CN208444831U - A kind of high-power encapsulation chip pin structure - Google Patents
A kind of high-power encapsulation chip pin structure Download PDFInfo
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- CN208444831U CN208444831U CN201821164775.2U CN201821164775U CN208444831U CN 208444831 U CN208444831 U CN 208444831U CN 201821164775 U CN201821164775 U CN 201821164775U CN 208444831 U CN208444831 U CN 208444831U
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- bending part
- pin
- chip
- plane
- bending
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Abstract
The utility model relates to a kind of high-power encapsulation chip pin structures, pin is arranged to the packed part and External connecting part two parts of soldering together, so that the External connecting part of pin is when cutting redundance and bending forming, reduce the stress for being transmitted to packed part, to reduce stress suffered by chip, spoilage of the chip in production is reduced, the yields of encapsulation chip is improved.
Description
Technical field
The utility model relates to a kind of high-power encapsulation chip pin structures, belong to chip encapsulation technology field.
Background technique
It is with epoxy resin that the encapsulation such as chip, pin are integral for encapsulating chip.It is as shown in Figure 1 a kind of common encapsulation
The structure chart of chip, the epoxy resin including inside containing chip, the first pin and the second pin setting as positive and negative anodes exist
The bottom end and side of epoxy resin.
Second pin needs to draw from epoxy resin side, and is bent to form the conduction flushed with the first pin several times
Contact surface, in the prior art, second pin are usually a whole copper piece, when cutting off pin redundance and bending pin,
Chip of the meeting into epoxy resin generates stress, and damage is easy to happen when chip is by stress, leads to product yield not
Foot.
Utility model content
Technical problem to be solved by the utility model is: being easy to happen in encapsulation process to solve chip in the prior art
The problem of damage, provides a kind of high-power encapsulation chip pin structure that can be improved production product yield.
The technical scheme adopted by the utility model to solve the technical problem is as follows:
A kind of high-power encapsulation chip pin structure, comprising:
Prolonged including the packed part for being arranged in epoxy resin and with packed part by what scolding tin welded together
The External connecting part outside epoxy resin is reached, External connecting part forms conductive contact surfaces after several bendings；
The packed part includes rectangular contact portion, be arranged in contact portion a line be obliquely installed it is first curved
The second bending part of the first bending part side extended towards plane where contact portion is arranged in folding part；
The External connecting part includes rectangular external connection portion, and the third being obliquely installed being arranged in external connection portion a line is curved
Folding part is linked together between third bending part and the second bending part by soldering.
Preferably, the high-power encapsulation chip pin structure of the utility model, plane and the first bending part where contact portion
The angle α of place plane is 60 ° -80 °, the angle β of plane where plane where the first bending part and the second bending part is 40 ° -
60 °, the angle γ of plane is 40 ° -60 ° where plane where third bending part and external connection portion.
Preferably, the high-power encapsulation chip pin structure of the utility model, the end of second bending part form
Positioning groove, the end of the third bending part form the positioning region with positioning groove cooperation.
Preferably, the high-power encapsulation chip pin structure of the utility model, close to third bending part in the external connection portion
Place forms stopper projection.
Preferably, the high-power encapsulation chip pin structure of the utility model, packed part and with External connecting part be plating
Zinc-copper material is made.
The beneficial effects of the utility model are:
The high-power encapsulation chip pin structure of the utility model, by pin be arranged to the packed part of soldering together and
External connecting part two parts, so that the External connecting part of pin, when cutting redundance and bending forming, reduction is transmitted to encapsulation
Partial stress reduces spoilage of the chip in production, improves the non-defective unit of encapsulation chip to reduce stress suffered by chip
Rate.
Detailed description of the invention
The present invention will be further described with reference to the accompanying drawings and examples.
Fig. 1 is the structural schematic diagram of the encapsulation chip of the utility model embodiment；
Fig. 2 be first pin of the utility model embodiment, copper sheet, soldering-tin layer, second pin configuration schematic diagram；
Fig. 3 a and Fig. 3 b are the main view and side view of the packed part of the second pin of the utility model embodiment respectively；
Fig. 4 a and Fig. 4 b are the main view and side view of the External connecting part of the second pin of the utility model embodiment respectively；
Appended drawing reference in figure are as follows: 1- epoxy resin；The first pin of 2-；3- second pin；41- chip；42- copper sheet；43-
Soldering-tin layer；301- contact portion；The first bending part of 302-；The second bending part of 303-；304- positioning groove；311- external connection portion；312-
Third bending part；313- stopper projection；The positioning region 314-.
Specific embodiment
It should be noted that in the absence of conflict, the spy in embodiment and embodiment in the utility model creation
Sign can be combined with each other.
The utility model create description in, it is to be understood that term " center ", " longitudinal direction ", " transverse direction ", "upper",
The orientation or position of the instructions such as "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside"
Relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description the utility model and creates and simplify description,
Rather than the device or element of indication or suggestion meaning must have a particular orientation, be constructed and operated in a specific orientation, because
This should not be understood as the limitation created to the utility model.In addition, term " first ", " second " etc. are used for description purposes only, and
It cannot be understood as indicating or implying relative importance or implicitly indicate the quantity of indicated technical characteristic.It defines as a result,
The feature of " first ", " second " etc. can explicitly or implicitly include one or more of the features.In the utility model
In the description of creation, unless otherwise indicated, the meaning of " plurality " is two or more.
In the description that the utility model is created, it should be noted that unless otherwise clearly defined and limited, term
" installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be fixedly connected, may be a detachable connection or one
Connect to body；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, it can also be indirect by intermediary
It is connected, can be the connection inside two elements.For the ordinary skill in the art, it can be managed by concrete condition
Solve concrete meaning of the above-mentioned term in the utility model creation.
The utility model will be described in detail below with reference to the accompanying drawings and embodiments creates.
Embodiment 1
The present embodiment provides a kind of high-power encapsulation chip pin structures, as shown in Fig. 3 a, 3b, 4a, 4b, comprising:
Welded together including the packed part for being arranged in epoxy resin (1) and with packed part by scolding tin
The External connecting part of epoxy resin (1) outside is extended to, External connecting part (31) forms conductive contact surfaces after several bendings；
The packed part includes rectangular contact portion 301, and being obliquely installed in 301 a line of contact portion is arranged in
The second bending part of 302 side of the first bending part extended towards 301 place plane of contact portion is arranged in first bending part 302
303；
The External connecting part includes rectangular external connection portion 311, and being obliquely installed in 311 a line of external connection portion is arranged in
Third bending part 312 is linked together between third bending part 312 and the second bending part 303 by soldering.
The angle α of 301 place plane of contact portion and 302 place plane of the first bending part is 60 ° -80 °, the first bending part
The angle β of 302 place planes and 303 place plane of the second bending part is 40 ° -60 °, 312 place plane of third bending part and outer
The angle γ of 311 place plane of socket part is 40 ° -60 °.The preferred cooperation of above-mentioned angle can make third bending part 312 and second
Biggish contact surface is formed between bending part 303, improves weld strength；Stopper projection 313 can prevent the second bending part 303 with
Scolding tin between third bending part 312 flows down after being melted down；
The end of second bending part 303 forms positioning groove 304, the end molding of the third bending part 312
There is the positioning region 314 cooperated with positioning groove 304.
Stopper projection 313 is formed at third bending part 312 in the external connection portion 311.
Preferably, packed part and be that zinc-plated copper product is made with External connecting part.
Encapsulation chip pin is arranged to the encapsulation of soldering together by the high-power encapsulation chip pin structure of the present embodiment
31 two parts of part 30 and External connecting part, so that the External connecting part 31 of encapsulation chip pin is in cutting redundance and is bent into
When type, the stress for being transmitted to packed part 30 is reduced, to reduce stress suffered by chip 41, reduces damage of the chip 41 in production
Bad rate improves the yields of encapsulation chip.Copper sheet 42 is set between chip 41, chip 41 is separated by copper sheet 42, can be provided
Electric conductivity and thermal conductivity between chip 41 increase contact area.
Embodiment 2
The present embodiment provides a kind of encapsulation chips, as shown in Figure 1, comprising:
Epoxy resin 1；
First pin 2 is located at 1 bottom of epoxy resin, and 2 bottom surface of the first pin exposes；
Second pin 3 is stretched out, the high-power encapsulation chip pin structure of structure such as embodiment 1 from 1 side of epoxy resin,
Conductive contact surfaces are flushed with the first pin 2；
Several chips 41, chip 41 and core are provided between first pin 2 and the packed part of the second pin 3
It is provided with copper sheet 42 between piece 41, is 43 (material of soldering-tin layer between the first pin 2, second pin 3 and copper sheet 42 and chip 41
For Pb92.5Sn5Ag2.5), chip 41, copper sheet 42 and soldering-tin layer 43 are encapsulated in epoxy resin 1；The thickness of the copper sheet 42
For 6-8mil；There are 3 pieces of chips 41 as shown in Figure 2；
The second pin 2 is "T"-shaped.
Further, the end of second bending part 303 forms positioning groove 304, the third bending part 312
End forms the positioning region 314 cooperated with positioning groove 304, by the cooperation of positioning region 314 and positioning groove 304, so that
In welding, the relative position of External connecting part and packed part is limited.
External connection portion 311 forms the shape of second pin 3 in Fig. 1 after bending twice.
First pin 2 is that zinc-plated copper product is made with second pin 3, as positive and negative anodes.
Embodiment 3
The present embodiment provides a kind of chip package production methods, comprising the following steps:
S1: the packed part 30 of the first pin 2, several chips 41, second pin 3 is stacked, chip 41 and core
Copper sheet 42, the first pin 2, the packed part 30 of second pin 3 and copper sheet 42 are placed between piece 41 and chip 41 is placed and welded
Tin, and apply pressure fixing and form chip and pin assembly；
The packed part 30 of the second pin 3 includes rectangular contact portion 301, is arranged in 301 a line of contact portion
The first bending part 302 being obliquely installed, be arranged in 302 side of the first bending part towards 301 place plane of contact portion extend
The second bending part 303, the angle α of 301 place plane of contact portion and 302 place plane of the first bending part is 60 ° -80 °, first
The angle β of 302 place plane of bending part and 303 place plane of the second bending part is 40 ° -60 °；
The External connecting part 31 of the second pin 3 includes rectangular external connection portion 311, is arranged in 311 a line of external connection portion
The third bending part 312 being obliquely installed, form stopper projection at third bending part 312 in the external connection portion 311
313, the angle γ of 312 place plane of third bending part and 311 place plane of external connection portion is 40 ° -60 °；Third bending part 312 with
It is linked together between second bending part 303 by soldering；The preferred cooperation of above-mentioned angle can make third bending part 312 and
Biggish contact surface is formed between two bending parts 303, improves weld strength；
S2: the chip of S1 and pin assembly are passed through into scolding tin stove heating, weld melts soldering tin by corresponding component；
S3: chip is encapsulated with pin assembly by epoxy resin 1, exposes 2 bottom of the first pin, the second pin
3 External connecting part 31 is pierced by from 1 side of epoxy resin；
S4: the redundance of the first pin 2 and second pin 3 of excision；
S5: the External connecting part 31 of second pin 3 is formed to the conductive contact flushed with the first pin 2 after several bendings
Face.
It is enlightenment, through the above description, related work people with the above-mentioned desirable embodiment according to the utility model
Member can carry out various changes and amendments in the range of without departing from this item utility model technical idea completely.This item is real
It is not limited to the contents of the specification with novel technical scope, it is necessary to its technology is determined according to scope of the claims
Property range.
Claims (5)
1. a kind of high-power encapsulation chip pin structure characterized by comprising
Including the extension for the packed part in epoxy resin (1) to be arranged and is welded together with packed part by scolding tin
To the External connecting part of epoxy resin (1) outside, External connecting part (31) forms conductive contact surfaces after several bendings；
The packed part includes rectangular contact portion (301), and what is be arranged in contact portion (301) a line is obliquely installed
Second extended towards plane where contact portion (301) in the first bending part (302) side is arranged in first bending part (302)
Bending part (303)；
The External connecting part includes rectangular external connection portion (311), and what is be arranged in external connection portion (311) a line is obliquely installed
Third bending part (312) is linked together between third bending part (312) and the second bending part (303) by soldering.
2. high-power encapsulation chip pin structure according to claim 1, which is characterized in that flat where contact portion (301)
The angle α of plane where face and the first bending part (302) is 60 ° -80 °, plane where the first bending part (302) and the second bending
The angle β of plane where portion (303) is 40 ° -60 °, plane where plane where third bending part (312) and external connection portion (311)
Angle γ be 40 ° -60 °.
3. high-power encapsulation chip pin structure according to claim 1, which is characterized in that second bending part
(303) end forms positioning groove (304), and the end of the third bending part (312) forms and positioning groove (304)
The positioning region (314) of cooperation.
4. high-power encapsulation chip pin structure according to claim 1, which is characterized in that on the external connection portion (311)
Stopper projection (313) are formed at third bending part (312).
5. high-power encapsulation chip pin structure according to claim 1, which is characterized in that packed part and and external connection portion
Dividing is that zinc-plated copper product is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821164775.2U CN208444831U (en) | 2018-07-23 | 2018-07-23 | A kind of high-power encapsulation chip pin structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821164775.2U CN208444831U (en) | 2018-07-23 | 2018-07-23 | A kind of high-power encapsulation chip pin structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208444831U true CN208444831U (en) | 2019-01-29 |
Family
ID=65086625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821164775.2U Active CN208444831U (en) | 2018-07-23 | 2018-07-23 | A kind of high-power encapsulation chip pin structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208444831U (en) |
-
2018
- 2018-07-23 CN CN201821164775.2U patent/CN208444831U/en active Active
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