CN205789528U - A kind of multiple bottom-side electrodes lead frame of chip solid electrolyte matter tantalum capacitor - Google Patents
A kind of multiple bottom-side electrodes lead frame of chip solid electrolyte matter tantalum capacitor Download PDFInfo
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- CN205789528U CN205789528U CN201620360273.1U CN201620360273U CN205789528U CN 205789528 U CN205789528 U CN 205789528U CN 201620360273 U CN201620360273 U CN 201620360273U CN 205789528 U CN205789528 U CN 205789528U
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- negative electrode
- anode
- weld tabs
- side electrodes
- lead frame
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Abstract
This utility model provides the multiple bottom-side electrodes lead frame of a kind of chip solid electrolyte matter tantalum capacitor, including frame body, it is stamped with negative electrode weld tabs, anode weld tabs, negative electrode alignment pin and anode alignment pin on frame body, and negative electrode alignment pin and anode alignment pin are separately positioned on negative electrode weld tabs and anode weld tabs；Being additionally provided with the negative electrode medicated pillow being perpendicular to frame body on described negative electrode weld tabs, the right-hand member of negative electrode weld tabs is also associated with the cathode pads parallel with frame body.This utility model provides a kind of brand-new multiple bottom-side electrodes lead frame, by the amendment to traditional bottom-side electrodes lead frame, the shortcoming that before solving, tantalum capacitor equivalent series resistance is bigger than normal, also solve and molding and in rear working procedure processing link, the bottom bonding plane that occurs is little, be easily generated the problem such as crackle, electrical property sudden change, this structure is equivalent to the twin-core design of bottom-side electrodes, and reliability and the qualification rate of bottom-side electrodes tantalum capacitor all can be improved a lot by this.
Description
Technical field
This utility model relates to chip solid electrolyte matter tantalum capacitor manufacturing process technology field, is specifically related to a kind of chip
The multiple bottom-side electrodes lead frame of solid electrolyte Ta capacitor.
Background technology
Tantalum electrolytic capacitor because its volume is little, capacity is big, good temp characteristic, stability and high reliability be by extensively
It is applied to all kinds of high-end electronic equipments such as space flight, aviation, electronics, weapons, boats and ships, communication and medical electronics.Along with electronics
Constantly develop towards miniaturization, and one of feature of miniaturization is that operating frequency is more and more higher, capacity is increasing, etc.
Effect series resistance is more and more lower, therefore has higher requirement the electrical property of electronic devices and components.To this end, tantalum capacitor manufacture
Industry is being that the ESR constantly reducing tantalum capacitor makes a sustained effort always.
At present, in tantalum capacitor manufacturing process, the equivalent series resistance (ESR) reducing solid electrolyte Ta capacitor becomes
One of Main way for design.Traditional bottom-side electrodes structure is wanted in the use of volume efficiency relative to conventional slice structure
Exceed 30%, and capacitance is bigger, has extremely low equivalent series inductance, but its equivalent series resistance is bigger than normal, it is impossible to meet
The circuit demand to low ESR.In existing bottom-side electrodes tantalum capacitor manufacturing process, use and soaked graphite, silver by single
Tantalum fuse after slurry bonds on lead frame, and this mode can not be greatly lowered equivalent series resistance, and only by fall
The ESR that low tantalum fuse itself is own.Meanwhile, the ESR of existing bottom-side electrodes largely limits bottom-side electrodes tantalum electric capacity
The range of device, and do not give full play of the electrical property advantage of bottom-side electrodes.
Utility model content
For solving above-mentioned technical problem, this utility model provides the multiple end of a kind of chip solid electrolyte matter tantalum capacitor
Face contact conductor framework, the multiple bottom-side electrodes lead frame of this chip solid electrolyte matter tantalum capacitor mode in parallel is come
Reducing the equivalent series resistance of tantalum capacitor, be equivalent to the twin-core structure of bottom-side electrodes, this can to bottom-side electrodes tantalum capacitor
All can improve a lot by property and qualification rate, have employed the design of multiplet, thus greatly reduce equivalent series resistance.
This utility model is achieved by the following technical programs.
The multiple bottom-side electrodes lead frame of a kind of chip solid electrolyte matter tantalum capacitor that this utility model provides, including
Frame body, frame body is stamped with negative electrode weld tabs, anode weld tabs, negative electrode alignment pin and anode alignment pin, and negative electrode location
Pin and anode alignment pin are separately positioned on negative electrode weld tabs and anode weld tabs；It is additionally provided with on described negative electrode weld tabs and is perpendicular to framework
The negative electrode medicated pillow of body, the right-hand member of negative electrode weld tabs is also associated with the cathode pads parallel with frame body；On described anode weld tabs
Being provided with the anode medicated pillow vertical with frame body, anode medicated pillow is relative with negative electrode medicated pillow；Described cathode pads and negative electrode weld tabs
Between the width of connecting portion less than the width of negative electrode weld tabs.
The height of described cathode pads is less than the height of the negative electrode tension hole bottom margin on negative electrode medicated pillow.
The height of described anode medicated pillow is 2 times of the height of negative electrode medicated pillow.
It is provided with for anode tantalum wire location and lower fixing weld groove and upper some weld groove on described anode medicated pillow, and under
Point weld groove and upper some weld groove consistency from top to bottom.
The surface of described frame body is coated with single coating that material is silver, gold, palladium, stannum.
It is containing silver, the multilayer coating of gold, palladium, stannum that the surface of described frame body is coated with material.
The material of described frame body is nickel, copper or nickeliferous, the alloying metal of copper, ferrum.
The beneficial effects of the utility model are: provide a kind of brand-new multiple bottom-side electrodes lead frame, by right
The amendment of traditional bottom-side electrodes lead frame, the shortcoming that before solving, tantalum capacitor equivalent series resistance is bigger than normal, also solve
Little at the bottom bonding plane molded and occur in rear working procedure processing link, be easily generated the problem such as crackle, electrical property sudden change, this knot
Structure is equivalent to the twin-core design of bottom-side electrodes, and this all can have the biggest proposing to reliability and the qualification rate of bottom-side electrodes tantalum capacitor
High.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model；
Fig. 2 is the flattening schematic diagram of Fig. 1；
Fig. 3 is the top view of Fig. 1；
Fig. 4 is the structural representation after Fig. 3 installs tantalum core；
In figure: 1-frame body, hole, 2-negative electrode location, hole, 3-anode location, 4-negative electrode weld tabs, 5-anode weld tabs, 6-is cloudy
Pole alignment pin, 7-anode alignment pin, 8-negative electrode medicated pillow, 9-anode medicated pillow, 10-cathode pads, 11-negative electrode tension hole, point under 12-
Weld groove, 13-upper some weld groove, 14-tantalum core, 15-anode tantalum wire, 16-bonding silver slurry.
Detailed description of the invention
The technical solution of the utility model is described further below, but claimed scope is not limited to described.
The multiple bottom-side electrodes lead frame of a kind of chip solid electrolyte matter tantalum capacitor as shown in Figures 1 to 3, including frame
Frame body 1, frame body 1 is stamped with negative electrode weld tabs 4, anode weld tabs 5, negative electrode alignment pin 6 and anode alignment pin 7, and negative electrode
Alignment pin 6 and anode alignment pin 7 are separately positioned on negative electrode weld tabs 4 and anode weld tabs 5；It is additionally provided with on described negative electrode weld tabs 4
Being perpendicular to the negative electrode medicated pillow 8 of frame body 1, the right-hand member of negative electrode weld tabs 4 is also associated with the cathode pads parallel with frame body 1
10；Being provided with the anode medicated pillow 9 vertical with frame body 1 on described anode weld tabs 5, anode medicated pillow 9 is relative with negative electrode medicated pillow 8；
The width of the connecting portion between described cathode pads 10 and negative electrode weld tabs 4 is less than the width of negative electrode weld tabs 4.Reduce the width of connecting portion
Degree is primarily to reduce the mechanical stress of connecting portion when bending process.
The height of described cathode pads 10 is less than the height of negative electrode tension hole 11 bottom margin on negative electrode medicated pillow 8.
The height of described anode medicated pillow 9 is 2 times of the height of negative electrode medicated pillow 8.Be provided with on described anode medicated pillow 9 for
Anode tantalum wire location and lower fixing weld groove 12 and upper some weld groove 13, and lower some weld groove 12 and upper some weld groove 13 consistency from top to bottom.
Anode tantalum wire 15 on tantalum core 14 will be through lower some weld groove 12 and upper some weld groove 13, then by its firm welding so that tantalum core up and down
Form symmetrical structure.The gap between gap, negative electrode medicated pillow 8 and negative electrode weld tabs between anode medicated pillow 9 and anode weld tabs be for
Reduce stress when giving a discount, prevent from adding and produce deformation man-hour.
The surface optional plating material of described frame body 1 be silver, single coating of gold, palladium, stannum or containing silver, gold, palladium,
The multilayer coating metal of stannum.
The material of described frame body 1 is nickel, copper or nickeliferous, the alloying metal of copper, ferrum.
In actual use, as shown in Figure 4, it is bonding that the tantalum core 14 of bottom first passes through bonding silver slurry 16 to this utility model
In cathode pads 10 on lead frame, and its anode tantalum wire is through lower some weld groove 12；The anode tantalum wire of the tantalum core on top is worn
Cross some weld grooves 13, connect by bonding silver slurry is fixing between upper and lower tantalum core, be upper and lower overlay structure.Bonding tantalum core
Epoxy resin is encapsulated in its outer surface by mold pressing through the operation molded by 14, and molding compound is also not limited to epoxy resin.Frame
The unnecessary lead frame of frame body 1 can be excised by rib cutting operation.
Claims (5)
1. a multiple bottom-side electrodes lead frame for chip solid electrolyte matter tantalum capacitor, including frame body (1), framework is originally
Negative electrode weld tabs (4), anode weld tabs (5), negative electrode alignment pin (6) and anode alignment pin (7), and negative electrode location it is stamped with on body (1)
Pin (6) and anode alignment pin (7) are separately positioned on negative electrode weld tabs (4) and anode weld tabs (5), it is characterised in that: described negative electrode
Being additionally provided with the negative electrode medicated pillow (8) being perpendicular to frame body (1) on weld tabs (4), the right-hand member of negative electrode weld tabs (4) is also associated with and frame
The cathode pads (10) that frame body (1) is parallel；The anode pillow vertical with frame body (1) it is provided with on described anode weld tabs (5)
Head (9), anode medicated pillow (9) is relative with negative electrode medicated pillow (8)；Connecting portion between described cathode pads (10) and negative electrode weld tabs (4)
Width less than the width of negative electrode weld tabs (4).
2. the multiple bottom-side electrodes lead frame of chip solid electrolyte matter tantalum capacitor as claimed in claim 1, its feature exists
In: the height of described cathode pads (10) is less than the height of negative electrode tension hole (11) bottom margin on negative electrode medicated pillow (8).
3. the multiple bottom-side electrodes lead frame of chip solid electrolyte matter tantalum capacitor as claimed in claim 1, its feature exists
In: the height of described anode medicated pillow (9) is 2 times of the height of negative electrode medicated pillow (8).
4. the multiple bottom-side electrodes lead frame of the chip solid electrolyte matter tantalum capacitor as described in arbitrary in claims 1 to 3,
It is characterized in that: be provided with on described anode medicated pillow (9) for anode tantalum wire location and lower fixing weld groove (12) and
Point weld groove (13), and lower some weld groove (12) and upper some weld groove (13) consistency from top to bottom.
5. the multiple bottom-side electrodes lead frame of the chip solid electrolyte matter tantalum capacitor as described in arbitrary in claims 1 to 3,
It is characterized in that: the surface of described frame body (1) is coated with single coating that material is silver, gold, palladium, stannum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620360273.1U CN205789528U (en) | 2016-04-26 | 2016-04-26 | A kind of multiple bottom-side electrodes lead frame of chip solid electrolyte matter tantalum capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620360273.1U CN205789528U (en) | 2016-04-26 | 2016-04-26 | A kind of multiple bottom-side electrodes lead frame of chip solid electrolyte matter tantalum capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205789528U true CN205789528U (en) | 2016-12-07 |
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ID=57411743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620360273.1U Active CN205789528U (en) | 2016-04-26 | 2016-04-26 | A kind of multiple bottom-side electrodes lead frame of chip solid electrolyte matter tantalum capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205789528U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300689A (en) * | 2018-11-02 | 2019-02-01 | 北京元六鸿远电子科技股份有限公司 | Molding Surface Mount ceramic capacitor and preparation method with non-slip groove |
| CN110447085A (en) * | 2017-03-29 | 2019-11-12 | 松下知识产权经营株式会社 | Solid electrolytic capacitor And Manufacturing approach |
| CN112185707A (en) * | 2020-11-06 | 2021-01-05 | 株洲宏达电子股份有限公司 | Preparation method of chip tantalum capacitor |
-
2016
- 2016-04-26 CN CN201620360273.1U patent/CN205789528U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110447085A (en) * | 2017-03-29 | 2019-11-12 | 松下知识产权经营株式会社 | Solid electrolytic capacitor And Manufacturing approach |
| CN110447085B (en) * | 2017-03-29 | 2021-10-15 | 松下知识产权经营株式会社 | Solid electrolytic capacitor and method for manufacturing the same |
| CN109300689A (en) * | 2018-11-02 | 2019-02-01 | 北京元六鸿远电子科技股份有限公司 | Molding Surface Mount ceramic capacitor and preparation method with non-slip groove |
| CN112185707A (en) * | 2020-11-06 | 2021-01-05 | 株洲宏达电子股份有限公司 | Preparation method of chip tantalum capacitor |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |