CN206412355U - A kind of movable thimble interior insulation encapsulating structure - Google Patents

Abstract

The utility model relates to a movable thimble internal insulation packaging structure, which includes a lead frame (1), the lead frame (1) includes a loading table (1.2) and pins (1.1), and the loading table (1.2) A chip (2) is arranged on it, and the chip (2) is electrically connected to the pin (1.1) of the lead frame (1), and a heat sink (5) is arranged under the lead frame (1), and the lead frame (1), chips (2), bonding wires (4) and heat sinks (5) are all encapsulated with plastic compound (11), and the back of the heat sink (5) is exposed outside the plastic compound (11), so An opening (8) is arranged in the middle of the heat sink (5), and the opening (8) is filled with a plastic sealing compound (11). The utility model relates to an internal insulation packaging structure of a movable thimble, which can solve the limitations of high price and uncontrollable insulation of the traditional ceramic sheet insulation.

Description

A movable thimble inner insulation packaging structure

technical field

The utility model relates to an inner insulating packaging structure of a movable thimble, which belongs to the technical field of semiconductor packaging.

Background technique

Because high-power MOS tubes generate a lot of heat, and the heat dissipation effect can directly affect the stability of MOS tubes and equipment, so a radiator is usually mounted on the back of high-power MOS tubes to improve the heat dissipation efficiency of high-power triodes. However, in order to ensure the insulation performance of the high-power MOS tube used in the high-voltage environment, it is necessary to use insulation measures to separate the lead frame from the heat sink during the manufacturing process. The most common method is to mount the ceramic chip between the lead frame and the heat sink. This insulation measure has the following disadvantages:

1. The insulation of ceramic sheets varies from good to bad in the market, and cumbersome inspection procedures are required to determine their insulation;

2. If the inclined tube occurs when the ceramic chip is loaded, it will directly cause the distance between the chip and the carrier table to be different, and the insulation effect will also be different;

3. The production process of ceramic sheets is cumbersome and the market price is expensive.

Utility model content

The technical problem to be solved by the utility model is to provide a movable thimble internal insulation packaging structure for the above-mentioned prior art, which can solve the traditional high price and insulation limitations of ceramic sheet insulation.

The technical solution adopted by the utility model to solve the above-mentioned problems is: a movable thimble internal insulation packaging structure, which includes a lead frame, the lead frame includes a carrier table and pins, and the chip carrier is provided with a chip through solder , the chip is electrically connected to the pins of the lead frame through bonding wires, a heat sink is arranged under the lead frame, and the lead frame, the chip, the bonding wire, and the periphery of the heat sink are all encapsulated with a plastic encapsulant, and the heat sink The back of the sheet is exposed out of the molding compound, and an opening is arranged in the middle of the heat sink, and the opening is filled with the molding compound.

A V-shaped groove is arranged on the carrier table, and the V-shaped groove is located on the periphery of the chip.

There are glue-locking steps at the edges around the back of the heat sink.

Compared with the prior art, the utility model has the advantages of:

The utility model relates to an internal insulation packaging structure of a movable thimble, which is insulated by plastic sealing material, has simple process and low manufacturing cost of the insulation structure. The thickness of the insulation layer between the heat sink and the slide table of the utility model can be adjusted according to requirements, and the insulation effect is controllable. The utility model can solve the limitation of high price and uncontrollable insulation of traditional ceramic sheet insulation.

Description of drawings

Fig. 1 is a schematic diagram of an inner insulating package structure of a movable thimble according to the present invention.

Fig. 2 to Fig. 10 are flow charts of each process of a process method of a movable thimble inner insulating packaging structure of the present invention.

in:

Lead frame 1

pin 1.1

Stage 1.2

Chip 2

Solder 3

Bonding wire 4

heat sink 5

V groove 6

Lock glue step 7

Hole 8

mold 9

Thimble 10

Molding compound11.

detailed description

The utility model is described in further detail below in conjunction with the accompanying drawings.

As shown in Fig. 1, a kind of active thimble inner insulating package structure in the present embodiment, it comprises lead frame 1, and described lead frame 1 comprises chip stage 1.2 and pin 1.1, and solder is passed on described chip stage 1.2 3. A chip 2 is provided, and the chip 2 is electrically connected to the pin 1.1 of the lead frame 1 through a bonding wire 4. A heat sink 5 is provided under the lead frame 1, and locks are provided on the edges around the back of the heat sink 5. Plastic step 7, the periphery of the lead frame 1, chip 2, bonding wire 4 and heat sink 5 is encapsulated with plastic compound 11, the back of the heat sink 5 is exposed outside the plastic compound 11, and the middle of the heat sink 5 is arranged There is an opening 8 filled with a molding compound 11;

A V-shaped groove 6 is provided on the loading table 1.2, and the V-shaped groove 6 is located on the periphery of the chip 2.

Its process method is as follows:

Step 1. Referring to Figure 2, take a lead frame, the lead frame includes a slide table and pins, and a V-shaped groove is arranged on the slide table;

Step 2, referring to Fig. 3, coating conductive or non-conductive bonding substance on the chip stage of the lead frame in step 1, and then implanting chips on the bonding substance;

Step 3, see Fig. 4, carry out the operation of bonding metal wire between the front of the chip and the front of the pin, the material of the metal wire is gold, silver, copper, aluminum or an alloy material, and the shape of the metal wire can be wire The shape can also be a ribbon;

Step 4, see Figure 5, provide a heat sink with an opening in the middle of the heat sink, and a rubber lock step on the back of the heat sink;

Step 5, see Figure 6, preset the heat sink into the mould, and there is a movable thimble on the mold corresponding to the opening of the heat sink, and the movable thimble passes through the opening of the heat sink and exposes the upper surface of the heat sink;

Step 6. Referring to Figure 7, put the lead frame that has been bonded with metal wires in step 3 into the mold, and the thimble of the mold lifts up the carrier table so that the lower surface of the carrier table has a certain distance from the upper surface of the heat sink;

Step 7. Referring to FIG. 8 , inject molding compound into the mold. The molding compound can be epoxy resin with or without filler. After injecting the molding compound, the gap between the heat sink and the slide table will be filled with the plastic sealant to insulate the heat sink and the slide table;

Step 8, see Figure 9, the movable thimble moves downward, and the uncured molding compound is filled into the opening, so that the back of the slide table is completely covered in the molding compound;

Step 9. Referring to FIG. 10 , cutting or punching the plastic-encapsulated semi-finished product separates the original array of plastic-encapsulated bodies from cutting or punching to obtain a movable thimble inner insulating packaging structure.

In addition to the above-mentioned embodiments, the utility model also includes other implementation modes, and any technical solution formed by equivalent transformation or equivalent replacement shall fall within the protection scope of the claims of the utility model.

Claims (3)

1. An insulating packaging structure with movable thimbles, characterized in that it includes a lead frame (1), and the lead frame (1) includes a slide table (1.2) and pins (1.1), and the slide table ( 1.2) is provided with a chip (2) through solder (3), and the chip (2) is electrically connected to the pin (1.1) of the lead frame (1) through the welding wire (4), and the lead frame (1) A heat sink (5) is arranged below, and the periphery of the lead frame (1), chip (2), bonding wire (4) and heat sink (5) is encapsulated with a plastic encapsulant (11), and the heat sink (5) ) back side is exposed outside the molding compound (11), and an opening (8) is arranged in the middle of the heat sink (5), and the opening (8) is filled with the molding compound (11). 2. The movable thimble internal insulation packaging structure according to claim 1, characterized in that: the carrier table (1.2) is provided with a V-shaped groove (6), and the V-shaped groove (6) is located on the chip (2) Periphery. 3 . The movable thimble inner insulating package structure according to claim 1 , characterized in that: glue-locking steps ( 7 ) are provided at the edges around the back of the heat sink ( 5 ). 4 .