CN208000911U - SMC chip-packaging structures and device - Google Patents
SMC chip-packaging structures and device Download PDFInfo
- Publication number
- CN208000911U CN208000911U CN201820389547.9U CN201820389547U CN208000911U CN 208000911 U CN208000911 U CN 208000911U CN 201820389547 U CN201820389547 U CN 201820389547U CN 208000911 U CN208000911 U CN 208000911U
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- Prior art keywords
- tablet
- chip
- smc
- packaging structures
- packaging
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8534—Bonding interfaces of the connector
- H01L2224/85345—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Packages (AREA)
Abstract
The utility model provides SMC chip-packaging structures and device, is related to technical field of electronic accessory, including shell and SMC chip-packaging structures, SMC chip-packaging structures are wrapped in enclosure;SMC chip-packaging structures include:First tablet and the second tablet, the first tablet top are connected with chip structure, are attached by wire jumper with above the second tablet above chip structure;The part of first tablet is set to the outside of shell side, and the part of the second tablet is set to the outside of shell opposite side.The utility model connects tablet by using flexible wire jumper, and stress becomes smaller when cutting tablet, is hardly damaged, meanwhile, tablet is exposed, keeps ontology thinning, and bonding area becomes larger, and heat dissipation effect is more preferable.
Description
Technical field
The utility model is related to technical field of electronic accessories, more particularly, to SMC chip-packaging structures and device.
Background technology
Existing SMC chip packages knot is two-piece type, upper and lower tablet, no wire jumper.In this way, encapsulation is thicker, tablet also needs
Bend not easy to be processed, heat dissipation effect is not good enough, and, stress is larger when cutting metal, the fragile deformation of tablet.
Utility model content
In view of this, the purpose of this utility model is to provide SMC chip-packaging structures and devices, by using flexible
Wire jumper connect tablet, cut tablet when stress become smaller, be hardly damaged, meanwhile, tablet is exposed, keeps ontology thinning, bonding area
Become larger, heat dissipation effect is more preferable.
In a first aspect, the utility model embodiment provides a kind of SMC chip-packaging structures, wherein including:First tablet
With the second tablet, the first tablet top is connected with chip structure, the chip structure top and second tablet top
It is attached by wire jumper.
With reference to first aspect, the utility model embodiment provides the first possible embodiment of first aspect,
In, the wire jumper includes the frustum cone structure being connected in one and straight panel structure;
The frustum cone structure is connected to above the chip structure, and the straight panel structure is connected on second tablet
Side.
With reference to first aspect, the utility model embodiment provides second of possible embodiment of first aspect,
In, the chip structure includes chip, and weld tabs is respectively welded above and below the chip.
With reference to first aspect, the utility model embodiment provides the third possible embodiment of first aspect,
In, first tablet with second tablet is cut by a whole tablet;
Second tablet after excision forming includes three sections, and first segment is connect with the wire jumper, and second segment is by described the
One section of end, which is bent downward, to be extended to form, and third section is bent by the end of the second segment and extended to form in the horizontal direction, and
The third section is in same level with first tablet.
The third possible embodiment with reference to first aspect, the utility model embodiment provide the of first aspect
Four kinds of possible embodiments, wherein the level interval between first tablet and the third section of second tablet is
1.5mm。
With reference to first aspect, the utility model embodiment provides the 5th kind of possible embodiment of first aspect,
In, the material of the wire jumper is copper.
With reference to first aspect, the utility model embodiment provides the 6th kind of possible embodiment of first aspect,
In, the material of first tablet and second tablet is copper.
Second aspect, the utility model embodiment also provide a kind of SMC chip packaging devices, wherein including shell and such as
Upper any one of them SMC chip-packaging structures;
The SMC chip-packaging structures are wrapped in the enclosure, and the part of the first tablet is set to the shell
The outside of side, the part of second tablet are set to the outside of the shell opposite side.
In conjunction with second aspect, the utility model embodiment provides the first possible embodiment of second aspect,
In, the material of the shell is epoxy resin.
In conjunction with second aspect, the utility model embodiment provides second of possible embodiment of second aspect,
In, the height of the shell is 1.6~1.7mm.
The utility model embodiment brings following advantageous effect:
SMC chip-packaging structures and device provided by the utility model, including shell and SMC chip-packaging structures, SMC cores
Chip package is wrapped in enclosure;SMC chip-packaging structures include:First tablet and the second tablet, the first tablet top
It is connected with chip structure, is attached by wire jumper with above the second tablet above chip structure;The part of first tablet is arranged
Outside in shell side, the part of the second tablet are set to the outside of shell opposite side.The utility model is by using having
The wire jumper of elasticity connects tablet, and stress becomes smaller when cutting tablet, is hardly damaged, meanwhile, tablet is exposed, keeps ontology thinning, welding
Area becomes larger, and heat dissipation effect is more preferable.
Other feature and advantage of the utility model will illustrate in the following description, also, partly from specification
In become apparent, or understood by implementing the utility model.The purpose of this utility model and other advantages are illustrating
Specifically noted structure is realized and is obtained in book, claims and attached drawing.
To enable the above objects, features, and advantages of the utility model to be clearer and more comprehensible, preferred embodiment cited below particularly, and
The appended attached drawing of cooperation, is described in detail below.
Description of the drawings
It, below will be right in order to illustrate more clearly of specific embodiment of the present invention or technical solution in the prior art
Specific implementation mode or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, it is described below
In attached drawing be that some embodiments of the utility model are not paying creativeness for those of ordinary skill in the art
Under the premise of labour, other drawings may also be obtained based on these drawings.
Fig. 1 is the SMC chip-packaging structure stereograms that the utility model embodiment one provides;
Fig. 2 is the SMC chip-packaging structure left views that the utility model embodiment one provides;
Fig. 3 is the SMC chip-packaging structure right views that the utility model embodiment one provides;
Fig. 4 is the SMC chip packaging device front views that the utility model embodiment two provides;
Fig. 5 is the SMC chip packaging device stereograms that the utility model embodiment two provides;
Fig. 6 is the SMC chip packaging device vertical views that the utility model embodiment two provides;
Fig. 7 is the SMC chip packaging device upward views that the utility model embodiment two provides.
Icon:The first tablets of 01-;The second tablets of 02-;03- wire jumpers;04- chip structures;05- shells.
Specific implementation mode
To keep the purpose, technical scheme and advantage of the utility model embodiment clearer, below in conjunction with attached drawing to this
The technical solution of utility model is clearly and completely described, it is clear that described embodiment is that the utility model part is real
Example is applied, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making
The every other embodiment obtained under the premise of creative work, shall fall within the protection scope of the present invention.
Existing SMC chip packages become tablet, and from inside, stretching re-extends into bottom.In this way, tablet is directly taken with tablet
Connect, cause encapsulation thicker, tablet also needs bend not easy to be processed, and heat dissipation effect is not good enough, and, when cutting metal stress compared with
Greatly, the fragile deformation of tablet.
Based on this, the utility model embodiment provide SMC chip-packaging structures and device, by using flexible jump
Line connects tablet, and stress becomes smaller when cutting tablet, is hardly damaged, meanwhile, tablet is exposed, keeps ontology thinning, and bonding area becomes larger,
Heat dissipation effect is more preferable.
For ease of understanding the present embodiment, first to the SMC chip package knots disclosed in the utility model embodiment
Structure describes in detail.
Embodiment one:
Fig. 1 is the SMC chip-packaging structure schematic diagrames that the utility model embodiment one provides.
Referring to figs. 1 to Fig. 3, SMC chip-packaging structures include:First tablet 01 and the second tablet 02, on the first tablet 01
Side is connected with chip structure 04, and 04 top of chip structure is attached with 02 top of the second tablet by wire jumper 03.
First tablet 01 with the second tablet 02 is cut by a whole tablet, the second tablet 02 packet after excision forming
Three sections are included, first segment is connect with wire jumper 03, and second segment is bent downward by the end of first segment and extended to form, and third section is by second segment
End bend extend to form in the horizontal direction, and third section is in same level with the first tablet 01.
It is connected by wire jumper 03 between two tablets, when using matrix process, wire jumper 03 has elasticity, is answered when cutting metal
Power becomes smaller, and tablet is hardly damaged.
03 welding section of wire jumper is opposite to be parallel to the second tablet 02, and 03 span of wire jumper is short, and relative level reduces welding production
Welding stress prevents Product jointing stress release, pressure break chip and fail.
The first tablet 01 after excision forming is larger relative to the area of the second tablet 02, and wire-jumper type is used between tablet
Connection structure so that chip welding section increases, and can place the chip of maximum 10A.
Horizontal distance between first tablet 01 and the third section of the second tablet 02 is 1.5mm.
The material of first tablet 01 and the second tablet 02 can be copper.
Wire jumper 03 includes the frustum cone structure being connected in one and straight panel structure.Frustum cone structure is small bowl-shape, the mouth of mouth outsole
It is the plane parallel with the first tablet 01 bottom of with.
Frustum cone structure is connected to 04 top of chip structure, and straight panel structure is connected to the top of the first segment of the second tablet 02.
The material of wire jumper 03 is copper.
Chip structure 04 includes chip, is respectively welded weld tabs above and below chip, plays welding;The weldering of lower section
Piece is welded on the first tablet 01, and the weld tabs of top is welded in the bottom of the frustum cone structure of wire jumper 03.
Embodiment two:
Fig. 4 is the SMC chip packaging device front views that the utility model embodiment two provides.
With reference to Fig. 4 to Fig. 7, SMC chip packaging devices include shell 05 and above-mentioned SMC chip-packaging structures.SMC chips
Encapsulating structure is wrapped in inside shell 05, and the part of the first tablet 01 is set to the outside of 05 side of shell, the second tablet 02
The part of third section be set to the outside of 05 opposite side of shell.The exposed structure setting of this tablet so that SMC chips
Packaging system ontology is thinning, and bonding area becomes larger, and heat dissipation effect is more preferable.The thin thickness of ontology, that is, the height of shell 05 is
1.6~1.7mm.
The material of shell 05 is epoxy resin.
It should be noted that:Similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined, then it further need not be defined and explained in subsequent attached drawing in a attached drawing.
The utility model embodiment brings following advantageous effect:
SMC chip-packaging structures and device provided by the utility model, including shell and SMC chip-packaging structures, SMC cores
Chip package is wrapped in enclosure;SMC chip-packaging structures include:First tablet and the second tablet, the first tablet top
It is connected with chip structure, is attached by wire jumper with above the second tablet above chip structure;The part of first tablet is arranged
Outside in shell side, the part of the second tablet are set to the outside of shell opposite side.The utility model is by using having
The wire jumper of elasticity connects tablet, and stress becomes smaller when cutting tablet, is hardly damaged, meanwhile, tablet is exposed, keeps ontology thinning, welding
Area becomes larger, and heat dissipation effect is more preferable.
In addition, in the description of the utility model embodiment unless specifically defined or limited otherwise, term " installation ",
" connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally connect
It connects;It can be mechanical connection, can also be electrical connection;It can be directly connected, can also indirectly connected through an intermediary, it can
To be the connection inside two elements.For the ordinary skill in the art, it can understand above-mentioned term with concrete condition
Concrete meaning in the present invention.
It is in the description of the present invention, it should be noted that term "center", "upper", "lower", "left", "right", " perpendicular
Directly ", the orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is only
The utility model and simplifying describes for ease of description, do not indicate or imply the indicated device or element must have it is specific
Orientation, with specific azimuth configuration and operation, therefore should not be understood as limiting the present invention.In addition, term " the
One ", " second ", " third " are used for description purposes only, and are not understood to indicate or imply relative importance.
In several embodiments provided herein, it should be understood that disclosed systems, devices and methods, it can be with
It realizes by another way.The apparatus embodiments described above are merely exemplary, for example, the division of the unit,
Only a kind of division of logic function, formula that in actual implementation, there may be another division manner, in another example, multiple units or component can
To combine or be desirably integrated into another system, or some features can be ignored or not executed.Another point, it is shown or beg for
The mutual coupling, direct-coupling or communication connection of opinion can be by some communication interfaces, device or unit it is indirect
Coupling or communication connection can be electrical, machinery or other forms.
The unit illustrated as separating component may or may not be physically separated, aobvious as unit
The component shown may or may not be physical unit, you can be located at a place, or may be distributed over multiple
In network element.Some or all of unit therein can be selected according to the actual needs to realize the mesh of this embodiment scheme
's.
Finally it should be noted that:Embodiment described above, only specific embodiment of the present utility model, to illustrate this
The technical solution of utility model, rather than its limitations, the scope of protection of the utility model is not limited thereto, although with reference to aforementioned
The utility model is described in detail in embodiment, it will be understood by those of ordinary skill in the art that:It is any to be familiar with this skill
The technical staff in art field within the technical scope disclosed by the utility model, still can be to the skill recorded in previous embodiment
Art scheme modify or can readily occur in variation or equivalent replacement of some of the technical features;And these modifications,
Variation is replaced, the spirit and model of the utility model embodiment technical solution that it does not separate the essence of the corresponding technical solution
It encloses, should be covered within the scope of the utility model.Therefore, the scope of protection of the utility model is answered described is wanted with right
Subject to the protection domain asked.
Claims (10)
1. a kind of SMC chip-packaging structures, which is characterized in that including:First tablet and the second tablet, the first tablet top
It is connected with chip structure, is attached by wire jumper with above second tablet above the chip structure.
2. SMC chip-packaging structures according to claim 1, which is characterized in that the wire jumper includes being connected in one
Frustum cone structure and straight panel structure;
The frustum cone structure is connected to above the chip structure, and the straight panel structure is connected to above second tablet.
3. SMC chip-packaging structures according to claim 1, which is characterized in that the chip structure includes chip, described
Weld tabs is respectively welded above and below chip.
4. SMC chip-packaging structures according to claim 1, which is characterized in that first tablet and second material
Piece is cut by a whole tablet;
Second tablet after excision forming includes three sections, and first segment is connect with the wire jumper, and second segment is by the first segment
End bend downward and extend to form, third section is bent by the end of the second segment and is extended to form in the horizontal direction, and described
Third section is in same level with first tablet.
5. SMC chip-packaging structures according to claim 4, which is characterized in that first tablet and second material
Level interval between the third section of piece is 1.5mm.
6. SMC chip-packaging structures according to claim 1, which is characterized in that the material of the wire jumper is copper.
7. SMC chip-packaging structures according to claim 1, which is characterized in that first tablet and second material
The material of piece is copper.
8. a kind of SMC chip packaging devices, which is characterized in that including shell and such as claim 1~6 any one of them SMC
Chip-packaging structure;
The SMC chip-packaging structures are wrapped in the enclosure, and the part of the first tablet is set to the shell side
Outside, the part of second tablet is set to the outside of the shell opposite side.
9. SMC chip packaging devices according to claim 8, which is characterized in that the material of the shell is epoxy resin.
10. SMC chip packaging devices according to claim 8, which is characterized in that the height of the shell be 1.6~
1.7mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820389547.9U CN208000911U (en) | 2018-03-21 | 2018-03-21 | SMC chip-packaging structures and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820389547.9U CN208000911U (en) | 2018-03-21 | 2018-03-21 | SMC chip-packaging structures and device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208000911U true CN208000911U (en) | 2018-10-23 |
Family
ID=63838904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820389547.9U Active CN208000911U (en) | 2018-03-21 | 2018-03-21 | SMC chip-packaging structures and device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208000911U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112992819A (en) * | 2021-04-26 | 2021-06-18 | 佛山市国星光电股份有限公司 | Packaging device and manufacturing method thereof |
-
2018
- 2018-03-21 CN CN201820389547.9U patent/CN208000911U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112992819A (en) * | 2021-04-26 | 2021-06-18 | 佛山市国星光电股份有限公司 | Packaging device and manufacturing method thereof |
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