CN206685372U - One kind improvement rectifier bridge lead frame - Google Patents
One kind improvement rectifier bridge lead frame Download PDFInfo
- Publication number
- CN206685372U CN206685372U CN201720460837.3U CN201720460837U CN206685372U CN 206685372 U CN206685372 U CN 206685372U CN 201720460837 U CN201720460837 U CN 201720460837U CN 206685372 U CN206685372 U CN 206685372U
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- China
- Prior art keywords
- lead wire
- lead
- frame
- lead frame
- time
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Abstract
The utility model discloses a kind of improvement rectifier bridge lead frame,Including lower lead frame and upper leadframe,Lead wire unit in lead frame is in matrix form proper alignment,When lower lead frame uses with upper lead frame overlapping,Lower lead wire unit is paired as complete rectifier bridge lead system with upper lead wire unit,Lead wire unit is connected on the lead frames by terminal pin,It is connected between lead wire and terminal pin by bending part,Bending part is provided with V-shaped groove,Be advantageous to bending and molding during its making,Reduce the undesirable deformation after shaping,There is positioning boss in lead wire in lead wire unit,The position of diode chip for backlight unit can be limited,The contact surface of lead wire and diode is in pitted skin shape simultaneously,Welding by the surface chip of relative coarseness is more firm,The frame piece of lead frame is provided with limit buckle,It is easy to lead frame to position and overlap,Simultaneously positioning hole is provided with frame piece,Convenient working,Reduce undesirable deformation caused by mechanical stress or thermal stress simultaneously.
Description
Technical field
A kind of lead frame of rectifier bridge is the utility model is related to, is a kind of improved lead frame.
Background technology
Rectifier bridge is conventional electronic component.In the manufacture craft of current SMD rectifier bridge, a crucial step be by
Diode chip for backlight unit is placed among the upper lead wire with terminal pin and lower lead wire, and chip is fixed on into lead wire in a welding manner
On, then carry out next process.To meet that large-scale production requires, occurs the lead wire for integrating multiple proper alignments at present
Lead frame, batch type weld job is carried out using lead frame, effectively increases production efficiency.Because lead frame is substantially in
Flake, undesirable stress strain is easily produced, in particular for the position for carrying out bending processing, to enable diode chip for backlight unit more
The contact surface of firmly welding, lead wire and diode chip for backlight unit also has further room for improvement.
Utility model content
In order to further reduce influence of the undesirable stress to rectifier bridge lead frame, the particularly shadow to needing bending part
Ring, while diode chip for backlight unit is more firmly welded in lead wire, reduce rectifier bridge finished product fraction defective, improve production
Efficiency, the utility model provides a kind of improvement rectifier bridge lead frame, by the contact surface for optimizing lead wire and diode chip for backlight unit
Chip is more firmly welded in lead wire, while optimizes the bending part and framework border of lead wire, is reduced because of frame
Stress caused by temperature caused by frame manufacture craft problem or welding and the undesirable deformation that occurs.
The technical scheme in the invention for solving the technical problem is：One kind improvement rectifier bridge lead frame, bag
Lead frame and lower lead frame are included, framework both sides are frame piece, and frame piece is connected by more Gen Zhong Zhu pieces, and lead wire is by drawing
Stitch is connected Yu Zhong Zhu pieces, Yan Zhong Zhu pieces side proper alignment.
Above-mentioned improvement rectifier bridge lead frame, upper lead wire unit number is identical with lower lead wire unit number, upper lead during use
Framework is positioned and overlapped by limit buckle with lower lead frame, and lead wire unit is matched with a lower lead wire unit on each,
Form the completed lead system of rectifier bridge.
Above-mentioned improvement rectifier bridge lead frame, lead wire passes through two bending parts and two terminal pin phases respectively under two panels
Even, a lower lead wire unit is formed, lower lead plate plane is slightly below terminal pin plane, respectively has one respectively in lead wire under two panels
The positioning boss of diode chip for backlight unit.
Above-mentioned improvement rectifier bridge lead frame, lead wire passes through two bending parts and two terminal pin phases respectively in two panels
Even, a upper lead wire unit is formed, upper lead plate plane is slightly above terminal pin plane.There are two two in wherein a piece of upper lead wire
The positioning boss of pole pipe chip.
The bending part of above-mentioned improvement rectifier bridge lead frame, connecting lead wire piece and terminal pin is along parallel to Zhong Zhu pieces direction
V-shaped groove is equipped with, is easy to bending part to be molded, undesirable deformation caused by reducing the stress occurred during bending and molding, avoids being molded
Situation not in place.
The contact surface of above-mentioned improvement rectifier bridge lead frame, lead wire and chip is in pitted skin shape, passes through relative coarseness
Contact surface improves the firmness of welding.
Above-mentioned improvement rectifier bridge lead frame, the frame piece of lead frame is provided with positioning hole, when facilitating welding job
Frame is fixed, and reduces undesirable deformation caused by mechanical stress and thermal stress when frame makes and caused by chip welding.
The beneficial effects of the utility model are to beat V-shaped groove by the bending part between lead wire and terminal pin so that folding
Turn of bilge can be well molded, and positioning hole is provided with frame piece, and framework caused by further reducing mechanical stress or thermal stress is not
Good deformation, pitted skin is designed in the contact surface of lead wire and chip, the welding of diode chip for backlight unit is caused with the surface of relative coarseness
It is more firm.
Brief description of the drawings
The utility model is further described below in conjunction with accompanying drawing.
Fig. 1 is overall schematic of the present utility model.
Fig. 2 is partial schematic diagram of the utility model based on Fig. 1 view surfaces.
Fig. 3 is schematic diagram of the lower lead wire unit based on Fig. 1 view surfaces.
Fig. 4 is second time lead wire of lower lead wire unit, second time lead bending part, second time terminal pin He Zhong Zhu pieces are whole
Elevational schematic view of the body based on Fig. 3 view surfaces.
Fig. 5 is schematic diagram of the upper lead wire unit based on Fig. 1 view surfaces.
Fig. 6 is lead wire on the first of upper lead wire unit, lead bending part on first, on first terminal pin He Zhong Zhu pieces are whole
Elevational schematic view of the body based on Fig. 5 view surfaces.
In figure, 1. times lead frames, lead frame on 2., 3. frame pieces, 4. Zhong Zhu pieces, 5. limit buckles, 6. positioning holes, 7.
First time lead wire, 8. second time lead wire, 9. first time bending part, 10. second time bending part, 11. first time terminal pin,
12. second time terminal pin, lead wire on 13. first, lead wire on 14. second, bending part on 15. first, bending on 16. second
Portion, terminal pin on 17. first, terminal pin on 18. second, 19. boss, 20.V shape grooves.
Embodiment
Rectifier bridge lead frame is improved, including lower lead frame 1 and upper lead frame 2, lead frame both sides respectively there are two
Frame piece 3, connected by 20 middle Zhu pieces 4 between frame piece 3,10 lead blade units of middle 4 side spread configuration of Zhu pieces.Lower lead
Overlapped when framework 1 uses with lower lead frame 2 by limit buckle 5, the lower lead wire unit of lower lead frame 1 and upper lead frame 2
Upper lead wire unit quantity it is identical, when lead frame overlaps, each lower lead wire unit with upper lead wire unit is corresponding combines, composition
The completed lead system of rectifier bridge.
Lower lead wire unit in lower lead frame 1, by first time folding between first time lead wire 7 and first time terminal pin 11
Turn of bilge 9 connects, and is connected between second time lead wire 8 and second time terminal pin 12 by second time bending part 10, first time terminal pin
11 with second time terminal pin 12 is equal is connected Yu Zhong Zhu pieces 4.Respectively there is a positioning in first time lead wire 7 and second time lead wire 8
The boss 19 of diode chip for backlight unit.
Upper lead wire unit in upper lead frame 2, on first in lead wire 13 and first between terminal pin 17 by first
Bending part 15 connects, and is connected by bending part 16 on second between terminal pin 18 in lead wire 14 and second on second, drawn on first
Stitch 17 with terminal pin on second 18 is equal is connected Yu Zhong Zhu pieces 4.There are two catching diode chips on first in lead wire 13
Boss 19.
On first time bending part 9, second time bending part 10, first bending part 15 with bending part on second 16 along parallel
V-shaped groove 20 is equipped with the direction of Yu Zhong Zhu pieces 4, above-mentioned bending part two sides are respectively equipped with two V-shaped grooves 20, and V-shaped groove position connects
Nearly lead wire or terminal pin.
Lead wire 14 has boss 19 in lead wire 13 and second in first time lead wire 7, second time lead wire 8, first
It is simultaneously the contact surface with diode chip for backlight unit, the contact surface of lead wire and diode chip for backlight unit is fabricated to the pitted skin shape shown in Fig. 3.
Limit buckle 5 is set on frame piece 3, for positioning and fastening upper lead frame 1 and lower lead frame 2, is set on frame piece 3
Positioning hole 6, positioning hole 6 are waist round hole and circular hole.Limit buckle 5 is one by limit buckle, waist round hole, the order of circular hole with positioning hole 6
Individual assembled unit arrangement, the arrangement of the assembled unit account for the width of two row lead wire units.
Above example is more excellent embodiment of the present utility model, to illustrate concrete structure of the present utility model, no
It should be regarded as, to definitely limitation of the present utility model, the those of ordinary skill in technical field that the utility model is related to, not taking off
On the premise of from basic thought of the present utility model and basic structure, according to actual conditions to it is of the present utility model implementation take with
The not absolute identical measure of above example, should also be considered as in rights protection scope of the present utility model.
Claims (4)
1. one kind improvement rectifier bridge lead frame, including lower lead frame（1）With upper lead frame（2）, it is characterised in that：Under draw
Wire frame（1）With upper lead frame（2）There is frame piece both sides（3）, frame piece（3）Between Tong Guo Zhong Zhu pieces（4）Connection, lead
Unit Yan Zhong Zhu pieces（4）Proper alignment；In lower lead wire unit, first time terminal pin（11）One end Lian Jie Zhong Zhu pieces（4）, the other end
Pass through first time bending part（9）With first time lead wire（7）Connection, second time terminal pin（12）One end Lian Jie Zhong Zhu pieces（4）, separately
One end passes through second time bending part（10）With second time lead wire（8）Connection；In upper lead wire unit, terminal pin on first（17）One
Hold Lian Jie Zhong Zhu pieces（4）, the other end passes through bending part on first（15）With lead wire on first（13）Connect, terminal pin on second
（18）One end Lian Jie Zhong Zhu pieces（4）, the other end passes through bending part on second（16）With lead wire on second（14）Connection；Under first
Lead wire（7）With second time lead wire（8）On respectively have the boss of a catching diode chip（19）, lead wire on first（13）
On have the boss of two catching diode chips（19）.
2. improvement rectifier bridge lead frame according to claim 1, it is characterised in that：First time bending of lower lead wire unit
Portion（9）, second time bending part（10）With the first of upper lead wire unit on bending part（15）, bending part on second（16）Both sides it is equal
Respectively it is provided with V-shaped groove（20）, V-shaped groove（20）The arranged direction for being oriented parallel to Zhong Zhu pieces.
3. improvement rectifier bridge lead frame according to claim 1, it is characterised in that：First time lead of lower lead wire unit
Piece（7）, second time lead wire（8）With the first of upper lead wire unit on lead wire（13）, lead wire on second（14）, it contacts two
The one side of pole pipe chip is in pitted skin shape.
4. improvement rectifier bridge lead frame according to claim 1, it is characterised in that：Frame piece（3）It is provided with limit buckle
（5）, circular or kidney ellipsoid positioning hole（6）, put in order by limit buckle, waist round hole, circular hole as an arrangement units, edge
Frame piece（3）Arrangement, the length that each arrangement units occupy are the length that two row lead wire units occupy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720460837.3U CN206685372U (en) | 2017-04-28 | 2017-04-28 | One kind improvement rectifier bridge lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720460837.3U CN206685372U (en) | 2017-04-28 | 2017-04-28 | One kind improvement rectifier bridge lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206685372U true CN206685372U (en) | 2017-11-28 |
Family
ID=60406100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720460837.3U Expired - Fee Related CN206685372U (en) | 2017-04-28 | 2017-04-28 | One kind improvement rectifier bridge lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206685372U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108745799A (en) * | 2018-04-20 | 2018-11-06 | 四川旭茂微科技有限公司 | A kind of matrix form lead frame and its application method |
-
2017
- 2017-04-28 CN CN201720460837.3U patent/CN206685372U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108745799A (en) * | 2018-04-20 | 2018-11-06 | 四川旭茂微科技有限公司 | A kind of matrix form lead frame and its application method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171128 Termination date: 20190428 |