CN205920968U - Lead frame of four rows of biserials - Google Patents
Lead frame of four rows of biserials Download PDFInfo
- Publication number
- CN205920968U CN205920968U CN201620979897.1U CN201620979897U CN205920968U CN 205920968 U CN205920968 U CN 205920968U CN 201620979897 U CN201620979897 U CN 201620979897U CN 205920968 U CN205920968 U CN 205920968U
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- chip
- biserials
- foot
- sides
- lead foot
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Abstract
The utility model discloses a lead frame of four rows of biserials is formed through continuous range of the side band on both sides by a plurality of the same elementary cells, the chip package unit of four rows of biserials of elementary cell distributes on the both sides in well area with double biserial, the chip package unit is equipped with that bearing chip's chip island, the centre be connected with chip island lead the foot, the foot is led to first side and the foot is led to both sides, chip island's front is equipped with the bump that a plurality of neatly arranged are used for enhancement and chip to contact, the advantage lie in the bump that chip island's front set up a plurality of neatly arranged be used for strengthening with the chip contact, save the higher silvering technique of the degree of difficulty, and the bump can form simultaneously in the trapezoidal surface punching press of back rank, under can not the condition of the increase of production degree of difficulty.
Description
Technical field
This utility model is related to a kind of lead frame of four row's biserials.
Background technology
The lead frame of four row's biserials has compared with two row's dual inline lead frameworks that production efficiency is high, stock utilization is high
Feature.But to guarantee using by the way of chip island is silver-plated in existing lead frame that the contact that chip island is with chip is good,
Thus, the lead frame of four row's biserials, in the case of increased chip island quantity, certainly will lead to silver-plated difficulty to increase it would be highly desirable to change
Enter.
Utility model content
Technical problem to be solved in the utility model is to provide one kind both to have production efficiency height, stock utilization height,
Do not increase the lead frame of four row's biserials of production difficulty again.
The technical scheme that this utility model solution above-mentioned technical problem is adopted is: a kind of lead frame of four row's biserials,
It is consecutively arranged to form by the sideband through both sides for multiple identical elementary cells；The chip packaging unit of four row's biserials of elementary cell with
Double biserial is distributed in the both sides of middle band, and described chip packaging unit is provided with and carries the chip island of chip and be connected with chip island
Middle lead foot, the first side lead foot and the second side lead foot；The front of described chip island be provided with multiple proper alignment for strengthen and core
The salient point of piece contact.
Compared with prior art, the utility model has the advantage of arranging the convex of multiple proper alignment in the front of chip island
Point, for strengthening being contacted with chip, is saved the higher silver-plated technology of difficulty, and salient point can overleaf be formed simultaneously in cascaded surface punching press,
In the case of production difficulty will not being increased.
As improvement, described chip island both sides are provided with the arcuate groove for strengthening plastic packaging effect, and plastic packaging effect is good, using the longevity
Life length.
As improvement, described first side lead foot, the both sides of the second side lead foot are equipped with projection, and described first side lead foot is close
The width of the projection of middle lead foot side is more than the projection of opposite side；Described middle lead foot is provided with to close convex of the second side lead foot
Rise so that the big good stability of wiring area.
As improvement, the front of described lead foot and its projection is designed with silver coating it is ensured that contact site electric conductivity is good.
Brief description
Fig. 1 is overlooking the structure diagram of the present utility model.
Specific embodiment
Below in conjunction with accompanying drawing embodiment, this utility model is described in further detail.
This preferred embodiment is illustrated in figure 1 a kind of lead frame of four row's biserials, by multiple identical elementary cells 1 through two
The sideband 2 on side is consecutively arranged to form；The chip packaging unit 4 of four row's biserials of elementary cell 1 is distributed in middle band 3 with double biserial
Both sides, chip packaging unit 4 be provided with carry chip chip island 41 be connected with chip island 41 middle lead foot 42, the first side
Lead foot 43 and the second side lead foot 44, the chip island 41 of first row and the chip island 41 of second row, the chip island 41 of the 3rd row and the
The chip island 41 of four rows is connected through dowel；The front of chip island 41 arranges the salient point 411(of multiple proper alignment or claims pit),
For strengthening contacting with chip, salient point 411 is preferably square boss；The back side of chip island 41 is cascaded surface, can be rushed by adjustment
Compression mould, so that salient point 411 is formed in punching press cascaded surface, will not increase production difficulty.Wherein, can arrange in chip island both sides
For strengthening the arcuate groove 412 of plastic packaging effect.
As improvement, the first side lead foot 43, the both sides of the second side lead foot 44 are equipped with projection, the first side lead foot 43 near in
Between lead foot 42 side projection width be more than opposite side projection；Middle lead foot 42 is provided with to close convex of the second side lead foot 44
Rise.Wherein, lead foot (42,43,44) and its front of projection are designed with silver coating.
Claims (4)
1. a kind of lead frame of four row's biserials, by sideband (2) continuous arrangement through both sides for multiple identical elementary cells (1) and
Become；The chip packaging unit (4) of four row's biserials of elementary cell (1) is distributed in the both sides of middle band (3), described core with double biserial
Piece encapsulation unit (4) is provided with the middle lead foot (42) carrying the chip island (41) of chip and being connected with chip island (41), the first side is led
Foot (43) and the second side lead foot (44)；It is characterized in that: the front of described chip island (41) be provided with multiple proper alignment for plus
The strong salient point (411) contacting with chip.
2. a kind of four row's biserials according to claim 1 lead frame it is characterised in that: described chip island (41) both sides
It is provided with the arcuate groove (412) for strengthening plastic packaging effect.
3. a kind of four row's biserials according to claim 1 lead frame it is characterised in that: described first side lead foot
(43), the both sides of the second side lead foot (44) are equipped with projection, and described first side lead foot (43) is near centre lead foot (42) side
Raised width is more than the projection of opposite side；Described middle lead foot (42) is provided with to the close projection of both sides lead foot (44).
4. a kind of four row's biserials according to claim 3 lead frame it is characterised in that: described lead foot (42,43,44)
And its front of projection is designed with silver coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620979897.1U CN205920968U (en) | 2016-08-29 | 2016-08-29 | Lead frame of four rows of biserials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620979897.1U CN205920968U (en) | 2016-08-29 | 2016-08-29 | Lead frame of four rows of biserials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205920968U true CN205920968U (en) | 2017-02-01 |
Family
ID=57869023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620979897.1U Active CN205920968U (en) | 2016-08-29 | 2016-08-29 | Lead frame of four rows of biserials |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205920968U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117116894A (en) * | 2023-09-21 | 2023-11-24 | 气派科技股份有限公司 | Four-row TO263 packaging frame compatible with multiple pins and penetrating type injection molding |
-
2016
- 2016-08-29 CN CN201620979897.1U patent/CN205920968U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117116894A (en) * | 2023-09-21 | 2023-11-24 | 气派科技股份有限公司 | Four-row TO263 packaging frame compatible with multiple pins and penetrating type injection molding |
| CN117116894B (en) * | 2023-09-21 | 2024-05-24 | 气派科技股份有限公司 | Four-row TO263 packaging frame compatible with multiple pins and penetrating type injection molding |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |