CN208548345U - Pin lead frame in a kind of lengthening applied to round fingerprint recognition - Google Patents
Pin lead frame in a kind of lengthening applied to round fingerprint recognition Download PDFInfo
- Publication number
- CN208548345U CN208548345U CN201820999659.6U CN201820999659U CN208548345U CN 208548345 U CN208548345 U CN 208548345U CN 201820999659 U CN201820999659 U CN 201820999659U CN 208548345 U CN208548345 U CN 208548345U
- Authority
- CN
- China
- Prior art keywords
- interior pin
- pin
- interior
- fingerprint recognition
- dao
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005530 etching Methods 0.000 claims abstract description 24
- 238000005520 cutting process Methods 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 239000003292 glue Substances 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 239000005022 packaging material Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 230000006698 induction Effects 0.000 abstract description 4
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 239000000047 product Substances 0.000 description 27
- 239000000758 substrate Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model discloses pin lead frame in a kind of lengthening applied to round fingerprint recognition, including etching region and Ji Dao, the etching region is located at around Ji Dao, and chip is fixed on Ji Dao；Etching region includes multiple interior pins；It is half-etching in the middle part of interior pin root and interior pin, interior pin front is all-metal；It further include bonding wire, one end of bonding wire connects interior pin front, the pad of the other end connection chip of bonding wire；It further include product cutting line and interior pin fixed part, product cutting line is rounded, and with the contact site of interior pin in the middle part of interior pin, interior pin fixed part is arranged along product cutting line periphery, and interior pin fixed part is all-metal.The structure of the utility model aims at fingerprint recognition product design, at low cost, and pin design is small and exquisite, facilitates packaging and routing；The distance of chip upper surface to product upper surface is shorter, meets the needs of fingerprint induction.
Description
Technical field
The utility model relates to a kind of special frame structures applied to fingerprint recognition product, more particularly to a kind of cooperation
Fingerprint recognition product has special shape rather than the frame of square products.
Background technique
Mainly the product of cooperation fingerprint recognition is mainly substrate design in the industry at present, and plate interior cabling etc. can be relatively free,
The routing ranking that substrate itself adapts to product design also designs freely relatively, but the cost is relatively high for overall price.And it is existing
Semiconductor QFN encapsulation lead frame structure, most fingerprint recognition products now are unable to satisfy in terms of design and production
Design package requirements, it is therefore desirable to design a kind of lead frame structure suitable for round fingerprint recognition product.
Utility model content
Purpose of utility model: it is asked to solve the substrate design higher cost of fingerprint recognition product of the existing technology
Topic, the utility model provide pin lead frame in a kind of lengthening applied to round fingerprint recognition.
Technical solution: the utility model provides pin lead frame in a kind of lengthening applied to round fingerprint recognition, packet
Etching region and Ji Dao are included, the etching region is located at around Ji Dao, and chip is fixed on Ji Dao；Etching region includes drawing in multiple
Foot, interior pin include interior pin root, interior pin middle part and interior pin front；Interior pin front is located at close to the etching region of Ji Dao
On inner edge, interior pin root is located remotely from the etching region outside of Ji Dao, by interior between interior pin root and interior pin front
Connection in the middle part of pin, interior pin root and interior pin middle part are half-etching, and interior pin front is all-metal；It further include bonding wire, weldering
One end of line connects interior pin front, the pad of the other end connection chip of bonding wire；It further include product cutting line and interior pin
Fixed part, it is peripheral and rounded that product cutting line is located at base island, and product cutting line and the contact site of interior pin draw in interior
In the middle part of foot, interior pin fixed part is arranged along product cutting line periphery, and interior pin fixed part is all-metal.
Further, the chip is fixed on Ji Dao by bonding die glue.
Further, the bonding die glue is silver paste.
Further, Ji Dao is rectangle.
Further, the height of the bonding wire apogee distance chip upper surface is less than 100um.
Further, Ji Dao, etching region, chip and bonding wire are integrally encapsulated by plastic packaging material.
Further, the interior pin is pin in lengthening.
The utility model has the advantages that the utility model provides pin lead frame in a kind of lengthening applied to round fingerprint recognition, it should
Structure aims at fingerprint recognition product design, overcomes prior art fingerprint recognition product asking using substrate design higher cost
Topic, pin design is small and exquisite, facilitates packaging and routing；The distance of chip upper surface to product upper surface is shorter, meets fingerprint induction
Demand；Using special base island fixed structure, the frame base island interconnecting piece in available frame structure is removed, increases space to increase
Pin number improves the versatility of frame.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the not upper chip of single semi-finished product of the utility model；
Fig. 2 is the structural schematic diagram after single finished product bonding wire of the utility model；
Fig. 3 is the cross-sectional view after single finished product bonding wire of the utility model along A-A angle.
Specific embodiment
The utility model is described in further detail in the following with reference to the drawings and specific embodiments.
As shown in Figures 2 and 3, pin lead frame in a kind of lengthening applied to round fingerprint recognition, including 1 He of etching region
Base island 2, the etching region 1 are located at around base island 2, and chip 3 is fixed on base island 2 by bonding die glue, and base island 2 is in rectangle；Erosion
Carving area 1 includes multiple interior pins 4, and interior pin 4 includes interior pin root 41, interior pin middle part 42 and interior pin front 43；Inside draw
Foot front 43 is located on 1 inner edge of etching region on base island 2, and interior pin root 41 is located remotely from 1 outside of etching region on base island 2
On, it is connected between interior pin root 41 and interior pin front 43 by the middle part of interior pin 42, in interior pin root 41 and interior pin
Portion 42 is half-etching, and interior pin front 43 is all-metal；It further include bonding wire 5, one end of bonding wire 5 connects interior pin front 43, weldering
The pad of the other end connection chip 3 of line 5；It further include product cutting line 6 and interior pin fixed part 7, product cutting line 6 is located at
Base island is peripheral and rounded, and the contact portion of product cutting line 6 and interior pin is located at 42 in the middle part of pin, interior pin fixed part 7
Along the 6 periphery setting of product cutting line, interior pin fixed part 7 is all-metal.
When single finished product cutting, is cut according to product cutting line 6, form finished product after cutting.Interior pin fixed part 7 rises
To the effect of fixed processing procedure, guiding function is also played in cutting process, would not remain on product after completing cutting.
The height of 5 apogee distance chip of bonding wire, 3 upper surface is less than 100um, to meet the needs of fingerprint induction.If
Distance is too big, and it is insensitive to may cause fingerprint induction.
Etching region 1, base island 2, chip 3 and bonding wire 5 pass through the whole encapsulating of plastic packaging material 9.
Bonding die glue in the present embodiment uses silver paste, i.e. chip 3 is pasted on base island 2 by silver paste, and there are also bases in base island 2
Island bracket 8 is the schematic rear view of the upper chip of single semi-finished product in Fig. 1 circle.
Interior pin 4 is designed as lengthening interior pin, and the product cutting line 6 of the periphery of rectangle base island 2 is allowed to be designed to circle,
And guarantee product cutting line 6 and interior pin contact portion quartile 42 in the middle part of interior pin；Pin front 43 in lengthening, it is more convenient to beat
Line.
Claims (7)
1. pin lead frame in a kind of lengthening applied to round fingerprint recognition, which is characterized in that including etching region and Ji Dao,
The etching region is located at around Ji Dao, and chip is fixed on Ji Dao；Etching region includes multiple interior pins, and interior pin includes interior draws
In the middle part of heel portion, interior pin and interior pin front；Interior pin front is located on the etching region inner edge of Ji Dao, interior pin root
On being located remotely from outside the etching region of Ji Dao, by connection in the middle part of interior pin between interior pin root and interior pin front, inside draw
It is half-etching in the middle part of heel portion and interior pin, interior pin front is all-metal；It further include bonding wire, one end of bonding wire connects interior pin
Front, the pad of the other end connection chip of bonding wire；It further include product cutting line and interior pin fixed part, product cutting line
It is peripheral and rounded positioned at base island, and the contact site of product cutting line and interior pin is in interior pin middle part, interior pin fixed part
It is arranged along product cutting line periphery, interior pin fixed part is all-metal.
2. pin lead frame in the lengthening according to claim 1 for being applied to round fingerprint recognition, which is characterized in that institute
Chip is stated to be fixed on Ji Dao by bonding die glue.
3. pin lead frame in the lengthening according to claim 2 for being applied to round fingerprint recognition, which is characterized in that institute
Stating bonding die glue is silver paste.
4. pin lead frame in the lengthening according to claim 1 for being applied to round fingerprint recognition, which is characterized in that base
Island is rectangle.
5. pin lead frame in the lengthening according to claim 1 for being applied to round fingerprint recognition, which is characterized in that institute
The height for stating bonding wire apogee distance chip upper surface is less than 100um.
6. pin lead frame in the lengthening according to claim 1 for being applied to round fingerprint recognition, which is characterized in that base
Island, etching region, chip and bonding wire are integrally encapsulated by plastic packaging material.
7. pin lead frame in the lengthening according to claim 1 for being applied to round fingerprint recognition, which is characterized in that institute
Interior pin is stated to lengthen interior pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820999659.6U CN208548345U (en) | 2018-06-27 | 2018-06-27 | Pin lead frame in a kind of lengthening applied to round fingerprint recognition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820999659.6U CN208548345U (en) | 2018-06-27 | 2018-06-27 | Pin lead frame in a kind of lengthening applied to round fingerprint recognition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208548345U true CN208548345U (en) | 2019-02-26 |
Family
ID=65423671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820999659.6U Active CN208548345U (en) | 2018-06-27 | 2018-06-27 | Pin lead frame in a kind of lengthening applied to round fingerprint recognition |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208548345U (en) |
-
2018
- 2018-06-27 CN CN201820999659.6U patent/CN208548345U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: An extended inner pin lead frame for circular fingerprint identification Effective date of registration: 20211122 Granted publication date: 20190226 Pledgee: Bank of Jiangsu Co.,Ltd. Nanjing Jiangbei new area sub branch Pledgor: NANJING MICROBONDING SEMICONDUCTOR CO.,LTD. Registration number: Y2021980012904 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20231222 Granted publication date: 20190226 Pledgee: Bank of Jiangsu Co.,Ltd. Nanjing Jiangbei new area sub branch Pledgor: NANJING MICROBONDING SEMICONDUCTOR CO.,LTD. Registration number: Y2021980012904 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: An extended inner pin lead frame for circular fingerprint recognition Granted publication date: 20190226 Pledgee: Nanjing Branch of Jiangsu Bank Co.,Ltd. Pledgor: NANJING MICROBONDING SEMICONDUCTOR CO.,LTD. Registration number: Y2024980001873 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |