CN206595282U - Surface mount type LED support structure - Google Patents

Abstract

The utility model discloses the metal substrate (1) of surface mount type LED support structure, including whole；Multiple LED support monomers (3) of determinant arrangement are formed on substrate (1), which constitute multiple row parallel to each other in a first direction and multiple rows parallel to each other in a second direction, include multiple LED support monomers (3) in each column, often row includes multiple LED support monomers (3)；Be each located on it is adjacent two row and positioned at between two LED support monomers (3) in a line by separated through groove (5) but through dowel (6) be connected；Each LED support monomer (3) include the molding glue material (2) that is formed in the molding glue material (2) of a LED support monomer part, each LED support monomer (3) with strip-shaped form it is substantially a ring-shaped be located on metal substrate (1) and formed together with substrate (1) bowl (9) of LED support monomer (3)；It is connected with each other between each LED support monomer (3) on each row by connecting portion (4).The utility model provides the Novel LED support that cost is reduced, performance is improved, production efficiency is improved.

Description

Surface mount type LED support structure

Technical field

The utility model is related to LED field, and in particular to surface mount type LED support, LED finished products and its manufacture method.

Background technology

It is well known that adopting surface mounted LED is widely used in various fields because it possesses small volume, the advantage of rapid heat dissipation. In the prior art, the production of surface mount type LED support is typically multiple adopting surface mounted LED pipes that marshalling is gone out on copper base Pin, plurality of adopting surface mounted LED pin is connected as a single entity, then the injection plastic material formation paster on the basis of every LEDs pin Formula LED support structure, is implanted into luminescent material on the basis of the structure, then, re-injects plastic material and is closed.

Due at present on the market the plastic material of main flow be PCT (poly terephthalic acid 1,4 cyclohexane dimethanol ester) and PPA (polyphtalamide), the support being made due to PCT and PPA types of material is in temperature tolerance, yellow, air-tightness, anti-UV In the performances such as property, corrosion resistance, the encapsulating products of epoxy resin type (EMC) support of comparable size are lagged behind.With 3030 Exemplified by product, PPA supports can only accomplish 0.1~0.2W LED power, and PCT can only typically accomplish 0.8W LED work(at present Rate.By contrast, EMC can accomplish 3W LED power.Therefore, many producers of industry are being attempted using epoxy resin (EMC) Support is molded on punching press copper base, because PCT and PPA plastic rubber materials are thermoplastics type, when support encapsulates finished product backlash muscle blanking Glue material is not easily broken, but epoxy resin (EMC) is thermosets, and performance is very crisp, easily occurs glue material during support floating screed blanking Embrittlement, starved situation.

At this stage, different from punched support it is on the market MAP formulas (matrix form high-density array) EMC supports, its base The mode that plate uses etching power-up plating is completed, and wherein the LED framework on substrate is arranged in MAP arrays, can be achieved highly dense Degree distribution, substrate utilization is greatly promoted.Support makes mainly adds epoxide-resin glue and by mould using lead frame Modeling is made, and the isolated single product of cutting technique can be used in the positive plate rack after encapsulation；Properties of product are intact, N/D.

Two kinds of EMC branch stand manufacturing methods of summary, respectively there is quality, and glue material easily occurs for punched EMC supports, floating screed blanking Embrittlement phenomenon, properties of product cannot be guaranteed.MAP formula EMC supports, although good product performance, but cost pressure is too high, particularly Its substrate uses the former above etch process, the etching lead substrate and the substrate of punched of identical size, price to be the 3 of the latter Have a surplus again.

Therefore at this stage, for the popularization volume production of EMC supports, this area in cost and performance in the urgent need to that can be changed It is kind, to obtain cost reduction, the Novel LED support that performance is improved, production efficiency is improved.

Utility model content

In view of the deficiencies in the prior art, can be by punching press LED branch the utility model proposes a kind of surface mount type LED support structure The dominance structure of both frame and MAP formula LED supports is combined, to obtain new LED support structure.

According to one side of the present utility model, a kind of surface mount type LED support structure, including substrate, molding glue material are contemplated, The substrate material is such as to set multiple LED support monomers inside sheet metal, substrate, and it is arranged for example preferably in bar shaped battle array Column or for determinant, on substrate the profile (such as L-shaped) of LED support monomer can by be machined mode as being die cut, punching Press to realize, molding glue material can be enclosed with LED support monomer.Mold glue material and preferably select EMC epoxy resin, such a technique is Completed using molding molding, the LED support in flakes finally given, machining can be used as cut in finished product LED after packaging Mode can obtain single product, without floating screed processing.Such a surface mount type LED support structure combines Sheet Metal Forming Technology and makes base Advantage on plate and MAP formula cutting support structures, solves at present punched EMC supports floating screed on the market and causes support embrittlement easy Disconnected problem, while also saving cost relative to MAP formula EMC supports.

Molding glue material has been set on every LEDs single support on substrate, LED support bowl shape is formed.Preferably, It is longitudinally connected by glue material filling progress between the longitudinal direction of such as substrate, the bowl and bowl of molding.

Preferably, the substrate material can select Copper base material (electroplating surface), or minute surface aluminium.

It is worth noting that, the profile pattern of substrate can be realized by Sheet Metal Forming Technology.

Enter for one, molding glue material and substrate combine to form support bowl body and can completed by being molded injection, LED support Can closely it be connected in longitudinal direction between monomer and monomer.Horizontal direction can be separated by means of substrate trench, while in longitudinal side It can be also connected on to adjacent wall scroll between every two LEDs support by means of dowel.Final full wafer LED support passes through obtaining after encapsulation Cut to finished product in flakes, then by the cutting groove of the such as left and right ends of substrate, you can the paster LED for obtaining single is produced Product finished product.

More specifically, according to the utility model there is provided a kind of surface mount type LED support structure in flakes, its feature exists In：The surface mount type LED support structure in flakes includes the metal substrate (1) of whole；Wherein, in the metal substrate of described whole (1) multiple LED support monomers (3) of determinant arrangement are formd on, the multiple LED support monomer (3) is constituted first Include on the multiple row being arranged parallel to each other on direction and the multiple rows being arranged parallel to each other in a second direction, each row Multiple LED support monomers (3), and each row includes multiple LED support monomers (3)；Wherein, it is each located on two adjacent row And positioned at between two LED support monomers (3) in a line by accordingly run through groove (5) be spaced apart, but simultaneously via The dowel (6) of relative set is connected；Wherein, each LED support monomer (3) includes being arranged on metal substrate (1) with shape Into the molding glue material (2) of a LED support monomer part, wherein, the molding glue material (2) in each LED support monomer (3) is with bar shaped Form be substantially annularly located on metal substrate (1), so as to form LED support monomer (3) together with metal substrate (1) Bowl (9)；Also, wherein, it is connected with each other between the adjacent LED single support (3) on each row by connecting portion (4).

According to an embodiment of the present utility model, the connecting portion (4), dowel (6) and through groove (5) be by punching Press or be die cut structure formed by the metal substrate (1).

According to another embodiment of the present utility model, the connecting portion (4) between the adjacent rows of LED support monomer (3) exists In line, the straight line is with being arranged on corresponding one of the substrate (1) one or both ends for rough alignment in second direction Or two cutting positioning groove (7) rough alignments.

According to another embodiment of the present utility model, between each two adjacent LED single support (3) on each row Be continuously connected on one direction via connecting portion (4), and per between each two adjacent LED single support (3) in a line Second party upwardly through through groove (5) be spaced apart but remained connected to via dowel (6).

According to another embodiment of the present utility model, the metal substrate (1) is copper, copper alloy, aluminum or aluminum alloy substrate, And the substrate (1) forms multiple LED support monomers (3) that determinant is arranged by punching press or cross cutting.

According to another embodiment of the present utility model, the first direction is the length of the metal substrate (1) of described whole Or width, and the second direction is perpendicular to the first direction.

According to another embodiment of the present utility model, the molding glue material (2) is made up of epoxy resin or silicones, described Molding glue material (2) and substrate (1) combine to form support bowl (9), and the width through groove (5) by being molded molding More than 0.10mm but less than 0.4mm.

According to another embodiment of the present utility model, the surface mount type LED support is carrying out the bonding of LED chip, encapsulation Form surface mount type LED support structure in flakes afterwards, the surface mount type LED support structure in flakes can by substrate either end or The cutting groove at two ends is cut and obtains independent adopting surface mounted LED finished product (11) one by one.

The utility model additionally provides a kind of surface mount type LED support monomer (3), and it passes through to above-mentioned in flakes SMD Corresponding dowel (6) and connecting portion (4) in LED support structure cut processing and obtain.

The utility model additionally provides a kind of adopting surface mounted LED, and it includes above-mentioned surface mount type LED support monomer (3) and encapsulation LED chip in the bowl (9) of the LED support monomer (3).

Advantageous effects of the present utility model further comprise but are not limited to following aspect.For example, the processing procedure of substrate leads to Cross punching press and cost is greatly reduced compared to etching, while more traditional floating screed, blanking process obtain the LED product of single form, Cutting technique realizes that the LED product of single form can avoid the phenomenon of LED support glue material embrittlement to occur very well.For conventional ones For type support, because LED support is respective array on substrate, influenceed by molding die, its LED support spacing, which is set, to be compared Greatly, generally in 0.4mm-0.5mm, so as to cause the output number of the LED support of unit substrate area relatively fewer and cause list Position cost is higher, productivity ratio is low.By contrast, the utility model proposes surface mount type LED support structure, exactly in such as base The close-packed arrays arrangement of support is realized in the longitudinal direction design of plate so that hypotelorism between support to minimum 0.10mm. Thus in equal substrate area, LED support arranging density for prior art with regard to substantially increasing, then into we Face can significantly reduce.

In description below to the drawings and specific embodiments, one or more embodiments of the present utility model will be illustrated Details.Many aspects and advantage of the present utility model will be illustrated partly in the following description, or can be shown by the explanation And be clear to, or can be learned by putting into practice the utility model.

Brief description of the drawings

With reference in the description and constituting the accompanying drawing of a specification part and illustrate embodiment of the present utility model, and with Illustrate to be used for explanation and illustration principle of the present utility model and some specific embodiments together.

Describe what can be implemented for the of the present utility model complete of those of ordinary skill in the art in this specification It is open, including its preferred embodiment, wherein refer to accompanying drawing.These accompanying drawings include：

Fig. 1 is the front view of the substrate proposed according to one embodiment of the present utility model.

Fig. 2 is the front view of the paster LED bracket proposed according to one embodiment of the present utility model.

Fig. 3 is the partial enlarged drawing at the substrate A proposed according to one embodiment of the present utility model.

Fig. 4 is the front view and side view of the paster LED bracket monomer proposed according to one embodiment of the present utility model.

Embodiment

Multiple non-limiting examples of the present utility model are described in detail referring now to accompanying drawing.In this specification The embodiment being related to is intended merely to explain principle of the present utility model and not limit scope of the present utility model.It is of the present utility model Patentable scope is limited only by the claims that follow.

It will also be understood by those skilled in the art that " longitudinal direction ", the definition of " transverse direction " in the utility model are relative Direction, is only used for explaining preferred embodiment with reference to accompanying drawing, without substantial limiting meaning." support " and " LED support " It is used interchangeably, and " substrate " and " metal substrate " is used interchangeably.

Referring to the drawings 1-2 and accompanying drawing 3-4, it is illustrated that some preferred embodiments of the invention, specifically it is presented below.

According to a preferred embodiment, there is provided the substrate 1 and such as mould for surface mount type LED support structure as shown in Figure 1-2 Plastic cement material 2, wherein, the material of substrate 1 is sheet metal such as copper sheet, and its thickness is preferably 0.10mm to 0.30mm, but not limited to this.

Substrate 1 can be arranged as required to certain length and width size.The inside of substrate 1 sets multiple LED support monomers 3, and it is arranged Row are in the array or determinant of bar shaped, and lateral line is preferably along the length direction arrangement of substrate, and longitudinal row is preferably along base The width arrangement of plate, still, those skilled in the art is appreciated that lateral line also can be along the width side of substrate completely To arrangement, longitudinal row can also be arranged along the length direction of substrate.

One of ordinary skill in the art it is also to be understood that the arrangement of row and column may not necessarily be along substrate length, width Direction arrangement is spent, but such as can obliquely be arranged, such as tilts 45 degree of arrangements.

Although also, one of ordinary skill in the art is it is also to be understood that the respective bearing of trend of row and column is preferably greatly Cause vertically, but it is also possible to deviate vertical certain angle, for example, arranged with the angle of non-90 degree, these are both depended on specifically Application scenario, without departing from basic conception of the present utility model and scope.

It is connected between two adjacent LED single supports 3 on longitudinal row by means of connecting portion 4, between adjacent longitudinal row Strip groove 5 is provided with order to spacing, and the company of being additionally provided between every two LEDs single support 3 on adjacent wall scroll Connect muscle 6.

According to a preferred embodiment of the present utility model, as Figure 2-3, the left and right ends of substrate 1 are settable to have cutting fixed Connecting portion 4 between adjacent two LED supports monomer on position groove 7, the center and longitudinal direction of the groove 7 (is preferably it Center 8) rough alignment, or flush in line.

Molding glue material 2 is provided with each LED support monomer 3 on substrate 1, the shape of LED support bowl 9 is formed.Enter one For step, there is glue material 10 to connect between the longitudinal direction of substrate 1, molding bowl 9 and bowl 9.

Preferably, the material of substrate 1 can select Copper base material (optionally electroplating on its surface), or be specular aluminium Material.

Preferably, epoxy resin (EMC), or silicones (SMC) may be selected in molding glue material 2.

It is worth noting that, according to a preferred embodiment of the present utility model, the profile pattern of substrate 1 can be added by machinery Work technique, such as cross cutting or Sheet Metal Forming Technology are realized.

Furthermore, according to a preferred embodiment of the present utility model, substantially the molding glue material 2 of bar shaped is with annularly portion Point or all mode and the substrate 1 of wrapping combine to form the shape of support bowl 9, this, which can pass through, is molded injection and completes.It is preferred that It is that LED support monomer 3 can for example pass through connecting portion with LED support monomer 3 on longitudinal direction (such as the length direction of substrate) 4 close connections, and separated in a lateral direction by substrate trench 5, while corresponding two LEDs on two adjacent longitudinal rows It is connected between support (that is, the two LED supports are generally registered with each other on horizontal direction/substrate width direction) by dowel 6.

Finally, the LED support structure in flakes of full wafer, by multiple LED support monomers 3 carry out LED chip bonding, After encapsulation, LED finished products in flakes are can obtain.According to a preferred embodiment, then by be such as arranged in substrate left and right ends or The cutting groove of either end is cut, such as machine cuts or laser cutting, you can obtain independent single one by one LED product (11).

Advantageous effects of the present utility model include but not limited, for example, the processing procedure of substrate by punching press compared to etching and Cost is greatly reduced, while more traditional floating screed, blanking process obtain the LED product of single form, cutting technique realizes single The LED product of form can avoid the phenomenon of LED support glue material embrittlement to occur very well.For conventional ones type support, due to LED support is respective array on substrate, is influenceed by molding die, and its LED support spacing is set than larger, generally in 0.4mm- 0.5mm, thus cause the output number of the LED support of unit substrate area relatively fewer and cause unit cost it is higher, production Rate is low.By contrast, the utility model proposes surface mount type LED support structure, exactly set in the longitudinal direction of such as substrate The close-packed arrays arrangement of support is realized on meter so that hypotelorism between support to minimum 0.10mm.Thus in equal substrate On area, LED support arranging density then can significantly contract with regard to being substantially increased for prior art in terms of cost Subtract.

Although some features of preferred embodiment, one of ordinary skill in the art's energy only have shown and described herein Enough expect many remodeling and change.It will thus be appreciated that appended claims be intended to covering fall into it is of the present utility model The such remodeling of whole and change in substance design.

Claims (10)

1. a kind of surface mount type LED support structure in flakes, it is characterised in that：

The surface mount type LED support structure in flakes includes the metal substrate (1) of whole；

Wherein, multiple LED support monomers (3) of determinant arrangement are formd on the metal substrate (1) of described whole, it is described many Individual LED support monomer (3) constitutes the multiple row being arranged parallel to each other in a first direction and put down each other in a second direction Include multiple LED support monomers (3) the multiple rows arranged, each row capablely on, and each row includes multiple LED support monomers (3)；

Wherein, be each located on adjacent two row it is upper and positioned at between two LED support monomers (3) in a line by corresponding It is spaced apart, but is connected simultaneously via the dowel (6) of relative set through groove (5)；

Wherein, each LED support monomer (3) includes being arranged on metal substrate (1) forming a LED support monomer part Glue material (2) is molded, wherein, the molding glue material (2) in each LED support monomer (3) is substantially annularly set in the form of bar shaped On metal substrate (1), so as to form the bowl (9) of LED support monomer (3) together with metal substrate (1)；

Also, it is connected with each other between the adjacent LED single support (3) on each row by connecting portion (4).

2. surface mount type LED support structure in flakes according to claim 1, it is characterised in that the connecting portion (4), company Connect muscle (6) and be by punching press or the structure that is formed on the metal substrate (1) of cross cutting separating technology through groove (5).

3. surface mount type LED support structure in flakes according to claim 1, it is characterised in that LED support monomer (3) Rough alignment in line, the straight line and is arranged on the substrate in a second direction for connecting portion (4) between adjacent rows (1) corresponding one or two cutting positioning groove (7) rough alignment of one or both ends.

4. surface mount type LED support structure in flakes according to claim 1, it is characterised in that each two on each row It is continuously connected in a first direction via connecting portion (4) between adjacent LED single support (3), and every two in every a line In a second direction by being spaced apart but being kept via dowel (6) through groove (5) between individual adjacent LED single support (3) It is connected.

5. surface mount type LED support structure in flakes according to claim 1, it is characterised in that the metal substrate (1) is Copper, copper alloy, aluminum or aluminum alloy substrate, and the metal substrate (1) forms what determinant was arranged by punching press or cross cutting Multiple LED support monomers (3).

6. surface mount type LED support structure in flakes according to claim 1, it is characterised in that the first direction is institute The length or width of the metal substrate (1) of whole are stated, and the second direction is perpendicular to the first direction.

7. surface mount type LED support structure in flakes according to claim 1, it is characterised in that the molding glue material (2) by Epoxy resin or silicones are made, and the molding glue material (2) and substrate (1) combine to form support bowl (9) by being molded molding, And the width through groove (5) is more than 0.10mm but less than 0.4mm.

8. surface mount type LED support structure in flakes according to claim 1, it is characterised in that the surface mount type LED support Surface mount type LED support structure in flakes, the surface mount type LED support knot in flakes are formed after LED chip bonding, encapsulation is carried out Structure can be cut by the cutting groove of substrate either end or two ends and obtain independent adopting surface mounted LED one by one into Product.

9. a kind of surface mount type LED support monomer (3), it passes through to the patch in flakes according to any one of the claims Corresponding dowel (6) and connecting portion (4) in sheet-shaped LED supporting structure cut processing and obtain.

10. a kind of adopting surface mounted LED, it includes surface mount type LED support monomer (3) according to claim 9, and is encapsulated in institute State the LED chip in the bowl (9) of LED support monomer (3).