CN202281621U - Precise row lead wire of NTC sensor - Google Patents

Precise row lead wire of NTC sensor Download PDF

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Publication number
CN202281621U
CN202281621U CN2011201102288U CN201120110228U CN202281621U CN 202281621 U CN202281621 U CN 202281621U CN 2011201102288 U CN2011201102288 U CN 2011201102288U CN 201120110228 U CN201120110228 U CN 201120110228U CN 202281621 U CN202281621 U CN 202281621U
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CN
China
Prior art keywords
lead
wire
ntc
townhouse
lead wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2011201102288U
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Chinese (zh)
Inventor
邬若军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN AMPRON TECHNOLOGY CORPORATION
Original Assignee
Shenzhen Ampron Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Ampron Technology Co Ltd filed Critical Shenzhen Ampron Technology Co Ltd
Priority to CN2011201102288U priority Critical patent/CN202281621U/en
Application granted granted Critical
Publication of CN202281621U publication Critical patent/CN202281621U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

A precise row lead wire of an NTC sensor is provided. An iron-nickel alloy belt with thickness of 0.12 to 0.15 mm is adopted, a precise die is used to punch the fence-shaped row lead wire, opposite pincerlike bayonets are punched on end parts of the lead wire for clamping NTC chips. The NTC chips and the end parts of the lead wire are melted and sealed by glass sleeves, and as welding processes are avoided, production efficiency is greatly enhanced, and product quality and stability are improved.

Description

The accurate townhouse lead-in wire of NTC sensor
Technical field:
The utility model relates to the pin configuration and the manufacturing process of NTC sensor, more particularly, and many NTC sensor leads that relate to a kind of precise forming, connect side by side.
Background technology:
The lead-in wire of traditional NTC sensor generally is to adopt manual work or semi automatic machine, with wire bonds to the electrode of NTC chip both sides.(has only 0.5 * 0.5mm because the yardstick of chip is very little 2) weld quite difficulty, quality also is difficult to guarantee.Adopt the townhouse lead-in wire of accurate punching out, can rely on the elastic force clamping NTC chip of lead-in wire end, and under the constraint of sealing the glass differential contraction stress, keep lead-in wire to contact with the good of NTC electrode.
The utility model content:
The accurate townhouse lead-in wire of NTC sensor by the thick iron-nickel alloy band of 0.12~0.15mm, utilizes the precision die punching out to become the townhouse lead-in wire of paliform, and the end punching out of lead-in wire becomes pincerlike bayonet socket facing each other to be used for clamping NTC chip.Adopt anchor clamps a plurality of NTC chips to be pushed simultaneously each pincerlike bayonet socket of townhouse lead-in wire; Entangle the lead-in wire end (pincerlike bayonet socket) of chip and clamping chip again with glass bushing; Insert in 600 ℃~700 ℃ tunnel caves and heated 0.5~1 minute; Make the glass bushing fusion, tight enclosing is lived NTC chip and lead-in wire end.Owing to removed welding sequence from, improved production efficiency greatly; Product quality and stability (do not weld flaw brought hidden danger of quality) have been improved.
Packaged NTC chip is connected together by the townhouse lead-in wire, adopts particular manufacturing craft that the coupling part punching is fallen, and becomes one by one independently NTC sensor.
Description of drawings:
The accurate townhouse lead-in wire of Fig. 1 .NTC sensor
Fig. 2. inserted the accurate townhouse lead-in wire of NTC chip
Fig. 3. accomplish NTC sensor and single NTC sensor that glass is honored as a queen and is still connected together
Embodiment:
Below in conjunction with accompanying drawing concrete embodiment is described: as shown in Figure 1, adopt iron nickel alloy strip (1) punching out to become the townhouse lead-in wire (3) of paliform, kept horizontal connecting band (4) between the lead-in wire, many parallel lead-in wires are connected as a single entity by equidistant.The end punching out of lead-in wire becomes pincerlike bayonet socket facing each other (2), and pincerlike bayonet socket is horn-like and opens slightly, is convenient to the NTC chip and inserts.Leave triangular hill (8) on the lead-in wire of pincerlike bayonet socket (2) below, in order to the position of restriction glass bushing.
Situation about being after townhouse lead-in wire (3) inserts NTC chips (5) shown in Figure 2, the NTC chip is by the elastic restoring force clamping of townhouse lead-in wire.
Utilize special tooling, glass bushing is entangled clamping respectively the lead-in wire end of chip (pincerlike bayonet socket), send into and be heated to the glass bushing fusion in the tunnel cave, chip and lead-in wire end are tightly wrapped, as shown in Figure 3, (6) are the glass encapsulating shell after the fusion.The differential contraction stress that produces during the glass bulb condensation end (pincerlike bayonet socket) that will go between is pressed on the electrode of NTC chip, keeps good electrical contact.
After glass encapsulating technology is accomplished, fall the coupling part between the NTC lead-in wire, form single NTC sensor (7) shown in Figure 3 with the particular manufacturing craft punching.

Claims (3)

1.NTC the accurate townhouse lead-in wire of sensor becomes the townhouse of paliform to go between by the thick iron-nickel alloy band punching out of 0.12~0.15mm, it is characterized in that: the end punching out of lead-in wire becomes pincerlike bayonet socket facing each other (2) to be used for clamping NTC chip.
2. according to the accurate townhouse lead-in wire of the affiliated NTC sensor of claim, it is characterized in that: kept horizontal connecting band between the lead-in wire, many parallel lead-in wires are connected as a single entity by equidistant.
3. according to the accurate townhouse lead-in wire of the affiliated NTC sensor of claim, it is characterized in that: the pincerlike bayonet socket (2) of lead-in wire end is horn-like and opens, and is convenient to the NTC chip and inserts; Leave triangular hill (8) on the lead-in wire of pincerlike bayonet socket (2) below, in order to the position of restriction glass bushing.
CN2011201102288U 2011-04-12 2011-04-12 Precise row lead wire of NTC sensor Expired - Lifetime CN202281621U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011201102288U CN202281621U (en) 2011-04-12 2011-04-12 Precise row lead wire of NTC sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011201102288U CN202281621U (en) 2011-04-12 2011-04-12 Precise row lead wire of NTC sensor

Publications (1)

Publication Number Publication Date
CN202281621U true CN202281621U (en) 2012-06-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011201102288U Expired - Lifetime CN202281621U (en) 2011-04-12 2011-04-12 Precise row lead wire of NTC sensor

Country Status (1)

Country Link
CN (1) CN202281621U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104008979B (en) * 2014-04-21 2017-01-04 中国电子科技集团公司第五十五研究所 The two-dimentional townhouse method for designing of package casing lead-in wire

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104008979B (en) * 2014-04-21 2017-01-04 中国电子科技集团公司第五十五研究所 The two-dimentional townhouse method for designing of package casing lead-in wire

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Legal Events

Date Code Title Description
DD01 Delivery of document by public notice

Addressee: Zhang Yanhong

Document name: Notification to Go Through Formalities of Registration

C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP03 Change of name, title or address

Address after: 518111 Guangdong City, Longgang District, Pinghu street Pinghu community Fumin Industrial Zone, Beverly Road, No. 65, building two, No. 43 to the four floor

Patentee after: SHENZHEN AMPRON TECHNOLOGY CORPORATION

Address before: 518111, Guangdong, Shenzhen District, Longgang District, Pinghu street, Pinghu community Fumin Industrial Zone, Fukang Road, No. 53, on the third floor, West Block

Patentee before: Shenzhen Ampron Technology Co., Ltd.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20120620