CN204792454U - Piece formula tantalum electrolytic capacitor's lead wire frame construction - Google Patents
Piece formula tantalum electrolytic capacitor's lead wire frame construction Download PDFInfo
- Publication number
- CN204792454U CN204792454U CN201520503425.4U CN201520503425U CN204792454U CN 204792454 U CN204792454 U CN 204792454U CN 201520503425 U CN201520503425 U CN 201520503425U CN 204792454 U CN204792454 U CN 204792454U
- Authority
- CN
- China
- Prior art keywords
- pillow
- lead frame
- anode
- positive pole
- frame body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 title claims abstract description 36
- 229910052715 tantalum Inorganic materials 0.000 title claims abstract description 25
- 239000003990 capacitor Substances 0.000 title claims abstract description 22
- 238000010276 construction Methods 0.000 title abstract 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title abstract 2
- 238000004080 punching Methods 0.000 claims abstract description 10
- 239000007784 solid electrolyte Substances 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 238000003466 welding Methods 0.000 abstract description 3
- 238000012797 qualification Methods 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 abstract 4
- 238000004519 manufacturing process Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The utility model provides a piece formula tantalum electrolytic capacitor's lead wire frame construction, including the lead frame body, the punching press has negative pole locating pin, negative pole soldering lug, positive pole soldering lug and positive pole locating pin on the lead frame body, be provided with under the positive pole pillow on pillow and the positive pole on the positive pole soldering lug, and on pillow and positive pole pillow perpendicular to lead frame body respectively under the positive pole. The utility model discloses with design on the positive pole soldering lug have with lead frame body mutually perpendicular's positive pole under on pillow and positive pole pillow, and be provided with recess A and the recess B for lead frame body symmetry on pillow and the positive pole on the pillow under the positive pole, during the bonding with the tantalum on the tantalum core for the silk laser spot welding fix in recess A and recess B, the problem of the leakage current that the leads to the fact increase not on a plane of tantalum core is solved, can improve piece formula tantalum electrolytic capacitor's volume efficiency and electric performance parameter, thereby improve product output qualification rate.
Description
Technical field
The utility model relates to chip solid electrolyte matter tantalum capacitor manufacturing process technology field, is specifically related to a kind of lead frame structure of chip solid electrolyte matter tantalum capacitor.
Background technology
At present, in tantalum capacitor manufacturing process, improve one of solid electrolyte Ta capacitor space service efficiency Main way becoming design.Traditional structural design only has 35% in the use of volume efficiency, and traditional tantalum capacitor twin-core manufacturing process to have soaked the first combination and solidification of tantalum fuse after graphite, silver slurry, then combine with old lead frame.Leakage current that this manufacture can not cause on a plane because of two tantalum wires increases, rosin joint and the capacity miss that causes, thus causes output low qualified.Novel tantalum capacitor can address these problems structural design at all.
Utility model content
For solving the problems of the technologies described above, the utility model provides a kind of lead frame structure of chip solid electrolyte matter tantalum capacitor, the lead frame structure of this chip solid electrolyte matter tantalum capacitor is by being designed to relative to lead frame body symmetrical structure by the groove A on anode weld tabs and groove B, tantalum wire also opposite anode weld tabs is symmetrical, the problem that after tantalum wire opposite anode weld tabs does not cause welding before solving on a plane, leakage current increases.
The utility model is achieved by the following technical programs.
The lead frame structure of a kind of chip solid electrolyte matter tantalum capacitor that the utility model provides, comprise lead frame body, lead frame body upper punch is pressed with negative electrode alignment pin, negative electrode weld tabs, anode weld tabs and anode alignment pin; Described anode weld tabs to be provided with under anode pillow on pillow and anode, and under anode on pillow and anode pillow respectively perpendicular to lead frame body.
On described lead frame body, also punching press has negative electrode location hole and anode location hole.
Under described anode, on pillow and anode, the end of pillow is equal with the distance between lead frame body two sides.
The fluted A of punching press and groove B respectively on pillow on pillow and anode under described anode, and described groove A and groove B is symmetrical about lead frame body.
Described lead frame body is nickel strap or copper strips body.
The beneficial effects of the utility model are: will anode weld tabs be designed with and pillow on pillow under the orthogonal anode of lead frame body and anode, and the groove A under anode, pillow is provided with for pillow and anode relative to lead frame body symmetry and groove B, time bonding, tantalum wire laser spot welding on tantalum core is fixed in groove A and groove B, the problem that before solving, two tantalum wires increase relative to the leakage current that anode weld tabs does not cause on a plane, thus volume service efficiency and the unit for electrical property parameters of chip solid electrolyte Ta capacitor can be improved, the design voltage multiple of tantalum fuse can be improved, this all can improve a lot to the reliability of chip tantalum capacitor and qualification rate.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is that Fig. 1 is along the structural representation after dotted line punching press;
Fig. 3 is the left view of Fig. 2;
Fig. 4 is the structural representation of the utility model real use state;
In figure: 1-negative electrode location hole, 2-lead frame body, 3-negative electrode alignment pin, 4-negative electrode weld tabs, 5-anode location hole, 6-anode weld tabs, pillow under 61-anode, pillow on 62-anode, 63-groove A, 64-groove B, 7-anode alignment pin, the bonding silver slurry of 8-, 9-tantalum core, 10-tantalum wire.
Embodiment
Further describe the technical solution of the utility model below, but described in claimed scope is not limited to.
The lead frame structure of a kind of chip solid electrolyte matter tantalum capacitor as shown in Figure 1 to 4, comprise lead frame body 2, lead frame body 2 upper punch is pressed with negative electrode alignment pin 3, negative electrode weld tabs 4, anode weld tabs 6 and anode alignment pin 7; Described anode weld tabs 6 to be provided with under anode pillow 62 on pillow 61 and anode, and under anode on pillow 61 and anode pillow 62 respectively perpendicular to lead frame body 2.Lead frame body 2 can be nickel strap or copper strips body.
On described lead frame body 2, also punching press has negative electrode location hole 1 and anode location hole 5.
Under described anode, on pillow 61 and anode, the end of pillow 62 is equal with the distance between lead frame body 2 two sides.The fluted A63 of punching press and groove B64 respectively on pillow 62 on pillow 61 and anode under described anode, and described groove A63 and groove B64 is symmetrical about lead frame body 2.
The utility model adopts the mode of punching press by downward for anode weld tabs 6 front end punching press 90 degree, to form under anode pillow 62 on pillow 61 and anode, anode weld tabs 6 provides support structure for pillow 62 on pillow under anode 61 and anode, pillow 62 centre recessing A63 and groove B64 on pillow 61 and anode under anode respectively again, for laying the tantalum wire 10 of tantalum core 9, be convenient to the relative position of fixing tantalum core 9 and lead frame body 2.The one side that tantalum core 9 is first bonded in lead frame body 2 by bonding silver slurry 8, after by mirror-image fashion at the plane of symmetry another tantalum core 9 bonding.Finally complete enantiomorphous assembling.
Claims (6)
1. the lead frame structure of a chip solid electrolyte matter tantalum capacitor, comprise lead frame body (2), lead frame body (2) upper punch is pressed with negative electrode alignment pin (3), negative electrode weld tabs (4), anode weld tabs (6) and anode alignment pin (7), it is characterized in that: described anode weld tabs (6) to be provided with under anode pillow (62) on pillow (61) and anode, and under anode on pillow (61) and anode pillow (62) respectively perpendicular to lead frame body (2).
2. the lead frame structure of chip solid electrolyte matter tantalum capacitor as claimed in claim 1, is characterized in that: the upper also punching press of described lead frame body (2) has negative electrode location hole (1) and anode location hole (5).
3. the lead frame structure of chip solid electrolyte matter tantalum capacitor as claimed in claim 1, is characterized in that: under described anode, on pillow (61) and anode, the end of pillow (62) is equal with the distance between lead frame body (2) two sides.
4. the lead frame structure of the chip solid electrolyte matter tantalum capacitor as described in claim 1 or 3, it is characterized in that: pillow (62) the upper fluted A of punching press (63) and groove B (64) respectively on pillow (61) and anode under described anode, and described groove A (63) and groove B (64) is symmetrical about lead frame body (2).
5., as the lead frame structure of the chip solid electrolyte matter tantalum capacitor as described in arbitrary in claims 1 to 3, it is characterized in that: described lead frame body (2) is nickel strap or copper strips body.
6. the lead frame structure of chip solid electrolyte matter tantalum capacitor as claimed in claim 4, is characterized in that: described lead frame body (2) is nickel strap or copper strips body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520503425.4U CN204792454U (en) | 2015-07-13 | 2015-07-13 | Piece formula tantalum electrolytic capacitor's lead wire frame construction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520503425.4U CN204792454U (en) | 2015-07-13 | 2015-07-13 | Piece formula tantalum electrolytic capacitor's lead wire frame construction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204792454U true CN204792454U (en) | 2015-11-18 |
Family
ID=54532453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520503425.4U Expired - Fee Related CN204792454U (en) | 2015-07-13 | 2015-07-13 | Piece formula tantalum electrolytic capacitor's lead wire frame construction |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204792454U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109637811A (en) * | 2018-12-13 | 2019-04-16 | 福建国光电子科技股份有限公司 | A kind of chip-type laminated solid aluminum electrolytic capacitor of ultrathin type polymer and preparation method |
| CN113161151A (en) * | 2020-01-07 | 2021-07-23 | 三星电机株式会社 | Tantalum capacitor |
| CN114121493A (en) * | 2021-11-12 | 2022-03-01 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | Non-polar chip tantalum capacitor and manufacturing method thereof |
-
2015
- 2015-07-13 CN CN201520503425.4U patent/CN204792454U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109637811A (en) * | 2018-12-13 | 2019-04-16 | 福建国光电子科技股份有限公司 | A kind of chip-type laminated solid aluminum electrolytic capacitor of ultrathin type polymer and preparation method |
| CN109637811B (en) * | 2018-12-13 | 2021-03-23 | 福建国光电子科技有限公司 | Ultra-thin polymer sheet type laminated solid aluminum electrolytic capacitor and preparation method thereof |
| CN113161151A (en) * | 2020-01-07 | 2021-07-23 | 三星电机株式会社 | Tantalum capacitor |
| CN113161151B (en) * | 2020-01-07 | 2022-08-26 | 三星电机株式会社 | Tantalum capacitor |
| CN114121493A (en) * | 2021-11-12 | 2022-03-01 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | Non-polar chip tantalum capacitor and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151118 |