CN102403295B - Metal bonded semiconductor package and method thereof - Google Patents

Abstract

The invention discloses a metal key joint semiconductor packaging method which is characterized in that a lead frame is provided, the lead frame comprises a chip base and pins, at least one base groove is arranged on the upper surface of the chip base, and the whole chip base is divided into a plurality of chip mounting areas by the base groove; providing a plurality of chips, and mounting the chips on the chip mounting areas of the corresponding chip bases through adhesives; providing at least one metal sheet for connection between chips; providing a lead for connection between the chip and the pin; providing a plastic package body, and plastically packaging the structure by the plastic package body; and cutting off the bottom of the groove of the base after plastic packaging is finished, so that the chip mounting areas which are connected with each other are divided into the chip mounting areas which are not connected with each other. The packaging method can effectively prevent the pollution to the chip mounting equipment caused by the overflow of the adhesive during the chip mounting, increase the utilization rate of the chip in the packaging body and reduce the packaging cost.

Description

Metal bonded semiconductor package and method thereof

technical field

The invention relates to a semiconductor package and a method thereof, in particular to a metal bonded semiconductor package and a method thereof.

Background technique

Packaging is very important to the chip. It not only protects the chip and enhances thermal conductivity, but also serves as a bridge between the internal world of the chip and the external circuit. At present, the continuous expansion of chip manufacturing scale and the huge and fast-growing terminal electronic application market have greatly promoted the growth of the entire semiconductor packaging industry. In order to meet the needs of light, thin, short, small products and initial system integration, various types of packaging structures have been introduced. Among them, wafer-level packaging that can meet the requirements of thin, light, short and high density has gradually attracted attention.

As shown in FIG. 1 , an existing package includes a lead 1 , a chip base 2 , an adhesive 3 , a chip 4 , leads 5 and a plastic package 6 . Wherein, at the initial stage of chip packaging, the chip base 2 and the pin 1 are disconnected, and there is a gap between the chip base 2 and the pin 1 . During the packaging process of the chip, the chip base 2 and the pins 1 are placed on the chip mounting equipment, then the adhesive 3 is coated on the chip base 2 , and then the chip 4 is arranged on the adhesive 3 . At this time, due to the extrusion effect of the chip 4 on the adhesive 3, the overflow of the adhesive 3 to the periphery of the chip base 2 is exacerbated, and the adhesive 3 will even flow from the gap between the chip base 3 and the pin 1. It flows into the chip mounting equipment, causing contamination of the chip mounting equipment.

In the prior art, in the initial stage of chip packaging, in addition to the disconnection between the chip base and the pins, the chip base and the chip base are also in a disconnected state, and there is also a gap between the chip base and the chip base , as shown in FIG. 2 , is a schematic cross-sectional view of a metal-bonded semiconductor package in the prior art, and the structure includes a pin 1', a chip base 2', an adhesive 3', a chip 4' and a connecting piece 5' . As shown in the first row of figures in Fig. 2, there is a gap d1 between the chip base 2' and the chip base 2', and a gap d2 is also left between the chip base 2' and the pin 1'. As shown in the second row of figures of Figure 2, when increasing the area of the chip 4' on the chip base 2' of the same size, the bonding material 3' below the chip 4' will move toward the surface of the chip base 2'. The edges overflow. As shown in the third row of Figure 2, the adhesive 3' will even flow into the gap between the chip base 2' and the chip base 2' and the gap between the chip base 2' and the pin 1' , Contamination of chip mounting equipment. Therefore, in the actual process, in order to avoid the pollution caused by the overflow of the above-mentioned adhesives to the chip mounting equipment, based on different adhesives, the requirements for the installation distance are stipulated, that is, under the premise of specifying the package size, the size of the chip can be reduced. The area, or under the premise of specifying the chip area, increase the package size. This measure greatly reduces the utilization rate of chips in the semiconductor package.

Contents of the invention

The purpose of the present invention is to provide a packaging method of metal sheet bonding, which can effectively prevent the pollution of the chip mounting equipment caused by the overflow of adhesives during chip mounting, and greatly increase the utilization of chips in the package. The efficiency reduces the packaging cost, and the packaging method is simple and easy to operate.

In order to achieve the above object, a metal-bonded semiconductor package proposed by the present invention includes:

A lead frame, the lead frame includes a chip base and pins, at least one base groove is provided on the upper surface of the chip base, and the base groove divides the entire chip base into a plurality of chip mounting areas, The pins are arranged near the chip base;

A plurality of chips, the plurality of chips are correspondingly arranged on each chip mounting area of the chip base through adhesives, and the chips include a plurality of top electrodes;

At least one metal sheet for connection between chips;

A plastic packaging body, which plastic-packages the chip base, pins, chips and metal sheets.

In the aforementioned metal-bonded semiconductor package, the disconnection at the bottom of the base groove divides multiple chip mounting areas on the chip base into chip mounting areas that are not connected to each other, and the disconnection width at the bottom of the groove is smaller than the width of the groove.

In the aforementioned metal bonded semiconductor package, the multiple chips include a first chip and a second chip, and the multiple chip mounting areas include a first chip mounting area and a second chip mounting area, and the first chip Disposed on the first chip mounting area, the second chip is disposed on the second chip mounting area, the second chip includes a bottom electrode and is electrically connected to the second chip mounting area.

In the aforementioned metal-bonded semiconductor package, one end of the metal sheet is electrically connected to the top electrode of the first chip, and the other end is disposed in the groove of the base near the mounting area of the second chip.

In the above-mentioned metal bonded semiconductor package, the bottom of the groove of the base is disconnected to divide the first chip mounting area and the second chip mounting area into chip mounting areas that are not connected to each other, and the width of the bottom of the groove is broken smaller than the groove width.

In the aforementioned metal-bonding semiconductor package, the adhesive overflows from the first chip mounting area to the bottom corner of the base recess near the first chip mounting area.

In the aforementioned metal bonded semiconductor package, the adhesive is a conductive adhesive.

The present invention provides another metal-bonded semiconductor package, including:

A lead frame, the lead frame includes a chip base and pins, the pins are arranged near the chip base, and a groove between the base and the pins is provided between the pins and the chip base , the bottom of the groove between the base and the pins is disconnected to divide the chip base and the pins into chip bases and pins that are not connected to each other, the width of the bottom of the groove is less than the width of the groove, and the chip base There is a chip mounting area on it;

a chip disposed on the chip mounting area by an adhesive, said chip comprising a plurality of top electrodes;

A metal connection is used to connect the top electrodes and pins of the chip;

A plastic encapsulation body, used for plastic encapsulation of the chip base, pins, chip and metal connection.

In the aforementioned semiconductor package with metal bonding, the metal connection includes a metal sheet, one end of the metal sheet is connected to the top electrode of the chip, and the other end is arranged in the groove between the base and the pin close to the pin The position of the chip is used to connect the top electrodes of the chip to the pins.

In the aforementioned metal-bonded semiconductor package, the adhesive overflows from the chip mounting area to the bottom corner of the groove between the base and the pins near the chip mounting area.

The present invention also provides a metal bonded semiconductor package, comprising:

A lead frame, the lead frame includes a chip base and pins, the chip base is provided with at least one base groove, the base groove divides the chip base into a plurality of chip mounting areas, the base The bottom of the seat groove is disconnected to divide the multiple chip mounting areas on the chip base into chip mounting areas that are not connected to each other, the pins are arranged near the chip base, and the pins are connected to the chip base There is a groove between the base and the pins, the bottom of the groove between the base and the pins is disconnected, the base and the pins are divided into chip bases and pins that are not connected to each other, and the bottom of the groove is disconnected the width is less than the groove width;

a plurality of chips disposed on their corresponding chip mounting areas via an adhesive;

Multiple metal connections for connections between chips and connections between chips and pins;

A plastic encapsulation body, used for plastic encapsulation of the chip base, pins, chip and metal connection.

In the aforementioned metal-bonded semiconductor package, the adhesive overflows from the chip base area to the bottom corner of the groove between the base and the pins near the chip base area.

In the above-mentioned semiconductor package with metal bonding, the metal connection includes a metal sheet, and one end of the metal sheet is arranged in the groove between the base and the pin near the pin for the top of the chip Connection of electrodes to pins.

A metal-bonded semiconductor packaging method of the present invention comprises the following steps:

Step 1: provide a lead frame, the lead frame includes a chip base and pins, at least one base groove is provided on the upper surface of the chip base, and the base groove divides the entire chip base into multiple parts. a chip mounting area, the pins are arranged near the chip base;

Step 2: providing a plurality of chips, mounting the plurality of chips on respective chip mounting areas of the corresponding chip base through an adhesive, the chips including a plurality of top electrodes;

Step 3: providing at least one metal connection for connecting the top electrode of the chip;

Step 4: Provide a plastic package, and plastic seal the chip base, pins, chips and metal connections;

Step 5: Disconnect the bottom of the groove of the base, so as to divide the interconnected chip mounting regions into individual chip mounting regions that are not connected to each other, and the disconnection width at the bottom of the groove is smaller than the width of the groove.

In the above semiconductor packaging method with metal bonding, in step 2, the first chip is installed on the first chip mounting area through the first adhesive, and the first adhesive overflows from the first chip mounting area to the bottom corner of the base recess close to the first chip mounting area, mounting a second chip on the second chip mounting area through a second adhesive, the second chip including a bottom electrode electrically connected to the second chip mounting area, The second adhesive overflows from the second chip mounting area to a bottom corner of the base groove near the second chip mounting area.

In the above semiconductor packaging method with metal bonding, in step 3, the providing at least one metal connection includes providing a first metal sheet, one end of which is connected to a top electrode of the first chip, and the other end is arranged in the recess of the base. The position in the groove close to the second chip mounting area is electrically connected to the bottom electrode of the second chip.

In the above metal bonding semiconductor packaging method, in step 1, a groove between the base and the pin is provided between the pin and the chip base.

The above metal bonding semiconductor packaging method, in step 5, further includes breaking the base and the bottom of the groove between the pins from the bottom of the plastic package to separate the chip base and the pins.

In the above semiconductor packaging method of metal bonding, in step 3, one end of the second metal sheet is provided to connect to a top electrode of the second chip, and the other end is arranged in the groove between the base and the pin near the pin. The location is electrically connected to the pin.

A metal-bonded semiconductor packaging method of the present invention comprises the following steps:

Step 1: provide a lead frame, the lead frame includes a chip base and pins, the pins are arranged near the chip base, the pins are connected to the chip base, and the lead A groove between the base and the pins is provided between the foot and the chip base, and a chip mounting area is provided on the chip base;

Step 2: providing at least one chip, disposing the chip on the chip mounting area through an adhesive, the chip including a plurality of top electrodes;

Step 3: Provide metal connections to connect the top electrodes of the chip to the pins;

Step 4: Provide a plastic package for plastic packaging the chip base, pins, chips and metal connections;

Step 5: Disconnect the base and the bottom of the groove between the pins from the bottom of the plastic package to separate the chip base and pins.

In the above-mentioned semiconductor packaging method with metal bonding, in step 2, the chip is mounted on the chip base through an adhesive, and the adhesive overflows from the base to a base close to the chip base and the bottom corner of the notch between the pins.

In the above-mentioned metal bonding semiconductor packaging method, in step 3, the providing metal connection includes providing one end of the first metal sheet connected to a top electrode of the first chip, and the other end of which is arranged in the recess between the base and the pin. The position in the groove close to the pin is electrically connected with the pin.

In the above metal bonding semiconductor packaging method, in step 1, at least one base groove is provided on the chip base, and the base groove divides the chip base into a plurality of chip mounting regions.

The above metal bonding semiconductor packaging method, in step 5, further includes breaking the base and the bottom of the groove between the pins from the bottom of the plastic package to separate the chip base and the pins.

A metal-bonded semiconductor packaging method of the present invention comprises the following steps:

Step 1: Provide a lead frame, the lead frame includes a chip base and pins, the chip base is provided with at least one base groove, and the base groove divides the chip base into a plurality of chips In the installation area, the pins are arranged around the chip base, the pins are connected to the chip base, and there is a space between the base and the pins between the pins and the chip base. a groove, the groove between the base and the pin is used to distinguish the pin from the chip base;

Step 2: providing at least one chip, the chip is disposed on its corresponding chip mounting area through an adhesive, and the chip includes a bottom electrode and a plurality of top electrodes;

Step 3: Provide a plurality of metal sheets, one end of the metal sheet is connected to the electrode on the top of the chip, and the other end is set in the groove of the base for connection between chips, one end of the metal sheet is connected to the electrode on the top of the chip, The other end is set in the groove between the base and the pin for connection between the chip and the pin;

Step 4: providing leads, which are connected to the top electrodes and pins of the chip;

Step 5: a plastic package, used to plastic chip base, pins, multiple chips and metal sheets;

Step 6: Cut off the bottom of the base groove from the bottom of the plastic package to divide the chip base into discrete chip mounting areas, cut off the bottom of the groove between the base and the pins from the bottom of the plastic package to divide Chip base and pins.

Compared with the prior art, the metal sheet bonding packaging method of the present invention has the following advantages and positive effects due to the adoption of the above-mentioned technical scheme:

1. The packaging method of the metal sheet bonding of the present invention connects between the chip bases and between the chip base and the pins at the initial stage of chip packaging, and between the chip bases and between the chip base and the leads. There is no gap between the feet exposed to the chip mounting equipment, thus avoiding the contamination of the chip mounting equipment by overflow of the adhesive during chip mounting.

2. The packaging method of the metal sheet bonding of the present invention prevents adhesives from excessively overflowing and accumulating to pollute the surface of the chip due to the provision of grooves between the chip bases and the connection between the chip base and the pins.

3. The packaging method of metal sheet bonding of the present invention is simple and easy to operate, and has low production cost.

Description of drawings

Embodiments of the present invention are more fully described with reference to the accompanying drawings. However, the accompanying drawings are for illustration and illustration only, and do not limit the scope of the present invention.

FIG. 1 is a cross-sectional view of a conventional semiconductor package structure.

2 is a cross-sectional view of a conventional semiconductor package structure illustrating adhesive overflow in three views.

FIG. 3 is a flow chart of the metal bonding semiconductor packaging method of the first embodiment.

FIG. 4 is a top view and a cross-sectional view of the lead frame provided in the first embodiment.

FIG. 5 is a top view and a cross-sectional view of setting the chip on the lead frame through the adhesive in the first embodiment.

FIG. 6 is a top view and a cross-sectional view of bonding chip electrodes and pins with metal sheets in Embodiment 1. FIG.

FIG. 7 is a top view and a cross-sectional view of connecting chip electrodes and pins with wires in Embodiment 1. FIG.

Fig. 8 is a top view and a cross-sectional view of plastic sealing with a plastic sealing body in the first embodiment.

FIG. 9 is a top view and a cross-sectional view of cutting the bottom surface of the base groove at the bottom of the plastic package in Embodiment 1. FIG.

FIG. 10 is a flow chart of the metal bonding semiconductor packaging method of the second embodiment.

FIG. 11 is a top view and a cross-sectional view of the lead frame provided in the second embodiment.

FIG. 12 is a top view and a cross-sectional view of setting the chip on the lead frame in the second embodiment.

13 is a top view and a cross-sectional view of bonding chip electrodes and pins with metal sheets in Embodiment 2.

Fig. 14 is a top view and a cross-sectional view of connecting chip electrodes and pins with wires in Embodiment 2.

Fig. 15 is a top view and a cross-sectional view of the plastic package of the plastic package in the second embodiment.

FIG. 16 is a top view and a cross-sectional view of the base and the bottom surface of the groove between the pins in the second embodiment of cutting the bottom of the plastic package.

FIG. 17 is a cross-sectional view of the metal-bonded semiconductor package structure of the third embodiment.

Detailed ways

Embodiment 1: The present invention provides a metal sheet bonding packaging method. The packaging structure of the packaging method includes a lead frame 110, an adhesive 120, chips 130, 140, a metal sheet 150, a lead 160, and a plastic package 170. The semiconductor packaging flow chart of metal sheet bonding is shown in Figure 3, and the specific packaging process is as follows:

As shown in FIG. 4 , firstly, a lead frame 110 is provided, and the lead frame 110 includes a chip base 115 and a plurality of pins. The previous figure in FIG. 4 is a top view of the lead frame, and the next figure is a cross-sectional view along the dotted line in the previous figure. The chip base 115 includes a first chip mounting area 1151 , a second chip mounting area 1152 and a base groove 1153 . The base groove 1153 is disposed between the chip mounting areas and can distinguish each chip mounting area. In practical applications, multiple chip mounting regions can be set on the chip base, and multiple base grooves can be set to distinguish them. In this embodiment, two chip mounting regions and one base groove are provided on the lead frame as an example. As shown in Figure 4, the multiple pins also include pins 111, 112, 113 and 114, wherein the pin 111 is connected to the chip base 1151, that is, the pin 111 is conductively connected to the bottom electrode of the chip; The pins 112 , 113 and 144 are arranged on both sides of the chip base 115 separated by a distance, and these pins respectively correspond to the electrodes of the chip.

As shown in FIG. 5 , since only two chip mounting regions are provided on the lead frame in this embodiment, two chips are provided. The two chips are respectively a first chip 130 and a second chip 140, and the first chip 130 and the second chip 140 are respectively made of a high-end metal oxide semiconductor field effect transistor (HS MOSFET) and a low-side metal oxide semiconductor field effect transistor (LS MOSFET). MOSFET) as an example. HS MOSFET and LS MOSFET include top source, gate and bottom drain respectively. The first chip 130 and the second chip 140 are respectively disposed on the first chip mounting area 1151 and the second chip mounting area 1152 through the adhesive 120 , and the adhesive 120 functions as a conductive bond. Preferably, the adhesive 120 is conductive silver paste. In a specific process operation, the conductive silver paste is first coated on the chip mounting area, and then the chip is placed on the conductive silver paste. Usually, the conductive silver paste will overflow on the chip mounting area, especially after the chip is placed on the conductive silver paste, the gravity of the chip will aggravate the overflow of the conductive silver paste. In this embodiment, as shown in FIG. 5 , the conductive silver paste will slowly overflow into the groove 1153 of the base. Adhesive overflowing from the first chip mounting area 1151 accumulates in the base groove near the bottom corner of the first chip mounting area, and adhesive overflowing from the second chip mounting area 1152 accumulates in the base groove adjacent to the second bottom corner of the chip mounting area. In the prior art, since the chip mounting areas are disconnected, the conductive silver paste will overflow from the chip mounting areas and pass through the gaps between the mounting areas, thereby contaminating the chip mounting equipment arranged under the lead frame. When packaging, the distance between the chip and the edge of the chip mounting area should be considered, thus limiting the size of the chip package. In this embodiment, the groove structure of the base between the chip mounting areas collects the overflowing adhesive and prevents it from flowing into the chip mounting equipment. The distance from the edge of the chip to the edge of the chip mounting area is generally greater than 3 mils, while the traditional The distance from the edge of the chip to the edge of the chip mounting area generally needs to be greater than 8-10 mils. Therefore, the utilization rate of the chip in the package in the present invention is obviously improved.

As shown in Figure 6, after the chip is placed on the chip mounting area, a metal sheet 150 is provided, one end 1501 of the metal sheet 150 is arranged on the top source of the first chip 130, and the other end 1502 is arranged on the base groove 153 The inner position is close to the second chip 140 . In the existing packaging technology, since the base groove is not provided, the one end 1502 of the metal sheet 150 and the second chip 140 are jointly arranged on the second chip mounting area 1152 . In order to prevent the adhesive at the lower part of one end 1502 of the metal sheet 150 from overflowing and accumulating with the adhesive at the lower part of the second chip 140, and even cause the adhesive to climb and affect the circuit performance of the chip surface, one end 1502 of the metal sheet 150 It is necessary to have a certain distance from the second chip 140 . And in this embodiment, one end 1502 of the metal sheet 150 is arranged in the base groove 1153, the base groove 1153 has a certain height, plus the thickness of the second chip 140 itself, the lower part of the one end 1502 of the metal sheet and The overflow of the adhesive on the lower part of the second chip 140 is less likely to climb to the surface of the second chip 140 and affect the performance of the circuit. Therefore, the distance between one end 1502 of the metal sheet and the second chip 140 can be shortened, and the distance between the first chip 1501 and the second chip 1502 can also be shortened. In this embodiment, the distance from the edge of the chip to the edge of the chip is greater than 5 mils to be suitable for packaging, while in traditional packaging, the distance from the edge of the chip to the edge of the chip needs to be greater than 20 mils. It can be seen that the groove structure in this embodiment The utilization rate of the chip in the package is improved, and the cost is saved. In addition, the metal sheet 150 can also be replaced by a lead wire or a ribbon connection wire.

As shown in Figure 7, lead 160 is provided for the connection of chip electrode, and first chip 130 is electrically connected with pin 111; The top gate of first chip 130 is connected with pin 113 by lead 160; The source is connected to the pin 112 through the lead 160 ; the top gate of the second chip 140 is connected to the pin 114 through the lead 160 .

As shown in FIG. 8 , after the wire connection is completed, the package structure is packaged with a plastic package 170 .

As shown in FIG. 9 , after the plastic packaging is completed, the bottom of the base groove 1153 is cut off from the bottom of the plastic packaging body 170 to divide the first chip mounting area 1151 and the second chip mounting area 1152 to complete chip packaging. The cut-off width at the bottom of the groove should be smaller than the width of the groove, so as to reserve enough bottom to receive one terminal of the metal sheet 150 .

In this embodiment, the first chip 130 and the second chip 140 are MOSFET chips respectively. The first chip 130 and the second chip 140 can also be an integrated circuit control chip and a MOSFET chip respectively, or a combination of other integrated circuit chips. The bottom of the chip can be provided with electrodes or not, and different conductive or insulating adhesives can be selected according to different chips. A first adhesive can be selected for the first chip, and a second adhesive can be selected for the second chip. The first binder and the second binder may be the same or different.

Embodiment 2. The present invention provides a packaging method for metal sheet bonding. The packaging structure includes a lead frame 210, an adhesive 220, a chip 230, a metal sheet 240, a lead 250, and a plastic package 260. The semiconductor packaging method of the present invention The flow chart is shown in Figure 10, and the specific packaging steps are as follows:

As shown in FIG. 11 , a lead frame 210 is provided, and the lead frame 210 includes pins and a chip base 211 . The pins include two groups of pins 212 , 213 connected to the chip base 211 and arranged on both sides of the chip base 211 , and pins 214 disconnected from the chip base 211 . As shown in Figure 1, between the chip base 211 and the pin 213, there is also a groove 215 between the base and the pin, and the groove 215 between the base and the pin connects the gap between the chip base 211 and the pin 213. distinguish between.

As shown in FIG. 12 , a chip 230 is provided, and the chip 230 is placed on the chip base 211 through the adhesive 220. The overflowed adhesive 220 can flow into the groove 215 between the base and the pins, and accumulate on the base. The groove between the pins is close to the bottom corner of the base, so as to avoid the connection to the chip mounting equipment, and the edge of the chip 230 can be as close as possible to the edge of the chip base 211 . At the same time, different conductive or insulating adhesives can be selected according to different chips.

As shown in Figure 13, the top electrode and pins of the chip are connected with a metal sheet 240. The chip is an example of a power metal oxide semiconductor, the top electrode is the source, and one end 2401 of the metal sheet 240 is arranged on the top source of the chip. , the other end 2401 of the metal sheet 240 is disposed in the groove close to the pin, and electrically connected to the pin. In addition, the metal sheet 240 can also be replaced by a lead wire or a ribbon connection wire.

As shown in FIG. 14 , a wire 250 is used to connect the top gate of chip 230 to pin 214 . As shown in FIG. 15 , the lead frame, chips, metal sheets and pins are then plastic-encapsulated with a plastic package 260 . After the plastic sealing is completed, as shown in Figure 16, at the bottom of the plastic package, cut off the bottom edge of the groove 215 between the base and the pins, thereby disconnecting the connection between the chip base 211 and the pins 213 to complete the entire packaging process . The cut-off width of the bottom of the groove should be smaller than the width of the groove to leave enough bottom to receive the terminal 2401 of the metal sheet 240 . In this embodiment, the chip base and the pins are connected together before plastic packaging, and are distinguished by the groove between the base and the pins, and the groove between the base and the pins protects the chip mounting equipment from contamination by adhesives , thereby allowing the distance between the chip base and the pins to be reduced, improving the utilization of the chip in the package. In this embodiment, the chip 230 may be a MOSFET chip or any other integrated circuit chip. The bottom of the chip can be provided with electrodes or not, and different conductive or insulating adhesives can be selected according to different chips.

Embodiment 3. The above embodiment 1 is that the packaging structure connects each chip mounting area on the chip base before plastic sealing, and distinguishes them by base grooves. After the plastic sealing is completed, the base grooves are cut to complete the entire encapsulation process. The second embodiment is that the package structure connects the chip base and the pins together before plastic sealing, and distinguishes them by the groove between the base and the pins. After the plastic sealing is completed, the groove between the base and the pins is cut to complete the whole Encapsulation process. In a specific packaging process, Embodiment 1 and Embodiment 2 can be combined. As shown in FIG. 17 , metal sheets are used instead of lead wires to connect the chip electrodes and pins, and the chip bases 311 in the lead frame 310 and between the chip bases 311 and the pins 312 are all connected together, and are connected with the bases respectively. The groove 313 and the groove 314 between the base and the pins are distinguished. After the chip is installed and the plastic package is molded, the groove 313 of the base and the groove 314 between the base and the pins are cut to complete the whole package. The groove bottom break width should be smaller than the groove width.

In the chip mounting process of this embodiment, the pollution of the chip mounting equipment caused by the overflow of the adhesive is also avoided, and the area of the chip that can be packaged in the package is increased to a greater extent, or the area of the chip that can be packaged is reduced to a greater extent. The packaging size of the chip reduces the packaging cost.

It must, of course, be realized that the foregoing description is of preferred embodiments of the invention and that the invention is susceptible to many modifications without departing from the spirit and scope as shown in the appended claims.

In no way is the invention limited to the details and methods shown in the foregoing description or drawings. The invention is capable of other embodiments and of being carried out in various ways. In addition, everyone must also realize that the wording and terminology used here and the abstract are for the purpose of introduction only and by no means limited thereto.

As such, those skilled in the art will appreciate that the insights upon which this invention is based may readily be employed in designing other structures, methods and systems for carrying out the several purposes of the invention. It is, therefore, of vital importance that the appended claims are to be regarded as including all such equivalent constructions insofar as they do not depart from the spirit and scope of the invention.

Claims (20)

1. A metal-bonded semiconductor package, comprising: A lead frame, the lead frame includes a chip base and pins, at least one base groove is provided on the upper surface of the chip base, and the base groove divides the entire chip base into a plurality of chip mounting areas, The plurality of chip mounting areas include a first chip mounting area and a second chip mounting area, and the pins are arranged near the chip base; A plurality of chips, the plurality of chips include a first chip and a second chip, the plurality of chips are correspondingly arranged in each chip mounting area of the chip base through an adhesive, and the chips include a plurality of top electrodes; The first chip is disposed on the first chip mounting area, the second chip is disposed on the second chip mounting area, the second chip includes a bottom electrode and is electrically connected to the second chip mounting area; At least one metal sheet is used for the connection between the chips, one end of the metal sheet is electrically connected to the top electrode of the first chip, and the other end is arranged in the groove of the base near the mounting area of the second chip; A plastic packaging body, which plastic-packages the chip base, pins, chips and metal sheets. 2. A metal-bonded semiconductor package as claimed in claim 1, wherein the bottom of the groove of the base is disconnected to divide a plurality of chip mounting areas on the chip base into chip mounting areas that are not connected to each other, The groove bottom break width is smaller than the groove width. 3. A semiconductor package with metal bonding as claimed in claim 1, wherein the bottom of the base groove is disconnected to divide the first chip mounting area and the second chip mounting area into disconnected parts. In the chip mounting area, the break width at the bottom of the groove is smaller than the width of the groove. 4. A metal-bonded semiconductor package as claimed in claim 1, wherein the adhesive overflows from the first chip mounting area to the bottom corner of the base recess near the first chip mounting area . 5. The metal-bonded semiconductor package as claimed in claim 4, wherein the adhesive is a conductive adhesive. 6. A metal bonded semiconductor package, comprising: A lead frame, the lead frame includes a chip base and pins, the pins are arranged near the chip base, and a groove between the base and the pins is provided between the pins and the chip base , the bottom of the groove between the base and the pins is disconnected to divide the chip base and the pins into chip bases and pins that are not connected to each other, the width of the bottom of the groove is less than the width of the groove, and the chip base There is a chip mounting area on it; a chip disposed on the chip mounting area by an adhesive, said chip comprising a plurality of top electrodes; A metal connection is used to connect the top electrode and the pin of the chip, and the metal connection includes a metal sheet, one end of the metal sheet is connected to the top electrode of the chip, and the other end is arranged in the groove between the base and the pin The position close to the pin is used to connect the top electrode of the chip to the pin; A plastic encapsulation body, used for plastic encapsulation of the chip base, pins, chip and metal connection. 7. A metal bonded semiconductor package as claimed in claim 6, wherein the adhesive overflows from the chip mounting area to the bottom corner of the recess between the base and the pins near the chip mounting area . 8. A metal-bonded semiconductor package, comprising: A lead frame, the lead frame includes a chip base and pins, the chip base is provided with at least one base groove, the base groove divides the chip base into a plurality of chip mounting areas, the base The bottom of the seat groove is disconnected to divide the multiple chip mounting areas on the chip base into chip mounting areas that are not connected to each other, the pins are arranged near the chip base, and the pins are connected to the chip base There is a groove between the base and the pins, the bottom of the groove between the base and the pins is disconnected, the base and the pins are divided into chip bases and pins that are not connected to each other, and the bottom of the groove is disconnected the width is less than the groove width; a plurality of chips disposed on their corresponding chip mounting areas via an adhesive; A plurality of metal connections are used for the connection between chips and the connection between chips and pins. The metal connection includes providing a metal sheet, one end of which is connected to the electrode on the top of the chip, and the other end is set in the groove of the base , for connection between chips; A plastic encapsulation body, used for plastic encapsulation of the chip base, pins, chip and metal connection. 9. A metal-bonded semiconductor package as claimed in claim 8, wherein the adhesive overflows from the chip base area to the groove between the base and the pin near the chip base area bottom corner. 10. A metal-bonded semiconductor package as claimed in claim 8, wherein the metal connection comprises another metal sheet, and one end of the other metal sheet is arranged between the base and the pin The position in the groove close to the pin is used for the connection between the top electrode of the chip and the pin. 11. A semiconductor packaging method for metal bonding, comprising the following steps: Step 1: provide a lead frame, the lead frame includes a chip base and pins, at least one base groove is provided on the upper surface of the chip base, and the base groove divides the entire chip base into multiple parts. a chip mounting area, the pins are arranged near the chip base; Step 2: Provide a plurality of chips, and mount the plurality of chips on respective chip mounting areas of the corresponding chip base through an adhesive, the chips include a plurality of top electrodes, wherein the first chip is mounted on the first chip mounting area and mounting a second chip on the area and on the second chip mounting area; Step 3: providing at least one metal connection for connecting the top electrode of the chip, providing the at least one metal connection includes providing a first metal piece, one end of which is connected to a top electrode of the first chip, and the other end of which is disposed in the groove of the base A position close to the second chip mounting area is electrically connected to the bottom electrode of the second chip; Step 4: Provide a plastic package, and plastic seal the chip base, pins, chips and metal connections; Step 5: Disconnect the bottom of the groove of the base, so as to divide the interconnected chip mounting regions into individual chip mounting regions that are not connected to each other, and the disconnection width at the bottom of the groove is smaller than the width of the groove. 12. A semiconductor packaging method with metal bonding as claimed in claim 11, wherein in step 2, the first chip is mounted on the first chip mounting area through the first adhesive, and the first The adhesive overflows from the first chip mounting area to the bottom corner of the base groove close to the first chip mounting area, and the second chip is mounted on the second chip mounting area through the second adhesive, and the second chip includes a The bottom electrode is electrically connected to the second chip mounting area, and the second adhesive overflows from the second chip mounting area to a bottom corner of the base recess near the second chip mounting area. 13. A semiconductor packaging method with metal bonding as claimed in claim 11, wherein in step 1, a groove between the base and the pin is provided between the pin and the chip base . 14. A semiconductor packaging method with metal bonding as claimed in claim 13, characterized in that, in step 5, further comprising breaking the base and the bottom of the groove between the pins from the bottom of the plastic package to separate Chip base and pins. 15. A semiconductor packaging method with metal bonding as claimed in claim 13, characterized in that, in step 3, one end of the second metal sheet is provided to connect to a top electrode of the second chip, and the other end thereof is set on the base The position close to the pins in the groove between the pins is electrically connected with the pins. 16. A semiconductor packaging method for metal bonding, comprising the following steps: Step 1: provide a lead frame, the lead frame includes a chip base and pins, the pins are arranged near the chip base, the pins are connected to the chip base, and the lead A groove between the base and the pins is provided between the foot and the chip base, and a chip mounting area is provided on the chip base; Step 2: providing at least one chip, disposing the chip on the chip mounting area through an adhesive, the chip including a plurality of top electrodes; Step 3: Provide a metal connection to connect the top electrode of the chip to the pin, the provision of the metal connection includes providing one end of the first metal sheet connected to a top electrode of the first chip, and the other end of which is set in the groove between the base and the pin The position close to the pin is electrically connected with the pin; Step 4: Provide a plastic package for plastic packaging the chip base, pins, chips and metal connections; Step 5: Disconnect the base and the bottom of the groove between the pins from the bottom of the plastic package to separate the chip base and pins. 17. The semiconductor packaging method of a metal bonding as claimed in claim 16, wherein in step 2, the chip is installed on the chip base by an adhesive, and the adhesive is removed from the base The top overflows to the bottom corner of the pedestal-to-lead recess near the chip base. 18. A semiconductor packaging method with metal bonding as claimed in claim 16, characterized in that, in step 1, at least one base groove is provided on the chip base, and the base groove will The chip base area is divided into a plurality of chip mounting areas. 19. The semiconductor packaging method with metal bonding according to claim 18, characterized in that, in step 5, further comprising breaking the bottom of the base groove, thereby dividing the interconnected chip mounting areas into interconnected The individual chip mounting areas are not connected. 20. A semiconductor packaging method for metal bonding, comprising the following steps: Step 1: Provide a lead frame, the lead frame includes a chip base and pins, the chip base is provided with at least one base groove, and the base groove divides the chip base into a plurality of chips In the installation area, the pins are arranged around the chip base, the pins are connected to the chip base, and there is a space between the base and the pins between the pins and the chip base. a groove, the groove between the base and the pin is used to distinguish the pin from the chip base; Step 2: providing at least one chip, the chip is disposed on its corresponding chip mounting area through an adhesive, and the chip includes a bottom electrode and a plurality of top electrodes; Step 3: Provide a plurality of metal sheets, one end of the metal sheet is connected to the electrode on the top of the chip, and the other end is set in the groove of the base for connection between chips, one end of the metal sheet is connected to the electrode on the top of the chip, The other end is set in the groove between the base and the pin for connection between the chip and the pin; Step 4: providing leads, which are connected to the top electrodes and pins of the chip; Step 5: a plastic package, used to plastic chip base, pins, multiple chips and metal sheets; Step 6: Cut off the bottom of the base groove from the bottom of the plastic package to divide the chip base into discrete chip mounting areas, cut off the bottom of the groove between the base and the pins from the bottom of the plastic package to divide Chip base and pins.