CN205542415U - Mode of opening a way multicore combination ceramic capacitor - Google Patents
Mode of opening a way multicore combination ceramic capacitor Download PDFInfo
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- CN205542415U CN205542415U CN201620073720.5U CN201620073720U CN205542415U CN 205542415 U CN205542415 U CN 205542415U CN 201620073720 U CN201620073720 U CN 201620073720U CN 205542415 U CN205542415 U CN 205542415U
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- lead frame
- ceramic capacitor
- multilayer ceramic
- fuse
- resinite
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Abstract
The utility model provides a mode of opening a way multicore combination ceramic capacitor, multicore combination ceramic capacitor includes resinite, lead frame, multilayer ceramic capacitor, fuse and pin, the fuse is established ties on the lead frame, and multilayer ceramic capacitor establishes ties or connects in parallel on the lead frame, lead frame, multilayer ceramic capacitor and fuse encapsulation are in the resinite, and the tip of lead frame stretches out the resinite and is connected with the pin. The utility model discloses can establish ties on the lead frame or parallelly connected a plurality of multilayer ceramic capacitor, can realize characteristics such as the little volume of condenser, high pressure resistant and large capacity. Scribble to spread on the electrode at multilayer ceramic capacitor both ends and prevent arcing protection liquid, and cure the solidification back and carry out compression molding with epoxy, can prevent effectively between multilayer ceramic capacitor's the electrode that the flashing over damages the circuit, also difficultly damage because of mechanical stress.
Description
Technical field
The utility model relates to a kind of ceramic capacitor, is specifically related to the ceramic capacitor combined by multiple multilayer ceramic capacitors and fuse.
Background technology
Multiple-layer sheet ceramic capacitor i.e. MLCC, is one of element the most commonly used in circuit, electrical equipment, electronics.It is widely used on the electric equipment products such as electronic product, communication, computer and electronic equipment at present.For unit uses MLCC quantity, maximum with notebook computer, DTV, IPAD and mobile phone consumption, every notebook computer MLCC amount is only about 500-900, and only, every mobile phone MLCC amount 200-700 is only for every DTV consumption about 600-800.
Capacitor just develops towards miniaturization, miniaturization, jumbo direction under the promotion of science and technology.Single MLCC is only by changing production technology and making the material of product, it is difficult to obtain the biggest progress on Large Copacity, high pressure resistant and low ESR.If directly using multiple MLCC serial or parallel connections in circuit, the complexity of circuit design can be increased, also can increase the space that MLCC takies on circuit boards.
Usual each MLCC has 2 welding pin on circuit boards, between intensive multiple MLCC, the spacing between pin can be the least, this not only adds the difficulty being installed on circuit board by MLCC, the difficulty of single MLCC is changed when also can increase maintenance, and when dust or other foreign matter are piled up on circuit boards, also have between MLCC and produce arc flash and damage the potential safety hazard of circuit.When multiple MLCC weld on circuit boards, circuit board the most easily occurs because making MLCC that the problem such as sealing-off, internal break occurs in mechanical stress.
Find that following patent and the utility model have a similarity by domestic retrieval:
Application No. 201520126655.3, the utility model of entitled " a kind of fuse discrete serial electric container " discloses a kind of fuse discrete serial electric container, relate to capacitor design technical field, including housing, it is placed in the capacitor body of enclosure interior, the impregnating agent being poured between housing and capacitor body, the end cap being arranged on housing and the binding post being arranged on end cap, capacitor body includes the first fuse group and the second fuse group, first fuse group is arranged on the top of the second fuse group, the upper end of the first fuse group is provided with on one location fastener, location fastener it is provided with in one between first fuse group and the second fuse group, the lower end of the second fuse group is provided with and positions fastener, pass through wired in series between first fuse group and the second fuse group and be connected on the binding post at top.The beneficial effects of the utility model are: this utility model simple in construction, reasonable in design, by series design two group capacitor fuse in same housing, while reducing housing consumptive material, add the power of capacitor, it is simple to same maintenance management, cost-effective.
Multiple capacitor bodies are cascaded by this utility model for the power increasing capacitor, have similarity with the utility model.But this utility model uses wire to be connected by multiple capacitor bodies, different from the utility model uses the structure welding multiple multilayer ceramic capacitor on lead frame.The number welding multilayer ceramic capacitor in the utility model on lead frame can be more, and the space taken is little, and after employing resinite encapsulation, whole multicore compound ceramic capacitor is more firm.
Utility model content
The technical problems to be solved in the utility model is: for electrical equipment needs Large Copacity, the capacitor that high pressure resistant, volume is little time, current capacitor is difficult to meet requirement, and propose a kind of multiple multilayer ceramic capacitors are arranged in parallel or in series on lead frame and are packaged a kind of small size, multicore compound ceramic capacitor high pressure resistant, jumbo.
Pin with the problems referred to above, the technical scheme that the utility model proposes is: a kind of open circuit mode multicore compound ceramic capacitor, multicore compound ceramic capacitor includes resinite, lead frame, multilayer ceramic capacitor, fuse and pin；Fuse is connected on lead frame, and multilayer ceramic capacitor serial or parallel connection is on lead frame；Lead frame, multilayer ceramic capacitor and fuse are encapsulated in resinite, and the end of lead frame is stretched out resinite and is connected with pin.
Further, lead frame includes lead frame matrix and lead frame coating, and lead frame matrix is silver or copper, and the internal layer of lead frame coating is nickel dam, and the outer layer of lead frame coating is tin layers.
Further, the thickness of lead frame matrix is 1.5mm, and the thickness of the nickel dam of lead frame coating is 1-7 μm, and the thickness of the tin layers of lead frame coating is 3-9 μm.
Further, multilayer ceramic capacitor and fuse are weldingly fixed on lead frame by solder(ing) paste, and on lead frame, the number of the fuse of welding is more than 1, and on lead frame, the number of the multilayer ceramic capacitor of welding is more than 2.
Further, lead frame is the wire frame of a Guan Bi, and lead frame has the end of more than 2, and the end of lead frame has been stretched out resinite and carried out bending.
Further, pin is welded on the end of lead frame, and fuse is connected on lead frame, and fuse is connected between multilayer ceramic capacitor and pin.
Further, resinite is rectangular-shaped, and pin is the cuboid sheet metal that thickness is less than 2mm, and pin is close on resinite.
The utility model has the advantages that:
1. on lead frame, multiple multilayer ceramic capacitors of welding can be closely spaced together, can realize the features such as the small size of capacitor, high pressure resistant, Large Copacity.
2. the lead frame outside resinite is immersed in surface treatment liquid so that on lead frame, plate last layer leypewter so that the most firm after pin welding.
3. it is coated with on the electrode at each multilayer ceramic capacitor two ends after spreading antiarcing-over protection liquid, and baked and cured and carries out compression molding with epoxy resin, can effectively prevent between the electrode of multilayer ceramic capacitor, producing arcing and damage circuit.
4. lead frame, multilayer ceramic capacitor and fuse are all encapsulated in resinite so that whole compound ceramic capacitor arrangement is firm, be difficult to damage because of mechanical stress.
Accompanying drawing explanation
Fig. 1 is the structural representation of embodiment one；
Fig. 2 is the equivalent circuit diagram of Fig. 1；
Fig. 3 is the structural representation of embodiment two；
Fig. 4 is the equivalent circuit diagram of Fig. 3；
Fig. 5 is the structural representation of embodiment three；
In figure: 1 lead frame, 2 multilayer ceramic capacitors, 3 fuses, 4 pins, 5 resinites.
Detailed description of the invention
Below in conjunction with embodiment and accompanying drawing, the utility model is done the description of a step:
Embodiment one
As it is shown in figure 1, multicore compound ceramic capacitor includes resinite (5), lead frame (1), multilayer ceramic capacitor (2), fuse (3) and pin (4).Multiple multilayer ceramic capacitors (2) are welded in lead frame (1), and the end of lead frame (1) is welded with fuse (3) and pin (4), thus form a series circuit.Wherein lead frame (1), multilayer ceramic capacitor (2) and fuse (3) are encapsulated in resinite (5), and pin (4) is welded on resinite (5) outward.
The end of lead frame (1) has been stretched out resinite (5) and has carried out bending, and the sheet pin (4) of metal carries out SMD attachment with the end of the lead frame (1) stretched out, and pin (4) is preferably the thickness sheet metal less than 2mm.Fuse (3) is connected on lead frame (1), and fuse (3) is connected between chip multilayer ceramic capacitor (2) and pin (4).
Lead frame (1) includes lead frame (1) matrix and lead frame (1) coating, and lead frame (1) matrix is silver or copper, is that centre hollow out is become lead frame (1) matrix, the thickness of lead frame (1) matrix to be 1.5mm by the method by punching press or etching.The internal layer of lead frame (1) coating is nickel dam, and the thickness of nickel dam is 1-7 μm, and the outer layer of lead frame (1) coating is tin layers, and the thickness of tin layers is 3-9 μm, is all to be plated to by rack plating process.It is by series connection or parallel connection, and the number of the multilayer ceramic capacitor (2) of serial or parallel connection according to the multilayer ceramic capacitor (2) in multicore compound ceramic capacitor, designs the shape of lead frame (1) matrix.
The electroplating time of the nickel dam of lead frame (1) coating is 10-40 minute, and electroplating current is 3-14A；The electroplating time of the tin layers of lead frame (1) coating is 20-60 minute, and electroplating current is 5-15A.Multilayer ceramic capacitor (2) and fuse (3) are all weldingly fixed on lead frame (1) by solder(ing) paste, and the temperature of solder(ing) paste welding is 270-320 DEG C.
As it is shown in figure 1, multiple multilayer ceramic capacitors (2) are welded on lead frame (1), upper formed is a series circuit, and plurality of multilayer ceramic capacitor (2) and two fuses (3) are all to connect in circuit, and its equivalent circuit diagram is as shown in Figure 2.As it is shown on figure 3, multiple multilayer ceramic capacitors (2) be parallel connection in circuit, and four fuses (3) are to connect with multilayer ceramic capacitor (2), and its equivalent circuit is as shown in Figure 4.Fig. 5 with Fig. 3 is similar, only four fuses (3) is connected with multilayer ceramic capacitor (2) and has made two fuses (3) into and connect with multilayer ceramic capacitor (2).
Table 1 below shows the value of capacity, loss angle tangent and insulaion resistance of the multilayer ceramic capacitor (2) used in the present embodiment:
Table 1: open circuit mode multilayer ceramic capacitor basic parameter
| Capacity (μ F) | Loss angle tangent (%) | Insulaion resistance (Ω) |
| 22.1-23.7 | 1.8-2.2 | ≥100MΩ·μF |
When table 2 below shows in the present embodiment fuse (3) FUSE using different rated current and rated voltage, when fuse (3) fuses, its different fusing time:
Table 2:FUSE parameter selects
| Tested number | Rated current (A) | Rated voltage (V) | Fusing time (S) |
| 1 | 5 | 25 | 1 |
| 2 | 10 | 16 | 0.5 |
| 3 | 15 | 10 | 0.1 |
By the parameter of fuse (3) FUSE of table 2 it can be seen that the rated current of FUSE its rated voltage the biggest is the lowest.Selecting suitable fuse (3) FUSE to be welded in lead frame (1) is a link critically important in this invention.
Table 3 below show when multilayer ceramic capacitor (2) MLCC and fuse (3) FUSE is welded with lead frame (1) by solder(ing) paste, the impact on properties of product of the different temperature.
Table 3: welding product performance
Owing to the electrode at multiple multilayer ceramic capacitors (2) two ends is relatively near, when especially having sharp-pointed projection on electrode, it is easily generated arcing.For preventing interelectrode arcing, have employed two kinds of guard methods: the first coats antiarcing-over protection liquid on the electrode at multilayer ceramic capacitor (2) two ends, and carries out baked and cured.It two is that epoxy resin is put into compression molding in mould, with resinite (5), the electrode at multilayer ceramic capacitor (2) two ends carries out insulation parcel.
Table 4 below shows the impact under different technological parameters, on mold pressing quality of the antiarcing-over protection liquid.
Table 4: antiarcing-over protection liquid technological parameter
After smearing and solidifying antiarcing-over protection liquid, multilayer ceramic capacitor (2), fuse (3), lead frame (1) and epoxy resin are put in mould, compression molding, and the product of shaping is carried out plastic packaging.Product surface after using sand-blasting machine to eject sand polishing plastic packaging after molding plastic packaging, makes the end by the lead frame (1) of plastic packaging expose.After sandblasting, the end of the lead frame (1) exposed after sandblasting being carried out bent angle, the end of clinched lead frame (1) makes it press close to resinite (5).After bent angle, the product after plastic packaging, sandblasting is immersed in surface treatment liquid, make exposed at outer lead frame (1) the upper plating last layer leypewter of resinite (5), in order to preferably weld.The end of the lead frame (1) after the pin (4) of sheet metal and bending is carried out SMD attachment after processing by surface.Use LCR table that capacity, the loss of product are tested after paster；Use Insulation Resistance Tester that the insulaion resistance of product is tested；Use Hi-pot Tester that the proof voltage performance of product is tested.
When multilayer ceramic capacitor (2) is to be welded in lead frame (1) by the way of series connection, the proof voltage performance of multicore compound ceramic capacitor can be improved；When multilayer ceramic capacitor (2) be mode in parallel be welded in lead frame (1) time, multicore compound ceramic capacitor can be made to become jumbo capacitor.And multilayer ceramic capacitor (2) is welded on the number on lead frame (1) and can need to weld according to concrete circuit, the welding number of multilayer ceramic capacitor (2) can also be increased or decreased so that multilayer ceramic capacitor (2) can form the multicore compound ceramic capacitor of the circuit that can be suitably used for various high request the most flexibly by the shape changing lead frame (1).
It addition, will not be burnt by overcurrent or overvoltage for protection circuit, multicore compound ceramic capacitor can need to weld the fuse (3) of different rated current and rated voltage according to concrete circuit.
It will be apparent that on the premise of without departing from principle described in the utility model, the some improvement made or modification are regarded as protection domain of the present utility model.
Claims (7)
1. an open circuit mode multicore compound ceramic capacitor, it is characterised in that multicore compound ceramic capacitor includes resinite (5), lead frame (1), multilayer ceramic capacitor (2), fuse (3) and pin (4)；Fuse (3) is connected on lead frame (1), and multilayer ceramic capacitor (2) serial or parallel connection is on lead frame (1)；Lead frame (1), multilayer ceramic capacitor (2) and fuse (3) are encapsulated in resinite (5), and the end of lead frame (1) is stretched out resinite (5) and is connected with pin (4).
A kind of open circuit mode multicore compound ceramic capacitor the most according to claim 1, it is characterized in that, lead frame (1) includes lead frame (1) matrix and lead frame (1) coating, lead frame (1) matrix is silver or copper, the internal layer of lead frame (1) coating is nickel dam, and the outer layer of lead frame (1) coating is tin layers.
A kind of open circuit mode multicore compound ceramic capacitor the most according to claim 2, it is characterized in that, the thickness of lead frame (1) matrix is 1.5mm, and the thickness of the nickel dam of lead frame (1) coating is 1-7 μm, and the thickness of the tin layers of lead frame (1) coating is 3-9 μm.
A kind of open circuit mode multicore compound ceramic capacitor the most according to claim 1, it is characterized in that, multilayer ceramic capacitor (2) and fuse (3) are weldingly fixed on lead frame (1) by solder(ing) paste, the number of the fuse (3) of the upper welding of lead frame (1) is more than 1, and the number of the multilayer ceramic capacitor (2) of the upper welding of lead frame (1) is more than 2.
A kind of open circuit mode multicore compound ceramic capacitor the most according to claim 1, it is characterized in that, lead frame (1) is the wire frame of a Guan Bi, and lead frame (1) has the end of more than 2, the end of lead frame (1) to stretch out resinite (5) and have carried out bending.
A kind of open circuit mode multicore compound ceramic capacitor the most according to claim 1, it is characterized in that, pin (4) is welded on the end of lead frame (1), fuse (3) is connected on lead frame (1), and fuse (3) is connected between multilayer ceramic capacitor (2) and pin (4).
A kind of open circuit mode multicore compound ceramic capacitor the most according to claim 1, it is characterised in that resinite (5) is rectangular-shaped, and pin (4) is the cuboid sheet metal that thickness is less than 2mm, and pin (4) is close on resinite (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620073720.5U CN205542415U (en) | 2016-01-26 | 2016-01-26 | Mode of opening a way multicore combination ceramic capacitor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620073720.5U CN205542415U (en) | 2016-01-26 | 2016-01-26 | Mode of opening a way multicore combination ceramic capacitor |
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| Publication Number | Publication Date |
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| CN205542415U true CN205542415U (en) | 2016-08-31 |
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| CN201620073720.5U Active CN205542415U (en) | 2016-01-26 | 2016-01-26 | Mode of opening a way multicore combination ceramic capacitor |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428065A (en) * | 2016-01-26 | 2016-03-23 | 株洲宏达陶电科技有限公司 | Open-circuit-mode multicore combined ceramic capacitor and manufacturing method thereof |
| CN108270411A (en) * | 2018-02-28 | 2018-07-10 | 成都宇鑫洪科技有限公司 | A kind of microminiature radio frequency interference filter |
| CN110098055A (en) * | 2019-05-30 | 2019-08-06 | 福建火炬电子科技股份有限公司 | A kind of multicore ceramic capacitor |
-
2016
- 2016-01-26 CN CN201620073720.5U patent/CN205542415U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428065A (en) * | 2016-01-26 | 2016-03-23 | 株洲宏达陶电科技有限公司 | Open-circuit-mode multicore combined ceramic capacitor and manufacturing method thereof |
| CN108270411A (en) * | 2018-02-28 | 2018-07-10 | 成都宇鑫洪科技有限公司 | A kind of microminiature radio frequency interference filter |
| CN110098055A (en) * | 2019-05-30 | 2019-08-06 | 福建火炬电子科技股份有限公司 | A kind of multicore ceramic capacitor |
| CN110098055B (en) * | 2019-05-30 | 2024-02-06 | 福建火炬电子科技股份有限公司 | Multicore ceramic capacitor |
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