CN204905243U

CN204905243U - Circuit component

Info

Publication number: CN204905243U
Application number: CN201520507164.3U
Authority: CN
Inventors: 周云福; 周湘; 周全
Original assignee: BrightKing Shenzhen Co Ltd
Current assignee: BrightKing Shenzhen Co Ltd
Priority date: 2015-07-14
Filing date: 2015-07-14
Publication date: 2015-12-23
Anticipated expiration: 2025-07-14

Abstract

The utility model discloses a circuit component, it is flat pin configuration since, and a housing, the casting glue, the circuit component that filler and electronic component combination constitute, it does for the one end certain distance department that goes between in the distance to flatten the processing to flatten the pin configuration, can for the monomer or a plurality of on the frame integrative taking shape form, flatten and go between to metal electrically conductive material's copper, the copper steel, indisputable or indisputable nickel, the surface can be through tin, silver, nickel or golden surface treatment, with the same comparing of traditional circuit component lead wire cross -sectional area size, the utility model discloses beneficial effect is: position and casting glue formation hasp structure are flattened to the lead wire, let lead wire and casting glue combine closely, have avoided traditional lead wire to become flexible the problem easily, and the effectual outside air that has reduced improves reliability of an item and yield through the functional risk of the interior influence of clearance entering circuit component of lead wire with the casting glue.

Description

A kind of circuit element

Technical field

The utility model relates to technical field of electronic components, particularly a kind of circuit element.

Background technology

Traditional circuit element, lead-in wire is equal diameter linear pattern, and without flattening process, but traditional lead-in wire easily comes off, and easily occurs gap with casting glue, and in use components and parts easily come off.Owing to there is gap between lead-in wire and casting glue, in use there is the risk that inside stuffing overflows from gap in conventional circuit elements.

Utility model content

The utility model provides a kind of circuit element, and this circuit element combines form by flattening pin configuration, shell, casting glue, filler and electronic component, there is not the problem of conventional wire loose or dislocation.

The utility model is by the following technical solutions:

A kind of circuit element, combines form by flattening pin configuration, shell, casting glue, filler and electronic component, described in flatten pin configuration be for flattening process in distance lead-in wire a distance, one end, can be monomer or multiplely integrally formedly on framework to form.

Preferably, described in flatten pin configuration flatten that lead-in wire is the copper of metal conductive materials, copper steel, iron or iron nickel, surface can through the surface treatment of tin, silver, nickel or gold.

Preferably, described in flatten lead-in wire be square, circular by the place of flattening groove or bore a hole from centre, deform by carrying out process to going between a certain section.

Preferably, lead-in wire is flattened described in for linear, U-shaped, V-arrangement or L shape.

Preferably, described sheathing material is the high temperature resistance and high strength material of LCP, the PBT of isolation material, nylon engineering plastic or pottery.

Preferably, described shell shape is semicircular arc or square.

Preferably, described electronic component can be the semiconductor chip of temperature alloy silk or gas discharge tube, piezo-resistance.

Preferably, described casting glue is gluey binding agent.

Preferably, described electronic component can be temperature alloy silk or the semiconductor chip such as gas discharge tube, piezo-resistance.

Utility model beneficial effect is: the lead-in wire added after flattening is combined tightr with casting glue, there is not the off-line that conventional wire occurs and situation about loosening, groove after simultaneously flattening is combined with the latch closure that casting glue is formed the better tightness making electronic devices and components, what to decrease in traditional handicraft that lead-in wire and casting glue gap produce is electrically bad, thus improves the stability of electronic devices and components.

Accompanying drawing explanation

Fig. 1 of the present utility modelly flattens pin configuration figure;

Fig. 2 of the present utility modelly flattens lead frame structure figure;

Fig. 3 is that view expressed by the semiconductor circuit components and parts containing filler of the present utility model;

Fig. 4 is that view expressed by the semiconductor circuit components and parts not containing filler of the present utility model.

Include in its Fig. 1-4:

1---flattening threading mechanism 2---circuit element

3---filler 4---casting glue

5---shell.

Embodiment

Below in conjunction with accompanying drawing 1,2,3,4, the utility model is described in further detail.

As shown in Figure 1: be the structure one that in a kind of semiconductor diode one flattens lead-in wire, its lead-in wire flattens process in a distance of distance lead-in wire one end.Wherein the rear shape of process flattened by lead-in wire, can be extended to both sides by the lead-in wire flattening place and form structure two, from structure two both sides, visual angle, front than other with leading part bit wide, from the side visual angle is seen that structure two lead-in wire more same than other position is narrow, the axis of structure two is identical with the axis of lead-in wire.

As shown in Figure 2: be multiple lead design of flattening be that framework is integrally formed, being generate to make lead-in wire electrode integrative-structure realize automation, enhance productivity, and being combined by its multiple monomer of innovation being designed to the integrally formed design of framework.

Embodiment one

As shown in Figure 3: the schematic diagram figure and the section expression view thereof that are a kind of semiconductor circuit components containing filler.The semiconductor circuit components that this example is said, it is by flattening after pin configuration 1 welds with circuit element 2, putting into shell 5, then adds filler 3 and finally fills out envelope with casting glue 4 and form.The plug-in unit semiconductor circuit electric property made thus and efficiency are better than traditional handicraft.

Embodiment two

As shown in Figure 4: the schematic diagram figure and the section expression view thereof that are a kind of semiconductor circuit components not containing filler.The semiconductor circuit components that this example is said, it is by flattening after pin configuration 1 welds with circuit element 2, putting into shell 5, finally fill out envelope with casting glue 4 and form.The plug-in unit semiconductor circuit electric property made thus and efficiency are better than traditional handicraft.

It is all better than traditional handicraft that embodiment one and embodiment dual-purpose flatten the semiconductor circuit components electric property that pin configuration makes, and finished product better tightness, pin intensity is higher.Filler in embodiment semiconductor circuit element plays the effect of temperature alloy silk or the semiconductor chip such as gas discharge tube, piezo-resistance in protective circuit element 2; some temperature alloy silks or the semiconductor chip such as gas discharge tube, piezo-resistance need to combine could form functional structure with corresponding filler, as temperature alloy silk combines could disconnect in set point of temperature with corresponding filler simultaneously.Embodiment two and embodiment one distinguish with, the inapplicable filler 3 of embodiment two, directly fill embedding by casting glue 4 complete.

The foregoing is only two kinds of preferred embodiments of the present utility model, not in order to limit the present invention, all equivalences done according to the structure described in the utility model claim, feature, combination and principle change or modify, and all should be included in the utility model patent claim.

Claims

1. a circuit element, it is characterized in that: form by flattening the combination of pin configuration, shell, casting glue, filler and electronic component, describedly flattening pin configuration, is for flattening process in a distance of distance lead-in wire one end, can be monomer or multiplely integrally formedly on framework to form.

2. a kind of circuit element according to claim 1, is characterized in that: described in flatten pin configuration flatten that lead-in wire is the copper of metal conductive materials, copper steel, iron or iron nickel, surface can through tin, silver, nickel or gold surface process.

3. a kind of circuit element according to claim 1, is characterized in that: described in flatten lead-in wire be square, circular by the place of flattening groove or bore a hole from centre, deform by carrying out process to going between a certain section.

4. a kind of circuit element according to claim 1, is characterized in that: described in flatten that lead-in wire is linear, U-shaped, V-arrangement or L shape.

5. a kind of circuit element according to claim 1, its spy is: described framework is that adhesive tape and paper tape combine, and is fixed on paper bag by lead-in wire by adhesive tape by plant equipment.

6. a kind of circuit element according to claim 1, is characterized in that: described sheathing material is the high temperature resistance and high strength material of LCP, the PBT of isolation material, nylon engineering plastic or pottery.

7. a kind of circuit element according to claim 1, is characterized in that: described shell shape is semicircular arc or square.

8. a kind of circuit element according to claim 1, is characterized in that: described casting glue is gluey binding agent.

9. a kind of circuit element according to claim 1, is characterized in that: described electronic component can be the semiconductor chip of temperature alloy silk or gas discharge tube, piezo-resistance.