CN219726965U

CN219726965U - Semiconductor plastic package substrate adsorption mold

Info

Publication number: CN219726965U
Application number: CN202222820323.8U
Authority: CN
Inventors: 冯越
Original assignee: Huatian Technology Nanjing Co Ltd
Current assignee: Huatian Technology Nanjing Co Ltd
Priority date: 2022-10-25
Filing date: 2022-10-25
Publication date: 2023-09-22
Anticipated expiration: 2032-10-25

Abstract

The utility model belongs to the technical field of packaging, and particularly relates to an adsorption die for a semiconductor plastic package substrate. The vacuum holes on the lower die are changed into vacuum groove designs, and when in plastic packaging, the non-plastic packaging area of the substrate is attached to the vacuum groove, so that the substrate can be adsorbed by the vacuum groove, and the substrate is attached to the lower die smoothly.

Description

Semiconductor plastic package substrate adsorption mold

Technical Field

The utility model belongs to the technical field of packaging, and particularly relates to an adsorption die for a semiconductor plastic package substrate.

Background

The semiconductor is usually packaged in the production process, the wafer is processed into independent chips, the packaging is usually plastic packaging, namely, products are packaged in plastic packaging materials through a packaging machine, and plastic packaging molds for packaging the semiconductor on the market are various, but have some defects;

if the existing plastic packaging mold for semiconductor packaging is used, flash is easily generated on the back of the substrate in the plastic packaging process, and in the operation process, the substrate deforms due to the adsorption of the substrate to form a bump, so that the product yield is low, and the mold needs to be disassembled again after the flash occurs.

Disclosure of Invention

The utility model provides a semiconductor plastic package substrate adsorption mold, which aims to solve the problem that in the prior art, the substrate deforms to form a bump mask due to insufficient substrate adsorption capacity.

In order to achieve the above purpose, the utility model proposes the following technical scheme:

a semiconductor plastic package substrate adsorption mold comprises a mold upper mold, a mold lower mold and a vacuum groove; the lower die of the die is provided with a plurality of vacuum grooves.

Preferably, the number of vacuum grooves on the lower die of the die is 50.

Preferably, the vacuum tank is rectangular in shape.

Preferably, the length of the vacuum tank is 3mm.

Preferably, the width of the vacuum tank is 0.1mm.

Preferably, two first adsorption lines are arranged on the lower die of the die; the first adsorption line comprises 15 vacuum grooves, and the long sides of the 15 vacuum grooves are positioned on the same horizontal line.

Preferably, the two first adsorption lines are parallel to each other.

Preferably, four second adsorption lines are arranged on the lower die of the die; the second adsorption line comprises 5 vacuum grooves, and the short sides of the 5 vacuum grooves are positioned on the same horizontal line.

Preferably, the four second adsorption lines are parallel to each other.

Preferably, the first adsorption line and the second adsorption line are perpendicular to each other.

The utility model has the advantages that:

the semiconductor plastic package substrate adsorption mold changes the original vacuum holes into vacuum grooves and is uniformly distributed, so that the stress on the substrate is reduced under the condition that the substrate adsorption is not abnormal, and the substrate adsorption is ensured to be smooth.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model. In the drawings:

FIG. 1 is a schematic view of a stitch-bonded insert;

FIG. 2 is a schematic diagram of the effect of the slot-like adsorption tank.

FIG. 3 is a schematic view of a prior art suction insert;

in the figure, 1 is a lower die of a die, 2 is a vacuum groove, 3 is a substrate, and 4 is a vacuum hole.

Detailed Description

The utility model will be described in detail below with reference to the drawings in connection with embodiments. It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other.

The following detailed description is exemplary and is intended to provide further details of the utility model. Unless defined otherwise, all technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the utility model.

Example 1:

referring to fig. 1, the utility model provides an adsorption mold for a semiconductor plastic package substrate, which comprises an upper mold, a lower mold 1 and vacuum grooves 2, wherein a plurality of vacuum grooves 2 are distributed on the lower mold 1, and the vacuum grooves 2 are 3mm long and 0.1mm wide.

Two first adsorption lines each consisting of 15 vacuum grooves 2 are arranged on the lower die 1, the section of each vacuum groove 2 is of an elongated rectangle, and the length-to-width ratio is greater than 20:1; the two first adsorption lines are parallel to each other; the first adsorption line comprises 15 vacuum grooves (2) which are arranged at intervals, and the long sides of the 15 vacuum grooves (2) are positioned on the same horizontal line.

Four second adsorption lines respectively formed by 5 vacuum grooves 2 are arranged on the lower die 1, the four second adsorption lines are parallel to each other, and long sides of the 5 vacuum grooves 2 on the second adsorption lines are positioned on the same straight line.

The first adsorption line and the second adsorption line are mutually perpendicular.

As shown in fig. 2, at the time of plastic packaging, a non-plastic packaging region of the substrate 3 is attached to the vacuum groove 2, so that the substrate 3 can be adsorbed by the vacuum groove 2, and is flatly attached to the lower die 1.

As shown in fig. 3, the old hole suction mold design has the phenomenon that the adsorption of the substrate 3 is uneven due to small adsorption area in actual operation, so that the adsorption of a single product of a strip is uneven, and the risks of bump mask and product flash are caused in the plastic packaging process;

as shown in fig. 1, the design of forming the vacuum holes 4 on the lower die 1 is changed into the design of forming the vacuum grooves 2, so that the area of the adsorption grooves contacting the product is increased, the substrate 3 can be more smoothly adsorbed under the condition of actual heated adsorption, and flash and bump caps of the product caused by deformation due to adsorption problem can be avoided, and the effect is shown in fig. 2.

It will be appreciated by those skilled in the art that the present utility model can be carried out in other embodiments without departing from the spirit or essential characteristics thereof. Accordingly, the above disclosed embodiments are illustrative in all respects, and not exclusive. All changes that come within the scope of the utility model or equivalents thereto are intended to be embraced therein.

Claims

1. The semiconductor plastic package substrate adsorption die is characterized by comprising an upper die and a lower die (1); the lower die (1) is provided with a plurality of vacuum grooves (2) with rectangular sections.

2. The semiconductor plastic package substrate adsorption mold according to claim 1, wherein the number of vacuum grooves (2) on the lower mold (1) is 50.

3. The semiconductor plastic package substrate adsorption mold according to claim 1, wherein the section of the vacuum groove (2) is an elongated rectangle, and the aspect ratio is greater than 20:1.

4. A semiconductor plastic package substrate adsorption mold according to claim 3, wherein the length of the vacuum groove (2) is 3mm.

5. A semiconductor plastic package substrate adsorption mold according to claim 3, wherein the width of the vacuum groove (2) is 0.1mm.

6. The semiconductor plastic package substrate adsorption mold according to claim 1, wherein two first adsorption lines are arranged on the lower mold (1); the first adsorption line comprises 15 vacuum grooves (2) which are arranged at intervals, and the long sides of the 15 vacuum grooves (2) are positioned on the same horizontal line.

7. The die as claimed in claim 6, wherein the two first adsorption lines are parallel to each other.

8. The semiconductor plastic package substrate adsorption mold according to claim 7, wherein four second adsorption lines are arranged on the lower mold (1); the second adsorption line comprises 5 vacuum grooves (2), and long sides of the 5 vacuum grooves (2) are positioned on the same straight line.

9. The die as claimed in claim 8, wherein the four second adsorption lines are parallel to each other.

10. The semiconductor package substrate adsorption mold of claim 9, wherein the first adsorption line and the second adsorption line are perpendicular to each other.