CN201975390U - Multi-LED chip packaging structure - Google Patents
Multi-LED chip packaging structure Download PDFInfo
- Publication number
- CN201975390U CN201975390U CN2010206836071U CN201020683607U CN201975390U CN 201975390 U CN201975390 U CN 201975390U CN 2010206836071 U CN2010206836071 U CN 2010206836071U CN 201020683607 U CN201020683607 U CN 201020683607U CN 201975390 U CN201975390 U CN 201975390U
- Authority
- CN
- China
- Prior art keywords
- led
- led chip
- groove
- led chips
- packaging structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
The utility model relates to a multi-LED chip packaging structure, belonging to the LED display equipment technical field. The invention, specifically relating to a technology about the multi-LED chip packaging structure, conquers the defects of the prior art and provides a packaging structure that can improve the brightness of an LED light source. The packaging structure, also allowing the hybrid electric connection and serial electric connection of multi-LED chips or a single-electrode LED chip, comprises metal wires, LED chips, a housing, grooves, and metal electrodes; wherein the housing takes a cuboid structure; the 4 to 16 cup-and-bowl shaped grooves, upon the upper surface of the housing, are mutually insulated; the LED chips, with number equal to that of the grooves, are installed inside the grooves; the metal electrodes, with number ranging from 2 to 10, are symmetrically arranged at two corresponding sides of the housing; and the lower electrodes of LED chips are connected via metal wires while the upper electrodes of the LED chips are led out via the metal wire to be connected with the metal electrodes.
Description
Technical field
The utility model belongs to LED display device technical field, is specifically related to the technology of the encapsulating structure of many led chips.
Background technology
At present, the power of single light-emitting diode (LED) chip is the demand that does not satisfy consumer's high brightness, so need a lot of led chips of combination under the situation of high brightness requiring to use.At this moment just need to adopt many led chips encapsulating structure, because this structure can improve the brightness of led light source.Prior art can't realize that the mixing of multiple led chip is electrically connected and is electrically connected in series or the mixing of single electrode led chip is electrically connected and is electrically connected in series.
The utility model content
In order to overcome the deficiencies in the prior art, the purpose of this utility model is: a kind of brightness that can improve led light source is provided.The mixing that can also realize multiple led chip is electrically connected and is electrically connected in series or the encapsulating structure of many led chips that the mixing of single electrode led chip is electrically connected and is electrically connected in series.
The technical scheme that its technical problem that solves the utility model adopts is as follows: a kind of encapsulating structure of many led chips, it comprises metal wire, led chip, shell, groove, metal electrode, described shell is a rectangular structure, groove is a cup bowl type, be positioned at the upper surface of shell, quantity is 4-16, and mutually insulated, led chip quantity equates with groove quantity, and corresponding one by one with groove, be installed in the groove, metal electrode quantity is 2-10, is on two sides that symmetry shape is installed in the shell correspondence, and the bottom electrode of led chip connects by metal wire, the top electrode of led chip is drawn by metal wire, is connected with metal electrode.
Described groove quantity is 6.
Described metal electrode quantity is 6.
Also comprise heat abstractor, described heat abstractor is installed in bottom portion of groove.Compared with prior art, the relative prior art of the utility model has following beneficial effect:
In use of the present utility model, a plurality of led chips have increased display brightness, by encapsulating a plurality of discrete bowl cups, and put a led chip in each bowl cup, have realized the encapsulating structure of the multiple electric connection mode of led chip.
Description of drawings
Fig. 1 is the structural representation of the encapsulating structure of the many led chips of the utility model;
Embodiment
Below in conjunction with drawings and Examples the utility model is further specified, but not as to qualification of the present utility model.
See also the embodiment of the encapsulating structure of the many led chips of the utility model shown in Figure 1.
A kind of encapsulating structure of many led chips, it comprises metal wire 1, led chip 2, shell 3, groove 4, metal electrode 5, shell 3 is a rectangular structure, groove 4 is a cup bowl type, be positioned at the upper surface of shell 3, quantity is 6, and mutually insulated, led chip 2 quantity equate with groove 4 quantity, and corresponding one by one with groove 4, be installed in the groove 4, metal electrode 5 quantity are 6, are on two sides that symmetry shape is installed in shell 3 correspondences, and the bottom electrode of led chip 2 connects by metal 1 line, the top electrode of led chip 2 is drawn by metal wire 1, is connected with metal electrode 5.
Also comprise heat abstractor 6, heat abstractor 6 is installed in groove 4 bottoms.
Above-described embodiment, the utility model embodiment a kind of more preferably just, the common variation that those skilled in the art carries out in the technical solutions of the utility model scope and replacing all should be included in the protection range of the present utility model.
Claims (4)
1. the encapsulating structure of led chip more than a kind, it is characterized in that: it comprises metal wire, led chip, shell, groove, metal electrode, described shell is a rectangular structure, groove is a cup bowl type, be positioned at the upper surface of shell, quantity is 4-16, and mutually insulated, led chip quantity equates with groove quantity, and corresponding one by one with groove, be installed in the groove, metal electrode quantity is 2-10, is on two sides that symmetry shape is installed in the shell correspondence, and the bottom electrode of led chip connects by metal wire, the top electrode of led chip is drawn by metal wire, is connected with metal electrode.
2. the encapsulating structure of many led chips according to claim 1, it is characterized in that: described groove quantity is 6.
3. the encapsulating structure of many led chips according to claim 1, it is characterized in that: described metal electrode quantity is 6.
4. the encapsulating structure of many led chips according to claim 1, it is characterized in that: also comprise heat abstractor, described heat abstractor is installed in bottom portion of groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206836071U CN201975390U (en) | 2010-12-28 | 2010-12-28 | Multi-LED chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206836071U CN201975390U (en) | 2010-12-28 | 2010-12-28 | Multi-LED chip packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201975390U true CN201975390U (en) | 2011-09-14 |
Family
ID=44580488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206836071U Expired - Fee Related CN201975390U (en) | 2010-12-28 | 2010-12-28 | Multi-LED chip packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201975390U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104776365A (en) * | 2015-05-05 | 2015-07-15 | 陈节庆 | Searchlight of LED forming machine |
-
2010
- 2010-12-28 CN CN2010206836071U patent/CN201975390U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104776365A (en) * | 2015-05-05 | 2015-07-15 | 陈节庆 | Searchlight of LED forming machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110914 Termination date: 20131228 |