CN201523009U - Lead frame - Google Patents

Lead frame Download PDF

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Publication number
CN201523009U
CN201523009U CN 200920249794 CN200920249794U CN201523009U CN 201523009 U CN201523009 U CN 201523009U CN 200920249794 CN200920249794 CN 200920249794 CN 200920249794 U CN200920249794 U CN 200920249794U CN 201523009 U CN201523009 U CN 201523009U
Authority
CN
China
Prior art keywords
lead frame
frame
row
lead frames
dice
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 200920249794
Other languages
Chinese (zh)
Inventor
黄仰东
沈骏
丁莹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Cable Suzhou Co Ltd
Original Assignee
Hitachi Cable Suzhou Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Suzhou Co Ltd filed Critical Hitachi Cable Suzhou Co Ltd
Priority to CN 200920249794 priority Critical patent/CN201523009U/en
Application granted granted Critical
Publication of CN201523009U publication Critical patent/CN201523009U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Lead Frames For Integrated Circuits (AREA)

Abstract

The utility model discloses a lead frame, which comprises four rows of disposed lead frames. At least two unit sheets are arranged into each row of lead frames in parallel, each unit sheet comprises a radiating portion, a gasket portion, a frame and a lateral connecting portion, and the frame is provided with an inner pin and an outer pin. The lead frame is characterized in that the first row of lead frames and the second row of lead frames are connected via the radiating portions of the unit sheets, the second row of lead frames and the third row of lead frames are connected via the lateral connecting portions and the outer pins of the unit sheets, and the third row of lead frames and the fourth row of lead frames are connected via the radiating portions of the unit sheets. The lead frame increases production efficiency and simultaneously saves materials and reduces production cost.

Description

A kind of lead frame
Technical field
The utility model relates to a kind of lead frame, is specifically related to a kind of lead frame that is used for semiconductor element.
Background technology
Lead frame is as the chip carrier of integrated circuit or discrete device, be a kind of being electrically connected by means of bonding gold wire realization chip internal circuit exit and outer lead, form the key structure spare of electric loop, it has played the function served as bridge that is connected with outer lead.At present, all needing to use lead frame in most semiconductor integrated packages, is basic material important in the electronics and information industry.The type of existing lead frame has TO, DIP, ZIP, SIP, SOP, SSOP, QFP (QFJ), SOD, SOT etc., and mainly produces with die stamping method and chemical etching method.All needing to use lead frame in the overwhelming majority conductor integrated package, is basic material important in the electronics and information industry.
Existing lead frame mainly is made of side by side at least 2 dice (can have usually several, tens or tens), referring to shown in Figure 1, described dice 7 comprises radiating part 8, gasket part 9 and framework, pin 10 and outer pin 11 in described framework is provided with.When making semiconductor product, earlier chip is installed on the gasket part of lead frame, with gold thread chip is electrically connected with the inside of frame pin then, adopt plastic package process (for example resin-encapsulated) that entire product is encapsulated at last, to reach the purpose of protection product.
Lead frame was widely used in the last few years, all related in many household electrical appliances such as air-conditioning, television set, soya-bean milk cooking machine, mobile phone and the electronic product using, and made the demand of lead frame in continuous increase.Yet in the production of reality, there is a bigger deficiency, though the design of single lead frame easily, but it is more serious to raw-material waste in actual production, and can only produce at every turn one row lead frame, production efficiency is also lower, just more increase production cost so virtually, thereby influenced the market efficiency of lead frame, reduced its competitiveness.
Summary of the invention
The utility model purpose provides a kind of lead frame, to improve lead frame production efficiency, has saved material simultaneously, has reduced production cost.
For achieving the above object, the technical solution adopted in the utility model is: a kind of lead frame, comprise the lead frame that four rows are provided with, be provided with at least 2 dice side by side in every row lead frame frame, described dice comprises radiating part, gasket part, framework and side connecting portion, pin and outer pin in described framework is provided with, radiating part through described dice between the described first row lead frame frame and the second row lead frame frame is connected, the described second row lead frame frame and the 3rd row lead frame frame through the side connecting portion of described dice and outside pin be connected, the radiating part through described dice between described the 3rd row lead frame frame and the 4th row lead frame frame is connected.
Above, the lead frame that described four row's structures are provided with, wherein the radiating part through dice is connected between the first row lead frame frame and the second row lead frame frame, has so just saved the raw-material use of the first row lead frame frame afterbody, the use of also having saved the second row lead frame frame head material simultaneously; The second row lead frame frame is connected with the 3rd row lead frame frame pin outside the side connecting portion of described dice reaches, and has saved the material of the second row lead frame frame afterbody and the 3rd row lead frame frame head simultaneously; Radiating part through described dice between described the 3rd row lead frame frame and the 4th row lead frame frame is connected, and can save the external part material of the 3rd row lead frame frame afterbody and the 4th row lead frame frame head.
Because the technique scheme utilization, the advantage that the utility model compared with prior art has is:
1, lead frame of the present utility model comprises the lead frame that four rows are provided with, and the setting of single lead frame has as compared with the past improved the production efficiency of lead frame greatly;
2, the setting of the utility model four row lead frame framves, adjacent row lead frame frame interconnects, and then has reduced the use of material, has reduced production cost.
2, the utility model is simple in structure, is easy to realize, is suitable for applying.
Description of drawings
Fig. 1 is the structural representation of lead frame in the prior art;
Fig. 2 is the structural representation of the utility model embodiment one
Fig. 3 is the structural representation of part lead frame among the utility model embodiment one.
Wherein: 1, dice; 2, outer pin; 3, interior pin; 4, gasket part; 5, radiating part; 6, side connecting portion; 7, dice; 8, radiating part; 9, gasket part; 10, interior pin; 11, outer pin.
Embodiment
Below in conjunction with drawings and Examples the utility model is further described:
Embodiment one: referring to Fig. 2, shown in 3, a kind of lead frame, comprise the lead frame that four rows are provided with, be provided with a plurality of dice 1 in every row lead frame frame side by side, the number of dice can be 6,8,12 or 20, described dice comprises radiating part 5, gasket part 4, framework and side connecting portion 6, pin 3 and outer pin 2 in described framework is provided with, radiating part 5 through described dice between the described first row lead frame frame and the second row lead frame frame is connected, the described second row lead frame frame and the 3rd row lead frame frame through the side connecting portion 6 of described dice and outside pin 2 be connected, the radiating part 5 through described dice between described the 3rd row lead frame frame and the 4th row lead frame frame is connected.

Claims (1)

1. lead frame, comprise the lead frame that four rows are provided with, be provided with at least 2 dice (1) in every row lead frame frame side by side, described dice (1) comprises radiating part (5), gasket part (4), framework and side connecting portion (6), described framework is provided with interior pin (3) and outer pin (2), it is characterized in that: the radiating part (5) through described dice between the described first row lead frame frame and the second row lead frame frame is connected, the described second row lead frame frame and the 3rd row lead frame frame through the side connecting portion (6) of described dice and outside pin (2) be connected, the radiating part (5) through described dice between described the 3rd row lead frame frame and the 4th row lead frame frame is connected.
CN 200920249794 2009-10-27 2009-10-27 Lead frame Expired - Fee Related CN201523009U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200920249794 CN201523009U (en) 2009-10-27 2009-10-27 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200920249794 CN201523009U (en) 2009-10-27 2009-10-27 Lead frame

Publications (1)

Publication Number Publication Date
CN201523009U true CN201523009U (en) 2010-07-07

Family

ID=42509185

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200920249794 Expired - Fee Related CN201523009U (en) 2009-10-27 2009-10-27 Lead frame

Country Status (1)

Country Link
CN (1) CN201523009U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100707

Termination date: 20171027