semiconductor package body.A kind of lead frame includes multiple lead wire units, and each of which lead wire unit includes：Support plate, it is configured as bearing wafer；At least one pin array around support plate, it is configured as being connected to the chip for being carried on support plate；At least one support bar, support plate is connected to the frame of lead wire unit via at least one described support bar；Wherein, there are Y-shaped hollow slots in support plate and at least one described support bar, the bearing of trend of its multiple bifurcated is parallel to the edge direction of the support plate or the bearing of trend of at least one support bar.The mould mobile equilibrium that difference in height between support plate and pin array contributes in encapsulating packaging process.Y-shaped hollow slots formation mould-locking structure, reduces the risk of packing colloid delamination.
Description
Technical field
The present invention relates generally to chip package, more particularly, to the encapsulation of lead frame (Lead Frame) structure.
Background technology
Lead frame as integrated circuit chip carrier, be one kind by means of bonding material (spun gold, filamentary silver, copper wire, aluminium
Silk) electric connection of chip internal circuits exit and outer lead is realized, the key structure part of conductive loops is formed, it is served
The function served as bridge connected with outer lead.Lead frame is all used in most semiconductor integrated block, it is electronic information production
Important basic material in industry.
The content of the invention
Current integrated circuit integrated level more and more higher, the I/O lines of chip are more and more.The speed of chip is more and more faster,
Power is also increasing.These trend propose higher requirement to existing semiconductor packaging.
In one embodiment of the invention, a kind of lead frame is disclosed, the lead frame includes multiple lead wire units,
Each of which lead wire unit includes：Support plate, it is configured as bearing wafer；At least one around the support plate is drawn
Pin array, it is configured as being connected to the chip for being carried on the support plate；At least one support bar, the support plate is via institute
State the frame that at least one support bar is connected to lead wire unit；Wherein, in the support plate and at least one described support bar
With Y-shaped hollow slots, the bearing of trend of its multiple bifurcated parallel to the support plate edge direction or it is described at least one
The bearing of trend of support bar.The mould mobile equilibrium that difference in height between support plate and pin array contributes in encapsulating packaging process.
Y-shaped hollow slots formation mould-locking structure, packing colloid, which coats chip, support plate, support bar through Y-shaped hollow slots, is
One entirety, reduces the risk of delamination.
In another embodiment of the present invention, a kind of semiconductor package body is disclosed, the semiconductor package body includes：Branch
Support plate；Chip, it is carried on the support plate；At least one pin array around the support plate, its is electrical
It is connected to the chip；At least one support bar, it is connected to the support plate；Wherein, the support plate and it is described at least
There are Y-shaped hollow slots on one support bar, the bearing of trend of its multiple bifurcated parallel to the support plate edge direction or
The bearing of trend of at least one support bar；Encapsulating material, its coat described chip, at least one described pin array, with
And the support plate.
In above-mentioned lead frame or some specific embodiments of semiconductor package body, at least one described support bar and institute
State and also connected by reinforcement between support plate.
In above-mentioned lead frame or some specific embodiments of semiconductor package body, in addition to covering it is described at least one
The end of pin array and the local silver-plated region of at least one support bar, the Y-shaped hollow slots along it is described extremely
The bearing of trend of a few support bar is extended to outside the silver-plated region.
In above-mentioned lead frame or some specific embodiments of semiconductor package body, the support plate and described at least one
The coupling part of individual support bar is in smooth camber line corner.
In above-mentioned lead frame or some specific embodiments of semiconductor package body, the Y-shaped hollow slots are along institute
The width of extension of at least one support bar is stated the 1/4~1/3 of at least one support bar width.
Brief description of the drawings
With reference to accompanying drawing, the detailed description below in relation to the preferred embodiments of the present invention will become apparent to.The present invention is to lift
The mode of example is explained, and is not limited to reference similar in accompanying drawing, accompanying drawing and is indicated similar element.
Fig. 1 is the plane figure schematic diagram of a lead frame；
Fig. 2A shows a lead wire unit 200 in the lead frame of one embodiment；
Fig. 2 B are Fig. 2A side schematic view；
Fig. 3 figures show a lead wire unit 300 in the lead frame of another embodiment；
Fig. 4 A show a lead wire unit 400 in the lead frame of another embodiment；
Fig. 4 B show Fig. 4 A part；
Fig. 5 shows a lead wire unit 500 in the lead frame of further embodiment.
Embodiment
The detailed description of accompanying drawing is intended to the explanation as currently preferred embodiment of the invention, and is not intended to represent the present invention
The only form that can be achieved.It should be understood that identical or equivalent function can be by being intended to be contained in essence of the invention
Not be the same as Example of the god with the scope of is completed.
Fig. 1 is the plane figure schematic diagram of a lead frame 10.Lead frame 10 includes the battle array that support plate 102 is constituted
Row.The array arrangement of pin 104 is around support plate 102.Pin array is linked together by even muscle 106.Even muscle 106 is mutual
It is connected to form the framework of grid type, so that lead frame 10 constitutes an entirety.Part composition one in each grid
Individual lead wire unit.Support plate 102 is connected to framework by support bar 103.It should be understood that Fig. 1 is meant only to schematically express
Relative position relation between support plate 102, support bar 103, the array of pin 104, company's muscle 106, and be not intended to accurately show
Show the dimension scale of each part.Lead frame 10 is suitable as entirety and miscellaneous part (such as chip) and encapsulated, for example including：Will
Chip is installed in support plate 102, and chip is electrically connected with pin 104, singulation (Singulation) after encapsulating encapsulation
The company's of removal muscle 106 can form each independent semiconductor package body.It is by metal, alloy etc. that lead frame 10, which is such as, but not limited to,
What conductive material was made.
Fig. 2A shows a lead wire unit 200 in the lead frame of one embodiment.The lead wire unit includes one
Generally in square support plate 202, and it is connected to via the support bar 203 on four angles the grid frame of lead frame.Draw
Pin array 204 is distributed in around support plate 202, and it is configured as being electrically connected to the chip for being carried on support plate 202.Connect muscle
206 link together the pin array of adjacent mesh.The chip 211 on support plate 202 is also show in figure.Support
Bar 203 can form ladder in turnover region 217, so that difference in height is formed between support plate 202 and pin array 204,
In favor of the mould mobile equilibrium in encapsulating packaging process.The end of silver-plated region 213 covering pin array 204 and support bar 203
The surrounding of part and support plate 202.Also there are Y-shaped hollow slots 215, its multiple bifurcated on support bar 203 and support plate 202
Bearing of trend parallel to the edge direction of support plate 202 or the bearing of trend of support bar 203, and bifurcated is on support bar 203
Extend to outside silver-plated region 213 and (can also not extend to outside silver-plated region 213), those skilled in the art should manage
Solution, " parallel " that this place is said is generally parallel rather than parallel on strict geometric meaning.Other Y-shaped is engraved
The bifurcated of dead slot 215 can be located within silver-plated area 213 parallel to the edge direction extension of support plate 202.Dotted line frame
208 show the scope of encapsulating encapsulation.Complete after encapsulating encapsulation, singulation removes even muscle and disconnects support bar 203 and grid frame
Connection, so as to form independent semiconductor package body.According to the particular type of encapsulation, it may also include bending pin in encapsulating
The step of part beyond region.Y-shaped hollow slots 215 help to discharge stress, and reduce silver-plated area, enhance and draw
Adhesion between wire frame and packing colloid, improves locked mode effect.Packing colloid is through Y-shaped hollow slots 215 by crystalline substance
Piece 211, support plate 202, the cladding of support bar 203 are an entirety, reduce the risk of delamination.
Fig. 2 B are Fig. 2A side schematic view.Dotted line frame 204 represents pin array.Chip 211 and pin array 204 are electrical
Connection.Support bar 203 forms ladder in turnover region 217 so that form difference in height between support plate 202 and pin array 204,
In favor of the mould mobile equilibrium in encapsulating packaging process.Merely for clear purpose by pin array 204 and support bar 203 in figure
The distal end of (leaving support plate) is shown as having a point height difference.Those skilled in the art will be understood that pin array 204 and support
The distal end of bar 203 (leaving support plate) can be generally concordant.
Fig. 3 figures show a lead wire unit 300 in the lead frame of another embodiment.With drawing shown in Fig. 2
Line unit 200 is compared, and the improvements of lead wire unit 300 are essentially consisted in：Also by adding between support bar 303 and support plate 302
Strengthening tendons 319 is connected, to strengthen steadiness.
Fig. 4 A show a lead wire unit 400 in the lead frame of another embodiment.Support plate is shown in figure
402nd, support bar 403, pin array 404, the turnover region 417 of support bar 403 and Y-shaped hollow slots 415.Fig. 4 B are shown
Fig. 4 A part.As illustrated, support plate 402 and the coupling part of support bar 403 are in smooth camber line corner, this design can
With the stress for strengthening the intensity of support bar 403 and producing when advantageously reducing singulation.
Fig. 5 shows a lead wire unit 500 in the lead frame of further embodiment.The lead wire unit 500 includes
One is connected to and draws generally in rectangular support plate 502, and via the support bar 503 of both sides (left and right sides shown in figure)
The grid frame of wire frame.Pin array 504 is distributed in the other both sides (both sides up and down shown in figure) of support plate 502, and it is passed through
It is configured to be electrically connected to the chip 511 being carried on support plate 502.Even muscle 506 connects the pin array of adjacent mesh
Together.Support bar 503 forms ladder in turnover region 517, so that being formed between support plate 502 and pin array 504
Difference in height, in favor of the mould mobile equilibrium in encapsulating packaging process.Also there is Y-shaped hollow out on support bar 503 and support plate 502
Groove 515, the edge direction (or edge direction of support plate 502) or branch of the bearing of trend of its multiple bifurcated parallel to chip 511
The bearing of trend of strut 503, it will be apparent to a skilled person that " parallel " that this place is said is generally parallel,
Rather than it is parallel on strict geometric meaning.Dotted line frame 508 shows the scope of encapsulating encapsulation.Complete after encapsulating encapsulation, singulation
The company's of removal muscle and the connection for disconnecting support bar 503 and grid frame, so as to form independent semiconductor package body.According to encapsulation
Particular type, may also include bending pin the step of the part beyond encapsulating region.Y-shaped hollow slots 515 help to release
Stress is put, and reduces silver-plated area, the adhesion between lead frame and packing colloid is enhanced, locked mode effect is improved.
Packing colloid coats chip 511, support plate 502, support bar 503 for an entirety, reduction through Y-shaped hollow slots 515
The risk of delamination.
In the above-described embodiments, width of the Y-shaped hollow slots along the extension of support bar can be in support bar width
1/4~1/3 in the range of.
In some change case of above-described embodiment, the distance of Y-shaped hollow slots and support plate edge is not less than 0.1 milli
Rice.
In some change case of above-described embodiment, Y-shaped hollow slots and the distance of packing colloid lateral edges are not less than
0.15 millimeter.
In some change case of above-described embodiment, the width of Y-shaped hollow slots is not less than 0.1 millimeter.
Although having illustrated and having described different embodiments of the invention, the present invention is not limited to these embodiments.Only exist
The technical characteristic occurred in some claims or embodiment be not meant to can not with other claims or embodiment
Other features are combined to realize beneficial new technical scheme.Without departing substantially from the essence of the invention as described by claims
In the case of god and scope, many modifications, change, deformation, substitute and it is equivalent be obvious to those skilled in the art
's.
Claims (10)
1. a kind of lead frame, it is characterised in that the lead frame includes：
Multiple lead wire units, each of which lead wire unit includes：
Support plate, it is configured as bearing wafer；
At least one pin array around the support plate, it is configured as being connected to the crystalline substance for being carried on the support plate
Piece；
At least one support bar, the support plate is connected to the frame of lead wire unit via at least one described support bar；
Wherein, there are Y-shaped hollow slots, the extension of its multiple bifurcated in the support plate and at least one described support bar
It is oriented parallel to the edge direction of the support plate or the bearing of trend of at least one support bar.
2. lead frame as claimed in claim 1, it is characterised in that between at least one described support bar and the support plate
Also connected by reinforcement.
3. lead frame as claimed in claim 1, it is characterised in that the Y-shaped hollow slots are along at least one described branch
The bearing of trend of strut is extended to outside silver-plated region.
4. lead frame as claimed in claim 1, it is characterised in that the support plate and the company of at least one support bar
Socket part point is in smooth camber line corner.
5. lead frame as claimed in claim 1, it is characterised in that the Y-shaped hollow slots are along at least one described branch
The width of the extension of strut at least one support bar width 1/4~1/3.
6. a kind of semiconductor package body, it is characterised in that the semiconductor package body includes：
Support plate；
Chip, it is carried on the support plate；
At least one pin array around the support plate, it is electrically connected to the chip；
At least one support bar, it is connected to the support plate；Wherein, in the support plate and at least one described support bar
With Y-shaped hollow slots, the bearing of trend of its multiple bifurcated parallel to the support plate edge direction or it is described at least one
The bearing of trend of support bar；
Encapsulating material, it coats the chip, at least one described pin array and the support plate.
7. semiconductor package body as claimed in claim 6, it is characterised in that at least one described support bar and the support plate
Between also connected by reinforcement.
8. semiconductor package body as claimed in claim 6, it is characterised in that the Y-shaped hollow slots are along described at least one
The bearing of trend of individual support bar is extended to outside silver-plated region.
9. semiconductor package body as claimed in claim 6, it is characterised in that the support plate and at least one described support bar
Coupling part be in smooth camber line corner.
10. semiconductor package body as claimed in claim 6, it is characterised in that the Y-shaped hollow slots along it is described at least
The width of the extension of one support bar at least one support bar width 1/4~1/3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410831214.3A CN104485323B (en) | 2014-12-23 | 2014-12-23 | Lead frame and semiconductor package body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410831214.3A CN104485323B (en) | 2014-12-23 | 2014-12-23 | Lead frame and semiconductor package body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104485323A CN104485323A (en) | 2015-04-01 |
| CN104485323B true CN104485323B (en) | 2017-08-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410831214.3A Active CN104485323B (en) | 2014-12-23 | 2014-12-23 | Lead frame and semiconductor package body |
Country Status (1)
| Country | Link |
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| CN (1) | CN104485323B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106486451B (en) * | 2015-08-28 | 2019-04-16 | 苏州普福斯信息科技有限公司 | The anti-layered structure of TSOP package leadframe |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG68542A1 (en) * | 1993-06-04 | 1999-11-16 | Seiko Epson Corp | Semiconductor device and manufacturing method thereof |
| US7211879B1 (en) * | 2003-11-12 | 2007-05-01 | Amkor Technology, Inc. | Semiconductor package with chamfered corners and method of manufacturing the same |
| JP5155644B2 (en) * | 2007-07-19 | 2013-03-06 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
| US8525310B2 (en) * | 2010-04-13 | 2013-09-03 | Mediatek Inc. | Leadframe package for high-speed data rate applications |
| CN201853699U (en) * | 2010-10-28 | 2011-06-01 | 宁波华龙电子股份有限公司 | Anti-crack and anti-seepage integrated circuit lead wire framework |
| US8866278B1 (en) * | 2011-10-10 | 2014-10-21 | Amkor Technology, Inc. | Semiconductor device with increased I/O configuration |
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| CN104485323A (en) | 2015-04-01 |
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Effective date of registration: 20210108 Address after: No. 669, GuoShouJing Road, Pudong New Area pilot Free Trade Zone, Shanghai, 201203 Patentee after: Rirong semiconductor (Shanghai) Co.,Ltd. Address before: No. 669, GuoShouJing Road, Zhangjiang High Tech Park, Pudong New Area, Shanghai 201203 Patentee before: ASE ASSEMBLY & TEST (SHANGHAI) Ltd. |