CN202183361U - Spacing correction device for lead frame pins of chip - Google Patents
Spacing correction device for lead frame pins of chip Download PDFInfo
- Publication number
- CN202183361U CN202183361U CN201120320438XU CN201120320438U CN202183361U CN 202183361 U CN202183361 U CN 202183361U CN 201120320438X U CN201120320438X U CN 201120320438XU CN 201120320438 U CN201120320438 U CN 201120320438U CN 202183361 U CN202183361 U CN 202183361U
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- chip
- chip lead
- punching pin
- rectification
- lead
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Abstract
The utility model discloses a spacing correction device for lead frame pins of a chip and provides the correction device with high pertinence, which overcomes the defect that the error is big because the leads of an integrated chip are subjected to unified regulation in the prior art. The spacing correction device comprises a mold for punching a lead frame of an integrated chip and the integrated chip with a plurality of leads which extend along the axial direction; a bearing platform which is used for clamping the integrated chip is arranged at a lower mold of the mold; a stripping plate forming punch which can clamp the integrated chip, root parts of the leads of the chip and the middle parts of the leads of the chip together with the bearing platform is arranged on an upper mold; a correction punch base is arranged in each of the bearing platform and a part corresponding to the middle part of each lead of the chip; a correction punch is arranged in each correction punch base; a male mold head is arranged at the upper end of each correction punch, one side of each male mold head protrudes relative to the other side; and the upper end face of each male mold head can be adjusted to exceed the upper surface of the bearing platform, and to be in extrusion with the inner side or the outer side of a near turning part of the middle part of a lead of the chip. The spacing correction device corrects the deviation of the leads of the chip one by one, so that the pertinence is high, the high precision can be achieved, and the pass rate and the productivity are increased.
Description
Technical field
The utility model belongs to integrated chip encapsulation technology field, is specifically related to a kind of chip lead framework pin spacing apparatus for correcting.
Background technology
Lead frame is as the chip carrier of integrated circuit; Be a kind of being electrically connected by means of bonding gold wire realization chip internal circuit exit and outer lead; To form the key structure spare of electric loop, it has played the function served as bridge that chip internal circuit exit is connected with outer lead; In the actual production, in order to produce in enormous quantities at a high speed, lead frame is stamped to form by specific arrangement mode on metal tape usually continuously; Yet punching course also can produce the position or the form variations of some lead-in wires because of the combined influence of blanking pressure unavoidably except there is dimensional discrepancy in meeting, therefore in the technical process of integrated chip encapsulation; Need be to the deviation of integrated chip lead frame; The deviation that comprises lead spacing is corrected, and just can encapsulate then, if the spacing between the chip lead is nonconforming; This for example can cause and have big gap between device wire tip and its pad on the PCB; And causing the defective of the skew even the disconnection of welding point, the product of encapsulation will become substandard products even scrap, and inspection or repair those substandard products; Its expense than inspection under the component-level situation and the expensive one magnitude of reparation deviation, is a crucial step so the deviation of lead frame is corrected often.But; Present most of integrated chip lead frame manufacturing enterprise is to adopt single unitary device at the adjusting device that adopts aspect chip lead space deviations is adjusted basically; This all-in-one-piece adjusting device operation is dumb, specific aim is poor, have bigger limitation in the use, because the chip lead that adopts punching process to process causes that the defective of uncertain skew takes place the chip lead spacing because material stress release and elastic return exist discreteness after punching out; Especially thin space device; The bending of its lead-in wire or the usual especially thing of the uncertainty of deflection, all-in-one-piece adjusting device even might the lead-in wire of this finishing be failed finishing is on the contrary the whole inclined to one side mistake of the lead-in wire that should not repair; This adjusting device is regulated difficulty greatly, and product percent of pass is low, production capacity does not increase.In the integrated package assembling process, also there is similar problem in the chip lead shaping; Chinese patent notification number CN101102663A for example; Name is called the patent of invention of " double array direct insertion integrated lead-in wire integer type device "; Disclose a kind of integrated package lead-in wire apparatus for shaping, comprise base, support, cylinder roll extrusion bearing.Support is installed on the base, and the spatial form that its shape and integrated package two row lead-in wires and integrated package surround is corresponding.The roll extrusion bearing has two, is installed in the support both sides respectively, and the gap is left with the cylinder of two roll extrusion bearings respectively in the support both sides, and gap width equals the integrated package lead thicknesses at least.This device to the chip lead shaping also is to adopt the integral type adjustment mode of trying to attend to big and small matters all at once; Lack specific aim; Particularly to the deviation of terminal pin spacing, this integral type apparatus for correcting can't exist the chip lead framework of discreteness that correcting accurately is provided to space deviations at all.
Summary of the invention
The utility model technical issues that need to address are, no matter overcome the big defective of the integrated chip lead-in wire shaping unified regulation of the individual character error of prior art, provide a kind of and treat respectively, with strong points, by the root adjustment chip lead framework pin spacing apparatus for correcting of whole shaping then.
The purpose of the utility model is achieved through following technical proposals: a kind of chip lead framework pin spacing apparatus for correcting; Comprise the mould of punching out integrated chip lead frame and have the radially integrated chip of some lead-in wires of expansion; Be provided with the plummer of clamping integrated chip at the counterdie of mould; Be provided with and clamp the stripper plate moulding punching pin that comprises integrated chip, chip lead root and chip lead middle part with plummer at patrix; Be respectively equipped with rectification punching pin seat with each corresponding position, chip lead middle part in the plummer; Correct in the punching pin seat and be furnished with the rectification punching pin; Have in the right and left of the upper end of rectification punching pin to be provided with the punch head outstanding with respect to another side on one side, the upper surface of said punch head can tune to the upper surface that exceeds plummer, and pushes mutually with the inboard or the outside near the position of transferring at chip lead middle part.
Generally speaking; The middle part of chip lead often is designed with circular-arc turning point; The two ends of circular-arc turning point are all straightway, comprise that it is free end that technological design has an end, said punch head then roof pressure on the left side or the right side of an end of this turning point circular arc; One end of said circular arc is near said free end; Its physical dimension of chip lead one side and the internal stress that are squeezed all change, and especially length increases, the free end that impels chip lead in the same plane of chip lead to the right or deflection to the left; The big I of the argument of deflection exceeds the length of the upper surface of plummer to be confirmed to confirm the extruding degree of depth through adjustment punch head, that is to say that the deviation of chip lead framework pin spacing can be able to correct exactly.
As preferably, the upper end of said rectification punching pin along both sides, the front and back structure of chip lead direction for being symmetrical set.From said plummer, unload and correct punching pin and its half turn; Exchange before and after making into symmetrically arranged rectification punching pin; Make simultaneously and correct swapping left and right of punching pin; Like this then rectification punching pin punch head that headed on chip lead left side originally just heads on the right side of chip lead instead, the rectification punching pin punch head that headed on the chip lead right side originally just heads on the left side of chip lead instead, so can make the free end of chip lead change yawing moment.
As preferably, the upper surface of said punch head exceeds the plummer upper surface, and the maximum length that exceeds is less than chip lead thickness and half the greater than chip lead thickness; The oversize no practical significance of the maximum length that exceeds, the too short rectification purpose that then do not reach.
As preferably, said rectification punching pin along the length of chip lead Width width more than or equal to chip lead; It is that the thickness of punch head is set is required that the length direction of correcting punching pin has half, is related to the width that push chip lead, directly influences squeezing effect and is extruded the intensity of chip lead afterwards.
As preferably, the end face of said rectification punching pin is a rectangular configuration; Rectangular configuration is very convenient for claiming structure, make to turn the right sides of correcting punching pin, also makes processing correct punching pin and correct punching pin seat ratio to be easier to.
As preferably, the end face of said punch head is the part of spherical structure, and the centre of sphere of spherical structure is positioned at the outside of punch side or side.The punch head of spherical structure is softer for the chip lead impression that is extruded; Avoid the surface of chip lead to sustain damage; Particularly help the material that is extruded of chip lead squeezed along its length and push away, more help free-ended deflection, make rectification sensitiveer.
As preferably, be provided with the height adjuster of adjustment punching pin below the said rectification punching pin; Because the deflection of each root chip lead is different, height adjuster is set motor-driven reply corrects the mutually different adjustment needs of punching pin.
As preferably; The height adjuster of said rectification punching pin is the screw rod adjusting device, and the screw rod adjusting device comprises the seat board that is fixedly connected on the counterdie bottom surface, and seat board is provided with screw; Be furnished with the adjustment screw rod in the screw, the upper end of adjustment screw rod is that spherical joint is connected with the lower end of correcting punching pin; Rotate the adjustment screw rod and can be used to adjust the degree of depth of roof pressure chip lead correcting up jack-up or down return of punching pin; The head of adjustment screw rod is interior hexagonal structure, makes adjustment easy to operate; The chip lead that can adapt to any batch with the screw rod adjusting device that can adjust is at random corrected processing.
As preferably, said chip lead framework pin spacing apparatus for correcting is provided with one group and comprises the mutually different rectification punching pin of some length; Get the integrated chip sample earlier and the deflection of chip lead is measured; Select the rectification punching pin of suitable length on mould, to install and fix according to the deflection that records again; Selecting the fixing rectification punching pin of a group length installs and fixes and makes apparatus for correcting be able to simplify to handle; This fixing rectification punching pin scheme can make structure obtain simplifying, and has blanket meaning as foregoing for belonging to same batch part with sample.
The beneficial effect of the utility model is:
1, the deviation of chip lead is corrected one by one, the rectification of chip lead pin spacing is with strong points;
2, can adjust and reach high precision to the rectification degree of distortion;
3, avoid the chip lead root is produced active force;
4, improve qualification rate, boost productivity.
Description of drawings
Fig. 1 is the structural representation of a kind of embodiment of the utility model;
Fig. 2 is the plummer upper bottom surface structural representation of the utility model embodiment;
Fig. 3 is the B-B generalized section of Fig. 2;
Fig. 4 is an adjustment punching pin schematic perspective view;
Fig. 5 is adjustment punching pin two schematic perspective views;
Fig. 6 is a chip lead deflection sketch map, and wherein D1 representes chip lead deflection left, and D2 representes chip lead deflection to the right, and dotted line is represented the tram of chip lead;
Fig. 7 compresses sketch map for punch head and the chip lead of correcting punching pin, and wherein the left side of punch head C1 and chip lead D1 compresses, and the right side of punch head C2 and chip lead D2 compresses;
Fig. 8 is the impression sketch map after the punch head of rectification punching pin compresses chip lead, and wherein the impression of chip lead D1 is in the left side, and the impression of chip lead D2 is on the right side;
Fig. 9 is the structural representation of the another kind of embodiment of the utility model.
Among the figure, integrated chip 1; Chip lead 11; Turning point 111; Straightway 112; Plummer 2; Correct punching pin seat 21; Upper bolster 3; Stripper plate moulding punching pin 31; Correct punching pin 4; Punch head 41; Ball-and-socket 42; Correct punching pin 2 43; Groove 44; Screw rod adjusting device 5; Seat board 51; Screw 52; Adjustment screw rod 53; Bulb 531; Die shoe 55.
Embodiment
Below in conjunction with accompanying drawing and specific embodiments the utility model is further described.
Embodiment 1: show like Fig. 1～Fig. 5; A kind of chip lead framework pin spacing apparatus for correcting; Comprise the mould of punching out integrated chip lead frame and have the radially integrated chip 1 of some lead-in wires of expansion; Be provided with the plummer 2 of clamping integrated chip at the counterdie of mould; Below the upper bolster 3 of patrix, be provided with and clamp the stripper plate moulding punching pin 31 that comprises integrated chip, chip lead root and chip lead middle part with plummer 2; Being respectively equipped with rectification punching pin seat 21, correct and be furnished with the punching pin 4 of rectification in the punching pin seat 21 in the plummer 2, be provided with the punch head of giving prominence to respect to another side 41 Yi Bian have in the right and left of the upper end of rectification punching pin 4 with each corresponding position, chip lead 11 middle parts; The upper surface of said punch head 41 can tune to the upper surface that exceeds plummer 2, and pushes mutually with the inboard or the outside near the turnover position at chip lead 11 middle parts.
Specifically; The middle part of chip lead 11 often is designed with circular-arc turning point 111; The two ends of circular-arc turning point are all straightway 112; Comprise that it is free end that production engineering specifications has an end, 41 roof pressures of said punch head are on the left side or the right side of an end of these turning point 111 circular arcs, and an end of said circular arc is near the lead-in wire free end; Its physical dimension of chip lead one side and the internal stress that are squeezed all change; To the right or left side deflection, the big I of the argument of deflection exceeds the length of the upper surface of plummer 2 to be confirmed to confirm the extruding degree of depth through adjustment punch head 41 free end that impels chip lead, that is to say that the deviation of chip lead framework pin spacing can be able to correct exactly in the same plane of lead-in wire.
Both sides, front and back, the upper end structure of correcting punching pin 4 is for being symmetrical set; From said plummer 2, unload and correct punching pin 4 and its half turn; Making into symmetrically arranged rectification punching pin 4 front and back exchanges; Make simultaneously and correct swapping left and right of punching pin 4, like this then rectification punching pin punch head 41 that headed on chip lead 11 left sides originally just heads on the right side of chip lead instead, so can make the free end deflection round about of chip lead 11.
The upper surface of punch head 41 exceeds plummer 2 upper surfaces, and the maximum length that exceeds is less than chip lead thickness and half the greater than chip lead thickness, and typical sizes is 1mm for example; The oversize no practical significance of the maximum length that exceeds, the too short rectification purpose that then do not reach.
Each bar seamed edge of punch head 41 all needs cavetto, prevents damage is caused on the chip lead surface.
Correct punching pin 4 along the length of chip lead Width width more than or equal to chip lead 11; It is that the thickness of punch head 41 is set is required that the length direction of correcting punching pin 4 has half, is related to the effective width of push chip lead 11, and it directly influences squeezing effect and is extruded the intensity of chip lead 11 afterwards.
The end face of rectification punching pin 4 is a rectangular configuration, and rectangular configuration is a symmetrical structure, and this feasible right sides of correcting punching pin is turned and seemed easily, also makes processing rectification punching pin 4 and rectification punching pin seat 21 than being easier to.
Be provided with the height adjuster of correcting punching pin below the rectification punching pin 4; Be specially screw rod adjusting device 5; Screw rod adjusting device 5 comprises the seat board 51 that is fixedly connected on the counterdie bottom surface, and seat board 51 is provided with the screw 52 by the sideline distribution of rhombus, and there are 5 screws on the every limit of rhombus; Totally 20 screws; Be furnished with adjustment screw rod 53 in the screw, there is a bulb 531 upper end of adjustment screw rod 53, and this bulb 531 cooperates with the ball-and-socket 42 of correcting punching pin 4 lower ends; Ball-and-socket 42 cuts a groove 44 vertically makes ball-and-socket have elasticity, and the bulb 531 of being convenient to adjust screw rod 53 is filled in ball-and-socket and cooperated rotationally with ball-and-socket; Rotate adjustment screw rod 53 and can be used to adjust the degree of depth of roof pressure chip lead correcting up jack-up or down return of punching pin 4; The head of adjustment screw rod 53 is interior hexagonal structure; This screw rod adjusting device that can adjust at random can adapt to any batch chip lead adjustment processing.
Fig. 6 is a chip lead deflection sketch map, and wherein D1 representes chip lead deflection left, and D2 representes chip lead deflection to the right.
Fig. 7 compresses sketch map for punch head and the chip lead of correcting punching pin, and wherein the left side of punch head C1 and chip lead D1 compresses, and the right side of punch head C2 and chip lead D2 compresses.
Fig. 8 is the impression sketch map after the punch head of rectification punching pin compresses chip lead, and wherein the impression of chip lead D1 is in the left side, and the impression of chip lead D2 is on the right side;
Embodiment 2: the chip lead framework pin spacing apparatus for correcting of the rectification punching pin of application of fixed as shown in Figure 9; It is that screw rod adjusting device with embodiment 1 removes; Establish a die shoe 55 again; Dispose three groups in addition and respectively comprise the mutually different rectification punching pin 2 43 of a collection of length, the lower end of correcting punching pin 2 43 need not process ball-and-socket, and the total height that the length of rectification punching pin 2 43 equals plummer 2 adds adjustment amount; Adjustment amount is pressed at interval value successively of 0.1m from 0mm to 2, for example get 0.1m, 0.2m, 0.3m ...During application; Get 3 integrated chip samples earlier and the deflection of chip lead measured and register the numerical value that records; Select the rectification punching pin two of suitable length on mould, to install and fix and lock according to the deflection mean value that records again; Then with integrated chip 1 be contained in plummer 2 above, push down each chip lead 11 with stripper plate moulding punching pin 31; Next step just can carry out the punching press shaping.The scheme of this rectification punching pin two can make structure obtain simplifying, and has blanket meaning equally for belonging to same batch integrated chip 1 with sample.
Embodiment 3: as the chip lead framework pin spacing apparatus for correcting of embodiment 2 or embodiment 3; Its end face of correcting the punch head 41 of punching pin is the part of spherical structure; The centre of sphere of spherical structure is positioned at the outside of punch side or side; The punch head of spherical structure is softer for the chip lead impression that is extruded, and can avoid the surface of chip lead to sustain damage, and particularly helps the material that is extruded of chip lead squeezed along its length pushing away; More help free-ended deflection, make rectification sensitiveer.
What need special proposition is; The same batch of chip lead that punch process obtains, because material, mould structure and processing technology are identical, its deformation place, deformation extent and distortion situation often have roughly the same or akin characteristic; Therefore be directed against the adjustment that sample carried out to the rectification punching pin; Also often have blanket meaning for belonging to same batch part, thereby can make operation obtain simplifying, enhance productivity with sample.
Claims (9)
1. chip lead framework pin spacing apparatus for correcting; Comprise the mould of punching out integrated chip lead frame and have the radially integrated chip of some lead-in wires of expansion; Be provided with the plummer of clamping integrated chip at the counterdie of mould; Be provided with and clamp the stripper plate moulding punching pin that comprises integrated chip, chip lead root and chip lead middle part with plummer at patrix, it is characterized in that, be respectively equipped with rectification punching pin seat with each corresponding position, chip lead middle part in the plummer; Correct in the punching pin seat and be furnished with the rectification punching pin; Have in the right and left of the upper end of rectification punching pin to be provided with the punch head outstanding with respect to another side on one side, the upper surface of said punch head can tune to the upper surface that exceeds plummer, and pushes mutually with the inboard or the outside near the position of transferring at chip lead middle part.
2. chip lead framework pin spacing apparatus for correcting according to claim 1 is characterized in that, the upper end of said rectification punching pin along both sides, the front and back structure of chip lead direction for being symmetrical set.
3. chip lead framework pin spacing apparatus for correcting according to claim 1 and 2 is characterized in that the upper surface of said punch head exceeds the plummer upper surface, and the maximum length that exceeds is less than chip lead thickness and half the greater than chip lead thickness.
4. chip lead framework pin spacing apparatus for correcting according to claim 1 and 2 is characterized in that, said rectification punching pin along the length of chip lead Width width more than or equal to chip lead.
5. chip lead framework pin spacing apparatus for correcting according to claim 4 is characterized in that the end face of said rectification punching pin is a rectangular configuration.
6. chip lead framework pin spacing apparatus for correcting according to claim 1 and 2 is characterized in that the end face of said punch head is the part of spherical structure, and the centre of sphere of spherical structure is positioned at the outside of punch side or side.
7. chip lead framework pin spacing apparatus for correcting according to claim 1 and 2 is characterized in that, is provided with the height adjuster of adjustment punching pin below the said rectification punching pin.
8. chip lead framework pin spacing apparatus for correcting according to claim 7; It is characterized in that; The height adjuster of said rectification punching pin is the screw rod adjusting device, and the screw rod adjusting device comprises the seat board that is fixedly connected on the counterdie bottom surface, and seat board is provided with screw; Be furnished with the adjustment screw rod in the screw, the upper end of adjustment screw rod is that spherical joint is connected with the lower end of correcting punching pin.
9. chip lead framework pin spacing apparatus for correcting according to claim 7 is characterized in that, said chip lead framework pin spacing apparatus for correcting is provided with one group and comprises the mutually different rectification punching pin of some length.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120320438XU CN202183361U (en) | 2011-08-30 | 2011-08-30 | Spacing correction device for lead frame pins of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120320438XU CN202183361U (en) | 2011-08-30 | 2011-08-30 | Spacing correction device for lead frame pins of chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202183361U true CN202183361U (en) | 2012-04-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120320438XU Expired - Fee Related CN202183361U (en) | 2011-08-30 | 2011-08-30 | Spacing correction device for lead frame pins of chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202183361U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102744872A (en) * | 2012-07-06 | 2012-10-24 | 陈长贵 | Calibrating and bending device before encapsulation |
| CN111824746A (en) * | 2019-04-16 | 2020-10-27 | 松下知识产权经营株式会社 | Component supply device, component mounting device, and component supply method |
| CN117038475A (en) * | 2023-10-09 | 2023-11-10 | 四川明泰微电子有限公司 | Chip orthopedic device |
-
2011
- 2011-08-30 CN CN201120320438XU patent/CN202183361U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102744872A (en) * | 2012-07-06 | 2012-10-24 | 陈长贵 | Calibrating and bending device before encapsulation |
| CN111824746A (en) * | 2019-04-16 | 2020-10-27 | 松下知识产权经营株式会社 | Component supply device, component mounting device, and component supply method |
| CN111824746B (en) * | 2019-04-16 | 2023-03-31 | 松下知识产权经营株式会社 | Component supply device, component mounting device, and component supply method |
| CN117038475A (en) * | 2023-10-09 | 2023-11-10 | 四川明泰微电子有限公司 | Chip orthopedic device |
| CN117038475B (en) * | 2023-10-09 | 2024-01-23 | 四川明泰微电子有限公司 | Chip orthopedic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120404 Termination date: 20140830 |
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| EXPY | Termination of patent right or utility model |