CN204792446U - Many tantalums core lead wire frame construction of piece formula tantalum electrolytic capacitor - Google Patents
Many tantalums core lead wire frame construction of piece formula tantalum electrolytic capacitor Download PDFInfo
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- CN204792446U CN204792446U CN201520503388.7U CN201520503388U CN204792446U CN 204792446 U CN204792446 U CN 204792446U CN 201520503388 U CN201520503388 U CN 201520503388U CN 204792446 U CN204792446 U CN 204792446U
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Abstract
The utility model provides a many tantalums core lead wire frame construction of piece formula tantalum electrolytic capacitor, including the lead frame body, the punching press has negative pole locating pin, negative pole soldering lug, positive pole soldering lug, positive pole locating pin and negative pole liner on the lead frame body, the front end of negative pole soldering lug is provided with the negative pole liner, just the negative pole liner is parallel with the lead frame body. The utility model discloses evenly fall into equal portions with the negative pole liner on the lead frame, utilize the piece formula tantalum electrolytic capacitor of this lead frame manufacturing, reduced the mould pressing disability rate. Through increase flexible conducting resin between tantalum core and tantalum core, be favorable to reducing the mould pressing like this to impact force that the core caused to improve tantalum capacitor production qualification rate.
Description
Technical field
The utility model relates to chip solid electrolyte matter tantalum capacitor manufacturing process technology field, is specifically related to a kind of many tantalums core lead frame structure of chip solid electrolyte matter tantalum capacitor.
Background technology
At present, in tantalum capacitor manufacturing process, the tantalum fuse soaked after graphite, silver slurry needs tantalum fuse and lead frame to combine the positive and negative electrode being used as capacitor exit.And traditional multicore bonded structure is after mold pressing, the situation easily causing short circuit and leakage current to increase occurs.Therefore, in order to meet the situation of present multiple tantalum fuse common cathode liner, needing to adjust its bonded structure, improving the bonding stability of tantalum fuse.Filler simultaneously between multiple fuse parallel connection also needs to be optimized, the advantage that multicore structure could be used like this to bring instead of when other unit for electrical property parameters of sacrifice tantalum capacitor.The improvement of this structure is equally applicable to the multicore structure of 3-6 core.In order to improve the quality of tantalum electrolytic capacitor product, ensureing its reliability, needing the lead frame structure of traditional chip solid electrolyte matter tantalum capacitor to make further improvement.
Utility model content
For solving the problems of the technologies described above, the utility model provides a kind of many tantalums core lead frame structure of chip solid electrolyte matter tantalum capacitor, many tantalums core lead frame structure of this chip solid electrolyte matter tantalum capacitor is by being evenly divided into equal portions by cathode pads, solve traditional multicore bonding way after bearing the large stress impact of mold pressing, the problem that the short circuit caused and leakage current increase.
The utility model is achieved by the following technical programs.
Many tantalums core lead frame structure of a kind of chip solid electrolyte matter tantalum capacitor that the utility model provides, comprises lead frame body; Described lead frame body upper punch is pressed with negative electrode alignment pin, negative electrode weld tabs, anode weld tabs, anode alignment pin and cathode pads, and the front end of described negative electrode weld tabs is provided with cathode pads, and described cathode pads is parallel with lead frame body.
On described lead frame body, also punching press has negative electrode location hole and anode location hole respectively.
Described lead frame body is nickel strap or copper strips body.
The beneficial effects of the utility model are: the cathode pads on lead frame is evenly divided into equal portions, the chip solid electrolyte matter tantalum capacitor utilizing this lead frame to manufacture, reduce mold pressing scrappage, due to the special construction of this lead frame, make can to bear between each fuse of chip solid electrolyte matter tantalum capacitor many tantalums core the dislocation shearing force under the large stress impact of mold pressing, between tantalum fuse and tantalum fuse, increase flexible conductive adhesive simultaneously, be conducive to reducing further the impulsive force that mold pressing causes fuse like this, thus improve tantalum capacitor production qualification rate.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the vertical view of Fig. 1;
Fig. 3 is the vertical view after Fig. 2 installs tantalum core;
In figure: 1-negative electrode location hole, 2-lead frame body, 3-negative electrode alignment pin, 4-negative electrode weld tabs, 5-anode location hole, 6-anode weld tabs, 7-anode alignment pin, 8-cathode pads, 9-tantalum core, 10-conducting resinl, 11-tantalum wire.
Embodiment
Further describe the technical solution of the utility model below, but described in claimed scope is not limited to.
Many tantalums core lead frame structure of a kind of chip solid electrolyte matter tantalum capacitor as shown in FIG. 1 to 3, comprises lead frame body 2; Described lead frame body 2 upper punch is pressed with negative electrode alignment pin 3, negative electrode weld tabs 4, anode weld tabs 6, anode alignment pin 7 and cathode pads 8, and the front end of described negative electrode weld tabs 4 is provided with cathode pads 8, and described cathode pads 8 is parallel with lead frame body 2.On described lead frame body 2, also punching press has negative electrode location hole 1 and anode location hole 5 respectively.Described lead frame body 2 is nickel strap or copper strips body.
Cathode pads 8 on lead frame body 2 is evenly divided into equal portions by the utility model, utilizes the chip solid electrolyte matter tantalum capacitor that this lead frame body 2 manufactures, reduces mold pressing scrappage.The special construction of this lead frame body 2, makes can to bear between each tantalum core of chip solid electrolyte matter tantalum capacitor many tantalums core 9 the dislocation shearing force under the large stress impact of mold pressing.In order to reduce the impact of shearing force on tantalum core 9, needing to increase flexible conductive adhesive 10 between each tantalum core 9, being conducive to the impulsive force that reduction mold pressing causes tantalum core 9 like this, thus improving qualification rate.
The utility model is in actual production, according to the concrete size of chip solid electrolyte matter tantalum capacitor, stamp out the negative electrode location hole 1 on lead frame body 2, anode location hole 5, anode weld tabs 6, negative electrode weld tabs 4, anode alignment pin 7 and negative electrode alignment pin 3 with shaping mould.Adopt the special instrument that bends again, target weld tabs 4 carries out operation of bending, to form Novel lead framework structure figure as shown in Figure 2.
Claims (3)
1. many tantalums core lead frame structure of a chip solid electrolyte matter tantalum capacitor, comprise lead frame body (2), it is characterized in that: described lead frame body (2) upper punch is pressed with negative electrode alignment pin (3), negative electrode weld tabs (4), anode weld tabs (6), anode alignment pin (7) and cathode pads (8), the front end of described negative electrode weld tabs (4) is provided with cathode pads (8), and described cathode pads (8) is parallel with lead frame body (2).
2. many tantalums core lead frame structure of chip solid electrolyte matter tantalum capacitor as claimed in claim 1, is characterized in that: on described lead frame body (2), also punching press has negative electrode location hole (1) and anode location hole (5) respectively.
3. many tantalums core lead frame structure of chip solid electrolyte matter tantalum capacitor as claimed in claim 1 or 2, is characterized in that: described lead frame body (2) is nickel strap or copper strips body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520503388.7U CN204792446U (en) | 2015-07-13 | 2015-07-13 | Many tantalums core lead wire frame construction of piece formula tantalum electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520503388.7U CN204792446U (en) | 2015-07-13 | 2015-07-13 | Many tantalums core lead wire frame construction of piece formula tantalum electrolytic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204792446U true CN204792446U (en) | 2015-11-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201520503388.7U Active CN204792446U (en) | 2015-07-13 | 2015-07-13 | Many tantalums core lead wire frame construction of piece formula tantalum electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204792446U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105826080A (en) * | 2016-05-30 | 2016-08-03 | 中国振华（集团）新云电子元器件有限责任公司 | Hermetically-sealed solid electrolyte tantalum capacitor packaged through ceramic |
| CN114121493A (en) * | 2021-11-12 | 2022-03-01 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | Non-polar chip tantalum capacitor and manufacturing method thereof |
-
2015
- 2015-07-13 CN CN201520503388.7U patent/CN204792446U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105826080A (en) * | 2016-05-30 | 2016-08-03 | 中国振华（集团）新云电子元器件有限责任公司 | Hermetically-sealed solid electrolyte tantalum capacitor packaged through ceramic |
| CN105826080B (en) * | 2016-05-30 | 2018-09-07 | 中国振华（集团）新云电子元器件有限责任公司 | A kind of fully closed solid electrolyte Ta capacitor of ceramic package |
| CN114121493A (en) * | 2021-11-12 | 2022-03-01 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | Non-polar chip tantalum capacitor and manufacturing method thereof |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |