CN202996822U - Lead frame - Google Patents
Lead frame Download PDFInfo
- Publication number
- CN202996822U CN202996822U CN 201220662392 CN201220662392U CN202996822U CN 202996822 U CN202996822 U CN 202996822U CN 201220662392 CN201220662392 CN 201220662392 CN 201220662392 U CN201220662392 U CN 201220662392U CN 202996822 U CN202996822 U CN 202996822U
- Authority
- CN
- China
- Prior art keywords
- lead
- lead frame
- wire
- muscle
- out wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a lead frame. The frame comprises a first lead frame and a second lead frame, wherein the first lead frame comprises several unit frames which are arranged continuously and are connected through a first lead connection rib; the second lead frame comprises several unit frames which are arranged continuously and are connected through a second lead connection rib. The first lead frame and the second lead frame are plug-in structures. A middle outgoing line and two side outgoing lines of the first lead frame are connected to the second lead connection rib. The middle outgoing line and the two side outgoing lines of the second lead frame are connected to the first lead connection rib. According to the lead frame, a scrap part which is cut off and is between terminal pins in the original frame is used to form another group of lead frame units. A utilization rate of a material is effectively increased. Lead frame cost is reduced. Consumption of energy and resources is reduced too.
Description
Technical field
The utility model relates to the circuit lead frame technical field, relates in particular to a kind of semi-conductor discrete device encapsulation lead frame.
Background technology
Lead frame is as the chip carrier of semi-conductor discrete device, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure spare of electric loop, it has played the function served as bridge that is connected with outer lead, is basic material important in electronics and information industry.The lead frame that now uses is single row configuration, bottom muscle and the non-lead portioned product of centre muscle all will remove, material between centre muscle and bottom muscle all is punched and becomes waste material, the lead frame output that material per ton can be produced is lower, the expenses such as the stove damage of the material melting of bearing, processing charges, traffic expense are high, directly affect the cost of lead frame.
In view of above-mentioned the deficiencies in the prior art, the utility model provides another kind of new solution.
The utility model content
The utility model is for the deficiency of prior art scheme, the technical scheme that adopts is: a kind of lead frame is provided, this lead frame utilizes and is punched the waste part of removing in former framework between terminal pin, become another group lead frame unit, effectively improve the utilance of material, reduce the lead frame cost, reduce the consumption of the energy and resource.
To achieve the above object of the invention, the technical scheme that the utility model adopts is: a kind of lead frame is provided, has it is characterized in that: comprise several unit framework continuous arrangements and connect by the first lead-in wire the first lead frame and the unit framework continuous arrangement of being connected that muscle connects connecting the second lead frame of muscle connection by the second lead-in wire; Described the first lead frame and the second lead frame are the mutual-inserting type structure;
The middle lead-out wire of described the first lead frame and both sides lead-out wire are connected in the second lead-in wire and connect on muscle; The middle lead-out wire of described the second lead frame and both sides lead-out wire are connected in the first lead-in wire and connect on muscle.
Preferably, described each unit framework comprise lead-out wire in the middle of radiating part, chip load section and be positioned in the middle of the side lead-out wire of the lead-out wire left and right sides.
Preferably, described first company's of lead-in wire muscle and second company's of lead-in wire muscle are arranged with location hole.
In sum, lead frame provided by the utility model utilizes and is punched the waste part of removing in former framework between terminal pin, becomes another group lead frame unit, effectively improves the utilance of material, reduce the cost of lead frame, reduced the consumption of the energy and resource.
Description of drawings
Fig. 1 is the utility model lead frame structure schematic diagram;
Fig. 2 is the utility model product front view;
Fig. 3 is along the cutaway view of A-A line in Fig. 2;
Fig. 4 is the utility model lead frame end view;
Fig. 5 is existing lead frame structure schematic diagram.
Wherein: 1, radiating part; 2, chip load section; 3, middle lead-out wire; 4, side lead-out wire; 5, the first lead-in wire connects muscle; 05, the second lead-in wire connects muscle; 6, location hole; 7, the first lead frame; 07, the second lead frame; 8, the first cut point; 08, the second cut point; 9, the bottom connects muscle.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is described in detail.
As described in Fig. 1 to Fig. 4, lead frame provided by the utility model is characterized in that: comprise several unit framework continuous arrangements and connect by the first lead-in wire the first lead frame 7 and the unit framework continuous arrangement of being connected that muscle 5 connects connecting the second lead frame 07 of muscle 05 connection by the second lead-in wire; Described the first lead frame 7 and the second lead frame 07 are the mutual-inserting type structure;
The middle lead-out wire 3 of described the first lead frame 7 and both sides lead-out wire 4 are connected in the second lead-in wire and connect on muscle 05; The middle lead-out wire 3 of described the second lead frame 07 and both sides lead-out wire 4 are connected in the first lead-in wire and connect on muscle 5.
Described each unit framework comprise radiating part 1, chip load section 2, middle lead-out wire 3 and be positioned in the middle of the side lead-out wire 4 of lead-out wire 3 left and right sides.Described the first lead-in wire connects muscle 5 and second company's of lead-in wire muscle 05 is arranged with location hole 6.
The utility model has effectively utilized former leadframe leads and has connected waste material space between muscle 5 and end muscle 9, the arrangement mode that adopts two row terminal pins to plug each other, and the lead frame of former single arrangement is arranged again is mutual-inserting type dual inline lead framework.
After the lead frame punch forming, in the middle of in the middle of on the first lead frame 7, lead-out wire 3 and side lead-out wire 4 and the second lead-in wire connect on the first cut point 8 of muscle 05 junction and the second lead frame 07, lead-out wire 3 and side lead-out wire 4 cut respectively with the second cut point 08 of the first company's of lead-in wire muscle 5 junctions, make First Line draw framework 7 and the second lead frame 07 becomes two independently lead frame support bodys.The location hole 6 that again the first lead-in wire is connected the symmetry on muscle 5 and second company's of lead-in wire muscle 05 is cut apart, and the first lead frame 7 and the second lead frame 07 are divided into independent shaped article.The framework place of bending adopts the oblique angle, is convenient in framework packing, use procedure lamination smooth and send sheet not fall sheet; Connect muscle in the middle of cutting when cutting muscle and just can obtain required semiconductor device.
As shown in Figure 5, when existing single lead frame product is shaped, will the company's of lead-in wire muscle 5 and the bottom connect the non-lead part of muscle 9 stamping-out fallen, material between lead-in wire muscle 5 and bottom muscle 9 all is punched and becomes waste material, the lead frame output that material per ton can be produced is lower, the expenses such as the stove damage of the material melting of bearing, processing charges, traffic expense are high, directly affect the cost of lead frame.
In sum, lead frame provided by the utility model utilizes and is punched the waste part of removing in former framework between terminal pin, becomes another group lead frame unit, effectively improves the utilance of material, reduce the cost of lead frame, reduced the consumption of the energy and resource.
Under announcement in book and instruction according to the above description, the utility model, leader's technical staff also can carry out suitable change and modification to above-mentioned execution mode.Therefore, above the utility model is not limited to, the embodiment of prompting and description, also should fall in the protection range of claim of the present utility model modifications and changes more of the present utility model.In addition, although the specific term of some that use in this specification, these terms do not consist of any restriction to the utility model just for convenience of description.
Claims (3)
1. lead frame is characterized in that: comprise several unit framework continuous arrangements and connect by the first lead-in wire the first lead frame (7) and the unit framework continuous arrangement of being connected that muscle (5) connects connecting second lead frame (07) of muscle (05) connection by the second lead-in wire; Described the first lead frame (7) and the second lead frame (07) are the mutual-inserting type structure;
The middle lead-out wire (3) of described the first lead frame (7) and both sides lead-out wire (4) are connected in the second lead-in wire and connect on muscle (05); The middle lead-out wire (3) of described the second lead frame (07) and both sides lead-out wire (4) are connected in the first lead-in wire and connect on muscle (5).
2. lead frame according to claim 1 is characterized in that: described each unit framework comprise radiating part (1), chip load section (2), middle lead-out wire (3) and be positioned in the middle of the side lead-out wire (4) of lead-out wire (3) left and right sides.
3. lead frame according to claim 1 is characterized in that: described the first lead-in wire connects muscle (5) and second lead-in wire company's muscle (05) is arranged with location hole (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220662392 CN202996822U (en) | 2012-12-05 | 2012-12-05 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220662392 CN202996822U (en) | 2012-12-05 | 2012-12-05 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202996822U true CN202996822U (en) | 2013-06-12 |
Family
ID=48567962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220662392 Expired - Fee Related CN202996822U (en) | 2012-12-05 | 2012-12-05 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202996822U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103617973A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Lead frame used in high temperature |
| CN109904081A (en) * | 2019-01-18 | 2019-06-18 | 深圳赛意法微电子有限公司 | The packaging method of semiconductor product based on IDF lead frame |
| CN115910974A (en) * | 2023-02-21 | 2023-04-04 | 厦门捷昕精密科技股份有限公司 | High-density semiconductor integrated circuit lead frame |
-
2012
- 2012-12-05 CN CN 201220662392 patent/CN202996822U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103617973A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Lead frame used in high temperature |
| CN109904081A (en) * | 2019-01-18 | 2019-06-18 | 深圳赛意法微电子有限公司 | The packaging method of semiconductor product based on IDF lead frame |
| CN109904081B (en) * | 2019-01-18 | 2020-11-20 | 深圳赛意法微电子有限公司 | Packaging method of semiconductor product based on IDF lead frame |
| CN115910974A (en) * | 2023-02-21 | 2023-04-04 | 厦门捷昕精密科技股份有限公司 | High-density semiconductor integrated circuit lead frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130612 Termination date: 20151205 |
|
| EXPY | Termination of patent right or utility model |