CN201796945U - LED light source package electrode - Google Patents

LED light source package electrode Download PDF

Info

Publication number
CN201796945U
CN201796945U CN2010201140321U CN201020114032U CN201796945U CN 201796945 U CN201796945 U CN 201796945U CN 2010201140321 U CN2010201140321 U CN 2010201140321U CN 201020114032 U CN201020114032 U CN 201020114032U CN 201796945 U CN201796945 U CN 201796945U
Authority
CN
China
Prior art keywords
electrode
light source
led light
circuit
electrode plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010201140321U
Other languages
Chinese (zh)
Inventor
吴锏国
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ANHUIRUIHUANG OPTOELECTRONICS TECHNOLOGY Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN2010201140321U priority Critical patent/CN201796945U/en
Application granted granted Critical
Publication of CN201796945U publication Critical patent/CN201796945U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Led Device Packages (AREA)

Abstract

The utility model relates to an LED light source package electrode, which comprises a metal electrode plate and a package frame. The metal electrode plate is formed by integrally punching and provided with circuit insulating slots; the circuit insulating slots are distributed outwardly radially on the electrode plate; the electrode plate and the package frame are formed integrally by a mould; and the circuit insulating slots on the electrode plate are filled with insulating materials to form insulation in the package frame. After the top ends of the circuit insulating slots on the electrode plate are sheared off, a single electrode is formed between each two circuit insulating slots, and a plurality of single electrodes can be connected by leads and freely combined into a plurality of input circuits. An even number of circuit insulating slots are arranged on lead electrodes for favoring 'U'-shaped distribution and control of the leads, and the design space for connection and combination of parallel and serial circuits of chips, so that low-current multi-channel parallel input can be realized, uncertainty of single-circuit high-voltage or high-current operation can be avoided, and operation stability of an LED light source can be guaranteed.

Description

A kind of led light source encapsulated electrode
Technical field
The utility model relates to a kind of electrode of integrated encapsulated LED light source.
Background technology
The integrated packaged light source of present LED all adopts single channel electrode package scheme, and sort circuit arranges to have only one group of positive pole-input of negative loop power supply source, can only carry out connection in series-parallel again and connect between the integrated packaged light source inside chip of LED.This single circuit input scheme, electric power outputting current and circuit load restriction directly restrict single integrated optical source package power, and the single supply input also may be because the unsteadiness of power supply causes the uncertainty of light source works.
The utility model content
The utility model provides a kind of multi channel electrode simple in structure at above the deficiencies in the prior art.
The utility model is achieved through the following technical solutions:
A kind of led light source encapsulated electrode, described electrode is made up of metal electrode film and package frame.
A kind of led light source encapsulated electrode, the whole punch forming of described metal electrode film is provided with the circuit insulation tank.
A kind of led light source encapsulated electrode, described circuit insulation tank are outside diversity and distribute on electrode slice.
A kind of led light source encapsulated electrode, described package frame are the plasticity insulating material.
A kind of led light source encapsulated electrode, described electrode slice and package frame are one by mould molding, the circuit insulation tank on the electrode slice is insulated the material filling and forms insulation in package frame.
A kind of led light source encapsulated electrode after cut off on the circuit insulation tank top on the described electrode slice, forms a single electrode between per two circuit insulation tanks, can connect independent assortment by lead between a plurality of single electrodes is a plurality of input circuits.
The beneficial effects of the utility model are:
1. electrode slice and package frame are one-body molded, have avoided traditional integrated encapsulated LED light source substrate to need one-time formed complicated technology of base plate, package frame and electrode and mould high cost investment, have reduced production cost.
Electrode slice and package frame one-body molded after, formed a plurality of single electrodes, for the LED integrated optical source of selecting for use different circuit arrangement modes to encapsulate multichannel input provides the space.
3. the power of having broken through traditional single integrated encapsulated LED light source is subjected to the restriction of power and current capacity, and can not be to the bottleneck of more high-power development.
Many line insulation grooves are set on the lead electrode of annular, " U " shape that is beneficial to lead is deployed to ensure effective monitoring and control of illegal activities, increase the chip parallel series circuit and connected the design space of making up, thereby realize the input of low current multi-channel parallel, avoid the uncertainty of single circuit high voltage or big current work, ensured the stability of led light source work.
Description of drawings
Fig. 1 is the structural representation of multi channel electrode.
Among the figure: 1 is the heat conduction electrode; 2 is the line insulation groove.
Embodiment
The utility model provides a kind of simple in structure and multiloop heat conduction electrode that can cut down the consumption of energy, heat conduction electrode 1 ringwise, electrode 1 is provided with the line insulation groove of outwards dispersing 2, and the number of line insulation groove 2 is an even number.
Another program of the present utility model provides a kind of lead cloth control method of realizing on multiloop heat conduction electrode.An electrode tip as positive level, connects the lead in two adjacent line insulation grooves, and lead extends into the annular center of heat conduction electrode from a line insulation groove wherein, exports from the line insulation groove of another electrode tip of next-door neighbour; And another lead extends into the annular center of heat conduction electrode 1 from wherein a line insulation groove, from the line insulation groove output of another electrode tip of next-door neighbour.
Even number bar line insulation groove 2 is set on lead electrode 1, " U " shape that is beneficial to lead is deployed to ensure effective monitoring and control of illegal activities, increase the chip parallel series circuit and connected the design space of making up, thereby realize the input of low current multi-channel parallel, avoid the uncertainty of single circuit high voltage or big current work, ensured the stability of led light source work.

Claims (5)

1. led light source encapsulated electrode is characterized in that described electrode is made up of metal electrode film and package frame; Described electrode slice and package frame are one by mould molding, and the circuit insulation tank on the electrode slice is insulated the material filling and forms insulation in package frame.
2. a kind of led light source encapsulated electrode according to claim 1 is characterized in that the whole punch forming of described metal electrode film, which is provided with the circuit insulation tank.
3. a kind of led light source encapsulated electrode according to claim 1 is characterized in that described circuit insulation tank is outside diversity and distributes on electrode slice.
4. a kind of led light source encapsulated electrode according to claim 1 is characterized in that described package frame is the plasticity insulating material.
5. a kind of led light source encapsulated electrode according to claim 1, after it is characterized in that circuit insulation tank top on the described electrode slice is cut off, form a single electrode between per two circuit insulation tanks, be connected to a plurality of input circuits by lead between a plurality of single electrodes.
CN2010201140321U 2010-01-23 2010-01-23 LED light source package electrode Expired - Fee Related CN201796945U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010201140321U CN201796945U (en) 2010-01-23 2010-01-23 LED light source package electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010201140321U CN201796945U (en) 2010-01-23 2010-01-23 LED light source package electrode

Publications (1)

Publication Number Publication Date
CN201796945U true CN201796945U (en) 2011-04-13

Family

ID=43851846

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010201140321U Expired - Fee Related CN201796945U (en) 2010-01-23 2010-01-23 LED light source package electrode

Country Status (1)

Country Link
CN (1) CN201796945U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111212677A (en) * 2018-09-21 2020-05-29 株式会社雷片 Method for manufacturing weak current tool

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111212677A (en) * 2018-09-21 2020-05-29 株式会社雷片 Method for manufacturing weak current tool

Similar Documents

Publication Publication Date Title
CN202120918U (en) Crimp-connection IGBT (Insulated Gate Bipolar Transistor) device
CN101392885A (en) High-power white light LED
CN100590869C (en) High-power LED encapsulation structure
CN201796945U (en) LED light source package electrode
CN203812910U (en) High-utilization-rate and high-luminous-efficiency LED array support
CN209389018U (en) It is a kind of can grain formula separation ceramic substrate
CN202799379U (en) Novel light-emitting diode (LED) copper substrate
CN202662641U (en) Three-in-one type junction box for photovoltaic module
CN202996822U (en) Lead frame
CN101777619A (en) LED light source encapsulated electrode
CN201994293U (en) Packaging structure of large power LED
CN103219329A (en) Light-emitting diode device and manufacturing method thereof
CN107482108A (en) A kind of new SMD lamp beads
CN203871366U (en) LED luminescent device
CN207967037U (en) A kind of two-way LED encapsulation structure be connected
CN207165614U (en) A kind of new SMD lamp beads
CN202797068U (en) Patched type laser packaging structure
CN201887044U (en) Encapsulating structure for LED light source module
CN201975390U (en) Multi-LED chip packaging structure
CN202585414U (en) Light emitting diode device
CN201204205Y (en) High-power LED encapsulation structure
CN202332954U (en) Antistatic LED (light emitting diode) packaging structure
CN201868428U (en) Luminous semiconductor curved surface encapsulated structure and luminous semiconductor light source device thereof
CN201758139U (en) Novel LED light source module packaging structure
CN203895451U (en) Large power led packaging structure

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
EE01 Entry into force of recordation of patent licensing contract

Assignee: AnhuiRuihuang Optoelectronics Technology Co., Ltd.

Assignor: Wu Jianguo

Contract record no.: 2011340000483

Denomination of utility model: LED light source encapsulated electrode

Granted publication date: 20110413

License type: Exclusive License

Record date: 20111222

ASS Succession or assignment of patent right

Owner name: ANHUI RESUN OPTOELECTRONIC TECHNOLOGY CO., LTD.

Free format text: FORMER OWNER: WU JIANGUO

Effective date: 20130916

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20130916

Address after: 205 room 605, min Chong Center, 230088 Mount Huangshan Road, Hefei high tech Zone, Anhui, China

Patentee after: AnhuiRuihuang Optoelectronics Technology Co., Ltd.

Address before: 203 room 230088, min Chong Center, 605 Mount Huangshan Road, Anhui, Hefei

Patentee before: Wu Jianguo

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110413

Termination date: 20140123