JPS6251555A - Thin film defoliating device - Google Patents

Abstract

PURPOSE:To reduce man-hours in processing by putting a rotary brush in contact with the protection film surface on a printed circuit board transported on rollers to cause rise of a part, blowing a fluid between it and a photosensitive resin for the purpose of defoliation, and by exhausting with a belt conveyor. CONSTITUTION:Each printed circuit board fed by transport rollers 2 and control rollers 3 in the direction shown by arrow comes in contact with a rotary brush 4 provided at its periphery with a hard needle made of resin, steel, etc., and part of its protection film will rise. Fluid such as air, water, etc. is injected from a fluid blasting device 5 between the protection film and photosensitive resin layer, and the protection film is defoliated while the circuit board is transported by the control rollers 3. Along the surface of a guide member 6B the defoliated protection film is sent off by a movable belt conveyor 6C which can be approached to the guide member 6B by a fixed belt conveyor 6A and an air cylinder 6Cc, and exhausted by a pair of belts 6Db of the exhaust mechanism 6D.

Description

Detailed Description of the Invention (1) Purpose of the Invention [Field of Industrial Application] The present invention relates to a thin film peeling device,
In particular, the present invention relates to a technique that is effective when applied to a device for removing a protective film applied to protect the surface of a substrate.

[Prior Art] Printed wiring boards used in electronic devices such as computers have a predetermined pattern of wiring made of copper or the like formed on one or both sides of an insulating substrate.

This type of printed wiring board can be manufactured by the following manufacturing process. First, a laminate consisting of a photosensitive resin (photoresist) layer and a transparent resin film (protective film) for protecting it is laminated by thermocompression on a conductive layer provided on an insulating substrate.

Thereafter, a wiring pattern film is placed on top of the other, and the photosensitive resin layer is exposed to light for a predetermined period of time through this wiring pattern film and the translucent resin film. After peeling off the transparent resin film, the exposed photosensitive resin layer is developed to form an etching mask pattern. Thereafter, unnecessary portions of the conductive layer are removed by etching, and the remaining photosensitive resin layer is peeled off to form a printed wiring board having a predetermined wiring pattern.

[Problems to be Solved by the Invention] In the manufacturing process of the above-mentioned printed wiring board, a step of peeling off the light-transmitting resin film is required when developing the photosensitive resin layer after exposure.

Peeling of this light-transmitting resin film relies on manual labor by one person, and since the film is thin, this is to prevent damage or destruction due to uneven peeling stress.

Requires manual dexterity and great skill.

For this reason, the peeling time of the light-transmitting resin film increases, resulting in a problem that the working time in the printed wiring board manufacturing process becomes longer.

The above-mentioned and other problems and novel features to be solved by the present invention will become clear from the description of this specification and the accompanying drawings.

(2) Structure of the Invention [Means for Solving Problems] A brief overview of one typical invention disclosed in this application is as follows.

That is, one aspect of the present invention is a peeling bag for peeling off a thin film attached to a substrate! The method is characterized by comprising a thin film raising means for raising a part of the thin film attached to the substrate, and a fluid spraying means for spraying a fluid between the raised thin film and the substrate. That is.

[Function] With the above structure, the thin film of the present invention, which is partially raised, can be easily, reliably, and instantaneously peeled off from the substrate by spraying fluid, so that the working time for peeling off the thin film can be reduced. can be significantly shortened.

[Example] Hereinafter, an example of the present invention applied to a peeling device for a protective film of a printed wiring board will be described.

It should be noted that in all the examples, parts having the same functions are given the same reference numerals, and repeated explanations thereof will be omitted.

FIG. 1 shows a schematic cross-sectional view of a protective film peeling apparatus that is an embodiment of the present invention.

As shown in FIG. 1, the protective film peeling device is composed of a thin film lifting device I and a thin film peeling device (2).

As shown in FIGS. 1 and 2, the thin film lifting device I mainly includes a transport roller 2. which transports a printed wiring board l.
It is composed of a conveyance control roller 3 and a thin film raising member 4.

The printed wiring board 1 has a conductive layer IB made of copper or the like formed on both sides (or one side) of an insulating board IA. On the conductive layer 1B of this printed wiring board 1, there is a photosensitive resin yf! IIC and translucent (protective) resin film ID
The conveyance roller 2 and the conveyance control roller 3 are configured to convey the printed wiring board l in the direction of the arrow in the conveyance path shown by line A-A in FIG. There is.

When the tip of the printed wiring board 1 comes into contact with the thin film raising member 4, as shown in FIG.
It is configured to cause a portion of D. This thin film raising member 4 is provided with a brush made of a plurality of hard needles made of resin, steel, etc. on the outer periphery of a rotating body. The lengths of the hard needles of this brush are irregular. This is to ensure that a part of the translucent resin film ID can be pulled up even if there is some variation in the contact between the thin film lifting member 4 and the printed wiring board 1. Moreover, the thin film raising member 4 is as follows.

After raising a part of the translucent resin film ID, the second
As shown by arrow B in the figure, it may be configured to be separated from the conveyance path. This means that the brush of the thin film raising member 4
This is to prevent damage, tin, and destruction to the photosensitive resin MIC via the transparent resin film ID.

In this way, by providing the a-film force-generating member 4 with a simple structure in which a brush is provided on the rotary body, it is possible to easily remove a part of the translucent resin film ID, which has weaker adhesive strength than the photosensitive resin layer IC. can be triggered.

Further, a thin film raising member 4 is provided on the conveyance path of the printed wiring board 1.
By providing this, a part of the translucent resin film ID can be automatically raised.

In addition, the partially raised translucent resin film ID is
Although it is pressed by the conveyance roller 2 or the conveyance control roller 3 while being conveyed to the thin film peeling device (2), it is not connected to the photosensitive resin layer IC again because it is not pressed by applying heat.

As shown in the enlarged cross-sectional views of FIGS. 1 and 4, the thin film peeling device n mainly includes a conveyance roller 2°, a conveyance control roller 3. It is composed of a fluid spray device 5 and a thin film discharge device 6.

The fluid spraying device 5 is configured so that a pressurized fluid, for example, air, a gas such as an inert gas, or a liquid such as water, is sprayed from a nozzle 5A. This fluid spraying device 5 is
It is configured to directly spray the fluid between the raised transparent resin film ID and the photosensitive resin layer IC (board) of the printed wiring board 1 that has been transported to a predetermined position by the transport control roller 3. There is.

In this way, the partially raised translucent resin film I
By spraying fluid between D and the photosensitive resin layer IC using the fluid spraying device 5, the fluid is blown between the photosensitive resin layer IC and the translucent resin film ID, so that the translucent resin film The ID can be easily and instantly peeled off.

The thin film discharge device 6 includes a fixed belt conveyor 6A, a guide member 6B, a movable belt conveyor 6C, and a thin film discharge belt mechanism 6D.

The fixed belt conveyor 6A includes a pair of rollers 6Aa, 6A, as shown in the main part perspective views of FIGS. 1, 4, and 5.
A' is provided with a plurality of belts 6Ab, each of which is wound around a pair of rollers 6Aa and 6Aa'. This fixed belt conveyor 6A is a fluid spraying device I! The transparent resin film ID peeled off in step 5 is discharged.

The guide member 6B is provided in the casing of the thin film peeling device (2) on the side of the fixed belt conveyor 6A, and its guide surface is configured to be flush with the belt 6Ab. This guide member 6B is connected to the fluid spraying device i! The transparent resin film ID peeled off in step 5 is attached using indirect fluid pressure from the fluid spraying device 5 or static electricity generated when the film is peeled off.

The guide member 6B is a peeled transparent resin film ID
It is desirable that the angle θ1 or more is substantially perpendicular to the printed wiring board 1 so that the film can be sufficiently attached and retained. Furthermore, by configuring the guide member 6B at an angle of θ1 or more, it is possible to reduce the force applied to the transparent resin film ID and the photosensitive resin layer IC when the transparent resin film is peeled off. Therefore, damage and destruction of the transparent resin film ID and the photosensitive resin layer IC can be prevented.

As shown in FIGS. 1 and 4, the movable belt conveyor 6C includes a plurality of pairs of rollers 6Ca and 6Ca', and a belt 6Cb wound around each pair of rollers 6Ca and 6Ca'.
It consists of This movable belt conveyor 6C has one roller 6Ca'f and an air cylinder 6Cc in the center.
The belt 6Ab of the fixed belt conveyor 6A or the guide member 6B is configured to be movable in the vicinity of or in contact with the belt 6Ab of the fixed belt conveyor 6A. The movable belt conveyor 6C is configured to reliably hold the transparent resin film ID peeled off by the fluid spray bag r115 on the guide member 6B and discharge it.

In this way, the thin film ejection device i! 6 is configured with a fixed belt conveyor 6A, a guide member 6B, and a movable belt conveyor 6C, so that the transparent resin film ID peeled off with the fluid spray bag R115 is attached to the guide member 6B, and the fixed belt conveyor 6A and the movable belt While being held securely by the conveyor 6C, it can be automatically discharged in the discharge direction shown by the arrow out in FIG.

As shown in FIG. 1, the discharge belt mechanism 6D includes a plurality of rollers 6Da and a pair of belts 6Db. This discharge belt machine @6D is configured to discharge the transparent resin film ID on the upper surface side of the printed wiring board 1.

Note that the movable belt conveyor 6C may be configured to be moved by an electromagnetic solenoid or a hydraulic cylinder instead of the air cylinder 6Cc.

In this way, by providing the thin film lifting device (1) and the thin film peeling device (2) on the conveyance path of the printed wiring board 1, a part of the transparent resin film ID of the printed wiring board 1 is raised, and then the fluid Spraying device 5 sprays transparent resin film I.
D can be easily and instantaneously peeled off, and the peeled transparent resin film ID can be reliably discharged automatically, so that one working time can be significantly shortened.

After the light-transmitting resin film 1D is peeled off by the thin film peeling device n, the printed wiring board 1 is transported to a developing device that develops the photosensitive resin layer tC using a transport control roller 3 and a transport roller 2.

It should be noted that the present invention is not limited to the above-mentioned embodiments, and it goes without saying that various modifications can be made without departing from the spirit of the invention.

For example, in the present invention, the brush may be made of any material other than steel and resin as long as it has a hardness sufficient to cause the translucent resin film ID.

Moreover, the shape of the brush may be plate-like instead of needle-like.

In addition, in the above embodiment, a part of the translucent resin film ID was raised using the thin film elevating member 4 made of a brush, but in the present invention, a part of the translucent resin film ID is raised using a thin film elevating member made of an adhesive tape. Part of the film ID may be triggered.

Further, in the above embodiment, an example was described in which the present invention is applied to a peeling device for a thin film of a printed wiring board, but the present invention can be applied to a peeling device for a protective film covering a decorative board used as a construction material, for example. You may.

(3) Effects As explained above, according to the present invention, the peeling device for peeling off the thin film attached to the substrate is a thin film peeling device for peeling off a thin film attached to the substrate. and a fluid spraying means for spraying a fluid between the raised thin film and the substrate, the part of the thin film stuck to the substrate is raised and the fluid is applied to this part. Since the thin film can be easily and instantaneously peeled off from the substrate by spraying, the working time for peeling off the thin film can be significantly shortened.

In addition to the above means, by providing a thin film discharge means for discharging the thin film peeled off by the fluid spray means, the thin film peeled off by the fluid spray means can be automatically moved in a predetermined direction while reliably holding the thin film peeled off. Can be discharged.

[Brief explanation of drawings]

Fig. 1 is a schematic sectional view of a protective film peeling device according to an embodiment of the present invention, Fig. 2 is an enlarged sectional view of the thin film lifting device of Fig. 1, and Fig. 3 is a printed image of Fig. 2. An enlarged sectional view of a wiring board. 4 is an enlarged cross-sectional view of the thin film peeling device shown in FIG. 1, and FIG. 5 is a perspective view of essential parts of the fixed belt conveyor and guide member shown in FIG. 4. In the figure, ■... Thin film lifting device, ■... Thin film peeling device. 1...Printed wiring board, IA...Insulating board, I
B... Conductive layer, IC... Photosensitive resin layer, ID...
Transparent resin film (protection), 2...conveyance roller, 3
...Conveyance control roller, 4...Thin film raising member, 5...
・Fluid spray device, 6... Thin film discharge bag [, 6A... Fixed belt conveyor, 6B... Guide member, 6C...
Movable belt conveyor, 6D... discharge belt mechanism.

Claims (3)

[Claims] (1) A peeling device for peeling off a thin film stuck to a substrate, comprising a thin film pulling means for pulling up a part of the thin film stuck to the substrate, and a space between the pulled thin film and the substrate. and a fluid spraying means for spraying fluid. (2) The thin film peeling device according to claim 1, wherein the thin film pulling means is a means for pulling up the thin film with a brush. (3) A peeling device for peeling off a thin film stuck to a substrate, comprising a thin film pulling means for pulling up a part of the thin film stuck to the substrate, and a space between the pulled up thin film and the substrate. A thin film peeling device characterized in that a fluid spraying means for spraying a fluid and a thin film discharge means for discharging the thin film peeled off by the fluid spraying means are provided.