CN202259200U - Chip lead adjusting device - Google Patents
Chip lead adjusting device Download PDFInfo
- Publication number
- CN202259200U CN202259200U CN2011203174632U CN201120317463U CN202259200U CN 202259200 U CN202259200 U CN 202259200U CN 2011203174632 U CN2011203174632 U CN 2011203174632U CN 201120317463 U CN201120317463 U CN 201120317463U CN 202259200 U CN202259200 U CN 202259200U
- Authority
- CN
- China
- Prior art keywords
- chip
- supporting platform
- plummer
- adjusting device
- adjusting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a chip lead adjusting device comprising a support; wherein the support is provided with a supporting platform thereon; an upper die base is arranged over the supporting platform, a moulding punch is arranged under the upper die base and directly opposite to the supporting platform; the supporting platform under the moulding punch is provided with an integrated chip thereon; the supporting platform is uniformly provided with a plurality of adjusting punches which penetrate the supporting platform; bottom ends of the adjusting punches are provided with adjusting screws; and top ends of the adjusting punches extends outside a top of the supporting platform, and are directly opposite to the integrated chip. The chip lead adjusting device of the utility model can adjust chip leads one by one, and can perform shaping integrally, thus the chip leads may have a high coplanarity.
Description
Technical field
The utility model relates to a kind of chip lead adjusting device.
Background technology
Lead frame is as the chip carrier of integrated circuit; Be a kind of being electrically connected by means of bonding gold wire realization chip internal circuit exit and outer lead; Form the key structure spare of electric loop, it has played the function served as bridge that is connected with outer lead, all need use lead frame in the semiconductor integrated package of the overwhelming majority; Thereby lead frame is a basic material important in the electronics and information industry.
The lead frame product type has TO, DIP, ZIP, SIP, SOP, SSOP, QFP (QFJ), SOD, SOT etc.Mainly produce with die stamping method and chemical etching method.
There is the big defective of integrated chip lead-in wire shaping error in existing chip lead-in wire adjusting device.
The utility model content
The utility model technical issues that need to address just are to overcome the defective of prior art, and a kind of chip lead adjusting device is provided, and it can be adjusted chip lead one by one, whole shaping, and the chip lead coplanarity is high.
For addressing the above problem, the utility model adopts following technical scheme:
The utility model provides a kind of chip lead adjusting device, comprises support, and said support is provided with plummer; Plummer top is provided with upper bolster, said upper bolster below, is provided with the moulding punching pin over against plummer, on the plummer of moulding punching pin below integrated chip is installed; Run through plummer and evenly be provided with a plurality of adjustment punching pines; Said adjustment punching pin bottom is provided with the adjustment screw rod, and the top that plummer is stretched out in the top activity of adjustment punching pin is over against integrated chip.
Through the cooperation of moulding punching pin with the adjustment punching pin, the utility model can be adjusted chip lead one by one, also can whole shaping, and the chip lead coplanarity is high.
Description of drawings
Fig. 1 is the utility model structural representation.
Embodiment
As shown in Figure 1, the utility model provides a kind of chip lead adjusting device, comprises support 1; Said support is provided with plummer 2, and plummer top is provided with upper bolster 3, said upper bolster below, is provided with moulding punching pin 4 over against plummer; On the plummer of moulding punching pin below integrated chip 5 is installed, runs through plummer and evenly be provided with a plurality of adjustment punching pines 6, said adjustment punching pin bottom is provided with adjustment screw rod 7; The top that plummer is stretched out in the top activity of adjustment punching pin is over against integrated chip.
Through the cooperation of moulding punching pin with the adjustment punching pin, the utility model can be adjusted chip lead one by one, also can whole shaping, and the chip lead coplanarity is high.
What should explain at last is: obviously, the foregoing description only be for explain clearly that the utility model does for example, and be not qualification to execution mode.For the those of ordinary skill in affiliated field, on the basis of above-mentioned explanation, can also make other multi-form variation or change.Here need not also can't give exhaustive to all execution modes.And conspicuous variation of being amplified out thus or change still are among the protection range of the utility model.
Claims (1)
1. a chip lead adjusting device comprises support, it is characterized in that: said support is provided with plummer; Plummer top is provided with upper bolster, said upper bolster below, is provided with the moulding punching pin over against plummer, on the plummer of moulding punching pin below integrated chip is installed; Run through plummer and evenly be provided with a plurality of adjustment punching pines; Said adjustment punching pin bottom is provided with the adjustment screw rod, and the top that plummer is stretched out in the top activity of adjustment punching pin is over against integrated chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203174632U CN202259200U (en) | 2011-08-29 | 2011-08-29 | Chip lead adjusting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203174632U CN202259200U (en) | 2011-08-29 | 2011-08-29 | Chip lead adjusting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202259200U true CN202259200U (en) | 2012-05-30 |
Family
ID=46120399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203174632U Expired - Fee Related CN202259200U (en) | 2011-08-29 | 2011-08-29 | Chip lead adjusting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202259200U (en) |
-
2011
- 2011-08-29 CN CN2011203174632U patent/CN202259200U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20120829 |