CN206412355U - A kind of movable thimble interior insulation encapsulating structure - Google Patents
A kind of movable thimble interior insulation encapsulating structure Download PDFInfo
- Publication number
- CN206412355U CN206412355U CN201720096679.8U CN201720096679U CN206412355U CN 206412355 U CN206412355 U CN 206412355U CN 201720096679 U CN201720096679 U CN 201720096679U CN 206412355 U CN206412355 U CN 206412355U
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- CN
- China
- Prior art keywords
- lead frame
- fin
- chip
- encapsulating structure
- plastic packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
The utility model is related to a kind of movable thimble interior insulation encapsulating structure, and it includes lead frame（1）, the lead frame（1）Including slide holder（1.2）And pin（1.1）, the slide holder（1.2）On be provided with chip（2）, the chip（2）With lead frame（1）Pin（1.1）It is electrically connected with, the lead frame（1）Lower section is provided with fin（5）, the lead frame（1）, chip（2）, bonding wire（4）And fin（5）Periphery is encapsulated with plastic packaging material（11）, the fin（5）The back side is exposed to plastic packaging material（11）Outside, the fin（5）Centre is provided with a perforate（8）, the perforate（8）It is interior to be filled with plastic packaging material（11）.A kind of movable thimble interior insulation encapsulating structure of the utility model, it can solve the problem that the uncontrollable limitation of expensive and insulating properties that tradition is insulated by potsherd.
Description
Technical field
The utility model is related to a kind of movable thimble interior insulation encapsulating structure, belongs to technical field of semiconductor encapsulation.
Background technology
Because high-power MOS tube caloric value is larger, and the quality of radiating effect can directly affect the steady of metal-oxide-semiconductor and equipment
It is qualitative, therefore would generally mount radiator to improve the radiating efficiency of large power triode at the high-power MOS tube back side.However,
To ensure the insulating properties of its high-power MOS tube being applied in hyperbaric environment, it is necessary to be arranged during manufacture using insulation
Apply and separate lead frame with radiator.Most common method is that potsherd is mounted between lead frame and radiator.This
Insulation measures are planted to have the disadvantage that：
1st, the insulating properties in the market of the insulation of potsherd is good and bad not etc., it is necessary to which cumbersome inspection process determines its insulating properties；
2nd, during potsherd load as occur inclined tube will result directly in, chip from slide holder with a distance from, insulation effect
；
3rd, the Making programme of potsherd is cumbersome, and the market price is expensive.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of movable thimble interior insulation for above-mentioned prior art
Encapsulating structure, it can solve the problem that the limitation for the expensive and insulating properties that tradition is insulated by potsherd.
The technical scheme in the invention for solving the above technical problem is：A kind of movable thimble interior insulation encapsulating structure,
It includes lead frame, and the lead frame includes solder is provided with chip on slide holder and pin, the slide holder, institute
State chip to be electrically connected with by the pin of bonding wire and lead frame, fin, the lead are provided with below the lead frame
Framework, chip, bonding wire and fin periphery are encapsulated with plastic packaging material, and the fin back side is exposed to outside plastic packaging material, described
It is provided with the middle of fin in a perforate, the perforate and is filled with plastic packaging material.
V-shaped groove is provided with the slide holder, the V-shaped groove is located at chip periphery.
Fin back side edge is provided with lock glue step.
Compared with prior art, the utility model has the advantage of：
A kind of movable thimble interior insulation encapsulating structure of the utility model, it is insulated by plastic packaging material, and technique is simple, absolutely
Edge structure manufacturing cost is low.Thickness of insulating layer between the utility model fin and slide holder can pacify demand and be adjusted, its
Insulation effect is controllable.The utility model can solve the problem that the uncontrollable limit of expensive and insulating properties that tradition is insulated by potsherd
System.
Brief description of the drawings
Fig. 1 is a kind of schematic diagram of movable thimble interior insulation encapsulating structure of the utility model.
Fig. 2 ~ Figure 10 is a kind of each operation flow of the process of movable thimble interior insulation encapsulating structure of the utility model
Figure.
Wherein：
Lead frame 1
Pin 1.1
Slide holder 1.2
Chip 2
Solder 3
Bonding wire 4
Fin 5
V-shaped groove 6
Lock glue step 7
Perforate 8
Mould 9
Thimble 10
Plastic packaging material 11.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing embodiment.
As shown in figure 1, a kind of movable thimble interior insulation encapsulating structure in the present embodiment, it includes lead frame 1, described
Lead frame 1 includes solder 3 is provided with chip 2, the chip 2 on slide holder 1.2 and pin 1.1, the slide holder 1.2
It is electrically connected with by the pin 1.1 of bonding wire 4 and lead frame 1, the lower section of lead frame 1 is provided with fin 5, the radiating
The back side edge of piece 5 is provided with lock glue step 7, and the lead frame 1, chip 2, bonding wire 4 and the periphery of fin 5 are encapsulated
There is plastic packaging material 11, the back side of fin 5 is exposed to outside plastic packaging material 11, and a perforate 8, institute are provided with the middle of the fin 5
State and plastic packaging material 11 is filled with perforate 8；
V-shaped groove 6 is provided with the slide holder 1.2, the V-shaped groove 6 is located at the periphery of chip 2.
Its process is as follows：
Step 1: referring to Fig. 2, taking a lead frame, lead frame includes slide holder and pin, and slide holder is provided with V-arrangement
Groove；
Step 2, referring to Fig. 3, coats conductive or non-conductive bonding material, so on the slide holder of step one lead frame
Chip is implanted on bonding material afterwards；
Step 3, referring to Fig. 4, bond wire line operation, the metal wire are carried out between chip front side and pin front
Material using gold, silver, copper, aluminium or alloy material, the shape of wire can be it is thread can also be banding；
Step 4, referring to Fig. 5 there is provided a fin, fin centre has a perforate, and the fin back side is provided with lock Jiao Tai
Rank；
Step 5, referring to Fig. 6, in preset fin to mould, correspondence fin position of opening has an activity on mould
Thimble, movable thimble passes through the perforate of fin and exposes heatsink upper surface；
Step 6: referring to Fig. 7, the lead frame that step 3 is completed into bond wire line operation is put into mould, mould
The upward jack-up slide holder of thimble, makes slide holder lower surface have certain distance apart from heatsink upper surface；
Step 7: referring to Fig. 8, plastic packaging material is injected into mould, plastic packaging material, which can be used, packing material or no-arbitrary pricing
The epoxy resin of material.Inject after plastic packaging material, plastic packaging material can be filled into the gap between fin and slide holder, makes fin
Insulated between slide holder；
Step 8, referring to Fig. 9, movable thimble is moved downward, and uncured plastic packaging material is filled into perforate, carries on the back slide holder
Face is coated in plastic packaging material completely；
Step 9: referring to Figure 10, being cut or being punched operation by the semi-finished product for completing plastic packaging, make script array
Plastic-sealed body cuts or is punched a kind of independent, obtained movable thimble interior insulation encapsulating structure.
In addition to the implementation, the utility model also includes other embodiment, all use equivalents or equivalent
The technical scheme of substitute mode formation, all should fall within the utility model scope of the claims.
Claims (3)
1. a kind of movable thimble interior insulation encapsulating structure, it is characterised in that：It includes lead frame（1）, the lead frame（1）
Including slide holder（1.2）And pin（1.1）, the slide holder（1.2）It is upper to pass through solder（3）It is provided with chip（2）, the chip
（2）Pass through bonding wire（4）With lead frame（1）Pin（1.1）It is electrically connected with, the lead frame（1）Lower section is provided with radiating
Piece（5）, the lead frame（1）, chip（2）, bonding wire（4）And fin（5）Periphery is encapsulated with plastic packaging material（11）, it is described to dissipate
Backing（5）The back side is exposed to plastic packaging material（11）Outside, the fin（5）Centre is provided with a perforate（8）, the perforate（8）
It is interior to be filled with plastic packaging material（11）.
2. a kind of movable thimble interior insulation encapsulating structure according to claim 1, it is characterised in that：The slide holder
（1.2）On be provided with V-shaped groove（6）, the V-shaped groove（6）Positioned at chip（2）Periphery.
3. a kind of movable thimble interior insulation encapsulating structure according to claim 1, it is characterised in that：The fin（5）
Back side edge is provided with lock glue step（7）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720096679.8U CN206412355U (en) | 2017-01-25 | 2017-01-25 | A kind of movable thimble interior insulation encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720096679.8U CN206412355U (en) | 2017-01-25 | 2017-01-25 | A kind of movable thimble interior insulation encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206412355U true CN206412355U (en) | 2017-08-15 |
Family
ID=59557971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720096679.8U Active CN206412355U (en) | 2017-01-25 | 2017-01-25 | A kind of movable thimble interior insulation encapsulating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206412355U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106601714A (en) * | 2017-01-25 | 2017-04-26 | 长电科技（宿迁）有限公司 | Insulation package structure in movable ejector pin and process method thereof |
-
2017
- 2017-01-25 CN CN201720096679.8U patent/CN206412355U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106601714A (en) * | 2017-01-25 | 2017-04-26 | 长电科技（宿迁）有限公司 | Insulation package structure in movable ejector pin and process method thereof |
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