CN201927584U - Coplanarity adjusting device for chip leads - Google Patents
Coplanarity adjusting device for chip leads Download PDFInfo
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- CN201927584U CN201927584U CN201120028031XU CN201120028031U CN201927584U CN 201927584 U CN201927584 U CN 201927584U CN 201120028031X U CN201120028031X U CN 201120028031XU CN 201120028031 U CN201120028031 U CN 201120028031U CN 201927584 U CN201927584 U CN 201927584U
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- chip
- adjusting device
- chip lead
- punching pin
- coplanarity
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Abstract
The utility model discloses a coplanarity adjusting device for chip leads, overcomes the shortcoming of a conventional integrated chip lead, such as great errors in shaping, and provides a chip lead adjusting device which can perform whole-shaping through adjusting one lead after another. The coplanarity adjusting device comprises a die for punching an integrated chip lead framework and an integrated chip with a plurality of leads expanding in the radial direction, wherein a lower die of the die is provided with a bearing table for clamping the integrated chip; an upper die is provided with a striper plate forming punch for clamping the integrated chip and both the roots and the tails of chip leads together with the bearing table; a settling groove is formed on the lower end surface of the striper plate forming punch at the part corresponding to the chip leads; adjustment punches corresponding to the chip leads are arranged oppositely at the side edge of the settling groove in the bearing table, the upper ends of the adjustment punches protrude out of the upside of the bearing table through adjustment and are pressed against the middle of the chip leads clamped on the bearing table; and the middle of the chip leads is positioned in the side edge of the settling groove. The coplanarity adjusting device provided by the utility model can be used for adjusting the chip leads one by one to achieve whole-shaping, and the coplanarity of the chip leads is high.
Description
Technical field
The utility model belongs to the technical field of integrated chip encapsulation, is specifically related to a kind of chip lead coplanarity adjusting device.
Background technology
In the technical process of integrated chip encapsulation, need carry out the coplanarity adjustment to the integrated chip lead-in wire, just can encapsulate then, if height is uneven between the chip lead, coplanarity is nonconforming, the product of encapsulation will become substandard products even scrap.At present, most of integrated chip lead frame manufacturing enterprise is single unitary device solving the coplanarity adjusting device that adopts aspect the chip lead coplanarity substantially, this all-in-one-piece adjusting device operation is dumb, maintenance difficulty is big, process length consuming time, cost is higher relatively, there is certain limitation in the use, particularly because the chip lead that adopts punching process to make, after punching out,, material stress release and elastic return cause that uneven defective takes place the chip lead coplanarity because existing discreteness, it is big to regulate difficulty, and product percent of pass is low, production capacity does not increase.In the integrated package assembling process, also there is similar problem in the chip lead shaping, Chinese patent notification number CN101102663A for example, name is called the patent of invention of " double array direct insertion integrated lead-in wire integer type device ", disclose a kind of integrated package lead-in wire apparatus for shaping, comprise base, support, cylinder roll extrusion bearing.Support is installed on the base, the spatial form correspondence that its shape and integrated package two row lead-in wires and integrated package surround.The roll extrusion bearing has two, is installed in the support both sides respectively, and the gap is left with the cylinder of two roll extrusion bearings respectively in the support both sides, and gap width equals the integrated package lead thicknesses at least.This device to the chip lead shaping also is to adopt the integral type of trying to attend to big and small matters all at once to adjust mode, the same defective that has lead-in wire uneven coplanarity difference of resilience after shaping.
Summary of the invention
The utility model technical issues that need to address are, no matter overcome the big defective of the integrated chip lead-in wire shaping unified regulation of the individual character error of prior art, provide a kind of and treat respectively by the root adjustment chip lead coplanarity adjusting device of whole shaping then.
The purpose of this utility model is achieved by following technical proposals: a kind of chip lead coplanarity adjusting device, comprise the mould of punching out integrated chip lead frame and have the radially integrated chip of some lead-in wires of expansion, be provided with the plummer of clamping integrated chip at the counterdie of mould, be provided with the stripper plate moulding punching pin that can clamp integrated chip, chip lead root and chip lead afterbody with plummer at patrix, described stripper plate moulding punching pin lower surface and the corresponding position of chip lead are provided with deep gouge; Be provided with in the relative position of described deep gouge side in the plummer and adjustment punching pin that each chip lead is corresponding respectively, the upper surface that protrudes in plummer all can be adjusted in the upper end of every adjustment punching pin, and be clamped in plummer on chip lead in the middle part of compress mutually; The middle part of described chip lead all is in the side of deep gouge.In order to use conveniently, the pin of overwhelming majority integrated chip module generally all is to arrange by limit, the left and right sides to be provided with according to standard code, so the trend of chip lead is at first radially expanding radially from the nearly center of chip, transfer when reaching certain-length again and continue to extend to the and arranged on left and right sides limit of chip module encapsulation respectively to the left and right sides, the position of the whole breakover points of chip lead all is in the four edges line inboard of a rhombus just; Because chip lead is subjected to the effect of blanking pressure in stamping-out processing, tend to produce the phenomenon that tail end upwarps, so clamp chip and root and afterbody with stripper plate moulding punching pin and plummer, the top of adjusting punching pin carefully is adjusted to the downside of roof pressure in the chip lead turning point, after patrix drives the moulding punching pin down matched moulds is pressed on the upper surface of chip lead, because adjust punching pin reverse roof pressure from the bottom up, the chip lead that makes original tail end upwarp distortion is corrected distortion inaccuracy.Chip lead constitutes for the sheet conducting material, the turning point that is in the lead-in wire medium position is the easiest in stamped process generation buckling deformation, have a strong impact on the integral planar of chip lead, but just because of the turning point of chip lead is the key position of distortion, so turning point shaping the most effectively shaping measure just at chip lead, adjust the sideline inner side arrangement setting that punching pin is also following rhombus, this has also been avoided the weakest chip lead root of bonding strength is produced active force simultaneously, avoids defective chip lead-in wire root.
As preferably, the shape that the deep gouge side in the described plummer assumes diamond in shape; The shape that the deep gouge side assumes diamond in shape is corresponding with the four edges line inboard that the whole breakover points of chip lead are in rhombus, also is provided with corresponding with the adjustment punching pin along the inboard arrangement in the sideline of rhombus simultaneously.
As preferably, the degree of depth of described deep gouge is 2～5mm.Because the maximum deformation quantity of chip lead is generally about 2mm, the degree of depth of getting deep gouge is greater than the chip lead maximum deformation quantity, be to consider that the later rubber-like chip lead of shaping has a certain amount of resilience, so when the overhang of adjusting punching pin is adjusted, need leave some surpluses, to play so-called hypercorrect effect, therefore must make the degree of depth of described deep gouge also leave certain surplus.What need special proposition is, the same batch of chip lead that punch process obtains, because material, mould structure and technology are identical, its deformation place, deformation extent and distortion situation often have roughly the same or akin feature, therefore at sample carried out to adjusting the adjustment of punching pin, also often have blanket meaning for part, thereby can make operation obtain simplifying, enhance productivity with same batch of sample.
As preferably, the upper surface of described adjustment punching pin is the hemicycle curved surface of column; The upper surface of adjusting punching pin is the roof pressure face, and the roof pressure face is made as columniform curved surface, eliminates any corner angle, can avoid making the surface of chip lead to sustain damage.
As preferably, be provided with the height adjuster of adjusting punching pin below the described adjustment punching pin; Because the deflection of each root chip lead is different, height adjuster is set motor-driven reply adjusts the mutually different adjustment needs of punching pin.
As preferably, the height adjuster of described adjustment punching pin is the screw rod adjusting device, and the screw rod adjusting device comprises the seat board that is fixedly connected on the counterdie bottom surface, and seat board is provided with screw, be furnished with the adjustment screw rod in the screw, the upper end of adjusting screw rod is that spherical joint is connected with the lower end of adjusting punching pin; Rotate to adjust screw rod and can be used to adjust the amplitude of roof pressure chip lead adjusting up jack-up or down return of punching pin; The head of adjusting screw rod is interior hexagonal structure, makes adjustment easy to operate; The chip lead adjustment that can adapt to any batch with the screw rod adjusting device that can adjust is at random processed.
As preferably, described coplanarity adjusting device is provided with one group and comprises the mutually different adjustment punching pin of some length; Get the integrated chip sample earlier and the deflection of chip lead is measured, select the adjustment punching pin of suitable length on mould, to install and fix according to the deflection that records again, selecting the fixing adjustment punching pin of a group length installs and fixes and makes adjusting device be simplified processing, this fixing adjustment punching pin scheme can make structure obtain simplifying, as previously described have blanket meaning for belonging to same batch part with sample.
The beneficial effects of the utility model are:
1 pair of chip lead is adjusted one by one, whole then shaping, chip lead coplanarity height;
2, the adjustment to distortion can reach high precision;
3, avoid the chip lead root is produced active force;
4, boost productivity.
Description of drawings
Fig. 1 is the structural representation of a kind of embodiment of the utility model;
Fig. 2 is the stripper plate moulding punching pin bottom surface structural representation of the utility model embodiment;
Fig. 3 is the A-A generalized section of Fig. 2;
Fig. 4 is the plummer bottom surface structural representation of the utility model embodiment;
Fig. 5 is the B-B generalized section of Fig. 4;
Fig. 6 is a kind of integrated chip planar structure schematic diagram;
Fig. 7 adjusts the punching pin schematic perspective view;
Fig. 8 is stripper plate moulding punching pin and the corresponding schematic diagram in adjustment punching pin position;
Fig. 9 is the structural representation of another kind of embodiment;
Figure 10 adjusts punching pin two schematic perspective views.
Among the figure, integrated chip 1; Chip lead 11; Plummer 2; Adjust punching pin installing hole 21; Upper bolster 3; Stripper plate moulding punching pin 31; Deep gouge 32; Adjust punching pin 4; Cylinder curved surface 41; Ball-and-socket 42; Adjust punching pin 2 43; Groove 44; Screw rod adjusting device 5; Seat board 51; Screw 52; Adjust screw rod 53; Bulb 531; Die shoe 55.
Embodiment
Below in conjunction with accompanying drawing and specific embodiments the utility model is further described.
Embodiment 1: as Fig. 1～shown in Figure 5, a kind of chip lead coplanarity adjusting device, comprise the mould of punching out integrated chip lead frame and have the radially integrated chip 1 of some lead-in wires of expansion, be provided with the plummer 2 of clamping integrated chip at the counterdie of mould, be provided with the stripper plate moulding punching pin 31 that can clamp integrated chip 1, chip lead root and chip lead afterbody with plummer 2 below upper bolster 3, described stripper plate moulding punching pin 31 lower surfaces and chip lead 11 corresponding positions are provided with deep gouge 32; Be provided with the adjustment punching pin installing hole 21 of the up/down perforation corresponding in the plummer 2 with each chip lead 11 difference in described deep gouge 32 side corresponding positions, adjust totally two ten of punching pin installing holes, installing hole 21 is a square opening, all being sliding combined with a section in each installing hole 21 is square adjustment punching pin 4, the upper surface that protrudes in plummer 2 all can be adjusted in the upper end of every adjustment punching pin 4, and compresses mutually with chip lead 11 middle parts on being clamped in plummer 2; The middle part of chip lead 11 all is in the side of deep gouge 32; The shape that the deep gouge side of stripper plate moulding punching pin 31 assumes diamond in shape; Chip lead 11 whole breakover points are in the four edges line inboard of rhombus, adjust punching pin 4 simultaneously and also are provided with along inboard arrangement the in the sideline of rhombus; The degree of depth of deep gouge 32 is 4mm.Because the maximum deformation quantity of chip lead 11 is generally about 2mm, the degree of depth of getting deep gouge 32 is greater than chip lead 11 maximum deformation quantities, be to consider that the later rubber-like chip lead 11 of shaping has a certain amount of resilience, so when the overhang of adjusting punching pin is adjusted, need leave some surpluses.The same batch of chip lead that punch process obtains, because material, mould structure and technology are identical, its deformation place, deformation extent and distortion situation often have roughly the same or akin feature, therefore at sample carried out to adjusting the adjustment of punching pin 4, for with sample be that same batch integrated chip 1 also often has blanket meaning, thereby can make operation obtain simplifying, enhance productivity; The chip lead plane distribution situation of integrated chip is referring to Fig. 6.
The upper surface of adjusting punching pin 4 is a hemicycle curved surface of column 41; Curved-surface structure can avoid making the surface of chip lead 11 to sustain damage, as shown in Figure 7.
Figure 8 shows that stripper plate moulding punching pin 31 and the corresponding situation in position of adjusting punching pin 4, two adjustment punching pines only are shown among the figure.
Be provided with the height adjuster of adjusting punching pin below the adjustment punching pin 4; Be specially screw rod adjusting device 5, screw rod adjusting device 5 comprises the seat board 51 that is fixedly connected on the counterdie bottom surface, seat board 51 is provided with the screw 52 by the sideline distribution of rhombus, there are 5 screws on the every limit of rhombus, totally 20 screws, is furnished with the screw rod 53 of adjustment in the screw, there is a bulb 531 upper end of adjusting screw rod 53, this bulb 531 cooperates with the ball-and-socket 42 of adjusting punching pin 4 lower ends, ball-and-socket 42 cuts a groove 44 vertically makes ball-and-socket have elasticity, and the bulb 531 of being convenient to adjust screw rod 53 is filled in ball-and-socket and cooperated rotationally with ball-and-socket; Rotate to adjust screw rod 53 and can be used to adjust the amplitude of roof pressure chip lead adjusting up jack-up or down return of punching pin 4; The head of adjusting screw rod 53 is interior hexagonal structure; This screw rod adjusting device that can adjust at random can adapt to any batch chip lead adjustment processing.
Embodiment 2: the chip lead coplanarity adjusting device of the adjustment punching pin that application as shown in Figure 9 is fixing, it is that screw rod adjusting device with embodiment 1 removes, establish a die shoe 55 again, dispose three groups in addition and respectively comprise the mutually different adjustment punching pin 2 43 of a collection of length, the lower end of adjusting punching pin two does not need to process ball-and-socket, the height that the length of adjusting punching pin 2 43 equals plummer 2 adds that the substrate thickness of integrated chip 1 adds adjustment amount, adjustment amount is pressed at interval value successively of 0.2mm from 0mm to 5mm, for example get 0.2mm, 0.4mm, 0.6mm ...During application, get 3 integrated chip samples earlier and the deflection of chip lead measured and register the numerical value that records, select the adjustment punching pin two of suitable length on mould, to install and fix and lock according to the deflection mean value that records again, then integrated chip 1 is contained in plummer 2 above, push down each chip lead 11 with stripper plate moulding punching pin 31, need add suitable resilience surplus in advance during adjustment; Next step just can carry out the punching press shaping.The scheme of this adjustment punching pin two can make structure obtain simplifying, and has blanket meaning equally for belonging to same batch integrated chip 1 with sample.
Claims (7)
1. chip lead coplanarity adjusting device, comprise the mould of punching out integrated chip lead frame and have the radially integrated chip of some lead-in wires of expansion, be provided with the plummer of clamping integrated chip at the counterdie of mould, be provided with the stripper plate moulding punching pin that to clamp integrated chip, chip lead root and chip lead afterbody with plummer at patrix, it is characterized in that described stripper plate moulding punching pin lower surface and the corresponding position of chip lead are provided with deep gouge; Be provided with in the relative position of described deep gouge side in the plummer and adjustment punching pin that each chip lead is corresponding respectively, the upper surface that protrudes in plummer all can be adjusted in the upper end of every adjustment punching pin, and be clamped in plummer on chip lead in the middle part of compress mutually; The middle part of described chip lead all is in the side of deep gouge.
2. chip lead coplanarity adjusting device according to claim 1 is characterized in that, the shape that the deep gouge side in the described plummer assumes diamond in shape.
3. chip lead coplanarity adjusting device according to claim 1 and 2 is characterized in that the degree of depth of described deep gouge is 2～5mm.
4. chip lead coplanarity adjusting device according to claim 1 and 2 is characterized in that the upper surface of described adjustment punching pin is the hemicycle curved surface of column.
5. chip lead coplanarity adjusting device according to claim 4 is characterized in that, is provided with the height adjuster of adjusting punching pin below the described adjustment punching pin.
6. chip lead coplanarity adjusting device according to claim 5, it is characterized in that, the height adjuster of described adjustment punching pin is the screw rod adjusting device, the screw rod adjusting device comprises the seat board that is fixedly connected on the counterdie bottom surface, seat board is provided with screw, be furnished with the adjustment screw rod in the screw, the upper end of adjusting screw rod is that spherical joint is connected with the lower end of adjusting punching pin.
7. chip lead coplanarity adjusting device according to claim 1 and 2 is characterized in that, described coplanarity adjusting device is provided with one group and comprises the mutually different adjustment punching pin of some length.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120028031XU CN201927584U (en) | 2011-01-27 | 2011-01-27 | Coplanarity adjusting device for chip leads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120028031XU CN201927584U (en) | 2011-01-27 | 2011-01-27 | Coplanarity adjusting device for chip leads |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201927584U true CN201927584U (en) | 2011-08-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120028031XU Expired - Fee Related CN201927584U (en) | 2011-01-27 | 2011-01-27 | Coplanarity adjusting device for chip leads |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201927584U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103050472A (en) * | 2012-12-28 | 2013-04-17 | 日月光封装测试(上海)有限公司 | Lead frame bar for semiconductor packaging, and mold and adhesive sealing method thereof |
| CN112397471A (en) * | 2019-08-16 | 2021-02-23 | 珠海格力电器股份有限公司 | SOP packaging structure and packaging method |
-
2011
- 2011-01-27 CN CN201120028031XU patent/CN201927584U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103050472A (en) * | 2012-12-28 | 2013-04-17 | 日月光封装测试(上海)有限公司 | Lead frame bar for semiconductor packaging, and mold and adhesive sealing method thereof |
| CN103050472B (en) * | 2012-12-28 | 2016-04-20 | 日月光封装测试(上海)有限公司 | Semiconductor-sealing-purpose conductive wire frame strip and mould thereof and glue sealing method |
| CN112397471A (en) * | 2019-08-16 | 2021-02-23 | 珠海格力电器股份有限公司 | SOP packaging structure and packaging method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110810 Termination date: 20140127 |