JPS60143697A - Method of fixing lead wire to printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION 2. Field of Industrial Use of Beno The present invention relates to a method for fixing lead wires to a printed wiring board used in electronic equipment.

2. Description of the Related Art In general, printed wiring boards used in electronic equipment are often installed at separate locations within the cabinet that constitutes the electronic equipment, and parallel lead wires or multiple single wires are connected between the printed wiring boards. The structure was such that electrical connections were made using lead wires. In this case, the printed wiring board is divided at the dividing line such as a perforation after both ends of the lead wire are joined by soldering to the respective substrate parts of the printed wiring board divided by a dividing line such as a perforation.

Problems to be Solved by the Invention However, in the conventional lead wire fixing method described above, the lead wires are soldered to the respective board parts of the printed wiring board that is separated along the dividing line. Since the end of the wire is simply inserted, the solder dip method is used to solder the lead wire in place on the printed wiring board and connect the lead wire using the pressure of molten solder. When the lead wire is soldered, the wire tends to float out of position, and the lead wire soldering described above has the disadvantage that it is not possible to reliably solder the wire to the position.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides that, when soldering the lead wires to the printed wiring board by the solder dip method, the lead wires are sometimes soldered to the respective substrate parts of the printed wiring board. For soldering the upper lead wire, a lead wire locking tongue protrudes into a hole formed near the position, and the lead wire is inserted into a long hole having a width that allows the lead wires to be inserted in parallel. The lead wire is bent into a substantially U-shape by being locked with a locking tongue, and the soldering of the lead wire is temporarily held in position.

According to the present invention, with the above configuration, the lead wire can be temporarily held on the printed wiring board by the elongated hole having the locking tongue during soldering, and each of the lead wires on the printed wiring board When soldering the lead wires on the board part, it is possible to prevent the lead wires from floating out of position, so that the soldering can be performed while maintaining the correct position relative to the position. As a result, the lead wires can be reliably soldered to the printed wiring board.

Embodiment FIGS. 1 to 4 show an embodiment of the present invention. 1st
In the figure, 1 is a front cabinet that constitutes electronic equipment, 2 is a transparent plate attached to the window hole of the front cabinet 1, and 3
is a decorative plate such as a scale plate of a radio receiver, and is provided facing inside the transparent plate 2. Reference numeral 4 designates a rear cabinet that constitutes electronic equipment, and bosses 5 and 6 for attaching parts are provided inside the cabinet. 6 is an electronic component, and 7a and 7b are printed wiring boards comprising electronic circuits, which are formed by dividing one printed wiring board 7. 8 is an electronic component that requires operation 6
9 is an LED that protrudes from the hole in the decorative plate 3.
These display components are mounted on the printed wiring board 7a.

Reference numeral 1o denotes parallel lead wires for connecting the printed wiring boards 7a and 7b, and the number of lead wires 1o corresponds to the layout of the circuit page 5. As described above, in electronic equipment, it is necessary to use a plurality of printed wiring boards and connect them with parallel lead wires.

Regarding the printed wiring board used in Fig. 1, the second
This will be explained with reference to FIG. 11 is a dividing line consisting of a perforated hole so that the printed wiring board 7 can be divided, and 12.13 is a dividing line formed near the soldering position of the parallel lead wires 1o on the printed wiring boards 7a and 7b. It is a long hole and has a width that allows parallel lead wires 1o to pass through it in parallel. Reference numerals 14 and 14' denote locking tongues protruding into the long hole from both sides of the long hole 12. In this embodiment, the locking tongues 14 are longer than the locking tongues 14'. There is. The locking tongues 14 and 14' form the long holes 12 and 13 into a substantially U-shaped shape, and the parallel lead wire 10 is fitted into the long hole 12 or 13 while being bent into a substantially U-shape. It is locked by the pieces 14, 14'.

Next, the fitting operation between the elongated hole and the lead wire will be explained according to FIGS. 4A to 4C. The parallel lead wire 1o is bent 6 pages and inserted into the long locking tongue 14 side of the elongated hole 12 (Fig. 4 A), and then passed through the short locking tongue 14' (Fig. 4 Port). When the parallel lead wire 1o is returned to the short locking tongue 14' side so that it is in a parallel state (FIG. 4C), the parallel lead wire 1O is bent into a U-shape and forms a long hole as shown in FIG. 1
2 or 13. At this time, the edge corner A of the elongated hole 12 or 13.

The parallel lead wires 1o come into contact with B, C, D, and E, and are held together with a constant force by the elasticity of the parallel lead wires. Therefore, when the printed wiring board 7 is soldered by the solder dip method, the parallel lead wires 1o are not lifted by the molten solder, and a reliable solder joint can be achieved. Moreover, even if the printed wiring board 7 is divided into 78 and 7b by the dividing line, the parallel lead wires 1o are firmly held by the printed wiring board 7a or 7b. In the drawing, 16 indicates a lead wire soldering part.

In the above embodiment, the elongated hole 12 on the printed wiring board 7a side is formed continuously with the hole on the parting line. The same effect can be achieved not only with parallel lead wires but also with single wires bound or twisted single wires, and even when soldered to electronic components such as volume switches instead of printed wiring boards. effect can be obtained.

Effects of the Invention The present invention provides parallel lead wires or lead wires integrated with a plurality of single wires through holes formed in the vicinity of positions for soldering the lead wires on each board portion of a printed wiring board that is divided by a dividing wire. A lead wire locking tongue protrudes inside and is inserted into an elongated hole having a width that allows the lead wires to be inserted in parallel, thereby locking the lead wire with the locking tongue and forming a shape of approximately U. Since the lead wires are bent in a letter shape, the lead wires can be temporarily held in position when soldering to the printed wiring board, and lifting of the lead wires due to the pressure of molten solder during soldering dip can be prevented. Reliable soldering can be performed.

In fact, if printed wiring boards connected by lead wires are installed in separate locations in an electronics cabinet, one printed wiring board may be in a stable hanging state during the manufacturing process, causing the lead wires to solder. The attachment may come off,
As a countermeasure against troubles such as disconnection at the base, a printed wiring board 16 constituting an electronic circuit is conventionally used as shown in FIG.
The soldering of the lead wire 17 soldered on the upper part was done by fixing the lead wire holding fitting 18 to the base of the part with a screw 19, but in the present invention, the lead wire is attached using a long hole having a locking tongue. In order to temporarily hold the wire by bending it, it is possible to use the temporary holding part for fixing the lead wire.Therefore, there is no need to provide a special part for fixing the lead wire, and the lead wire can be fixed in an extremely narrow space. can be securely fixed,
The device can be made smaller, and there is no risk of the soldered part of the lead wire coming off or breaking during assembly.
Due to the elasticity of the lead wire itself, which is bent and held, it is possible to prevent abnormal noise from being generated due to contact between the lead wire and other parts due to vibrations of a speaker or the like.

[Brief explanation of drawings]

Fig. 1 is a schematic sectional view of an electronic device using a lead wire fixing device according to the present invention, Figs. 2 and 3 show an embodiment of the present invention, and Fig. 3 is a perspective view, FIG. 4 is a sectional view. FIG. 4 is a plan view of the lead wire fixing operation state, and FIG. 5 is a perspective view of the conventional lead wire fixing state. 7...Printed wiring board, 1o...Parallel lead wire, 12.13...Long hole, 14, 14'.
...Locking tongue piece. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 3 Figure 1n Figure 4

Claims (1)

[Claims] Electric circuits configured on each board part of a printed wiring board separated by a dividing line such as a perforation are connected using parallel lead wires or lead wires that integrate multiple single wires soldered to each board part. When soldering the lead wires on each of the above board parts, the lead wire locking tongue piece protrudes from the hole opening formed near the position, and the lead wires are inserted into a long hole having a width that allows the lead wires to be inserted in parallel. By inserting the lead wire and locking the lead wire with the locking tongue, the lead wire is bent into a substantially U-shape, and the soldering of the lead wire is temporarily held in position. A method for fixing lead wires to a printed wiring board, characterized in that, in this temporarily held state, the lead wires are soldered and fixed to each board part of the printed wiring board using a solder dip method.