CN203746844U - Power module packaging structure - Google Patents
Power module packaging structure Download PDFInfo
- Publication number
- CN203746844U CN203746844U CN201420046333.3U CN201420046333U CN203746844U CN 203746844 U CN203746844 U CN 203746844U CN 201420046333 U CN201420046333 U CN 201420046333U CN 203746844 U CN203746844 U CN 203746844U
- Authority
- CN
- China
- Prior art keywords
- signal
- terminal
- circuit board
- power
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000004806 packaging method and process Methods 0.000 title abstract 4
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 238000003466 welding Methods 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- 238000005452 bending Methods 0.000 claims description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 229910052718 tin Inorganic materials 0.000 claims description 9
- 239000011135 tin Substances 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 5
- 210000005069 ears Anatomy 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- 101000709025 Homo sapiens Rho-related BTB domain-containing protein 2 Proteins 0.000 description 6
- 102100032658 Rho-related BTB domain-containing protein 2 Human genes 0.000 description 6
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Abstract
A power module packaging structure mainly comprises a DBC, a circuit board and a casing, wherein the DBC is provided with a chip and a bonding line and welded on a substrate, power terminals, signal terminals and signal guiding frames are fixed on the circuit board, the circuit board is welded on the DBC via pins of the power terminals and signal guiding frames, the whole module is fixed and enclosed by the casing, the casing is provided with openings, and the power and signal terminals extend out of the openings and are connected with the external application end. Two signal terminals are respectively led to the gate electrodes of an upper tube and a lower tube, other two signal terminals are respectively led to the emitter electrodes of the upper tube and the lower tube, the signal terminals are connected with corresponding signal guiding frames via circuits on the circuit board, and the signal guiding frames are welded and connected to corresponding positions of the DBC. The three power terminals are fixed via the circuit board, and welded and connected to corresponding positions of the DBC. The power module packaging structure is characterized by being simple in structure, convenient to use and install and simple in technology, and improving the packaging precision and the using reliability.
Description
Technical field
The utility model relates to a kind of power module package structure, belong to power electronics technical field.
Background technology
Traditional power model is realized the connection of power section and signal section with signal lead or bonding line, if use signal lead to connect, the general insulating material such as silicone tube that use are enclosed within lead-in wire outside, the length of silicone tube is controlled and sleeve pipe action need to manually complete, also signal lead and signal terminal to be welded afterwards, generally need craft or machine to carry out singly, therefore more difficult automation and the consistency of realizing in process and control.
Summary of the invention
The purpose of this utility model is to overcome the deficiency that prior art exists, and provides a kind of simple in structure, and easy to install and use, manufacture craft is easy, improves the power module package structure of encapsulation precision and dependability.
The purpose of this utility model completes by following technical solution, described power module package structure, it mainly comprises: one with chip and bonding line and be welded on the DBC on a substrate, one is fixed with circuit board that power terminal, signal terminal and signal draw frame draws frame pin by power terminal pin and signal and is welded on DBC, one shell, by whole module fixed closed, is provided with the opening that stretches out with signal terminal and be connected with applications end for power terminal on shell.
Have two signal terminals to guide to respectively the gate pole of top tube and down tube, another two signal terminals are guided to respectively the emitter of top tube and down tube; Circuit on described circuit board draws frame by signal terminal with corresponding signal and is communicated with, and described signal draws frame and the welding connection of the upper corresponding position of described DBC; There are three power terminals to fix by circuit board, and are communicated with the upper corresponding position welding of DBC.
The surface of described circuit board is useful on power terminal, signal terminal and signal draws the circular or square installing hole that frame coordinates; Signal terminal and corresponding signal draw that between frame, to have metal connecting circuit, its metal covering be that naked copper maybe can plate gold, silver, tin, nickel, and scribble insulating material in other positions except installing hole welding region and metal connecting circuit.
Described circuit board does not have the surface of circuit to offer at it to be convenient to the hole that encapsulating is used; Signal draws to set up and is set to sleeve pin-like, the first half contact pin and the latter half sleeve, consists of, and the bottom of sleeve is connected with DBC by scolder.
On described circuit board, offer power terminal installing hole, installing hole shape and position will with shape, the location matches of power terminal, the position of power terminal will be mated with the aperture position of shell with welding position, the power terminal of power terminal pin.
On described circuit board, offer signal terminal installing hole, installing hole shape and position will with shape, the location matches of signal terminal, the position of signal terminal will be mated with the aperture position of shell with signal terminal.
On described circuit board, offer signal and draw frame installing hole, shape, the location matches of frame will be drawn with signal in installing hole shape and position, and signal draws the welding position that the position of frame will draw frame pin with signal and mates.
The first half of described power terminal is stretched out shell bending, wherein offers circular or oval-shaped hole, for the nut with corresponding placement on shell, carries out combination.
Stretching out between housing parts and remainder of described power terminal has recessed of reduced thickness, or digs inwards two indent ears in dogleg section, so that the bending of power terminal extension; Described power terminal electroplate, tin, gold, nickel these can weld metal.
Described signal terminal exposes housing parts and offers the small sircle hole that facilitates application end to peg graft or weld; The abutting end of described signal terminal and circuit board is provided with projection, and signal terminal inserts part setting party's lead angle that just signal terminal inserts of circuit board; The electroplating surfaces with tin of signal terminal, gold, nickel these can weld metal.
The utility model is mainly the application of circuit-board connecting structure on power model, the power terminal of power model, signal terminal and signal draw frame all to be fixed by a circuit board, and circuit part needs being connected by the circuit design on circuit board couples together; It has simple in structure, easy to install and use, and manufacture craft is easy, improves the features such as encapsulation precision and dependability.
Accompanying drawing explanation
Fig. 1 is for being used the power model structural representation of circuit-board connecting structure.
Fig. 2 is circuit-board connecting structure schematic diagram.
Fig. 3 is the electrical block diagram of circuit board.
Label shown in figure has: 1: circuit board, 2:DBC, 3: signal draws frame, 4: bonding line, 5: power terminal, 6: signal terminal, 7: substrate, 8: shell.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in detail: shown in Fig. 1-3, power module package structure described in the utility model, it mainly comprises: one with chip and bonding line 4 and be welded on the DBC2 on a substrate 7, one is fixed with circuit board 1 that power terminal 5, signal terminal 6 and signal draw frame 3 draws frame pin by power terminal pin and signal and is welded on DBC2, one shell 8, by whole module fixed closed, is provided with the opening that stretches out and be connected with applications end with signal terminal 6 for power terminal 5 on shell 8.
Shown in figure, have two signal terminals 6 to guide to respectively the gate pole of top tube and down tube, another two signal terminals 6 are guided to respectively the emitter of top tube and down tube; Circuit on described circuit board 1 draws frame 3 by signal terminal 6 and corresponding signal and is communicated with, and described signal draws frame 3 and the welding connection of the upper corresponding position of described DBC2; There are three power terminals 5 fixing by circuit board 1, and are communicated with the upper corresponding position welding of DBC2.
The surface of described circuit board 1 is useful on power terminal 5, signal terminal 6 and signal draws the circular or square installing hole that frame 3 coordinates; Signal terminal 6 and corresponding signal draw that between frame 3, to have metal connecting circuit, its metal covering be that naked copper maybe can plate gold, silver, tin, nickel, and scribble insulating material in other positions except installing hole welding region and metal connecting circuit.
Described circuit board 1 does not have the surface of circuit to offer at it to be convenient to the hole that encapsulating is used; Signal draws frame 3 and is arranged to sleeve pin-like, the first half contact pin 31 and the latter half sleeve 32, consists of, and the bottom of sleeve is connected with DBC2 by scolder.
On described circuit board 1, offer power terminal 5 installing holes, installing hole shape and position will with shape, the location matches of power terminal 5, the position of power terminal 5 will be mated with the aperture position of shell 8 with welding position, the power terminal 5 of power terminal pin.
On described circuit board 1, offer signal terminal 6 installing holes, installing hole shape and position will with shape, the location matches of signal terminal 6, the position of signal terminal will be mated with the aperture position of shell 8 with signal terminal 6.
On described circuit board 1, offer signal and draw frame 3 installing holes, shape, the location matches of frame 3 will be drawn with signal in installing hole shape and position, and signal draws the welding position that the position of frame 3 will draw frame pin with signal and mates.
The first half 51 of described power terminal 5 is stretched out shell bending, wherein offers circular or oval-shaped hole 52, for the nut with corresponding placement on shell, carries out combination.
Stretching out between housing parts and remainder 53 of described power terminal has recessed of reduced thickness, or digs inwards two indent ears in dogleg section, so that the bending of power terminal extension; Described power terminal electroplate, tin, gold, nickel these can weld metal.
Described signal terminal 6 exposes housing parts and offers the small sircle hole that facilitates application end to peg graft or weld; The abutting end of described signal terminal and circuit board is provided with projection, and signal terminal inserts part setting party's lead angle that just signal terminal inserts of circuit board; The electroplating surfaces with tin of signal terminal, gold, nickel these can weld metal.
Embodiment: shown in Fig. 1, in described power model, DBC2 with chip and bonding line is welded on substrate 7, fixed circuit board 1 that power terminal 5, signal terminal 6 and signal draw frame 3 by power terminal pin and signal draw frame pin be welded to DBC upper after, then by shell by whole module fixed closed.On shell, have opening, power terminal and signal terminal stretch out by opening, are connected with applications end.In this structure, have 2 signal terminals to guide to respectively the gate pole of top tube and down tube, 2 signal terminals are guided to respectively the emitter of top tube and down tube.Circuit design by circuit board is drawn frame by signal terminal and corresponding signal and is communicated with, signal draw frame again with DBC on correspondence position welding be communicated with.3 power terminals are fixed by circuit board, and are communicated with the relevant position welding on DBC.If needed, also can power terminal be partly communicated with corresponding signal by circuit design.
Shown in Fig. 2, the utility model can pass through jig Design, power terminal, signal terminal and signal is drawn to frame and insert circuit board the corresponding mounting hole place, and fix by fixture, metallic region spot printing scolder around installing hole, and reflow soldering in the equipment such as reflow ovens.Then by after welding all-in-one-piece circuit board by power terminal pin and signal, draw frame pin and be welded on module DBC.Wherein on circuit board 1, there is no circuit part design perforate 11, so as during encapsulating from then on hole pour into, also can reduce materials.Signal draws frame can be designed to figure middle sleeve pin-like, the first half contact pin 31 and the latter half sleeve 32, consists of.Sleeve bottom is connected with DBC by scolder.Also can be designed to S type bending to reduce stress.Power terminal the first half 51 is stretched out shell bending, wherein has circle or oval aperture 52, the nut of placing on corresponding shell, and application end can be combined with nut by this perforate.Recessed an of reduced thickness can be designed in 53 positions between extension and remainder, or digs inwards 2 indent ears etc. in dogleg section, so that the bending of terminal extension.Signal terminal and circuit board mating part can design raised face 61, and enhancing coordinates with circuit board, and the part of inserting circuit board can design lead angle 62, so that the insertion of signal terminal.The size of stretching out housing parts 64 will coordinate the respective openings size of shell, this part will be narrower than the part 63 of not stretching out shell.Signal terminal stretches out on housing parts small sircle hole 65, to facilitate application end to peg graft or welding.
Shown in Fig. 3, power terminal inserts circuit board by installing hole 13, is around metallic region 14, by scolder, power terminal is connected with circuit board metallic region.Signal terminal inserts circuit board by installing hole 15, is around metallic region 16, by scolder, signal terminal is connected with circuit board metallic region.Signal draws frame and inserts circuit board by installing hole 17, is around metallic region 18, by scolder, signal is drawn to frame and is connected with circuit board metallic region.Signal terminal and corresponding signal draw frame and are communicated with by metallic region 12, and all the other positions 19 are all insulating material, non-conductive.If needed, also can be by power terminal and corresponding signal section conducting, this can design on DBC, also can design on circuit board.
Claims (10)
1. a power module package structure, it is characterized in that: it mainly comprises: one with chip and bonding line and be welded on the DBC(2 on a substrate (7)), one is fixed with circuit board (1) that power terminal (5), signal terminal (6) and signal draw frame (3) draws frame pin by power terminal pin and signal and is welded on DBC(2) on, one shell, by whole module fixed closed, is provided with the opening that stretches out with signal terminal and be connected with applications end for power terminal on shell (8).
2. power module package structure according to claim 1, is characterized in that: have two signal terminals (6) to guide to respectively the gate pole of top tube and down tube, another two signal terminals (6) are guided to respectively the emitter of top tube and down tube; Circuit on described circuit board (1) draws frame (3) connection by signal terminal (6) and corresponding signal, and described signal draws frame (3) and described DBC(2) the welding connection of upper corresponding position; Have three power terminals (5) fixing by circuit board (1), and with DBC(2) upper corresponding position welding is communicated with.
3. power module package structure according to claim 2, is characterized in that: the surface of described circuit board (1) is useful on power terminal (5), signal terminal (6) and signal draws the circular or square installing hole that frame (3) coordinates; Signal terminal (6) and corresponding signal draw between frame (3) metal connecting circuit, and its metal covering is that naked copper maybe can plate gold, silver, tin, nickel, and scribbles insulating material in other positions except installing hole welding region and metal connecting circuit.
4. according to the power module package structure described in claim 1 or 2 or 3, it is characterized in that: the hole (11) that described circuit board (1) does not have the surface of circuit to offer to be convenient to encapsulating and to use at it; Signal draws frame (3) and is arranged to sleeve pin-like, the first half contact pin (31) and the latter half sleeve (32), consists of, and the bottom of sleeve is by scolder and DBC(2) be connected.
5. power module package structure according to claim 4, it is characterized in that: described circuit board offers power terminal installing hole on (1), installing hole shape and position will with shape, the location matches of power terminal (5), the position of power terminal (5) will be mated with the aperture position of shell (8) with welding position, the power terminal of power terminal pin.
6. power module package structure according to claim 4, it is characterized in that: described circuit board offers signal terminal installing hole on (1), installing hole shape and position will with shape, the location matches of signal terminal (6), the position of signal terminal will be mated with the aperture position of shell (8) with signal terminal (6).
7. power module package structure according to claim 4, it is characterized in that: on described circuit board (1), offer signal and draw frame installing hole, shape, the location matches of frame (3) will be drawn with signal in installing hole shape and position, and signal draws the welding position that the position of frame (3) will draw frame pin with signal and mates.
8. according to the power module package structure described in claim 1 or 2 or 3 or 5, it is characterized in that: the first half of described power terminal (5) is stretched out shell bending, wherein offer circular or oval-shaped hole, for carrying out combination with the nut of the upper corresponding placement of shell (8).
9. power module package structure according to claim 8, it is characterized in that: stretching out of described power terminal (5) has recessed of reduced thickness between housing parts and remainder, or dig inwards two indent ears in dogleg section, so that the bending of power terminal extension; Described power terminal (5) electroplate, tin, gold, nickel these can weld metal.
10. according to the power module package structure described in claim 1 or 2 or 3 or 6, it is characterized in that: described signal terminal (6) exposes housing parts and offers the small sircle hole that facilitates application end to peg graft or weld; Described signal terminal (6) is provided with projection with the abutting end of circuit board (1), and signal terminal (6) inserts part setting party's lead angle (62) that just signal terminal inserts of circuit board (1); The electroplating surfaces with tin of signal terminal (6), gold, nickel these can weld metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420046333.3U CN203746844U (en) | 2014-01-25 | 2014-01-25 | Power module packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420046333.3U CN203746844U (en) | 2014-01-25 | 2014-01-25 | Power module packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203746844U true CN203746844U (en) | 2014-07-30 |
Family
ID=51346607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420046333.3U Expired - Lifetime CN203746844U (en) | 2014-01-25 | 2014-01-25 | Power module packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203746844U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103779344A (en) * | 2014-01-25 | 2014-05-07 | 嘉兴斯达半导体股份有限公司 | Power module encapsulating structure |
| CN106684074A (en) * | 2017-01-22 | 2017-05-17 | 嘉兴斯达半导体股份有限公司 | Novel pressure welding type power module |
| CN107069651A (en) * | 2017-03-28 | 2017-08-18 | 深圳市振华微电子有限公司 | Current foldback circuit, overcurrent protector and current foldback circuit forming method |
| CN109257896A (en) * | 2017-07-13 | 2019-01-22 | 博大科技股份有限公司 | Electronic device construction and its assemble method |
-
2014
- 2014-01-25 CN CN201420046333.3U patent/CN203746844U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103779344A (en) * | 2014-01-25 | 2014-05-07 | 嘉兴斯达半导体股份有限公司 | Power module encapsulating structure |
| CN103779344B (en) * | 2014-01-25 | 2017-02-08 | 嘉兴斯达半导体股份有限公司 | Power module encapsulating structure |
| CN106684074A (en) * | 2017-01-22 | 2017-05-17 | 嘉兴斯达半导体股份有限公司 | Novel pressure welding type power module |
| CN106684074B (en) * | 2017-01-22 | 2023-08-01 | 嘉兴斯达半导体股份有限公司 | Novel crimping type power module |
| CN107069651A (en) * | 2017-03-28 | 2017-08-18 | 深圳市振华微电子有限公司 | Current foldback circuit, overcurrent protector and current foldback circuit forming method |
| CN109257896A (en) * | 2017-07-13 | 2019-01-22 | 博大科技股份有限公司 | Electronic device construction and its assemble method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Semiconductor power module package structure and preparation method thereof Effective date of registration: 20151209 Granted publication date: 20140730 Pledgee: Agricultural Bank of China Limited by Share Ltd Jiaxing science and Technology Branch Pledgor: STARPOWER SEMICONDUCTOR LTD. Registration number: 2015990001099 |
|
| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20161212 Granted publication date: 20140730 Pledgee: Agricultural Bank of China Limited by Share Ltd Jiaxing science and Technology Branch Pledgor: STARPOWER SEMICONDUCTOR LTD. Registration number: 2015990001099 |
|
| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Semiconductor power module package structure and preparation method thereof Effective date of registration: 20161216 Granted publication date: 20140730 Pledgee: Agricultural Bank of China Limited by Share Ltd Jiaxing science and Technology Branch Pledgor: STARPOWER SEMICONDUCTOR LTD. Registration number: 2016330000098 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20180904 Granted publication date: 20140730 Pledgee: Agricultural Bank of China Limited by Share Ltd Jiaxing science and Technology Branch Pledgor: STARPOWER SEMICONDUCTOR LTD. Registration number: 2016330000098 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |