CN109119397A - A kind of ultrathin type stamp-mounting-paper diode frame - Google Patents
A kind of ultrathin type stamp-mounting-paper diode frame Download PDFInfo
- Publication number
- CN109119397A CN109119397A CN201811241276.3A CN201811241276A CN109119397A CN 109119397 A CN109119397 A CN 109119397A CN 201811241276 A CN201811241276 A CN 201811241276A CN 109119397 A CN109119397 A CN 109119397A
- Authority
- CN
- China
- Prior art keywords
- chassis base
- frame
- mounting
- plate body
- stamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 4
- 238000003466 welding Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 239000011800 void material Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/4952—Additional leads the additional leads being a bump or a wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Wire Processing (AREA)
Abstract
A kind of ultrathin type stamp-mounting-paper diode frame.It is related to photovoltaic art more particularly to a kind of ultrathin stamp-mounting-paper diode frame.It is simple to provide a kind of structure, facilitates processing, connects reliable ultrathin stamp-mounting-paper diode frame.Including chassis base and frame pin, the chassis base is identical with the thickness of frame pin, spacing is equipped between the chassis base and frame pin, the inside of the chassis base is the settlement for chip placement, the frame pin in " mountain " font, including plate body and three pins being located on the outside of plate body, the plate body is towards chip placing area；The plate body is connected with the chip on settlement by wire jumper.This invention ensures that the effect of welding, is less prone to rosin joint phenomenon, improves product quality.
Description
Technical field
The present invention relates to photovoltaic art more particularly to a kind of ultrathin stamp-mounting-paper diode frames.
Background technique
With greatly developing for photovoltaic diode, the type of terminal box also becomes more and more, along with the limitation of cost,
So that people are also increasingly stringenter the performance requirement of diode.Traditional product is mainly made by axial direction and TO-263 series of products
With since the thickness of product ontology limits, the cost of terminal box, which is reduced, certain inhibition, becomes this field skill
Art personnel technical problem urgently to be resolved.
State Intellectual Property Office is CN105227129B, entitled " high thermal conductivity in the notification number of 2017.11.28 days bulletins
Patch bypass " diode, bonding area is big, has better heat dissipation performance, improves service life.However, its exist with
Lower problem: a, frame patch form step integral structure by thin slice and sheet, and work in-process, punching press difficulty is big, at high cost；b,
As shown in figure 5, wire jumper welding is welded using 3 point contacts, is easily deformed, not easily-controllable since its pin (i.e. three foot wire jumpers 7) separates
Flatness processed, in this way, being wherein easy to appear rosin joint, technique controlling difficulty is big.
Summary of the invention
The present invention facilitates processing, the reliable ultrathin type patch two of connection in view of the above problems, to provide a kind of structure simple
Pole pipe frame.
The technical scheme is that including chassis base and frame pin, the thickness of the chassis base and frame pin
It spends identical, spacing is equipped between the chassis base and frame pin, the inside of the chassis base is for chip placement
Settlement, the frame pin in " mountain " font, including plate body and three pins being located on the outside of plate body, the plate body is towards core
Piece settlement；
The plate body is connected with the chip on settlement by wire jumper.
The thickness of the chassis base is lower than 0.4mm.
The chassis base is equipped with a pair and crosses glue hole.
The chassis base and frame pin are copper.
The wire jumper is aluminium strip.
The present invention at work, the thickness of chassis base is carried out thinned, keeps it identical with the thickness of frame pin, convenient
Processing, ensure that the flatness of frame；Meanwhile frame pin being separately provided, frame pin and chassis base interval are arranged, and lead to
Aluminium strip welded connecting is crossed, in this way, only need to can realize connection by two-point contact, the effect of welding is ensure that, is less prone to void
Phenomenon is welded, product quality is improved.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention,
Fig. 2 is the package structure diagram of Fig. 1,
Fig. 3 is the schematic diagram of internal structure of Fig. 1,
Fig. 4 is the structural schematic diagram of the double frame of copper strips,
Fig. 5 is the structural schematic diagram of the prior art；
1 is chassis base in figure, and 10 be settlement, and 2 be frame pin, and 21 be ontology, and 22 be pin, and 3 be chip, and 4 be wire jumper,
5 be glue hole, and 6 be plastic-sealed body, and 7 be three foot wire jumpers.
Specific embodiment
The present invention as shown in Figure 1-3, include chassis base 1 and frame pin 2, the thickness of the chassis base and frame pin
It spends identical, spacing is equipped between the chassis base and frame pin, the inside of the chassis base is for chip placement 3
Settlement 10, the frame pin are in " mountain " font, including plate body 21 and three pins 22 being located on the outside of plate body, the plate body
Towards chip placing area 10；
Chip on the plate body and settlement is connected by wire jumper 4.
The present invention at work, the thickness of chassis base is carried out thinned, keeps it identical with the thickness of frame pin, convenient
Processing, ensure that the flatness of frame；Meanwhile frame pin being separately provided, frame pin and chassis base interval are arranged, and lead to
Aluminium strip welded connecting is crossed, in this way, only need to can realize connection by two-point contact, the effect of welding is ensure that, is less prone to void
Phenomenon is welded, product quality is improved.
Frame pin is arranged to plate body and three pins are integrally formed, facilitates processing；Meanwhile it only need to be by aluminium strip connecting plate
Body facilitates processing.Three pins are connected, and keep same plane, weld easily controllable.Finally, passing through plastic-sealed body 6 for frame
Bottom plate and frame pin carry out plastic packaging.
The thickness of the chassis base 1 is lower than 0.4mm.It is carried out by the thickness to chassis base thinned, reduces cost, just
In processing.In this way, chassis base and frame pin can facilitate processing by copper strips punch forming.
The chassis base is equipped with a pair and crosses glue hole 5.In this way, the bond strength of reinforced frame bottom plate and plastic packaging material, even
It connects reliably, improves service life.
The chassis base and frame pin be it is copper, convenient for by copper strips punch forming, processing is simple, guarantee that frame is whole
Body flatness.
The wire jumper 4 is aluminium strip, facilitates processing, at low cost.
As shown in figure 4, processing is simple with normal copper strips punch forming after being thinned, guarantee frame flatness.Double life
Production efficiency is double, and material/equipment overhead cost is low.
Claims (5)
1. a kind of ultrathin type stamp-mounting-paper diode frame, which is characterized in that including chassis base and frame pin, the framework bottom
Plate is identical with the thickness of frame pin, and spacing, the inside of the chassis base are equipped between the chassis base and frame pin
For the settlement for chip placement, the frame pin is drawn in " mountain " font, including plate body and be located on the outside of plate body three
Foot, the plate body is towards chip placing area；
The plate body is connected with the chip on settlement by wire jumper.
2. a kind of ultrathin stamp-mounting-paper diode frame according to claim 1, which is characterized in that the chassis base
Thickness is lower than 0.4mm.
3. a kind of ultrathin stamp-mounting-paper diode frame according to claim 1, which is characterized in that on the chassis base
Glue hole is crossed equipped with a pair.
4. a kind of ultrathin stamp-mounting-paper diode frame according to claim 1, which is characterized in that the chassis base and
Frame pin is copper.
5. a kind of ultrathin stamp-mounting-paper diode frame according to claim 1, which is characterized in that the wire jumper is aluminium
Band.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811241276.3A CN109119397A (en) | 2018-10-24 | 2018-10-24 | A kind of ultrathin type stamp-mounting-paper diode frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811241276.3A CN109119397A (en) | 2018-10-24 | 2018-10-24 | A kind of ultrathin type stamp-mounting-paper diode frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109119397A true CN109119397A (en) | 2019-01-01 |
Family
ID=64855530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811241276.3A Withdrawn CN109119397A (en) | 2018-10-24 | 2018-10-24 | A kind of ultrathin type stamp-mounting-paper diode frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109119397A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080111219A1 (en) * | 2006-11-14 | 2008-05-15 | Gem Services, Inc. | Package designs for vertical conduction die |
| US20100052141A1 (en) * | 2008-09-01 | 2010-03-04 | Cambridge Silicon Radio Ltd. | Qfn package |
| CN102629599A (en) * | 2012-04-06 | 2012-08-08 | 天水华天科技股份有限公司 | Quad flat no lead package and production method thereof |
| CN103887407A (en) * | 2014-03-19 | 2014-06-25 | 浙江古越龙山电子科技发展有限公司 | Miniature SMD light emitting diode and production process thereof |
| US20150325559A1 (en) * | 2014-05-09 | 2015-11-12 | Alpha And Omega Semiconductor Incorporated | Embedded package and method thereof |
| CN106783793A (en) * | 2017-03-24 | 2017-05-31 | 王刚 | A kind of leads of semiconductor device framework of use TO types encapsulation |
| CN207183282U (en) * | 2017-07-28 | 2018-04-03 | 阳信金鑫电子有限公司 | A kind of high current mounts diode package structure |
| CN208796989U (en) * | 2018-10-24 | 2019-04-26 | 扬州扬杰电子科技股份有限公司 | Ultrathin stamp-mounting-paper diode frame |
-
2018
- 2018-10-24 CN CN201811241276.3A patent/CN109119397A/en not_active Withdrawn
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080111219A1 (en) * | 2006-11-14 | 2008-05-15 | Gem Services, Inc. | Package designs for vertical conduction die |
| US20100052141A1 (en) * | 2008-09-01 | 2010-03-04 | Cambridge Silicon Radio Ltd. | Qfn package |
| CN102629599A (en) * | 2012-04-06 | 2012-08-08 | 天水华天科技股份有限公司 | Quad flat no lead package and production method thereof |
| US20150102476A1 (en) * | 2012-04-06 | 2015-04-16 | Huatian Technology (Xi'an) Co., Ltd. | Quad flat no lead package and production method thereof |
| CN103887407A (en) * | 2014-03-19 | 2014-06-25 | 浙江古越龙山电子科技发展有限公司 | Miniature SMD light emitting diode and production process thereof |
| US20150325559A1 (en) * | 2014-05-09 | 2015-11-12 | Alpha And Omega Semiconductor Incorporated | Embedded package and method thereof |
| CN106783793A (en) * | 2017-03-24 | 2017-05-31 | 王刚 | A kind of leads of semiconductor device framework of use TO types encapsulation |
| CN207183282U (en) * | 2017-07-28 | 2018-04-03 | 阳信金鑫电子有限公司 | A kind of high current mounts diode package structure |
| CN208796989U (en) * | 2018-10-24 | 2019-04-26 | 扬州扬杰电子科技股份有限公司 | Ultrathin stamp-mounting-paper diode frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190101 |