CN206364007U - Lead frame - Google Patents
Lead frame Download PDFInfo
- Publication number
- CN206364007U CN206364007U CN201621015973.3U CN201621015973U CN206364007U CN 206364007 U CN206364007 U CN 206364007U CN 201621015973 U CN201621015973 U CN 201621015973U CN 206364007 U CN206364007 U CN 206364007U
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- CN
- China
- Prior art keywords
- radiating part
- lead portion
- lead frame
- kink
- vertical component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model belongs to technical field of integrated circuits, more particularly to a kind of lead frame.Lead frame, it includes lead portion and the radiating part being connected with lead portion, and chip is arranged on radiating part, it is characterised in that：Described lead portion is linked together with radiating part by attachment structure, described attachment structure includes the horizontal part being connected with lead portion, the end of horizontal part is connected with vertical component effect, the lower end of vertical component effect is provided with kink, through hole is provided with described radiating part, the bottom surface of kink through through hole and kink and radiating part is offseted, and vertical component effect is connected in through hole.The utility model designs lead portion and radiating part connects reliable lead frame, it is ensured that the overall construction intensity of lead frame, will not be the problem of there is coming off separation.
Description
Technical field
The utility model belongs to technical field of integrated circuits, more particularly to a kind of lead frame.
Background technology
Lead frame is used as integrated circuit in semiconductor element production process (Integrated Circuit, IC) chip
Carrier, is to make the key of chip internal circuits exit and outer lead formation electric loop, is also the base in electronics and information industry
Plinth material, demand is very big.Lead frame in the market is mostly pin and fin integral structure, by profile shapes
Material is processed, and excessively relies on foreign material, and has that waste of raw materials is serious, production cost is high, production cycle length, processing essence
Degree and stability are poor and cause the problem of product fraction defective is high.
In addition in the prior art, there is an a kind of lead frame for separate type, it on heat sink by being provided with one
The projection of an embedded groove is provided with groove, leading part, both fix by being interference fitted, there is connection insecure
Problem.
The content of the invention
The utility model in view of the shortcomings of the prior art, reliably draw by the utility model design lead portion and radiating part connection
, will not be the problem of there is coming off separation in wire frame, it is ensured that the overall construction intensity of lead frame.
The technical solution of the utility model is as follows：
Lead frame, it includes lead portion and the radiating part being connected with lead portion, and chip is arranged on radiating part, and it is special
Levy and be：Described lead portion is linked together with radiating part by attachment structure, and described attachment structure includes and lead portion
The horizontal part of connection, the end of horizontal part is connected with vertical component effect, and the lower end of vertical component effect is provided with kink, described radiating part
Through hole is provided with, the bottom surface of kink through through hole and kink and radiating part is offseted, and vertical component effect is connected in through hole.
Described lead portion includes integrated pin position, and the left end at pin position is symmetrically arranged with wire jumper connecting portion, jumps
Line connecting portion is connected with chip, and described attachment structure is located between two wire jumper connecting portions.
Described radiating part includes heat sink, and the upper surface of heat sink is provided with the groove being embedded in for chip, heat sink
Lower surface is provided with radiating ribs.
In summary, the utility model has the advantages that：
1st, the utility model is improved the attachment structure of leading part and radiating part, using the spacing connection side of grafting
Formula, improves the connection reliability of leading part and radiating part, it is to avoid both loosen, causing leading part to be connected with chip can not
By the problem of, it is ensured that the overall construction intensity of lead frame, will not be the problem of occur coming off separation.
2nd, the leading part and radiating part in the utility model can reduce difficulty of processing with separate machined, improve production
Efficiency, saves manufacturing cost.
Brief description of the drawings
Fig. 1 is composition schematic diagram of the present utility model；
Fig. 2 is schematic side view of the present utility model；
1 is lead portion in figure, and 2 be horizontal part, and 3 be wire jumper connecting portion, and 4 be chip, and 5 be radiating part, and 21 be vertical component effect, 22
It is radiating ribs for kink, 51,52 be groove, and 53 be through hole.
Embodiment
The utility model is described further below in conjunction with the accompanying drawings.
As depicted in figs. 1 and 2, lead frame, it includes lead portion 1 and the radiating part being connected with lead portion 5, chip 4
It is arranged on radiating part 5, described lead portion 1 is linked together with radiating part 5 by attachment structure, described attachment structure bag
The horizontal part 2 being connected with lead portion is included, the end of horizontal part 2 is connected with vertical component effect 21, and the lower end of vertical component effect 21 is provided with bending
Through hole 53, bottom surface phase of the kink 22 through through hole and kink 22 and radiating part are provided with portion 22, described radiating part 5
Support, vertical component effect 21 is connected in through hole 53.
Described lead portion 1 includes integrated pin position, and the left end at pin position is symmetrically arranged with wire jumper connecting portion 3,
Wire jumper connecting portion 3 is connected with chip 4, and described attachment structure is located between two wire jumper connecting portions 3, described wire jumper connecting portion
Lower surface provided with connection bump with wafer surface.
The connection of lead portion and radiating part is realized by attachment structure, it is ensured that connection reliability between the two, gram
The risk come off existed in the prior art using interference fit is taken.
Described radiating part 5 includes heat sink, and the upper surface of heat sink is provided with the groove 52 being embedded in for chip, heat sink
Lower surface be provided with radiating ribs 51, Embedded mounting means is used between chip and heat sink, is not in displacement, it is convenient
Follow-up weld job, it is ensured that the accuracy of positioning, the heat in the making while radiating ribs set can work chip
Distributed, while the heat in also being converged to welding process radiates, it is to avoid the injury that temperature overheating is caused to chip.
In summary, the utility model has the advantages that：
1st, the utility model is improved the attachment structure of leading part and radiating part, using the spacing connection side of grafting
Formula, improves the connection reliability of leading part and radiating part, it is to avoid both loosen, causing leading part to be connected with chip can not
By the problem of, it is ensured that the overall construction intensity of lead frame, will not be the problem of occur coming off separation.
2nd, the leading part and radiating part in the utility model can reduce difficulty of processing with separate machined, improve production
Efficiency, saves manufacturing cost.
Claims (3)
1. lead frame, it includes lead portion and the radiating part being connected with lead portion, and chip is arranged on radiating part, its feature
It is：Described lead portion is linked together with radiating part by attachment structure, and described attachment structure includes connecting with lead portion
The horizontal part connect, the end of horizontal part is connected with vertical component effect, and the lower end of vertical component effect, which is provided with kink, described radiating part, to be set
Through hole is equipped with, the bottom surface of kink through through hole and kink and radiating part is offseted, and vertical component effect is connected in through hole.
2. lead frame according to claim 1, it is characterised in that：Described lead portion includes integrated pin position,
The left end at pin position is symmetrically arranged with wire jumper connecting portion, and wire jumper connecting portion is connected with chip, and described attachment structure is located at two
Between individual wire jumper connecting portion.
3. lead frame according to claim 1, it is characterised in that：Described radiating part includes heat sink, heat sink
Upper surface is provided with the groove being embedded in for chip, and the lower surface of heat sink is provided with radiating ribs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621015973.3U CN206364007U (en) | 2016-08-30 | 2016-08-30 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621015973.3U CN206364007U (en) | 2016-08-30 | 2016-08-30 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206364007U true CN206364007U (en) | 2017-07-28 |
Family
ID=59368071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621015973.3U Active CN206364007U (en) | 2016-08-30 | 2016-08-30 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206364007U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111199941A (en) * | 2018-11-16 | 2020-05-26 | 泰州友润电子科技股份有限公司 | High-insulation lead frame and gluing method |
-
2016
- 2016-08-30 CN CN201621015973.3U patent/CN206364007U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111199941A (en) * | 2018-11-16 | 2020-05-26 | 泰州友润电子科技股份有限公司 | High-insulation lead frame and gluing method |
| CN111199941B (en) * | 2018-11-16 | 2022-03-25 | 泰州友润电子科技股份有限公司 | High-insulation lead frame and gluing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 213126 86 Anjia Road, Chun Jiang Town, Xinbei District, Changzhou, Jiangsu Patentee after: Changzhou Golden Square New Materials Co., Ltd. Address before: 213126 86 Anjia Road, Chun Jiang Town, Xinbei District, Changzhou, Jiangsu Patentee before: Changzhou Jinfangyuan Copper Co., Ltd. |