CN203812910U - High-utilization-rate and high-luminous-efficiency LED array support - Google Patents
High-utilization-rate and high-luminous-efficiency LED array support Download PDFInfo
- Publication number
- CN203812910U CN203812910U CN201420146368.4U CN201420146368U CN203812910U CN 203812910 U CN203812910 U CN 203812910U CN 201420146368 U CN201420146368 U CN 201420146368U CN 203812910 U CN203812910 U CN 203812910U
- Authority
- CN
- China
- Prior art keywords
- cup
- led
- substrate
- led array
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims abstract description 45
- 239000000463 material Substances 0.000 claims description 31
- 239000011521 glass Substances 0.000 claims description 8
- 238000001746 injection moulding Methods 0.000 claims description 5
- 210000001624 hip Anatomy 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 238000010923 batch production Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000001795 light effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The utility model relates to a high-utilization-rate and high-luminous-efficiency LED array support, and relates to the technical field of LED supports. The high-utilization-rate and high-luminous-efficiency LED array support comprises a plurality of LED support units, each LED support unit comprises a substrate and a plastic part, each substrate comprises a die bonding pad and a polarity bonding pad, each substrate is provided with a fixing hole used for fixing the plastic part to improve the combination stability of the plastic part and the substrate, each plastic part comprises a lamp cup and an insulating part, each insulating part plays a role in insulating the die bonding pad from the polarity bonding pad, each insulating part is provided with a first shoulder portion and a second shoulder portion, one end of the die bonding pad is correspondingly provided with a first clamping shoulder matched with the first shoulder portion, one end of the polarity bonding pad is correspondingly provided with a second clamping shoulder matched with the second shoulder portion, and therefore the combination stability of the insulating part and the substrate is further improved. Compared with a cup-in-cup support in the prior art, each substrate is simple in structure, the cup-in-cup structure manufactured through processes of stretching and the like is not needed, the plastic part and the substrate are fixedly connected, at the same time, the processes are simplified, and the cost is reduced.
Description
Technical field
The utility model relates to LED support technical field, particularly relates to the LED array support of a kind of high usage and high light efficiency.
Background technology
In recent years, because luminous flux and the light efficiency of LED lamp constantly promote, and the principle of luminosity of LED lamp is to be luminous energy by electric energy conversion, its power consumption is low, the advantages such as little, the low pollution of volume and long service life, and be applicable to batch production, be widely used at present LED illuminating product, LCD TV and backlight product etc.
The advantages such as COB LED lamp is the one of LED lamp, and the making of COB LED lamp is LED wafer to be directly fixed to (pcb board) on substrate go up and encapsulate, and has production utilance high, and thermal resistance is low, optical quality is good.At present, mainly comprise the electrically-conductive backing plate of being made by conducting metals such as copper and the insulated substrate of being made by insulating material such as potteries for encapsulating the LED support that COB LED lamp uses.
Prior art generally adopts LED support to realize the batch production of COB LED lamp, specifically: on a slice heat conduction sheet material, realize the encapsulation of multiple LED wafers simultaneously, finally more packaged one by one LED wafer (being COB LED lamp) is cut from heat conduction sheet material, and the heat conduction sheet material of prior art is with too large (being generally 4.2mm) of step pitch of row's two adjacent LEDs wafer, residue rim charge many (distance of the fixing hole on general Far Left or rightmost LED support and rim charge is 3.75mm), due to the size of heat conduction sheet material and the arrangement of LED wafer position unreasonable, cause the utilance of heat conduction sheet material low, to carry out in process of production punching press, plating, injection moulding, die bond, bonding wire, some glue, blanking station supervisor, if the quantity of the COB LED lamp that monolithic heat conduction sheet material is produced is few, cause production utilance low, and, in the LED support of prior art, for the Lamp cup and the heat conduction sheet material that make PPA material better combine, while avoiding hanking application, there is quality problem, (in general, the angle of cup is 60 degree to be generally made as cup cup-shaped for the lamp chamber of fixed L ED wafer, the angle of outer cup is 38 degree), its glass of type angle is little, thickness large (being generally 0.9mm), therefore, bright dipping weak effect, and processing technology is comparatively complicated, and manufacturing cost is higher, the area of the die bond pad of prior art is little, and radiating effect is poor.
Utility model content
The purpose of this utility model is to avoid weak point of the prior art and LED array support that a kind of high usage and high light efficiency are provided, and the combination stability of this LED array support is good, and processing technology is simple, low cost of manufacture.
The purpose of this utility model is achieved through the following technical solutions:
The LED array support of a kind of high usage and high light efficiency is provided, the many rows LED support that comprises heat conduction sheet material and form on heat conduction sheet material, described LED support comprises substrate and the plastic parts of injection moulding on described substrate, described substrate is provided with the fixing hole for fixing described plastic parts, described substrate comprises die bond pad and polarity pad, in the utility model, described plastic parts comprises Lamp cup and insulating part, described fixing hole comprises Lamp cup fixing hole and insulating part fixing hole, described Lamp cup is fixed on described Lamp cup fixing hole, and described insulating part is fixed on described insulating part fixing hole; Described insulating part is spaced from each other die bond pad and polarity pad, described insulating part is respectively equipped with the first shoulder that embeds described die bond pad and the second shoulder that embeds described polarity pad in the both sides of length direction, corresponding first dogging shoulder that is provided with in one end of the described die bond pad connecting with described the first shoulder, corresponding second dogging shoulder that is provided with in one end of the described polarity pad connecting with described the second shoulder.
Wherein, described die bond pad and polarity pad are extended with the first conducting strip and the second conducting strip to Lamp cup outside respectively.
Wherein, described Lamp cup comprises glass portion and connecting portion, and described connecting portion is plugged in described Lamp cup fixing hole, and described cup portion is positioned at described substrate one side.
Wherein, the cup portion of described Lamp cup surrounds a glass chamber, and two mutually perpendicular longitudinal cross-sections in described cup chamber are from the shape of the inside convergent of oral area in described cup chamber, and bottom, described cup chamber is also provided with the containing cavity for accommodating LED wafer.
Wherein, two mutually perpendicular longitudinal cross-sections in described cup chamber are inverted isosceles trapezoid face, the angle of two waists of one of them isosceles trapezoid is 115 to 140 degree, the angle of another one isosceles trapezoid is 110 to 130 degree, and two mutually perpendicular longitudinal cross-sections of described containing cavity are rectangular surfaces.
Wherein, the thickness of described substrate is 0.2 ± 0.01 to 0.35 ± 0.01mm, and the height of described LED support is 0.6 ± 0.02 to 0.9 ± 0.02mm.
Wherein, the centre distance of adjacent two described LED supports of same row is 3.2 to 3.8mm.
Wherein, the both sides of described heat conduction sheet material are provided with side location hole, and the centre distance of described location hole and immediate LED support is 3.2mm.
Wherein, the middle part of described heat conduction sheet material is longitudinally provided with a row middle part location hole, and the width that is positioned at the central passage that two row LED supports of location hole both sides, described middle part surround is 2.4mm.
Wherein, described Lamp cup fixing hole is circular hole.
Wherein, the length of described die bond pad is 4mm, and wide is 1.5 to 2.5mm.
Wherein, the distance of adjacent two described LED supports of described same row is 0.6mm.
Wherein, the width on the top of described insulating part is 0.15 to 0.45mm.
The beneficial effects of the utility model: the LED array support of a kind of high usage and high light efficiency, the many rows LED support that comprises heat conduction sheet material and form on heat conduction sheet material, LED support comprises substrate and the injection moulding plastic parts on substrate, substrate comprises die bond pad and polarity pad, substrate is provided with the fixing hole for fixing plastic parts, strengthen the combination stability of plastic parts and substrate, plastic parts comprises Lamp cup and insulating part, fixing hole comprises Lamp cup fixing hole and insulating part fixing hole, Lamp cup is fixed on Lamp cup fixing hole, and insulating part is fixed on insulating part fixing hole, insulating part is spaced from each other die bond pad and polarity pad, play the effect of die bond pad and polarity pad mutual insulating, insulating part is respectively equipped with the first shoulder that embeds die bond pad and the second shoulder that embeds polarity pad in the both sides of length direction, corresponding first dogging shoulder that is provided with in one end of the die bond pad connecting with the first shoulder, corresponding second dogging shoulder that is provided with in one end of the polarity pad connecting with the second shoulder, more strengthen the combination stability of insulating part and substrate, with prior art cup in cup support compared with, because board structure is simple, do not need to produce cup structure in cup by operations such as stretchings, the utility model has been simplified operation and has been reduced cost in taking into account plastic parts and substrate stable connection, increase area of dissipation, improve heat dispersion, and except die bond pad and polarity pad etc. adopt heat conduction sheet material, miscellaneous part all adopts plastic parts, reduce cost.
The cup portion of Lamp cup surrounds a glass chamber, and two mutually perpendicular longitudinal cross-sections in cup chamber are from the shape of the inside convergent of oral area in cup chamber, and bottom, cup chamber is also provided with the containing cavity for accommodating LED wafer.Two mutually perpendicular longitudinal cross-sections in cup chamber are inverted isosceles trapezoid face, the angle of two waists of one of them isosceles trapezoid is 124 degree, the angle of another one isosceles trapezoid is 118 degree, two mutually perpendicular longitudinal cross-sections of containing cavity are rectangular surfaces, Lamp cup is set to wide-angle, compared with cup in the low-angle cup of prior art, can improve it and go out light effect.
Brief description of the drawings
Utilize accompanying drawing to be described further utility model, but the embodiment in accompanying drawing does not form any restriction of the present utility model, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to the following drawings other accompanying drawing.
Fig. 1 is the structural representation of the LED array support of an embodiment of the present utility model.
Fig. 2 is the enlarged diagram at A place in Fig. 1, i.e. the structural representation of LED support angle.
Fig. 3 is the A-A schematic cross-section of Fig. 2.
Fig. 4 is the B-B schematic cross-section of Fig. 2.
In figure, include:
1---heat conduction sheet material;
2---LED support, 21---substrate, 211---the first through hole, 212---insulating part fixing hole, 213---the second through hole, 214---the first conducting strip, 215---die bond pad, 2151---the first dogging shoulder, 216---polarity pad, 2161---second dogging shoulder, 217---the second conducting strips;
3---plastic parts, 31---Lamp cup, 311---the first isosceles trapezoid, 312---the first rectangular surfaces, 313---the second isosceles trapezoid, 314---the second rectangular surfaces, 32---insulating part, 321---first shoulder, 322---the second shoulders.
Embodiment
With the following Examples the utility model is further described.
A kind of high usage of the present embodiment and the LED array support of high light efficiency, as shown in Figure 1, the many rows LED support 2 that comprises heat conduction sheet material 1 and form on heat conduction sheet material 1, described heat conduction sheet material also possesses conducting function, as shown in Figure 2, LED support 2 comprises substrate 21 and the injection moulding plastic parts 3 on substrate 21, substrate 21 comprises die bond pad 215 and polarity pad 216, substrate 21 is provided with the fixing hole for fixing plastic parts 3, strengthen the combination stability of plastic parts 3 and substrate 21, as shown in Figure 3, plastic parts 3 comprises Lamp cup 31 and insulating part 32, fixing hole comprises Lamp cup fixing hole and insulating part fixing hole 212, Lamp cup fixing hole is specially the first through hole 211 and the second through hole 213, Lamp cup 31 is fixed on the first through hole 211 and the second through hole 213, insulating part 32 is fixed on insulating part fixing hole 212, insulating part 32 is spaced from each other die bond pad 215 and polarity pad 216, play the effect of die bond pad 215 and polarity pad 216 mutual insulatings, insulating part 32 is respectively equipped with the first shoulder 321 that embeds die bond pad 215 and the second shoulder 322 that embeds polarity pad 216 in the both sides of length direction, corresponding first dogging shoulder 2151 that is provided with in one end of the die bond pad 215 connecting with the first shoulder 321, corresponding second dogging shoulder 2161 that is provided with in one end of the polarity pad 216 connecting with the second shoulder 322, more strengthen the combination stability of insulating part 32 and substrate 21, with prior art cup in cup support compared with, because substrate 21 is simple in structure, do not need to produce cup structure in cup by operations such as stretchings, the utility model has been simplified operation and has been reduced cost in taking into account plastic parts 3 and substrate 21 stable connections, and except die bond pad 215 and polarity pad 216 etc. adopt heat conduction sheet material 1, miscellaneous part all adopts plastic parts 3, reduce cost.
Polarity pad 216 is as the installing electrodes of another electrode of LED wafer.
Described die bond pad 215 and polarity pad 216 are extended with the first conducting strip 214 and the second conducting strip 217, the first conducting strips 214 and the second conducting strip 217 respectively for being electrically connected with external circuit to Lamp cup 31 outsides.
Described Lamp cup 31 comprises glass portion and connecting portion, and described connecting portion is plugged in described Lamp cup 31 fixing holes, and described cup portion is positioned at described substrate 21 1 sides, and Lamp cup 31 can be combined with substrate 21 better.
The cup portion of Lamp cup 31 surrounds a glass chamber, and two mutually perpendicular longitudinal cross-sections in cup chamber are from the shape of the inside convergent of oral area in cup chamber, and bottom, cup chamber is also provided with the containing cavity for accommodating LED wafer.As shown in Figure 3 and Figure 4, two mutually perpendicular longitudinal cross-sections in described cup chamber are inverted isosceles trapezoid face, the angle a=124 degree (as shown in Figure 3) of two waists of the first isosceles trapezoid 311, the angle b=118 degree (as shown in Figure 4) of the second isosceles trapezoid 313, two mutually perpendicular longitudinal cross-sections of described containing cavity are rectangular surfaces, be respectively the first rectangular surfaces 312 and the second rectangular surfaces 314, Lamp cup 31 is set to wide-angle, compared with cup in the low-angle cup of prior art, can improve it and go out light effect.
As shown in Figure 3, the thickness of described substrate 2121 is D=0.3 ± 0.01mm, substrate 21 can use copper product to make, in the cup of prior art, the substrate 2121(of cup is copper product) thickness be 0.12 or 0.15mm, as the copper product of used thickness 0.12 or 0.15mm do not adopt in cup cup-shaped insulator 3(be generally PPA material and make) cannot be combined with substrate 21, when application, will there is quality problem, therefore, the thickness of substrate 21 is made as 0.3 ± 0.01mm and can improves and the combination stability of insulator 3, can realize heat is conducted better and caused radiator simultaneously, improve light sustainment rate.
As shown in Figure 1, the centre distance of adjacent two described LED supports 22 of same row is W1=3.8mm; The both sides of described heat conduction sheet material 11 are provided with side location hole, and the centre distance of described location hole and immediate LED support 22 is W2=3.2mm; The distance of adjacent two described LED supports 22 of described same row is W3=0.6mm; The middle part of described heat conduction sheet material 11 is longitudinally provided with a row middle part location hole, and the width that is positioned at the central passage that two row LED supports 22 of location hole both sides, described middle part surround is W4=2.4mm; The width on the top of described insulating part 32 is W5=0.35mm; Like this, taking long as L=75mm, wide is that the heat conduction sheet material 11 of W=36mm is example, 72 LED supports 22 can be set, the heat conduction sheet material 11 that is 50mm, the wide 36mm of being with the length of prior art can only arrange compared with 30 LED supports 22, by dwindling the distance of 22 of LED supports and dwindling rim charge width, can increase the quantity of single LED support 22, the utilance that improves heat conduction sheet material 11, reduces costs; By increasing the quantity of single LED support 22, can improve insulator 3(PPA) utilance, reduce PPA Material Cost, can improve the production efficiency of die bond, bonding wire, some glue, baking, blanking station simultaneously, reduce production costs.
Described Lamp cup fixing hole (i.e. the first through hole 211 and the second through hole 213) is circular hole, can realize and the better combination of substrate 21.
The length of described die bond pad 215 is L1=6.975mm, and wide is W7=1.9mm, compared with prior art, has increased the area of die bond pad 215, can increase in the contact area of base fin, improves radiating effect.
The wide W6=0.12mm that is of described the first rectangular surfaces 312 and the second rectangular surfaces 314, be 0.12mm for the height of the containing cavity of placing LED wafer, can be used for placing the LED wafer that thickness is less than 0.12mm, the light of LED wafer is just sent along the sidewall of Lamp cup 31, can improve illumination effect.
Finally should be noted that; above embodiment is only in order to illustrate the technical solution of the utility model; but not restriction to the utility model protection range; although the utility model has been done to explain with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify or be equal to replacement the technical solution of the utility model, and not depart from essence and the scope of technical solutions of the utility model.
Claims (10)
1. the LED array support of a high usage and high light efficiency, the many rows LED support that comprises heat conduction sheet material and form on heat conduction sheet material, described LED support comprises substrate and the plastic parts of injection moulding on described substrate, described substrate is provided with the fixing hole for fixing described plastic parts, described substrate comprises die bond pad and polarity pad, it is characterized in that: described plastic parts comprises Lamp cup and insulating part, described fixing hole comprises Lamp cup fixing hole and insulating part fixing hole, described Lamp cup is fixed on described Lamp cup fixing hole, and described insulating part is fixed on described insulating part fixing hole; Described insulating part is spaced from each other die bond pad and polarity pad, described insulating part is respectively equipped with the first shoulder that embeds described die bond pad and the second shoulder that embeds described polarity pad in the both sides of length direction, corresponding first dogging shoulder that is provided with in one end of the described die bond pad connecting with described the first shoulder, corresponding second dogging shoulder that is provided with in one end of the described polarity pad connecting with described the second shoulder.
2. the LED array support of a kind of high usage as claimed in claim 1 and high light efficiency, is characterized in that: described die bond pad and polarity pad are extended with the first conducting strip and the second conducting strip to Lamp cup outside respectively.
3. the LED array support of a kind of high usage as claimed in claim 1 and high light efficiency, is characterized in that: described Lamp cup comprises glass portion and connecting portion, and described connecting portion is plugged in described Lamp cup fixing hole, and described cup portion is positioned at described substrate one side.
4. the LED array support of a kind of high usage as claimed in claim 1 and high light efficiency, it is characterized in that: the cup portion of described Lamp cup surrounds a glass chamber, two mutually perpendicular longitudinal cross-sections in described cup chamber are from the shape of the inside convergent of oral area in described cup chamber, and bottom, described cup chamber is also provided with the containing cavity for accommodating LED wafer.
5. the LED array support of a kind of high usage as claimed in claim 4 and high light efficiency, it is characterized in that: two mutually perpendicular longitudinal cross-sections in described cup chamber are inverted isosceles trapezoid face, the angle of two waists of one of them isosceles trapezoid is 115 to 140 degree, the angle of another one isosceles trapezoid is 110 to 130 degree, and two mutually perpendicular longitudinal cross-sections of described containing cavity are rectangular surfaces.
6. the LED array support of a kind of high usage as claimed in claim 1 and high light efficiency, is characterized in that: the thickness of described substrate is 0.2 ± 0.01 to 0.35 ± 0.01mm, and the height of described LED support is 0.6 ± 0.02 to 0.9 ± 0.02mm.
7. the LED array support of a kind of high usage as claimed in claim 1 and high light efficiency, is characterized in that: the centre distance of adjacent two described LED supports of same row is 3.2 to 3.8mm.
8. the LED array support of a kind of high usage as claimed in claim 1 and high light efficiency, is characterized in that: the both sides of described heat conduction sheet material are provided with side location hole, the centre distance of described location hole and immediate LED support is 3.2mm.
9. the LED array support of a kind of high usage as described in claim 1 to 8 any one and high light efficiency, it is characterized in that: the middle part of described heat conduction sheet material is longitudinally provided with a row middle part location hole, the width that is positioned at the central passage that two row LED supports of location hole both sides, described middle part surround is 2.4mm.
10. the LED array support of a kind of high usage as claimed in claim 1 and high light efficiency, is characterized in that: described Lamp cup fixing hole is circular hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420146368.4U CN203812910U (en) | 2014-03-28 | 2014-03-28 | High-utilization-rate and high-luminous-efficiency LED array support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420146368.4U CN203812910U (en) | 2014-03-28 | 2014-03-28 | High-utilization-rate and high-luminous-efficiency LED array support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203812910U true CN203812910U (en) | 2014-09-03 |
Family
ID=51451629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420146368.4U Expired - Lifetime CN203812910U (en) | 2014-03-28 | 2014-03-28 | High-utilization-rate and high-luminous-efficiency LED array support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203812910U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016197961A1 (en) * | 2015-06-11 | 2016-12-15 | 吴少健 | Led light packaging frame |
| CN106876375A (en) * | 2017-03-28 | 2017-06-20 | 山东晶泰星光电科技有限公司 | A kind of integrated form RGB LED displays |
| CN109065696A (en) * | 2018-10-29 | 2018-12-21 | 博罗县正润光电有限公司 | A kind of LED New-support |
| CN110762402A (en) * | 2019-10-18 | 2020-02-07 | 吴少健 | Manufacturing method of matrix type LED lamp source |
-
2014
- 2014-03-28 CN CN201420146368.4U patent/CN203812910U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016197961A1 (en) * | 2015-06-11 | 2016-12-15 | 吴少健 | Led light packaging frame |
| CN106876375A (en) * | 2017-03-28 | 2017-06-20 | 山东晶泰星光电科技有限公司 | A kind of integrated form RGB LED displays |
| CN109065696A (en) * | 2018-10-29 | 2018-12-21 | 博罗县正润光电有限公司 | A kind of LED New-support |
| CN110762402A (en) * | 2019-10-18 | 2020-02-07 | 吴少健 | Manufacturing method of matrix type LED lamp source |
| CN110762402B (en) * | 2019-10-18 | 2021-03-30 | 华南半导体(广东)有限公司 | Manufacturing method of matrix type LED lamp source |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203812910U (en) | High-utilization-rate and high-luminous-efficiency LED array support | |
| TWI415309B (en) | Preform Molded Polycrystalline Bearing Modules with Lead Frame Type | |
| CN102214776A (en) | Light emitting diode package, lighting device and light emitting diode package substrate | |
| CN201535483U (en) | Novel series and parallel LED (Light-Emitting Diode) packaging base | |
| CN103682028A (en) | Light emitting diode package structure and manufacture method thereof | |
| CN202905774U (en) | Substrate for light source module | |
| CN103579450A (en) | Light-emitting diode lamp bar | |
| CN203351644U (en) | Flip-chip LED support and surface mounted LED | |
| CN202003993U (en) | Large power LED packaging structure | |
| CN201429033Y (en) | Novel LED series module packaging structure | |
| CN208620092U (en) | A kind of steady type luminous lamp strip | |
| CN201758139U (en) | Novel LED light source module packaging structure | |
| CN202042521U (en) | LED packaging support, single piece thereof and LED packaging structure | |
| CN219778909U (en) | Spiral flip chip COB substrate | |
| CN201884982U (en) | Novel LED (light-emitting diode) light source module encapsulation structure | |
| CN201887044U (en) | Encapsulating structure for LED light source module | |
| CN201112407Y (en) | High power light-emitting diode structure | |
| CN103682063A (en) | Laterally light-emitting LED packaging structure and manufacturing method for laterally light-emitting LED packaging structure | |
| CN220106574U (en) | All-in-one LED support, LED light source module and LED electronic display screen | |
| CN203190172U (en) | Light bar structure | |
| CN202259291U (en) | Direct inserting type multi-chip LED lamp bead | |
| CN212783499U (en) | Fungible COB class SMD support | |
| CN201430162Y (en) | Novel LED packaging base | |
| CN203707166U (en) | All-metal integrated LED lamp bead packaging structure | |
| CN212062468U (en) | Side-emitting thermoelectric separation support |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140903 |