CN110098055B - Multicore ceramic capacitor - Google Patents
Multicore ceramic capacitor Download PDFInfo
- Publication number
- CN110098055B CN110098055B CN201910463167.4A CN201910463167A CN110098055B CN 110098055 B CN110098055 B CN 110098055B CN 201910463167 A CN201910463167 A CN 201910463167A CN 110098055 B CN110098055 B CN 110098055B
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- Prior art keywords
- polar plate
- pin
- polar
- capacitor
- plate
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 21
- 238000005538 encapsulation Methods 0.000 claims abstract description 3
- 239000003990 capacitor Substances 0.000 claims description 54
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 230000005611 electricity Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The utility model provides a multicore ceramic capacitor, including first pin, the second pin, a plurality of electric capacity chip and encapsulation body, first pin is formed with first polar plate, the second pin is formed with the second polar plate, first polar plate and second polar plate parallel interval arrangement, still include the series connection polar plate, the series connection polar plate sets up between first polar plate and second polar plate, between series connection polar plate and the first polar plate, all be connected with electric capacity chip between series connection polar plate and the second polar plate, electric capacity chip establishes ties into electric capacity chipset through the series connection polar plate earlier, then electric capacity chipset establishes ties into electric capacity chip unit again, finally the electricity is connected between first polar plate and second polar plate, realize the series-parallel connection combination of electric capacity chip, partial electric capacity chip has improved ceramic capacitor's withstand voltage value with partial electric capacity chip series connection.
Description
Technical Field
The invention belongs to the field of electronic elements, and particularly relates to a multi-core ceramic capacitor.
Background
Multilayer chip ceramic capacitors, MLCCs, are one of the most commonly used components in circuits, appliances, and electronic equipment. At present, the method is widely applied to electronic products, communication, computers and other electrical products and electronic equipment. For the number of MLCCs used by a single machine, the using amount of the notebook computers, the digital televisions, the IPAD and the mobile phones is the largest, the using amount of each notebook computer MLCC is about 500-900, the using amount of each digital television is about 600-800, and the using amount of each mobile phone MLCC is 200-700.
Capacitors are being developed toward miniaturization, microminiaturization and large capacity under the promotion of technology. The single MLCC is difficult to make great progress in large capacity, high voltage resistance and low equivalent series resistance by changing the production process and the materials for manufacturing products, and if a plurality of MLCCs are directly connected in series or in parallel in a circuit, the complexity of circuit design is increased, the space occupied by the MLCCs on a circuit board is increased, and the MLCCs are required to be further improved.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a multi-core ceramic capacitor capable of improving the withstand voltage value of the capacitor.
The invention adopts the following technical scheme:
the utility model provides a multicore ceramic capacitor, includes first pin, second pin, a plurality of electric capacity chip and encapsulation body, and first pin is formed with first polar plate, and the second pin is formed with the second polar plate, and first polar plate and second polar plate parallel interval arrangement still include the series polar plate, and the series polar plate setting is between first polar plate and second polar plate, all is connected with electric capacity chip between series polar plate and the first polar plate, between series polar plate and the second polar plate.
Further, the number of the capacitance chips between the serial polar plate and the first polar plate is the same as the number of the capacitance chips between the serial polar plate and the second polar plate and the capacitance chips are oppositely arranged.
Further, the first pin is provided with two first polar plates which are arranged at intervals in parallel, the second pin is provided with two second polar plates which are arranged at intervals in parallel, the first polar plates and the second polar plates are arranged in a staggered manner, and the serial polar plates are arranged between the adjacent first polar plates and the adjacent second polar plates.
Further, the capacitor chips are arranged between the front side and the back side of the serial polar plate and the first polar plate, and between the front side and the back side of the serial polar plate and the second polar plate, and the number of the capacitor chips on the front side is the same as that of the capacitor chips on the back side and the capacitor chips on the back side are oppositely arranged.
Further, the first pin and the second pin are both provided with easy-to-break holes.
Further, the frangible hole is arranged at the middle position of the first pin or the second pin in the transverse direction.
Furthermore, both ends of the serial clamping plates are provided with positioning holes.
Further, the package body is used for packaging the first polar plate, the second polar plate, the serial polar plate and the capacitor chip, and the package body is approximately cuboid.
As can be seen from the above description of the present invention, compared with the prior art, the present invention has the following beneficial effects: the capacitor chips are connected in series through the series electrode plates to form a capacitor chip group, then the capacitor chip groups are connected in parallel to form capacitor chip units, and finally the capacitor chip groups are electrically connected between the first electrode plate and the second electrode plate, so that series-parallel connection combination of the capacitor chips is realized, the voltage withstand value of the ceramic capacitor is improved, the bearing voltage of each capacitor chip is reduced due to the fact that part of the capacitor chips are connected in series with part of the capacitor chips, each capacitor chip unit formed by connecting the capacitor chip groups in parallel is the same voltage and capacitance, a voltage equalizing circuit is realized, the reliability of products is improved, and the capacitor chip is flexibly applied to various fields.
Drawings
FIG. 1 is a partial schematic of the present invention;
FIG. 2 is a partial schematic of the present invention;
FIG. 3 is a partial schematic of the present invention;
FIG. 4 is a partial schematic of the present invention;
FIG. 5 is a partial schematic of the present invention;
FIG. 6 is a partial schematic of the present invention;
in the figure, a 1-first pin, a 2-second pin, a 3-series polar plate, a 4-capacitor chip, a 5-package body, a 6-frangible hole, a 11-first polar plate, a 21-second polar plate and a 31-positioning hole are arranged.
Detailed Description
The invention is further described below by means of specific embodiments.
Referring to fig. 1 to 6, a multi-core ceramic capacitor includes a first lead 1, a second lead 2, a series plate 3, a plurality of capacitor chips 4, and a package 5.
The first pin 1 and the second pin 2 are oppositely arranged, the first pin 1 is provided with a first polar plate 11, the second pin 2 is provided with a second polar plate 21, the first polar plate 11 and the second polar plate 21 are arranged at intervals in parallel, specifically, the first pin 1 is provided with two first polar plates 11 arranged at intervals in parallel, the second polar plate 2 is provided with two second polar plates 21 arranged at intervals in parallel, the first polar plates 11 and the second polar plates 21 are arranged in a staggered manner, further, the width of the first polar plate 11 positioned at the left side of the first pin 1 is smaller than the width of the other first polar plate 11, and the width of the second polar plate 21 positioned at the right side of the second pin 2 is smaller than the width of the other second polar plate 21.
The series polar plate 3 is arranged between the first polar plate 11 and the second polar plate 21, the series polar plate 3 is arranged between the adjacent first polar plate 11 and the second polar plate 21, positioning holes 31 are formed in two ends of the series polar plate 3, when the capacitor chip 4 is welded, the series polar plate 3 is positioned between the first polar plate 11 and the second polar plate 21 through the positioning holes 31, specifically, the first pin 1 and the second pin 2 are provided with the flexible holes 6, the flexible holes 6 are arranged at the transverse middle positions of the first pin 1 or the second pin 2, the rigidity of the first pin 1 or the second pin 2 can be reduced by the flexible holes 6, the subsequent downward bending is facilitated, and further, the manufacturing material of the series polar plate 3 is the same as that of the first pin 1 and the second pin 2.
The capacitor chips 4 are electrically connected between the serial pole plate 3 and the first pole plate 11 and between the serial pole plate 3 and the second pole plate 21, the number of the capacitor chips 4 arranged between the serial pole plate 3 and the first pole plate 11 is the same as and oppositely arranged with the number of the capacitor chips 4 arranged between the serial pole plate 3 and the second pole plate 21, specifically, the capacitor chips 4 are arranged between the serial pole plate 3 and the front side and the back side of the first pole plate 11, the capacitor chips 4 on the front side and the capacitor chips 4 on the back side are the same as and oppositely arranged with the number of the capacitor chips 4 on the back side, further, the front side of the multi-core ceramic capacitor comprises three groups of capacitor chip units connected between the first pole plate 11 and the second pole plate 21 in parallel, each capacitor chip unit comprises four capacitor chip groups, each capacitor chip group comprises two capacitor chip 4 connected in series through the serial pole plate 3, the four capacitor chip groups of each capacitor chip unit share one serial pole plate 3, the capacitor chip 4 is connected in series through the serial pole plate 3 to form the capacitor chip group, the value of the ceramic capacitor is improved, the voltage born by each capacitor chip 4 is reduced, the reliability of the capacitor chip 4 is improved, the capacitor chip unit is connected with the capacitor chip unit in parallel, and the voltage-equalizing circuit is the voltage between the first pole plate and the capacitor unit is the same as the voltage equalizing circuit.
The package body 5 is used for packaging the first polar plate 11, the second polar plate 21, the series polar plate 3 and the capacitor chip 4, the package body 5 is approximately cuboid, and specifically, the package body 5 is epoxy resin.
The capacitor chip 4 in the multi-core ceramic capacitor is connected in series through the series polar plate 3 and then connected in parallel, so that the series-parallel connection combination of the capacitor chips is realized, the withstand voltage value of the ceramic capacitor is improved, the bearing voltage of each capacitor chip 4 is reduced, each capacitor chip unit formed by connecting a plurality of capacitor chips in series in parallel is the same voltage and capacitance, a voltage equalizing circuit is realized, the reliability of products is improved, and the multi-core ceramic capacitor can be flexibly applied to various fields.
The foregoing description is only illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, i.e., the invention is not to be limited to the details of the claims and the description, but rather is to cover all modifications which are within the scope of the invention.
Claims (6)
1. The utility model provides a multicore ceramic capacitor, includes first pin, second pin, a plurality of capacitance chip and encapsulation body, and first pin is formed with first polar plate, and the second pin is formed with the second polar plate, and first polar plate and second polar plate parallel interval arrangement, its characterized in that: the capacitor chip is electrically connected between the serial polar plate and the first polar plate and between the serial polar plate and the second polar plate;
the first pin is provided with two first polar plates which are arranged in parallel at intervals, the second pin is provided with two second polar plates which are arranged in parallel at intervals, the first polar plates and the second polar plates are arranged in a staggered manner, and the serial polar plates are arranged between the adjacent first polar plates and the adjacent second polar plates;
the capacitor chips are arranged between the front side and the back side of the serial polar plate and the first polar plate, and between the front side and the back side of the serial polar plate and the second polar plate, and the number of the capacitor chips on the front side is the same as that of the capacitor chips on the back side and are oppositely arranged.
2. A multi-core ceramic capacitor according to claim 1, wherein: the number of the capacitance chips between the serial polar plate and the first polar plate is the same as that between the serial polar plate and the second polar plate and the capacitance chips are oppositely arranged.
3. A multi-core ceramic capacitor according to claim 1, wherein: the first pin and the second pin are both provided with easy-to-fold holes.
4. A multi-core ceramic capacitor according to claim 3, wherein: the frangible holes are arranged at the transverse middle positions of the first pins or the second pins.
5. A multi-core ceramic capacitor according to claim 1, wherein: and positioning holes are formed at two ends of the series polar plates.
6. A multi-core ceramic capacitor as defined in claim 1, wherein: the packaging body is used for packaging the first polar plate, the second polar plate, the serial polar plate and the capacitor chip, and is cuboid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910463167.4A CN110098055B (en) | 2019-05-30 | 2019-05-30 | Multicore ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910463167.4A CN110098055B (en) | 2019-05-30 | 2019-05-30 | Multicore ceramic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110098055A CN110098055A (en) | 2019-08-06 |
| CN110098055B true CN110098055B (en) | 2024-02-06 |
Family
ID=67449704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910463167.4A Active CN110098055B (en) | 2019-05-30 | 2019-05-30 | Multicore ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110098055B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115295312B (en) * | 2022-08-10 | 2023-05-12 | 福建火炬电子科技股份有限公司 | Preparation process of multi-core group capacitor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205542415U (en) * | 2016-01-26 | 2016-08-31 | 株洲宏达陶电科技有限公司 | Mode of opening a way multicore combination ceramic capacitor |
| CN206312762U (en) * | 2016-12-15 | 2017-07-07 | 东莞市纬迪实业有限公司 | The anti-riot thin film capacitor of high withstand voltage |
| CN208189401U (en) * | 2018-03-30 | 2018-12-04 | 汕头高新区松田实业有限公司 | A kind of series connection ceramic capacitor |
| CN209980998U (en) * | 2019-05-30 | 2020-01-21 | 福建火炬电子科技股份有限公司 | Multi-core ceramic capacitor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101872519B1 (en) * | 2011-04-21 | 2018-06-29 | 삼성전기주식회사 | Multilayer ceramic capacitor having controller equivalent series resisitance |
-
2019
- 2019-05-30 CN CN201910463167.4A patent/CN110098055B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205542415U (en) * | 2016-01-26 | 2016-08-31 | 株洲宏达陶电科技有限公司 | Mode of opening a way multicore combination ceramic capacitor |
| CN206312762U (en) * | 2016-12-15 | 2017-07-07 | 东莞市纬迪实业有限公司 | The anti-riot thin film capacitor of high withstand voltage |
| CN208189401U (en) * | 2018-03-30 | 2018-12-04 | 汕头高新区松田实业有限公司 | A kind of series connection ceramic capacitor |
| CN209980998U (en) * | 2019-05-30 | 2020-01-21 | 福建火炬电子科技股份有限公司 | Multi-core ceramic capacitor |
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| Publication number | Publication date |
|---|---|
| CN110098055A (en) | 2019-08-06 |
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