CN206779457U - The SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches - Google Patents
The SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches Download PDFInfo
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- CN206779457U CN206779457U CN201720674529.0U CN201720674529U CN206779457U CN 206779457 U CN206779457 U CN 206779457U CN 201720674529 U CN201720674529 U CN 201720674529U CN 206779457 U CN206779457 U CN 206779457U
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Abstract
The utility model discloses the SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches, to solve the problems such as complicated, pressed density skewness present in existing pressed by powder technology, installation step is numerous and diverse；And the problem such as efficiency is low, complicated, energy utilization rate is low present in existing powder ultrasound molding-compression technique, the utility model includes SMD vibration cavity plate component, upper ejector die, lower ejector die, moves back die-cushion block, heightens forks piece, electrode briquetting, and the utility model can effectively solve present in complicated, pressed density skewness present in pressed by powder technology and existing powder ultrasound molding-compression technique the problems such as efficiency is low, complicated, energy utilization rate is low.
Description
Technical field
The SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches that the present invention designs, belongs to Electronic Components Manufacturing system
Make technical field.
Background technology
With science and technology progress, some large scale equipments, precision instrument have been widely used for manufacturing industry, oil,
The every field such as chemical industry, Aero-Space, and wherein capacitor plays vital effect, and tantalum electrolytic capacitor is as electricity
One kind of container, because it possesses excellent electrical property, operating temperature range is wide, and various informative, and volume efficiency is excellent, by
More and more extensive concern is arrived, this just proposes higher requirement to tantalum electrolytic capacitor.In the processing of tantalum electrolytic capacitor
The processing and fabricating of tantalum core is the committed step for ensureing tantalum electrolytic capacitor quality in manufacturing process, but existing compacting tool set is deposited
Pressed density is uneven, assembling process complexity the problems such as.
Existing pressed by powder technology, powder is mainly processed into given size and shape using mechanical pressure and model
Product process, the problems such as complicated, pressed density skewness, installation step is numerous and diverse be present；Existing powder ultrasound shaping pressure
Technology processed, dither mainly is applied to mould using multiple transducers, there is that efficiency is low, complicated, energy utilization rate
Low problem.
The content of the invention
To solve complicated, pressed density skewness, installation step present in above-mentioned existing pressed by powder technology
The problems such as numerous and diverse；And efficiency is low, complicated, energy utilization rate is low etc. present in existing powder ultrasound molding-compression technique
Problem, the utility model disclose the SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches.The SMD tantalum electricity of piezoelectric patches
Electrolysis condenser ultrasound antifriction mould includes SMD vibration cavity plate component, upper ejector die, lower ejector die, moves back die-cushion block, heightens fork
Piece, electrode briquetting；The SMD vibration cavity plate component upper and lower ends are connected with upper ejector die and lower ejector die respectively, and
It is disposed with and heightens between SMD vibration cavity plate component and upper ejector die and SMD vibration cavity plate component and lower ejector die
Forks piece, it is described move back die-cushion block and be arranged in heighten between forks piece and lower ejector die, the electrode briquetting and SMD vibration cavity plate group
Part coordinates.
The SMD vibration cavity plate component includes vibration die cavity matrix, piezoelectric element, and the vibration die cavity matrix is circle
Cylinder, vibration die cavity intrinsic silicon are provided with circular cavity or square cavity；The vibration die cavity outer surface of matrix is provided with n faceted pebble
（N is >=2 even number）, vibrate die cavity matrix rib and be provided with open slot, the opening trench bottom is provided with electrode installation cambered surface；It is described
Piezoelectric element is pasted on faceted pebble by gluing mode.
The upper ejector die includes circular upper ejector die boss or square upper ejector die boss, upper ejector die base；It is described
Ejector die boss or square upper ejector die boss end are provided with planoconcave in circle；The upper ejector die base is circle；It is described
Lower ejector die includes circular lower ejector die boss or square lower ejector die boss, lower ejector die base, lower ejector die and convex pressure
Mould difference is under circle that ejector die boss or square lower ejector die boss height are higher, the circular upper ejector die boss or side
Ejector die boss, circular lower ejector die boss or square lower ejector die boss enter from vibration die cavity matrix upper and lower ends respectively in shape
Enter into circular cavity or square cavity.
The die-cushion block that moves back is fork-shaped, including fork body, handle, the fork body, respectively with lower ejector die, heighten forks piece and connect
Touch, realize that the tantalum core that compacting is completed exits SMD vibration cavity plate component with the distance for limiting lower ejector die, heightening forks piece；It is described
Heightening forks piece includes feet, flake handle, and it is respectively arranged in SMD vibration cavity plate component and upper ejector die and SMD
Vibration cavity plate component and move back between die-cushion block.
The electrode briquetting includes press handle, pressing plate and the briquetting groove for being arranged at bottom；Pressing plate and it is arranged at
The briquetting groove of bottom coordinates with open slot and electrode installation cambered surface respectively, and the fitting end face of the press handle is inclination
Face, it can be bonded with vibrating the outer surface of die cavity matrix.
Beneficial effect：The utility model proposes the SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches, in tantalum electric capacity
On the basis of compacting tool set, with reference to ultrasonic antifriction effect, in tantalum electric capacity pressing process, applied using piezoelectric element to mould and surpassed
Acoustic vibration, efficiently solves conventional powder compact technique, the problems such as complicated, pressed density skewness, existing powder
Ultrasonic molding-compression technique, the problems such as efficiency is low, complicated, energy utilization rate is low, the utility model have simple in construction, pressure
The technical advantages such as excellent effect processed, cost be low, can greatly promote the industry development of tantalum electrolytic capacitor, to national defense construction, society
It can improve with great social and economic effects.
Brief description of the drawings
Fig. 1 show the structural representation of the SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches；
Fig. 2 show the structural decomposition diagram of the SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches；
The SMD vibration that Fig. 3 show the circular cavity of the SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches is recessed
Membrane module structural representation；
The SMD vibration that Fig. 4 show the square cavity of the SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches is recessed
Membrane module structural representation；
Fig. 5 show the circular upper ejector die boss of having of the SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches
Convex stamper architecture schematic diagram；
What Fig. 6 showed piezoelectric patches SMD tantalum electrolytic capacitor ultrasound antifriction mould has square upper ejector die boss
Convex stamper architecture schematic diagram；
Fig. 7 show the circular lower ejector die boss of having of the SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches
Lower ejector die structural representation；
What Fig. 8 showed piezoelectric patches SMD tantalum electrolytic capacitor ultrasound antifriction mould has square lower ejector die boss
Lower ejector die structural representation；
What Fig. 9 showed the SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches moves back die-cushion block structure schematic diagram；
What Figure 10 showed the SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches heightens forks piece structural representation；
Figure 11 show the electrode briquette structure schematic diagram of the SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches.
Embodiment
Embodiment one:Illustrate present embodiment with reference to Fig. 1 ~ 11.Present embodiment provides the SMD tantalum of piezoelectric patches
The embodiment scheme of electrolytic capacitor ultrasound antifriction mould.The SMD tantalum electrolytic capacitor ultrasound antifriction of piezoelectric patches
Mould includes SMD vibration cavity plate component 1, upper ejector die 2, lower ejector die 3, moves back die-cushion block 4, heightens forks piece 5, electrode briquetting
6；The SMD upper and lower ends of vibration cavity plate component 1 are connected with upper ejector die 2 and lower ejector die 3 respectively, and in paster
It is disposed between formula vibration cavity plate component 1 and upper ejector die 2 and SMD vibration cavity plate component 1 and lower ejector die 3 and heightens fork
Piece 5, it is described move back die-cushion block 4 and be arranged in heighten between forks piece 5 and lower ejector die 3, the electrode briquetting 6 and SMD vibration cavity plate
Component 1 coordinates to fixed electrode.
The SMD vibration cavity plate component 1 of the SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches includes vibration
Die cavity matrix 1-1, piezoelectric element 1-2, the vibration die cavity matrix 1-1 is cylinder, and circle is provided with inside vibration die cavity matrix 1-1
Shape cavity 1-1-100 or square cavity 1-1-101 suppress tantalum core of different shapes to load tantalum powder；The vibration die cavity
Matrix 1-1 outer surfaces are provided with n faceted pebble 1-1-2（N is >=2 even number）, to ring pressing electric device 1-2, circular vibration die cavity
Matrix 1-1 ribs are provided with open slot 1-1-3, and to install electrode, the open slot 1-1-3 bottoms are provided with electrode installation cambered surface 1-
1-3-1 is to facilitate fixed electrode；The piezoelectric element 1-2 is pasted on faceted pebble 1-1-2 by gluing mode.
The upper ejector die 2 includes the upper ejector die boss 2-101 of circular upper ejector die boss 2-100 or square, convex pressure
Mould base 2-2；The upper ejector die boss 2-101 of the circular upper ejector die boss 2-100 or square, can be according to the tantalum of required compacting
The shape of core is changed, and tantalum core of different shapes is suppressed to coordinate with circular cavity 1-1-100 or square cavity 1-1-101, described
The upper ejector die boss 2-101 ends of ejector die boss 2-100 or square are provided with planoconcave 2-1-1 in circle, to for compacting
Tantalum core chamfering, facilitates subsequent packages；The upper ejector die base 2-2 is circle, to realize the transmission of power, and limits convex pressure
The axial displacement of mould 2；The lower ejector die 3 include the circular lower lower ejector die boss 3-101 of ejector die boss 3-100 or square,
Lower ejector die base 3-2, lower ejector die 3 are under circle convex pressure under ejector die boss 3-100 or square with the difference of upper ejector die 2
Mould boss 3-101 height is higher, and will suppress the SMD vibration cavity plate component 1 of the tantalum core completed ejection, the circle is convex
The upper ejector die boss 2-101 of pressing mold boss 2-100 or square, the circular lower lower ejector die boss of ejector die boss 3-100 or square
3-101 is entered in circular cavity 1-1-100 or square cavity 1-1-101 from vibration die cavity matrix 1-1 upper and lower ends respectively, with
Suppress tantalum powder.
The die-cushion block 4 that moves back is fork-shaped, including fork body 4-1, handle 4-2, the fork body 4-1, respectively with lower ejector die 3,
Heighten forks piece 5 to contact, SMD vibration is exited with the tantalum core of the lower ejector die 3 of limitation, the distance realization compacting completion for heightening forks piece 5
Cavity plate component 1；The forks piece 5 of heightening includes feet 5-1, flake handle 5-2, and it is respectively arranged in SMD vibration cavity plate component
1 and upper ejector die 2 and SMD vibration cavity plate component 1 and between moving back die-cushion block 4, to adjust SMD vibration cavity plate component
1 with the axial distance of upper ejector die 2 and lower ejector die 3, completed the uniform compacting of tantalum core.
The electrode briquetting 6 includes press handle 6-1, pressing plate 6-2 and is arranged at the briquetting groove 6-3 of bottom；It is described
Press handle 6-1 is to facilitate the placement that fetches of electrode briquetting 6, pressing plate 6-2 and the briquetting groove 6-3 difference for being arranged at bottom
Coordinate with open slot 1-1-3 and electrode installation cambered surface 1-1-3-1 with fixed electrode, the fitting end face of the press handle 6-1
6-1-1 is inclined plane, to be bonded with the outer surface for vibrating die cavity matrix 1-1.
Operation principle：The SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches include SMD vibration cavity plate component 1,
Upper ejector die 2, lower ejector die 3, move back die-cushion block 4, heighten forks piece 5, electrode briquetting 6；Before compacting, assembly jig simultaneously loads tantalum powder,
During compacting, apply axial compressive force for mould, and that extracts top and bottom successively heightens forks piece 5, reaches the two-way compacting of classification
Purpose, at the same time, excitation electric signal is passed through for piezoelectric element 1-2, according to the inverse piezoelectric effect of piezoelectric, piezoelectric element 1-
2 according to excitation electric signal elongation, shorten, and then excited vibration die cavity matrix 1-1 produce dither, so as to reduce tantalum powder with
Frictional force between tantalum powder, tantalum powder and circular cavity 1-1-100 or square cavity 1-1-101 inwalls, reaches the effect uniformly suppressed
Fruit.
Claims (5)
1. the SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches, it is characterised in that：The SMD tantalum electrolysis of piezoelectric patches
Capacitor ultrasound antifriction mould includes SMD vibration cavity plate component (1), upper ejector die (2), lower ejector die (3), moves back die-cushion block
(4) forks piece (5), electrode briquetting (6), are heightened；It is described it is SMD vibration cavity plate component (1) upper and lower ends respectively with upper ejector die
(2) it is connected with lower ejector die (3), and in SMD vibration cavity plate component (1) and upper ejector die (2) and SMD vibration
Be disposed between cavity plate component (1) and lower ejector die (3) and heighten forks piece (5), it is described move back die-cushion block (4) and be arranged in heighten forks piece
(5) between lower ejector die (3), the electrode briquetting (6) coordinates with SMD vibration cavity plate component (1).
2. the SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches according to claim 1, it is characterised in that：The patch
Chip vibrating cavity plate component (1) includes vibration die cavity matrix (1-1), piezoelectric element (1-2), the vibration die cavity matrix (1-1)
For cylinder, vibration die cavity matrix (1-1) is internal to be provided with circular cavity (1-1-100) or square cavity (1-1-101)；It is described to shake
Dynamic model chamber matrix (1-1) outer surface is provided with n faceted pebble (1-1-2)（N is >=2 even number）, vibrate and set on die cavity matrix (1-1) rib
There is open slot (1-1-3), open slot (1-1-3) bottom is provided with electrode installation cambered surface (1-1-3-1)；The piezoelectric element
(1-2) is pasted on faceted pebble (1-1-2) by gluing mode.
3. the SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches according to claim 1, it is characterised in that：On described
Ejector die (2) includes circular upper ejector die boss (2-100) or square upper ejector die boss (2-101), upper ejector die base (2-
2)；The circular upper ejector die boss (2-100) or square upper ejector die boss (2-101) end are provided with planoconcave (2-1-1)；
The upper ejector die base (2-2) is circle；The lower ejector die (3) includes circular lower ejector die boss (3-100) or square
Lower ejector die boss (3-101), lower ejector die base (3-2), lower ejector die (3) are under circle with upper ejector die (2) difference
Ejector die boss (3-100) or square lower ejector die boss (3-101) height are higher, the circular upper ejector die boss (2-
100) or square upper ejector die boss (2-101), circle descend ejector die boss (3-100) or square lower ejector die boss (3-
101) circular cavity (1-1-100) or square cavity (1-1-101) are entered from vibration die cavity matrix (1-1) upper and lower ends respectively
In.
4. the SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches according to claim 1, it is characterised in that：It is described
It is fork-shaped to move back die-cushion block (4), including fork body (4-1), handle (4-2), it is described fork body (4-1), respectively with lower ejector die (3), adjust
High forks piece (5) contacts, and is exited with the tantalum core of the lower ejector die (3) of limitation, the distance realization compacting completion for heightening forks piece (5) SMD
Vibrate cavity plate component (1)；The forks piece (5) of heightening includes feet (5-1), flake handle (5-2), and it is respectively arranged in paster
Formula vibration cavity plate component (1) and upper ejector die (2) and SMD vibrate cavity plate component (1) and move back between die-cushion block (4).
5. the SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches according to claim 1, it is characterised in that：The electricity
Extreme pressure block (6) includes press handle (6-1), pressing plate (6-2) and the briquetting groove (6-3) for being arranged at bottom；Pressing plate (6-2) with
And be arranged at the briquetting groove (6-3) of bottom and coordinate respectively with open slot (1-1-3) and electrode installation cambered surface (1-1-3-1),
The fitting end face (6-1-1) of the press handle (6-1) is inclined plane, can be bonded with the outer surface of vibration die cavity matrix (1-1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720674529.0U CN206779457U (en) | 2017-06-12 | 2017-06-12 | The SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720674529.0U CN206779457U (en) | 2017-06-12 | 2017-06-12 | The SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches |
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| CN206779457U true CN206779457U (en) | 2017-12-22 |
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| CN201720674529.0U Expired - Fee Related CN206779457U (en) | 2017-06-12 | 2017-06-12 | The SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111059094A (en) * | 2020-01-09 | 2020-04-24 | 长春工业大学 | Limit screw rod rotation decoupling type mechanical rodless locking cylinder |
-
2017
- 2017-06-12 CN CN201720674529.0U patent/CN206779457U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111059094A (en) * | 2020-01-09 | 2020-04-24 | 长春工业大学 | Limit screw rod rotation decoupling type mechanical rodless locking cylinder |
| CN111059094B (en) * | 2020-01-09 | 2021-09-14 | 长春工业大学 | Limit screw rod rotation decoupling type mechanical rodless locking cylinder |
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| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171222 |