CN113889561A - Packaging substrate manufacturing method and packaging substrate - Google Patents
Packaging substrate manufacturing method and packaging substrate Download PDFInfo
- Publication number
- CN113889561A CN113889561A CN202111161216.2A CN202111161216A CN113889561A CN 113889561 A CN113889561 A CN 113889561A CN 202111161216 A CN202111161216 A CN 202111161216A CN 113889561 A CN113889561 A CN 113889561A
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- Prior art keywords
- organic
- manufacturing
- enclosing wall
- curing
- package substrate
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- 239000000758 substrate Substances 0.000 title claims abstract description 58
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 34
- 239000000084 colloidal system Substances 0.000 claims abstract description 25
- 238000010586 diagram Methods 0.000 claims abstract description 13
- 238000001723 curing Methods 0.000 claims description 19
- 239000003292 glue Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 10
- 238000004381 surface treatment Methods 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 238000007772 electroless plating Methods 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims description 2
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 1
- 238000000016 photochemical curing Methods 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 238000012858 packaging process Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The embodiment of the invention discloses a manufacturing method of a packaging substrate and the packaging substrate, wherein the method comprises the following steps: covering a photosensitive film on the substrate, and carrying out exposure and development according to a pre-designed circuit diagram to obtain a wall groove; organic colloid is poured into the groove of the enclosing wall; curing the organic colloid; and after the curing is finished, removing the photosensitive film, obtaining an organic enclosing wall cured by the organic colloid at the position of the enclosing wall groove, and finishing the manufacturing of the packaging substrate. The manufacturing process of the packaging substrate can obtain the organic enclosing wall more quickly and efficiently, reduces the cost and is more suitable for automatic industrial mass production.
Description
Technical Field
The invention relates to the field of packaging processes, in particular to a packaging substrate manufacturing method and a packaging substrate.
Background
The existing method for realizing the cavity enclosure of the cavity structure package substrate generally includes Low Temperature Co-fired Ceramic (LTCC), High Temperature Co-fired Ceramic (HTCC), pattern electroplating, and pre-formed soldering (kovar ring soldering), but the common disadvantages include complex process and High cost, and it is difficult to apply LEDs (Light Emitting diodes) in applications where cost performance is sought, and it is difficult to produce the cavity enclosure in large quantities, and the production cycle is long, and the cavity enclosure is not suitable for the current industrial environment.
Disclosure of Invention
In view of the above, the present invention provides a method for manufacturing a package substrate, including:
covering a photosensitive film on the substrate, and carrying out exposure and development according to a pre-designed circuit diagram to obtain a wall groove;
organic colloid is poured into the groove of the enclosing wall;
curing the organic colloid;
and after the curing is finished, removing the photosensitive film, obtaining an organic enclosing wall cured by the organic colloid at the position of the enclosing wall groove, and finishing the manufacturing of the packaging substrate.
Further, after obtaining the organic enclosure wall, the method further includes:
and leveling the organic enclosing wall to make the surface of the organic enclosing wall smooth.
Furthermore, a plurality of chip packaging cavities are formed on the organic enclosing wall.
Further, the cavity is rectangular or circular in shape.
Further, the organic colloid is one or a combination of more of heat-curable glue and light-curable glue, and the material of the organic colloid is one or a combination of more of silica gel, silicone resin and epoxy resin.
Further, the removing the photosensitive film includes:
and removing the photosensitive film by adopting a dry film remover, a wet film remover or a plasma removing method.
Further, the photosensitive film is one of a photosensitive dry film, a photosensitive wet film or a photoresist.
Further, after the organic enclosing wall is obtained, performing surface treatment on a preset line in the organic enclosing wall, wherein the surface treatment comprises electroplating or chemical plating; the plating or electroless plating material comprises one of silver, nickel gold or nickel palladium gold.
Further, the curing the organic colloid includes:
and baking or irradiating the organic colloid by ultraviolet rays at a preset temperature to realize the curing of the organic colloid.
Further, an embodiment of the present application further provides a substrate, and the substrate is manufactured according to any one of the package substrate manufacturing methods in the above embodiments.
The application provides a manufacturing method of a packaging substrate and the packaging substrate, the method comprises the steps of covering a photosensitive film on the packaging substrate, and exposing and developing to obtain an enclosing line according to a pre-designed line diagram; obtaining a fence groove according to the fence line; pouring organic colloid in the groove of the enclosing wall for self-leveling, and then carrying out curing operation; and finally, removing the photosensitive film to obtain the organic fence solidified by the organic colloid at the position of the fence line. Compared with the prior art, the manufacturing method of the packaging substrate is simpler and faster, the used materials are cheap, the manufacturing cost of the organic enclosing wall is reduced, and the whole process is more suitable for the current automatic generation.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings required to be used in the embodiments will be briefly described below, and it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope of the present invention. Like components are numbered similarly in the various figures.
Fig. 1 is a schematic flow chart illustrating a method for manufacturing a package substrate according to the present application;
FIG. 2 is a schematic diagram of a substrate circuit according to an embodiment of the present application;
fig. 3 is a schematic diagram illustrating a substrate circuit after dispensing according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of a substrate organic fence according to an embodiment of the present application;
fig. 5 is a schematic diagram illustrating an internal structure of a cavity in a substrate organic enclosure according to an embodiment of the present disclosure.
Description of the symbols: 30-cavity, 31-organic fence, 500-bond pad.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
Hereinafter, the terms "including", "having", and their derivatives, which may be used in various embodiments of the present invention, are only intended to indicate specific features, numbers, steps, operations, elements, components, or combinations of the foregoing, and should not be construed as first excluding the existence of, or adding to, one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing.
Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which various embodiments of the present invention belong. The terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning that is consistent with their contextual meaning in the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein in various embodiments of the present invention.
Based on the drawbacks of the prior art, embodiments of the present application provide a method for manufacturing a package substrate, which is understood with reference to the flowchart in fig. 1.
Example 1
Step S100, covering a photosensitive film on the substrate, and performing exposure and development according to a pre-designed circuit diagram to obtain a fence groove.
Before the photosensitive film is coated, the substrate of the preset circuit is subjected to pretreatment of oil removal, oxidation removal and impurity removal. For example, if the photosensitive film is coated on a metal, the metal needs to be roughened.
The photosensitive film is covered on the package substrate, and then exposure and development operations are performed according to a circuit diagram designed by a circuit board process, so that a fence line is generated on the substrate, which can be understood by referring to fig. 2 specifically, fig. 2 is a schematic diagram of the substrate on which the fence line is formed, wherein a grid-shaped portion of the fence line is exposed and then appears, and the rest portion is an unexposed portion.
The photosensitive film is mainly used for generating a layer of protective film on the substrate after exposure and development so as to facilitate subsequent process steps, specifically, the photosensitive film can be an exposure and development material which can achieve similar effects, such as a photosensitive dry film, a photosensitive wet film or a photoresist, and the application is not limited herein.
Further, according to the requirement, photosensitive films with different thicknesses can be used, so that organic enclosing walls with different heights can be obtained, for example, a photosensitive film with a thicker thickness can be used to obtain an organic enclosing wall with a higher height, whereas a photosensitive film with a thinner thickness can be used to obtain an organic enclosing wall with a shorter height.
Step S200, pouring organic colloid into the groove of the enclosing wall;
in this embodiment, a specific method for obtaining the fence groove is an etching method, since the substrate portion other than the wiring is protected by the wiring formed by the photosensitive film, the fence groove can be formed by the etching method, wherein the depth of the fence groove is between 0.1 and 0.3 cm.
Step S300, curing the organic colloid;
the organic glue is poured into the groove, wherein the organic glue can be one of thermalization glue or light curing glue, as long as the material can meet the material of the packaging process, the specific material of the organic glue can be one or a combination of silica gel, silicon resin and epoxy resin, and the composition and the proportion can be configured according to the actual situation, which is not limited herein.
After the grooves are filled with the organic glue and self-leveled, the curing operation can be carried out, and a corresponding curing method is carried out according to different types of the organic glue, for example, the curing operation is carried out by baking the heat-cured glue or by an ultraviolet irradiation method.
And S400, after the curing is finished, removing the photosensitive film, obtaining an organic fence obtained by curing the organic colloid at the position of the fence line, and finishing the manufacturing of the packaging substrate.
After curing, the organic gel is solidified into an organic fence, and meanwhile, in order to obtain a solidified organic fence from the substrate, the photosensitive film needs to be removed first, and the type of the photosensitive film used in the removal method is more specifically related, for example, a dry film remover is used for the photosensitive dry film, a wet film remover is used for the photosensitive wet film, and a plasma removal method is used for the photoresist, and the specific removal method is not limited in the embodiments of the present application as the case may be.
A plurality of cavities of the same size are also formed in the organic enclosure, wherein the cavities 30 are provided with predetermined circuits therein, such as chip bonding pads 500 shown in fig. 5, so that chip pads (bonding pads) that need to be packaged later can be bonded.
After the Organic enclosing wall is formed, the surface of the Organic enclosing wall needs to be leveled, so as to ensure the surface smoothness of the Organic enclosing wall, avoid the loss caused by uneven surface when a subsequent chip is packaged, and after leveling, the surface treatment method further comprises the steps of electroplating, chemical plating or overall soaking and covering OSP (Organic solder mask).
Example 2
Besides, the present application also provides a package substrate manufactured by using the above-mentioned embodiment, and the package substrate follows the package substrate manufacturing method in the above-mentioned embodiment, and the specific shape can refer to fig. 2 to fig. 4 of the specification.
Fig. 2 is a groove of a surrounding wall after exposure, fig. 3 is a cavity 30 surrounded by an organic fence 31 obtained by dropping organic glue and curing, fig. 4 is an organic heterogeneous forming cavity packaging substrate formed after obtaining the organic fence, a rectangular frame surrounded in the organic fence is a cavity for carrying a chip, and a bonding pad 500 is arranged inside the cavity 30, so that a chip pad to be packaged can be bonded thereafter.
The specific internal structure of the cavity is shown in fig. 5, the internal structure of each cavity may be the same or different, and a plurality of such cavities 30 may be provided on one substrate, so that after such a substrate is generated, a plurality of the same chips or chips of the same type and different numbers may be packaged in batch in a subsequent chip packaging process, thereby improving the efficiency of industrial production.
The application provides a manufacturing method of a packaging substrate and the packaging substrate, in the method of the scheme, a photosensitive film is covered on the packaging substrate, and according to a pre-designed circuit diagram, an enclosing line is obtained through exposure and development; obtaining a fence groove according to the fence line; pouring organic colloid in the groove of the enclosing wall for self-leveling, and then carrying out curing operation; and finally, removing the photosensitive film to obtain the organic fence solidified by the organic colloid at the position of the fence line. Compared with the prior art, the manufacturing method of the organic enclosing wall of the packaging substrate is simpler and faster, the used materials are cheap, the manufacturing cost of the organic enclosing wall is reduced, and the whole process is more suitable for the current automatic production.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus and method can be implemented in other ways. The apparatus embodiments described above are merely illustrative, and for example, the flowchart and block diagrams in the figures illustrate apparatus and methods according to various embodiments of the present invention.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention.
Claims (10)
1. A method for manufacturing a package substrate includes:
covering a photosensitive film on the substrate, and carrying out exposure and development according to a pre-designed circuit diagram to obtain a wall groove;
organic colloid is poured into the groove of the enclosing wall;
curing the organic colloid;
and after the curing is finished, removing the photosensitive film, obtaining an organic enclosing wall cured by the organic colloid at the position of the enclosing wall groove, and finishing the manufacturing of the packaging substrate.
2. The method for manufacturing a package substrate according to claim 1, further comprising, after obtaining the organic fence:
and leveling the organic enclosing wall to make the surface of the organic enclosing wall smooth.
3. The method for manufacturing a package substrate according to claim 1, wherein the organic wall has a plurality of chip package cavities formed therein.
4. The method as claimed in claim 3, wherein the cavity is rectangular or circular.
5. The method for manufacturing a package substrate according to claim 1, wherein the organic colloid is one or a combination of thermosetting glue and photo-curing glue, and the material of the organic colloid is one or a combination of silicone, silicone and epoxy.
6. The method for manufacturing a package substrate according to claim 1, wherein the removing the photosensitive film comprises:
and removing the photosensitive film by adopting a dry film remover, a wet film remover or a plasma removing method.
7. The method of claim 1, wherein the photosensitive film is one of a dry film, a wet film or a photoresist.
8. The manufacturing method of the package substrate according to claim 1, wherein after the organic enclosing wall is obtained, a surface treatment is performed on a preset circuit in the organic enclosing wall, and the surface treatment includes electroplating or electroless plating; the plating or electroless plating material comprises one of silver, nickel gold or nickel palladium gold.
9. The method for manufacturing a package substrate according to claim 1, wherein the curing the organic gel comprises:
and baking or irradiating the organic colloid by ultraviolet rays at a preset temperature to realize the curing of the organic colloid.
10. A substrate manufactured according to the method for manufacturing a package substrate as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111161216.2A CN113889561A (en) | 2021-09-30 | 2021-09-30 | Packaging substrate manufacturing method and packaging substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111161216.2A CN113889561A (en) | 2021-09-30 | 2021-09-30 | Packaging substrate manufacturing method and packaging substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113889561A true CN113889561A (en) | 2022-01-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111161216.2A Pending CN113889561A (en) | 2021-09-30 | 2021-09-30 | Packaging substrate manufacturing method and packaging substrate |
Country Status (1)
| Country | Link |
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| CN (1) | CN113889561A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001035972A (en) * | 1999-07-16 | 2001-02-09 | Hamamatsu Photonics Kk | Manufacture of semiconductor device |
| US20070189007A1 (en) * | 2004-03-26 | 2007-08-16 | Keiji Nishimoto | Led mounting module, led module, manufacturing method of led mounting module, and manufacturing method of led module |
| CN103390563A (en) * | 2013-08-06 | 2013-11-13 | 江苏长电科技股份有限公司 | Metal circuit board structure and technique of flip chip of firstly-packaged and then-etched three-dimensional system level |
| CN106783755A (en) * | 2016-11-11 | 2017-05-31 | 东莞市凯昶德电子科技股份有限公司 | A kind of ceramic packaging substrate preparation method with copper facing box dam |
| CN206595282U (en) * | 2017-03-04 | 2017-10-27 | 深圳市斯迈得半导体有限公司 | Surface mount type LED support structure |
| US20190013239A1 (en) * | 2016-12-07 | 2019-01-10 | Dongguan Kechenda Electronics Technology Co., Ltd. | Method for preparing ceramic package substrate with copper-plated dam |
| CN111446349A (en) * | 2020-04-09 | 2020-07-24 | 盐城东山精密制造有限公司 | L ED packaging substrate |
| CN113241398A (en) * | 2021-05-21 | 2021-08-10 | 珠海市宏科光电子有限公司 | COB light source packaging heat balance treatment process |
-
2021
- 2021-09-30 CN CN202111161216.2A patent/CN113889561A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001035972A (en) * | 1999-07-16 | 2001-02-09 | Hamamatsu Photonics Kk | Manufacture of semiconductor device |
| US20070189007A1 (en) * | 2004-03-26 | 2007-08-16 | Keiji Nishimoto | Led mounting module, led module, manufacturing method of led mounting module, and manufacturing method of led module |
| CN103390563A (en) * | 2013-08-06 | 2013-11-13 | 江苏长电科技股份有限公司 | Metal circuit board structure and technique of flip chip of firstly-packaged and then-etched three-dimensional system level |
| CN106783755A (en) * | 2016-11-11 | 2017-05-31 | 东莞市凯昶德电子科技股份有限公司 | A kind of ceramic packaging substrate preparation method with copper facing box dam |
| US20190013239A1 (en) * | 2016-12-07 | 2019-01-10 | Dongguan Kechenda Electronics Technology Co., Ltd. | Method for preparing ceramic package substrate with copper-plated dam |
| CN206595282U (en) * | 2017-03-04 | 2017-10-27 | 深圳市斯迈得半导体有限公司 | Surface mount type LED support structure |
| CN111446349A (en) * | 2020-04-09 | 2020-07-24 | 盐城东山精密制造有限公司 | L ED packaging substrate |
| CN113241398A (en) * | 2021-05-21 | 2021-08-10 | 珠海市宏科光电子有限公司 | COB light source packaging heat balance treatment process |
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