CN103949792A - Integrated solder and electronic packaging case brazing mounting tool - Google Patents
Integrated solder and electronic packaging case brazing mounting tool Download PDFInfo
- Publication number
- CN103949792A CN103949792A CN201410194489.0A CN201410194489A CN103949792A CN 103949792 A CN103949792 A CN 103949792A CN 201410194489 A CN201410194489 A CN 201410194489A CN 103949792 A CN103949792 A CN 103949792A
- Authority
- CN
- China
- Prior art keywords
- scolder
- solder
- lead
- wire
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses an integrated solder and an electronic packaging case brazing mounting tool, and relates to the field of machining of airtight packaging cases of electronic products and photoelectric electronic products. The integrated solder consists of at least two solder rings and solder ribs for connecting all the solder rings integrally. The electronic packaging case brazing mounting tool comprises a substrate and a plurality of leading wires, wherein soldering holes in the same number as that of the leading wires are formed in the substrate; the integrated solder is also provided with the soldering rings which are in the same number as that of the leading wires; the leading wires are sleeved with convex ribs; the integrated solder is paved on the substrate; the leading wires are inserted into the solder rings and the soldering holes; the bottom sides of the convex ribs are propped against the upper surfaces of the solder rings. When the solder is used, correspondingly required solder amount is shorn according to the number of the leading wires; because the solder adopts an integrated structure, the solder can be positioned at one time when being mounted, and then the leading wires can be mounted directly; therefore, a cumbersome single solder circle installation process is avoided; the mounting time is saved; the production efficiency is improved; moreover, the product consistency is very good.
Description
Technical field
The present invention relates to electronic product and photoelectricity electronic product airtight packaging casing manufacture field, specifically relate to a kind of Contiuum type scolder, frock is shelved in electronic encapsulation shell soldering.
Background technology
In electronic encapsulation shell production process, often use the technique of soldering lead-in wire, the scolder production method of using when soldering lead-in wire has two kinds conventionally, one be first solder wire on a cylinder, and then cut into single scolder ring (as shown in Figure 1) according to the requirement of amount of solder; Another mode is to be processed into preformed single scolder ring by punching or other processing modes.The lead-in wire scolder of making due to two kinds of methods is all single scolder ring, and very loaded down with trivial details while shelving, efficiency is low, easily fills less neglected loading, and the scolder ring uniformity of shearing out by wrapping wire is also poor, affects the uniformity of product quality.
Summary of the invention
One of object of the present invention is to be to provide a kind of Contiuum type scolder, and it has avoided the shortcoming of single scolder ring, has improved greatly production efficiency.Another object of the present invention is to provide a kind of electronic encapsulation shell soldering to shelve frock, reduced the probability of makeing mistakes while shelving, improved and shelved efficiency.
In order to solve foregoing invention object, the technical scheme adopting is: a kind of Contiuum type scolder, and by least two scolder rings and each scolder ring is connected into holistic scolder muscle form.
As the further improvement of Contiuum type scolder, the width of described scolder muscle is 1/5～1/10 of scolder ring interior diameter.Described Contiuum type scolder is to be integral type structure by thin ribbon shaped scolder punching machine-shaping.
In order to solve above-mentioned another goal of the invention, the technical scheme adopting is: frock is shelved in a kind of electronic encapsulation shell soldering, comprise matrix and several lead-in wires, on described matrix, offer number and the welding hole that goes between and be consistent, described Contiuum type scolder is also provided with number and the scolder ring that lead-in wire is consistent, and on described lead-in wire, is equipped with convex tendon, and described Contiuum type scolder is layed on matrix, lead-in wire inserts in scolder ring and welding hole, the upper surface butt of the bottom side of convex tendon and scolder ring.
As electronic encapsulation shell, the further improvement of frock is shelved in soldering, and described convex tendon is integral type structure with lead-in wire by machine-shaping, and the installation site of each convex tendon on lead-in wire is consistent.The material of described matrix is made as pottery or metal, and in the time that material is chosen as pottery, the periphery along welding hole on described matrix is provided with the coat of metal.
Compared with prior art, frock is shelved in Contiuum type scolder of the present invention, electronic encapsulation shell soldering, and its beneficial effect shows:
In solution prior art, before lead-in wire and housing soldering, shelve inefficient problem, be applicable to many situations that goes between.Scolder reset condition is thin ribbon shaped coiled strip, is processed into Contiuum type (decorative pattern shape) structure by punching processing mode, with time according to number of leads come cutting in requisition for amount of solder.Because scolder is Contiuum type structure, so scolder can one-time positioning while shelving, then just can directly fill lead-in wire, thereby avoid loaded down with trivial details single scolder circle installation process, save the time of shelving, improved production efficiency, and homogeneity of product is very good.
Brief description of the drawings
Fig. 1 is the structural representation of single scolder ring in prior art.
Fig. 2 is the structural representation of lead-in wire.
Fig. 3 is the structural representation of Contiuum type scolder.
Fig. 4 is the structural representation of matrix.
Fig. 5 is the structural representation after shelving, before soldering.
Fig. 6 is the structural representation after soldering completes.
In figure, Reference numeral implication is as follows:
10-lead-in wire 11-convex tendon
20-Contiuum type scolder 21-scolder ring 22-scolder muscle
The 30-matrix 31-welding hole 32-coat of metal.
Detailed description of the invention
As shown in Figure 2, lead-in wire 10 is with convex tendon 11, and the installation site of each convex tendon 11 on lead-in wire 10 is consistent, so that carry out soldering with matrix 30, convex tendon 11 can be an entirety with lead-in wire 10, also can split accessory assembling form.
As shown in Figure 3, Contiuum type scolder 20 is by 15 scolder rings 21 and each scolder ring 21 is connected into holistic scolder muscle 22 form, and every 4 scolder rings 21 are arranged according to square, and surrounds foursquare scolder muscle 22 by four and connect.Scolder reset condition is thin ribbon shaped coiled strip, is processed into by punching Contiuum type (decorative pattern) structure that band connects muscle.
Scolder muscle 22 width are more narrow better, the fusing of scolder while being beneficial to soldering, but width should meet the requirement of punching processing technology, meets again the requirement of the structural strength of Contiuum type scolder own, and generally designing its width is 1/5～1/10 of scolder ring 21 interior diameters.
As shown in Figure 4, the material of matrix 30 is pottery or metal, in the time that the material of matrix 30 is pottery, on matrix 30, be provided with the coat of metal 32 along the periphery of welding hole 31, in the time that the material of matrix 30 is metal, if soldering can be directly carried out in metal material and wetting, can first carry out preplating processing to metal and carry out again soldering if do not infiltrated.
As shown in Figure 5, Contiuum type scolder is layed on matrix 30, and lead-in wire 10 inserts in scolder ring 21 and welding hole 31, the upper surface butt of the bottom side of convex tendon 11 and scolder ring 21.
While shelving, first use soldering mould fixing base 30, then Contiuum type (decorative pattern) scolder 20 is placed in brazing area, finally refill lead-in wire 10.
Lead-in wire installs and whole assembly is positioned and fixed with soldering mould afterwards, then puts into soldering sintering furnace and carries out soldering.
The setting of soldering sintering furnace technological parameter will match with corresponding scolder technological parameter.When soldering sintering due to the impact of temperature and capillarity, narrower company's muscle part can automatically melt and trickle to lead-in wire root, thereby avoided the UNICOM between lead-in wire, and soldering sintering can not see the company's muscle between scolder after completing, especially obvious to ceramic matrix.
After soldering completes, matrix material forms an overall structure with lead-in wire, and this structure is carried out to other technique post-processed relevant to package casing, just can complete the production of package casing.
The foregoing is only the schematic detailed description of the invention of the present invention, not in order to limit scope of the present invention.Any those skilled in the art, the equivalent variations of having done under the premise without departing from the spirit and scope of the present invention and improvement, all should belong to the scope of protection of the invention.
Claims (7)
1. a Contiuum type scolder, is characterized in that: by least two scolder rings (21) and each scolder ring (21) is connected into holistic scolder muscle (22) form.
2. Contiuum type scolder according to claim 1, is characterized in that: the width of described scolder muscle (22) is 1/5～1/10 of scolder ring (21) interior diameter.
3. Contiuum type scolder according to claim 1, is characterized in that: described Contiuum type scolder is to be integral type structure by thin ribbon shaped scolder punching machine-shaping.
4. apply the electronic encapsulation shell soldering of Contiuum type scolder as claimed in claim 1 and shelve frock for one kind, comprise matrix (30) and several lead-in wires (10), on described matrix (30), offer the welding hole (31) that number and lead-in wire (10) are consistent, it is characterized in that: described Contiuum type scolder is also provided with the scolder ring (21) that number and lead-in wire (10) are consistent, on described lead-in wire (10), be equipped with convex tendon (11), described Contiuum type scolder is layed on matrix (30), lead-in wire (10) inserts in scolder ring (21) and welding hole (31), the upper surface butt of the bottom side of convex tendon (11) and scolder ring (21).
5. frock is shelved in electronic encapsulation shell soldering according to claim 4, it is characterized in that: described convex tendon (11) is integral type structure with lead-in wire (10) by machine-shaping, and the installation site of each convex tendon (11) on lead-in wire (10) is consistent.
6. shelve frock according to the electronic encapsulation shell soldering described in claim 4 or 5, it is characterized in that: the material of described matrix (30) is made as pottery, described matrix (30) is upper is provided with the coat of metal (32) along the periphery of welding hole (31).
7. shelve frock according to the electronic encapsulation shell soldering described in claim 4 or 5, it is characterized in that: the material of described matrix (30) is made as metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410194489.0A CN103949792A (en) | 2014-05-09 | 2014-05-09 | Integrated solder and electronic packaging case brazing mounting tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410194489.0A CN103949792A (en) | 2014-05-09 | 2014-05-09 | Integrated solder and electronic packaging case brazing mounting tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103949792A true CN103949792A (en) | 2014-07-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410194489.0A Pending CN103949792A (en) | 2014-05-09 | 2014-05-09 | Integrated solder and electronic packaging case brazing mounting tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103949792A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104551432A (en) * | 2014-12-16 | 2015-04-29 | 芜湖美威包装品有限公司 | Solder ring |
| CN104759781A (en) * | 2015-04-17 | 2015-07-08 | 郑州机械研究所 | Silver substitute copper phosphorus tin coating brazing alloy ring and preparation method thereof |
| CN109128567A (en) * | 2017-06-19 | 2019-01-04 | 张跃 | A kind of cored solder structure, soldering sandwich composite board and its assembling mode |
| CN109398488A (en) * | 2017-08-16 | 2019-03-01 | 张跃 | A kind of land craft structure |
| CN112705809A (en) * | 2020-12-31 | 2021-04-27 | 合肥圣达电子科技实业有限公司 | Rack mounting method and rack mounting die for needle grid type infrared detector shell |
| CN114178647A (en) * | 2021-11-18 | 2022-03-15 | 西安赛尔电子材料科技有限公司 | Controllable flow process method for brazing filler metal |
| CN114178642A (en) * | 2021-11-22 | 2022-03-15 | 西安赛尔电子材料科技有限公司 | Method for welding high-power metal shell |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4050621A (en) * | 1976-11-03 | 1977-09-27 | Bunker Ramo Corporation | Method and apparatus for soldering electric terminals to double-sided circuit boards |
| US4557411A (en) * | 1983-10-26 | 1985-12-10 | At&T Information Systems | Interconnected solder pads and the method of soldering |
| US5029748A (en) * | 1987-07-10 | 1991-07-09 | Amp Incorporated | Solder preforms in a cast array |
| US5242097A (en) * | 1992-06-26 | 1993-09-07 | Indium Corporation Of America | Integrated preforms |
| US5620129A (en) * | 1995-02-17 | 1997-04-15 | Rogren; Philip E. | Device and method for forming and attaching an array of conductive balls |
| CN203843385U (en) * | 2014-05-09 | 2014-09-24 | 中国电子科技集团公司第四十三研究所 | Connected welding flux and electronic packaging shell match assemble welding tool |
-
2014
- 2014-05-09 CN CN201410194489.0A patent/CN103949792A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4050621A (en) * | 1976-11-03 | 1977-09-27 | Bunker Ramo Corporation | Method and apparatus for soldering electric terminals to double-sided circuit boards |
| US4557411A (en) * | 1983-10-26 | 1985-12-10 | At&T Information Systems | Interconnected solder pads and the method of soldering |
| US5029748A (en) * | 1987-07-10 | 1991-07-09 | Amp Incorporated | Solder preforms in a cast array |
| US5242097A (en) * | 1992-06-26 | 1993-09-07 | Indium Corporation Of America | Integrated preforms |
| US5620129A (en) * | 1995-02-17 | 1997-04-15 | Rogren; Philip E. | Device and method for forming and attaching an array of conductive balls |
| CN203843385U (en) * | 2014-05-09 | 2014-09-24 | 中国电子科技集团公司第四十三研究所 | Connected welding flux and electronic packaging shell match assemble welding tool |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104551432A (en) * | 2014-12-16 | 2015-04-29 | 芜湖美威包装品有限公司 | Solder ring |
| CN104759781A (en) * | 2015-04-17 | 2015-07-08 | 郑州机械研究所 | Silver substitute copper phosphorus tin coating brazing alloy ring and preparation method thereof |
| CN109128567A (en) * | 2017-06-19 | 2019-01-04 | 张跃 | A kind of cored solder structure, soldering sandwich composite board and its assembling mode |
| CN109398488A (en) * | 2017-08-16 | 2019-03-01 | 张跃 | A kind of land craft structure |
| CN112705809A (en) * | 2020-12-31 | 2021-04-27 | 合肥圣达电子科技实业有限公司 | Rack mounting method and rack mounting die for needle grid type infrared detector shell |
| CN112705809B (en) * | 2020-12-31 | 2024-03-15 | 合肥圣达电子科技实业有限公司 | Method and die for mounting needle grid type infrared detector shell |
| CN114178647A (en) * | 2021-11-18 | 2022-03-15 | 西安赛尔电子材料科技有限公司 | Controllable flow process method for brazing filler metal |
| CN114178642A (en) * | 2021-11-22 | 2022-03-15 | 西安赛尔电子材料科技有限公司 | Method for welding high-power metal shell |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140730 |
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| RJ01 | Rejection of invention patent application after publication |