CN104551432A - Solder ring - Google Patents

Solder ring Download PDF

Info

Publication number
CN104551432A
CN104551432A CN201410774461.4A CN201410774461A CN104551432A CN 104551432 A CN104551432 A CN 104551432A CN 201410774461 A CN201410774461 A CN 201410774461A CN 104551432 A CN104551432 A CN 104551432A
Authority
CN
China
Prior art keywords
solder ring
solder
ring main
main bodys
joint pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410774461.4A
Other languages
Chinese (zh)
Inventor
何奕报
周锦强
张位龙
高宗应
周业斌
张茂林
孙义斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhu Meiwei Packing Products Co Ltd
Original Assignee
Wuhu Meiwei Packing Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhu Meiwei Packing Products Co Ltd filed Critical Wuhu Meiwei Packing Products Co Ltd
Priority to CN201410774461.4A priority Critical patent/CN104551432A/en
Publication of CN104551432A publication Critical patent/CN104551432A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Arc Welding In General (AREA)

Abstract

The invention discloses a solder ring which comprises at least two solder ring bodies. Each solder ring body is in a shape of circular ring. Several solder ring bodies are arranged coaxially and in parallel. Every two adjacent solder ring bodies are connected through one or more connecting poles. According to the solder ring of the invention, the whole solder ring is formed by utilizing several solder ring bodies arranged coaxially and in parallel and arranging the connecting poles among several solder ring bodies; the whole solder ring is steady in structure, has bigger contact area and more solder than the solder ring with the single ring and has good guiding performance; the solder skips or nonuniform welding is not easy to cause.

Description

Solder ring
Technical field
The present invention relates to copper pipe welding technology field, particularly a kind of solder ring for weld filler.
Background technology
Copper pipe in heat exchanger, when closed, be generally couple together with the open at one end of little bend pipe by big syphon, be then welded and fixed.Welding needs to increase weld filler, is generally on little bend pipe, overlap a welding ring to serve as weld filler.Existing welding ring is exactly the copper material of a ring-type, and material small area of contact is also little, and can not meet the requirement of welding, easily cause solder skip or weld uneven, affect the quality of product, follow-up needs carries out repair welding, improves human cost, affects production efficiency.
Summary of the invention
The copper material of the technical issues that need to address of the present invention to be existing welding ring a be exactly ring-type, material small area of contact is also little, can not meet the requirement of welding.
For solving the problems of the technologies described above, the invention provides a kind of solder ring, comprise at least two solder ring main bodys, each solder ring main body is annular, multiple solder ring main body is coaxially arranged in parallel, is connected between two adjacent solder ring main bodys by one or more joint pin.Solder ring of the present invention, utilize multiple solder ring main bodys coaxially arranged in parallel, and joint pin is set between multiple solder ring main body to form whole solder ring, whole solder ring structure is stablized, than the solder ring of monocycle, contact area is large, and solder is many, and steering capability is good, be not easy to cause solder skip or weld uneven.
Wherein a kind of scheme is, multiple described joint pin is vertically connected between two adjacent solder ring main bodys.Joint pin is vertically connected between two adjacent solder ring main bodys, Stability Analysis of Structures.
Wherein another kind of scheme is, multiple described joint pin Sloped rotating is connected between two adjacent solder ring main bodys.Joint pin Sloped rotating is connected between two adjacent solder ring main bodys, the fusing of solder is connected more even.
Preferably, the invention provides a kind of solder ring, comprise two solder ring main bodys, between two solder ring main bodys, be connected with a spiral helicine joint pin.Between two solder ring main bodys, be connected with a spiral helicine joint pin, the molten solder of solder is more even, and has certain toughness, is not easy distortion.
Solder ring of the present invention, change the structure of traditional monocycle as solder ring, add changeable structure, and the solder ring main body of multilayer, structure is more stable, solder contact face is large and fusing is even, welding quality is better, is not easy produce solder skip and weld uneven phenomenon, decreases the workload of follow-up repair welding, improve efficiency simultaneously, improve yield rate.
Accompanying drawing explanation
Fig. 1 is the structural representation of the embodiment of the present invention one;
Fig. 2 is the structural representation of the embodiment of the present invention two;
Fig. 3 is the structural representation of the embodiment of the present invention three;
Wherein, 1-solder ring main body, 2-joint pin.
Detailed description of the invention
The preferred technical solution of the present invention is described in detail below in conjunction with accompanying drawing.
As shown in the figure, solder ring of the present invention, comprises at least two solder ring main bodys 1, and each solder ring main body 1 is annular, and multiple solder ring main body 1 is coaxially arranged in parallel, connects 2 between two adjacent solder ring main bodys 1 by one or more joint pin.
Embodiment one:
Solder ring of the present invention, comprise two solder ring main bodys 1, each solder ring main body 1 is annular, two solder ring main bodys 1 are coaxially arranged in parallel, 2 are connected by multiple joint pin between two solder ring main bodys 1, multiple described joint pin 2 is vertically connected between two solder ring main bodys 1, and joint pin 2 can be 4-6.Joint pin 2 is vertically connected between two adjacent solder ring main bodys 1, Stability Analysis of Structures.
Embodiment two:
Solder ring of the present invention, comprise two solder ring main bodys 1, each solder ring main body 1 is annular, two solder ring main bodys 1 are coaxially arranged in parallel, 2 are connected by multiple joint pin between two solder ring main bodys 1, multiple described joint pin 2 Sloped rotating is connected between two solder ring main bodys 1, and joint pin 2 can be 3-5.Joint pin 2 Sloped rotating is connected between two solder ring main bodys 1, the fusing of solder is connected more even.
Embodiment three:
Solder ring of the present invention, comprises two solder ring main bodys 1, and each solder ring main body 1 is annular, and two solder ring main bodys 1 are coaxially arranged in parallel, is connected with a spiral helicine joint pin 2 between two solder ring main bodys 1.Between two solder ring main bodys, be connected with a spiral helicine joint pin, the molten solder of solder is more even, and has certain toughness, is not easy distortion.
Solder ring of the present invention, utilize multiple solder ring main bodys coaxially arranged in parallel, and joint pin is set between multiple solder ring main body to form whole solder ring, whole solder ring structure is stablized, than the solder ring of monocycle, contact area is large, and solder is many, and steering capability is good, be not easy to cause solder skip or weld uneven.
Solder ring of the present invention, change the structure of traditional monocycle as solder ring, add changeable structure, and the solder ring main body of multilayer, structure is more stable, solder contact face is large and fusing is even, welding quality is better, is not easy produce solder skip and weld uneven phenomenon, decreases the workload of follow-up repair welding, improve efficiency simultaneously, improve yield rate.

Claims (4)

1. a solder ring, is characterized in that: comprise at least two solder ring main bodys, and each solder ring main body is annular, and multiple solder ring main body is coaxially arranged in parallel, is connected between two adjacent solder ring main bodys by one or more joint pin.
2. solder ring as claimed in claim 1, is characterized in that: multiple described joint pin is vertically connected between two adjacent solder ring main bodys.
3. solder ring as claimed in claim 1, is characterized in that: multiple described joint pin Sloped rotating is connected between two adjacent solder ring main bodys.
4. solder ring as claimed in claim 3, is characterized in that: comprise two solder ring main bodys, be connected with a spiral helicine joint pin between two solder ring main bodys.
CN201410774461.4A 2014-12-16 2014-12-16 Solder ring Pending CN104551432A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410774461.4A CN104551432A (en) 2014-12-16 2014-12-16 Solder ring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410774461.4A CN104551432A (en) 2014-12-16 2014-12-16 Solder ring

Publications (1)

Publication Number Publication Date
CN104551432A true CN104551432A (en) 2015-04-29

Family

ID=53069067

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410774461.4A Pending CN104551432A (en) 2014-12-16 2014-12-16 Solder ring

Country Status (1)

Country Link
CN (1) CN104551432A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104801808A (en) * 2015-05-12 2015-07-29 广东骏驰科技股份有限公司 Copper brazing material automatic feeding device
CN106624240A (en) * 2016-12-20 2017-05-10 江门市森德制冷器材有限公司 Process for covering copper on surface of iron part

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2273634Y (en) * 1996-09-11 1998-02-04 中国石油天然气总公司工程技术研究院 Solder ring used for induction soldering pipeline
US5887779A (en) * 1997-04-25 1999-03-30 Phoenix Logistics, Inc. Solder sleeve having improved heat transfer characteristics and method therefor
JP2002252294A (en) * 2001-02-22 2002-09-06 Sumitomo Metal Electronics Devices Inc Solder and semiconductor package using it
US20090200363A1 (en) * 2008-02-13 2009-08-13 Trane International Inc. Braze Ring
CN203471158U (en) * 2013-09-10 2014-03-12 珠海格力电器股份有限公司 Brazing filler metal welding ring and welding device and production line
CN103949792A (en) * 2014-05-09 2014-07-30 中国电子科技集团公司第四十三研究所 Integrated solder and electronic packaging case brazing mounting tool
CN204449682U (en) * 2014-12-16 2015-07-08 芜湖美威包装品有限公司 Solder ring

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2273634Y (en) * 1996-09-11 1998-02-04 中国石油天然气总公司工程技术研究院 Solder ring used for induction soldering pipeline
US5887779A (en) * 1997-04-25 1999-03-30 Phoenix Logistics, Inc. Solder sleeve having improved heat transfer characteristics and method therefor
JP2002252294A (en) * 2001-02-22 2002-09-06 Sumitomo Metal Electronics Devices Inc Solder and semiconductor package using it
US20090200363A1 (en) * 2008-02-13 2009-08-13 Trane International Inc. Braze Ring
CN203471158U (en) * 2013-09-10 2014-03-12 珠海格力电器股份有限公司 Brazing filler metal welding ring and welding device and production line
CN103949792A (en) * 2014-05-09 2014-07-30 中国电子科技集团公司第四十三研究所 Integrated solder and electronic packaging case brazing mounting tool
CN204449682U (en) * 2014-12-16 2015-07-08 芜湖美威包装品有限公司 Solder ring

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104801808A (en) * 2015-05-12 2015-07-29 广东骏驰科技股份有限公司 Copper brazing material automatic feeding device
CN104801808B (en) * 2015-05-12 2016-08-17 广东骏驰科技股份有限公司 A kind of copper solder automatic charging device
CN106624240A (en) * 2016-12-20 2017-05-10 江门市森德制冷器材有限公司 Process for covering copper on surface of iron part

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Legal Events

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20150429