CN216487995U - Deformation correction jig for lead frame - Google Patents
Deformation correction jig for lead frame Download PDFInfo
- Publication number
- CN216487995U CN216487995U CN202123319373.XU CN202123319373U CN216487995U CN 216487995 U CN216487995 U CN 216487995U CN 202123319373 U CN202123319373 U CN 202123319373U CN 216487995 U CN216487995 U CN 216487995U
- Authority
- CN
- China
- Prior art keywords
- base
- guide wheel
- connecting piece
- sliding
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000012937 correction Methods 0.000 title claims abstract description 40
- 230000002093 peripheral effect Effects 0.000 claims abstract description 5
- 230000000712 assembly Effects 0.000 claims description 15
- 238000000429 assembly Methods 0.000 claims description 15
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202123319373.XU CN216487995U (en) | 2021-12-24 | 2021-12-24 | Deformation correction jig for lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202123319373.XU CN216487995U (en) | 2021-12-24 | 2021-12-24 | Deformation correction jig for lead frame |
Publications (1)
Publication Number | Publication Date |
---|---|
CN216487995U true CN216487995U (en) | 2022-05-10 |
Family
ID=81428073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202123319373.XU Active CN216487995U (en) | 2021-12-24 | 2021-12-24 | Deformation correction jig for lead frame |
Country Status (1)
Country | Link |
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CN (1) | CN216487995U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117684234A (en) * | 2023-11-21 | 2024-03-12 | 珠海全润科技有限公司 | Positioning adjusting device and positioning adjusting method for electroplating mold |
-
2021
- 2021-12-24 CN CN202123319373.XU patent/CN216487995U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117684234A (en) * | 2023-11-21 | 2024-03-12 | 珠海全润科技有限公司 | Positioning adjusting device and positioning adjusting method for electroplating mold |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Hengqin Financial Investment International Finance Leasing Co.,Ltd. Assignor: Zhuhai Quanrun Technology Co.,Ltd. Contract record no.: X2023980044678 Denomination of utility model: A deformation correction fixture for lead frame Granted publication date: 20220510 License type: Exclusive License Record date: 20231026 |
|
EE01 | Entry into force of recordation of patent licensing contract | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A deformation correction fixture for lead frame Effective date of registration: 20231030 Granted publication date: 20220510 Pledgee: Hengqin Financial Investment International Finance Leasing Co.,Ltd. Pledgor: Zhuhai Quanrun Technology Co.,Ltd. Registration number: Y2023980063342 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |