CN202259229U - Lead wire framework transmission clamp - Google Patents
Lead wire framework transmission clamp Download PDFInfo
- Publication number
- CN202259229U CN202259229U CN2011203174312U CN201120317431U CN202259229U CN 202259229 U CN202259229 U CN 202259229U CN 2011203174312 U CN2011203174312 U CN 2011203174312U CN 201120317431 U CN201120317431 U CN 201120317431U CN 202259229 U CN202259229 U CN 202259229U
- Authority
- CN
- China
- Prior art keywords
- lead wire
- wire framework
- lead frame
- anchor clamps
- transmission
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Wire Bonding (AREA)
Abstract
The utility model discloses a lead wire framework transmission clamp composed of a transmission part and a clamping part which are integrated into a whole one and have a same thickness. The transmission part is provided with a driving hole; the lamping part is provided with a U-shaped slot, an opening of which orientates a direction deviating from the transmission part; the opening of the U-shaped slot is provided with a lead inclined plane. A lead wire framework is clamped by a lead wire framework transmission clamp and transmits with the lead wire framework transmission clamp in an automatic bonding die device to realize splintering and bonding die mechanization of a device employing the lead wire framework.
Description
Technical field
The utility model relates to a kind of lead frame transmission anchor clamps.
Background technology
Lead frame is as the chip carrier of integrated circuit; Be a kind of being electrically connected by means of bonding gold wire realization chip internal circuit exit and outer lead; Form the key structure spare of electric loop, it has played the function served as bridge that is connected with outer lead, all need use lead frame in the semiconductor integrated package of the overwhelming majority; Thereby lead frame is a basic material important in the electronics and information industry.
The lead frame product type has TO, DIP, ZIP, SIP, SOP, SSOP, QFP (QFJ), SOD, SOT etc.Mainly produce with die stamping method and chemical etching method.
Existing lead frame transmission anchor clamps can't use automatic bonding die equipment to accomplish sliver, bonding die, and manual operation causes chip to collapse limit percent defective height, production efficiency is low.
The utility model content
The utility model technical issues that need to address just are to overcome the defective of prior art, and a kind of lead frame transmission anchor clamps are provided, and it has realized adopting the sliver of the device of lead frame, the mechanization of bonding die operation.
For addressing the above problem, the utility model adopts following technical scheme:
The utility model provides a kind of lead frame transmission anchor clamps; Said anchor clamps are formed by constituting as a whole driving section and clamping part; The driving section is provided with a driving hole; Clamping part is provided with " U " shape slot, and the opening of said " U " shape slot is towards deviating from the driving section direction, and " U " shape slot opening part is provided with one and imports the inclined-plane.
The driving section is identical with clamping part thickness.
Lead frame is by the clamping of lead frame transmission anchor clamps, and transmission in automatic bonding die equipment has together realized adopting the sliver of the device of lead frame, the mechanization of bonding die operation.
Description of drawings
Fig. 1 is the utility model structural representation.
Fig. 2 is that the A-A of Fig. 1 is to view.
Embodiment
Like Fig. 1, shown in Figure 2; The utility model provides a kind of lead frame transmission anchor clamps; Said anchor clamps are formed with clamping part 2 by constituting as a whole driving section 1, and the driving section is provided with a driving hole 3, and clamping part is provided with " U " shape slot 4; The opening of said " U " shape slot is towards deviating from the driving section direction, and " U " shape slot opening part is provided with one and imports inclined-plane 5.
The driving section is identical with clamping part thickness.
Lead frame is by the clamping of lead frame transmission anchor clamps, and transmission in automatic bonding die equipment has together realized adopting the sliver of the device of lead frame, the mechanization of bonding die operation.
What should explain at last is: obviously, the foregoing description only be for explain clearly that the utility model does for example, and be not qualification to execution mode.For the those of ordinary skill in affiliated field, on the basis of above-mentioned explanation, can also make other multi-form variation or change.Here need not also can't give exhaustive to all execution modes.And conspicuous variation of being amplified out thus or change still are among the protection range of the utility model.
Claims (2)
1. lead frame transmission anchor clamps; It is characterized in that: said anchor clamps are formed by constituting as a whole driving section and clamping part; The driving section is provided with a driving hole; Clamping part is provided with " U " shape slot, and the opening of said " U " shape slot is towards deviating from the driving section direction, and " U " shape slot opening part is provided with one and imports the inclined-plane.
2. lead frame transmission anchor clamps as claimed in claim 1 is characterized in that: the driving section is identical with clamping part thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203174312U CN202259229U (en) | 2011-08-29 | 2011-08-29 | Lead wire framework transmission clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203174312U CN202259229U (en) | 2011-08-29 | 2011-08-29 | Lead wire framework transmission clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202259229U true CN202259229U (en) | 2012-05-30 |
Family
ID=46120428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203174312U Expired - Fee Related CN202259229U (en) | 2011-08-29 | 2011-08-29 | Lead wire framework transmission clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202259229U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111199941A (en) * | 2018-11-16 | 2020-05-26 | 泰州友润电子科技股份有限公司 | High-insulation lead frame and gluing method |
-
2011
- 2011-08-29 CN CN2011203174312U patent/CN202259229U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111199941A (en) * | 2018-11-16 | 2020-05-26 | 泰州友润电子科技股份有限公司 | High-insulation lead frame and gluing method |
| CN111199941B (en) * | 2018-11-16 | 2022-03-25 | 泰州友润电子科技股份有限公司 | High-insulation lead frame and gluing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20120829 |