JPS62126076A - Thin film peeling device - Google Patents

Abstract

PURPOSE:To enable execution of automatic film peeling work and to shorten a working time, by a method wherein energy is exerted on an inner portion in a given distance from a thin film end part to float a part of the film end part. CONSTITUTION:A rotary arm 5A is rotated around a shaft 5B, and an adhesive member 4 is pressed against the end part of a permeable-to-light resin film 1D. The shaft 5B is supported to a support frame 5C, and the rotary arm 5A is rotated in the direction of an arrow mark (c) around the shaft 5B by means of gears 5D and 5E in a state in that the tip of the adhesive member 4 is forced into contact with the upper surface of the end part in a conveying direction of the permeable-to-light resin film 1D. Rightward moving motion of a gear 5F and a rack 5G pulls up the end part of the permeable-to-light resin film 1D, and guides the end part to the pull-in port of a thin film peeling discharging mechanism. The pulled up permeable-to-light resin film 1D is bitten through by rollers 6Aa and 6Ba. Thereafter, with the rotary arm 5A moved leftward, the adhesive member 4 is pulled off from the permeable-to-light resin film 1D.

Description

Detailed Description of the Invention (1) Purpose of the Invention [Field of Industrial Application] The present invention relates to a thin film peeling technique, and in particular:
The present invention relates to a technique that is effective when applied to a technique for peeling off a Y1 film attached to protect the surface of a substrate.

[Prior Art] Printed wiring boards used in electronic devices such as computers have a predetermined pattern of wiring made of copper or the like formed on one or both sides of an insulating substrate.

Twelve printed wiring boards of this type can be manufactured by the following manufacturing process. First, a conductor provided on an insulating substrate? A laminate consisting of a photosensitive resin (photoresist) layer and a transparent resin film (protective film) for protecting it is laminated on the tiWJ under heat and pressure.

Thereafter, a wiring pattern film is placed on top of the other, and the photosensitive resin layer is exposed for a predetermined period of time through this wiring pattern film and the translucent resin film. After peeling off the transparent resin film, the exposed photosensitive resin layer is developed to form an etching mask pattern. After this, the said guide? I! Unnecessary portions of the layer are removed by etching, and the remaining photosensitive resin layer is further removed to form a printed wiring board having a predetermined wiring pattern.

[Installation Points to be Solved by the Invention] In the manufacturing process of the above-mentioned printed wiring board, when the photosensitive resin layer is exposed and then developed, a step of peeling off the light-transmitting resin film is required. Peeling off this translucent resin film relies on one person's manual labor, and since the film is thin, it requires finger dexterity and great skill to prevent damage or destruction due to uneven peeling stress. .

For this reason, the peeling time of the light-transmitting resin film increases, resulting in a problem that the working time in the printed wiring board manufacturing process becomes longer.

Therefore, an automatic thin film peeling apparatus has been developed that automatically performs the thin film peeling process using a machine.

This automatic thin film peeling device uses a roller, black, needle, etc. to lift the edge of the thin film attached to the substrate, lifts up the lifted part and peels it off, and then automatically discharges the peeled thin film to the outside. It was designed to do so.

However, with conventional automatic thin film peeling equipment.

Since the edge of the thin film is often attached to the edge of the substrate with an uneven distance, a roller,
There has been a problem in that it is difficult to apply force with a knife, needle, etc. to make only a predetermined uniform width at the edge of the thin film.

Further, since the thin substrate is warped or curved, there is a problem in that it is difficult to align the means for floating the thin film on the substrate.

The above-mentioned and other problems and novel features to be solved by the present invention will become clear from the description of the present invention HA and the accompanying drawings.

(2) Structure of the Invention [Means for Solving Problems] Among the inventions disclosed in this application, a brief overview of typical inventions is as follows.

That is, it is a thin film peeling device that peels and discharges a thin film attached to a substrate, and includes a thin film edge detection means for detecting the edge of the thin film, and a predetermined distance inside from the detected thin film edge. The present invention is characterized in that it is provided with a thin film floating means that applies energy to lift a part of the end of the thin film. moreover.

The present invention is characterized in that a thin film straightening means is provided for applying pressure to the edge of the substrate with a pressing member to correct warping or bending of the edge. Furthermore, a stopper that stops the end portion of the substrate at a predetermined position.

The present invention is characterized by being provided with a thin film peeling conveying means for floating the thin film while applying pressure to the end of the substrate in the stopped position with a presser member, and conveying the floating thin film while peeling it. .

[Function] The present invention stops the edge of the substrate being conveyed at a predetermined position with a stopper, presses the edge of the substrate with a presser member and applies pressure to correct the warpage or bending of the edge, and The end of the thin film is detected by the thin film end detection means, and the thin film floating means applies energy to a portion up to a predetermined distance inside from the detected thin film end to float a part of the thin film end. The thin film is removed by a thin film peeling and conveying means while being peeled off from the exposed area.

The edge of the thin film on the substrate and the means for moving the edge can be reliably and easily aligned.

[Example] Hereinafter, an example in which the present invention is applied to a protective film removing apparatus for a printed wiring board will be described with reference to the drawings.

It should be noted that in all the examples, parts having the same functions are given the same reference numerals, and repeated explanations thereof will be omitted.

FIG. 1 is a side view showing a schematic configuration of a protective film removing apparatus for a printed wiring board according to an embodiment of the present invention.

Printed wiring mJ in the protective film peeling device of this example
! The plate transport mechanism is as shown in Figure 1.

It is mainly composed of a transport drive roller 2 that transports the printer 1 and the wiring board l. In the conveyance path in this conveyor groove, the upper mechanism 3. Adhesive member 4 attached to the movable part of the thin film lifting mechanism 5. A thin film peeling angle setting member 8 is provided.

As shown in FIGS. 2 and 6, the printed wiring board 1 has conductive FIBs made of copper or the like formed on both surfaces (or one surface) of an insulating substrate IA.

On the conductive layer IB of this printed wiring board 1, a photosensitive resin F! A laminate consisting of JIC and a transparent resin film (protective film) ID is laminated by thermocompression bonding. The photosensitive resin layer IC is in a state after being exposed to light in a predetermined pattern.

The conveyance drive roller 2 is configured to convey the printed wiring board l in the direction of the arrow in the conveyance path shown by line A-Δ in FIG.

As shown in FIG. 5, the thin film edge floating mechanism 3 includes a stopper 21 for stopping the substrate 1 at a predetermined position and a thin film edge floating device attached to a support frame 20 that is slidably attached to the main body of the apparatus. A plurality of 23 are provided.

As shown in FIGS. 2 and 3, the support frame 20 is provided with a thin film end flotation device support frame 22 having a guide rail 22A for slidably moving the thin film end flotation device 23 up and down. ing. The support frame 20 is moved up and down by, for example, an air cylinder 2OA. A thin film end floating device 23 is slidably attached to the thin film end floating device support frame 22 on a guide rail 22A via a support frame 23A. The thin film end floating device 23 is attached to the support frame 2
The air cylinder 24 moves it closer to or farther away from the substrate 1 via the wire 3A.

Further, the support frame 23A is provided with a suppressing member 23B that presses the substrate 1 stopped by the stopper 21 to correct bending or warping. Further, the support frame 23A includes a thin film end detection member support frame 23D that supports the thin film end detection member 23C and a thin film floating member 2.
A thin film floating member support frame 23F that supports 3E is slidably provided.

Further, the thin film floating member support frame 23F is slidably supported by the thin film end detection member supporting frame 23D, and a thin film floating member 23E is fixed at a predetermined angle to the tip thereof. A thin film floating member 23E is attached to the rear end of the thin film floating member support frame 23F.
A displacement adjustment screw 23G is provided through the frame 23H. In addition, the 1g membrane floating member support frame 23
A spring 23J is provided to always press F backward.

The tip 23C1 of the thin film end detection member 23C has a slightly bent claw-like shape, and is bifurcated to form a parenthesis-shaped space.

The thin film end detection member 23C is rotatably supported by a fixing pin 23DI on the thin film end detection member support frame 23D.

The thin film floating member 23E is movable using an electromagnetic vibrator, for example, as shown in FIG. A needle-like member 23E2 is provided on the piece 23E+, and when power is not supplied to the electromagnetic coil 23E3 of the electromagnetic vibrator, the needle-like member 23E2 is moved toward the rear by a spring 23E4, as shown in FIG. 3(A). When power is supplied from the power cord 23E5 to the electromagnetic coil 23E3, the movable piece 23E1 attracts or repels the needle-like member 23, as shown in FIG. 3(B).
By protruding E2, the needle-like member 23E2 is vibrated.

As shown in FIG. 4, the tip of the thin film end detection member 23C and the tip of the thin film floating member 23E are placed in a slightly retracted position by the suppressing member 23B when not in operation, and when in operation, respectively. It protrudes a little more than the suppressing member 23B.

Next, the operation of the thin film end floating earth structure @23 of this embodiment will be briefly explained.

In FIG. 2, when the support frame 20 is moved toward the substrate transport path by the air cylinder 2OA, the transported substrate l is stopped at the stopper 21. As shown in FIG. next,
The support frame 23A is moved toward the substrate transport path by the air cylinder 24, and pressure is applied by pressing the edge of the substrate l. As a result, the warpage and bending of the substrate l is corrected, and in this state, the thin film end detection member support frame 23D is moved to the right by the air cylinder 23K, and the thin film end detection member 23C is removed from the photosensitive resin layer IC or the light-transmitting material. Resin film 10
contact with. In this state, the thin film floating 1+4 support frame 23F is moved to the right by the air cylinder 23L,
The needle-like member 23E2 of the thin film floating member 23E is driven.

This causes vibration (energy) to the translucent resin film ID.
is added, and the photosensitive vI4 fat floats up and separates from yaIC.

As shown in FIG. 1, the adhesive member 4 has a thin film
It is attached to the rotating arm 5A of J5. The rotating arm 5A is configured to rotate around a shaft 5B, and is configured to press the adhesive member 4 against the end of the transparent resin film ID. The shaft 5B is supported by a support frame 5C, and with the tip of the adhesive member 4 in contact with the upper surface of the end of the translucent resin film ID in the transport direction, the rotating arm 5A is moved around the shaft 5B. As shown in FIG. 1, it is configured to rotate in the direction of arrow C using gears 5D and 5E at the center. Then, by moving the gear 5F and the rack 5G in the right direction, the end of the translucent resin film ID is pulled up and brought to the inlet of the thin film peeling discharge@structure 6, as shown in FIG. It looks like this. Then, the raised translucent resin film ID is bitten by the rollers 6Aa and 6Ba. Then, move the rotating arm 5Δ to the left in the figure.

Separate the adhesive member 4 from the transparent resin film ID.

At this time, in order to reliably separate the adhesive member 4 and the transparent resin film ID, as shown in FIG. 6.

Thin film end holding mechanism 7 (shown with broken lines) such as an air cylinder
may also be used.

The thin film peeling angle setting member 8 is provided in the casing of the thin film peeling apparatus so as to align with one end of the belt conveyor 6A of the thin film peeling and discharging mechanism 6, as shown in FIGS. 6 to 8. .

This thin film peeling angle setting member 8 is a transparent resin film I.
Preventing the peeling position from changing when peeling D.

In order to prevent unbalanced peeling stress and prevent damage or destruction of the transparent resin film ID and photosensitive resin layer IC, the transparent resin is applied to the printed wiring board 1. The structure is such that the peeling angle of the translucent resin film ID is set so that the peeling angle 0 of the film ID is approximately from a right angle to an obtuse angle. The tip of the thin film peeling angle setting member 8 is provided so that it can be brought closer to or separated from the printed wiring method board 1.

Further, the tip of the thin film peeling angle setting member 8 has a cross section shaped like an arc with a small radius of curvature. For example, one radius of curvature is 3 nun or less.

By providing the thin film peeling angle setting member 8 in this way, the peeling position is stabilized and the translucent resin film I
Uniform peeling stress can be applied to D and the photosensitive resin layer IC.

The thin film peeling and discharging mechanism 6 is composed of a belt conveyor 6A and a belt conveyor 6B.

As shown in FIGS. 1 and 6, the belt conveyor 6A includes a plurality of pairs of rollers 6Aa and 6Aa', and a belt 6A wound around the pair of rollers 5Aa and 6Aa'.
It is composed of b. Similarly, Bell L-Conveyor 6
B is a pair of rollers 6B a.

A plurality of belts 6Ba' are provided and the belt 6Bb is wound around the belts 6Ba'.
It consists of

Note that this belt conveyor 6B has one roller 6Ba.
The end of the translucent resin film ID is rotated by an air cylinder or the like around ', and brought into contact with the belt 6Ab of the belt conveyor 6A, and brought to the inlet of the thin film end floating mechanism 6. It may also be possible to securely hold (discharge) the part so as to deal with troubles such as mistakes in discharging the thin film.

The belt conveyor 6A and the belt conveyor 6B sandwich the transparent resin film ID that has been peeled off by the thin film pulling machine yI5 and guided by the thin film peeling angle setting member 8, and each pair of rollers 6Aa, 6Aa' By driving a pair of rollers 6Ba and 6Ba', the transparent resin film ID is sequentially peeled off and discharged.

The belt conveyors 6A and 6B are provided in contact with or close to each other with a slight shift in the conveyance direction, and the roller 6A
The peeled transparent resin film ID is discharged from the a′ side.

When the translucent plastic film ID is peeled off by the thin film peeling device, the printed wiring board 1 is removed by the transport drive roller 2.
The photosensitive resin layer IC is transported to a developing device for developing the photosensitive resin layer IC.

Although the present invention has been specifically described above based on examples, the present invention is not limited to the above-mentioned examples, and it goes without saying that various modifications can be made without departing from the spirit of the invention.

For example, in the embodiment described above, the translucent resin film ID is sequentially peeled off and discharged by driving the thin film end floating mechanism 3d' and the pair of rollers 6Ba and 6Ba'.

The belt conveyors 6A and 6B are provided in contact with or close to each other with a slight deviation in the feeding direction, and the roller 6A
The peeled transparent resin film ID is discharged from the a′ side.

After the transparent resin film ID is peeled off by the protective film peeling device, the printed wiring board 1 is transported by an Ia feeding drive roller 2 to a developing device that develops the photosensitive resin layer IC.

Although the present invention has been specifically explained above based on the embodiments, the present invention is not limited to the embodiments described above (it goes without saying that various modifications can be made without departing from the spirit of the invention).

For example, in the embodiment described above, the thin film end floating mechanism 3 was arranged before the thin film peeling angle setting member 8, but the thin film lifting mechanism 5
and the thin film peeling angle setting member 8.

Further, in the above embodiment, the present invention was applied to a device for removing a thin film of a printed wiring board, but the present invention is also applicable to a device for removing a protective film covering a decorative board used as a construction material, for example. May be applied.

Moreover, a suppressing member, a brush, etc. may be used as a means for lifting the end portion of the translucent resin film ID.

Moreover, instead of the adhesive member 4, a translucent resin film I
You may also spray fluid onto the floating portion of D to raise it.

(3) Effects As explained above, according to the present invention, the following effects can be obtained.

(Δ), the edge of the thin film pasted on the substrate was detected, and energy was applied to the area within a predetermined distance from the edge of the thin film to lift a part of the edge of the thin film. By applying energy to a predetermined distance inside from the edge of the thin film, a part of the edge of the thin film can be lifted, so the wiring pattern on the board is not biased and the thin film can be lifted. It can be peeled off.

(B) The edge of the thin film on the substrate is pressed and pressure is applied to the edge of the thin substrate to correct the warping or bending of the edge, so that the edge of the thin film on the substrate and its edge are aligned. Positioning with the means can be performed accurately and easily.

(C) In addition to the above (B), by providing a stopper that stops the edge of the substrate at a predetermined position, the position of the substrate can be set accurately. The positioning with the means for lifting the part can be performed accurately and easily.

(D) In addition to the above (C), by providing a means for lifting the edge of the thin film on the substrate, the alignment between the edge of the thin film on the substrate and the means for lifting the edge is improved. Since the end portion of the a-film can be raised by setting accurately, damage to the wiring pattern in the photosensitive resin layer can be prevented.

(E) In addition to the above (D), by providing a means for discharging while peeling off the floating portion of the end of the thin film, the thin film peeling work can be performed automatically, so the work time can be reduced. can be significantly shortened.

[Brief explanation of drawings]

FIG. 1 is a side view showing a schematic configuration of a protective film stripping device for a printed wiring board according to an embodiment of the present invention. FIG. 2 is a side view showing the appearance of a thin film end floating mechanism according to the present embodiment. , FIG. 3 is a side view of the thin film floating member of FIG. 2, and FIG. 4 is a side view of the thin film floating member of FIG.
FIG. 2 is a plan view showing the arrangement positions of the tip of the holding member, the tip of the thin film edge detection member, and the tip of the thin film floating member; FIG. 5 is a stopper and thin film edge detection mechanism of one embodiment. FIG. 6 is a cross-sectional view showing a schematic configuration of the thin film peeling and carrying-out mechanism shown in FIG. 1, and FIGS. 7 and 8 are cross-sectional views showing a schematic structure of the thin film peeling and carrying-out mechanism and thin film peeling angle setting member shown in FIG. It is a diagram. In the figure, 1... Printed wiring board, 2... Conveyance drive roller, 3... Thin film end floating mechanism, 4... Adhesive member, 5... Thin film lifting mechanism, 5A... times Moving arm, 6...
Thin film peeling and discharging mechanism, 7... Thin film end holding mechanism, 8...
・Thin film peeling angle setting member, 21...stopper, 23・
... Thin film end floating device, 23C... Thin film end detection member, 23E... Thin film thickness upper member.

Claims (6)

[Claims] (1) A thin film peeling device that peels off and discharges a thin film stuck to a substrate, which includes a thin film edge detection means for detecting the edge of the thin film, and a predetermined area inside from the detected thin film edge. A thin film peeling device characterized by being provided with a thin film floating means that applies energy to a portion up to a distance to float a part of the end of the thin film. (2) The thin film peeling apparatus according to claim 1, wherein the energy is a force such as pressure. (3) The thin film peeling apparatus according to claim 1, wherein the energy is vibration. (4) A thin film peeling device for peeling off and discharging a thin film pasted on a substrate, comprising substrate straightening means for applying pressure to the edge of the substrate with a pressing member to correct warping or bending of the edge. , thin film edge detection means for detecting the edge of the thin film while holding the edge of the substrate with the substrate straightening means; A thin film peeling device characterized by being provided with a thin film floating means for floating a part of the part. (5) A thin film peeling device that peels off and discharges a thin film stuck to a substrate, which includes a stopper that stops the edge of the substrate at a predetermined position, and a presser member that applies pressure to the edge of the substrate at the stop position. thin film straightening means for correcting warps and bends at the edges of the substrate; thin film edge detection means for detecting the edges of the thin film while holding the edges of the substrate; and the detected thin film edges. 1. A thin film peeling device characterized by being provided with a thin film floating means for floating a part of the end of the thin film by applying vibration to a part of the inner side up to a predetermined distance. (6) A thin film peeling device that peels off and discharges a thin film attached to a substrate, the thin film edge detection means detecting the edge of the thin film, and a predetermined area inside from the detected thin film edge. a thin film floating means that lifts a part of the edge of the thin film by applying vibration to a portion up to the distance, a stopper that stops the edge of the substrate at a predetermined position, and a presser member that applies pressure to the edge of the substrate at the stopping position. A thin film peeling apparatus further comprising a thin film straightening means for correcting warps and bends at the ends thereof, and a thin film peeling and conveying means for conveying the floated thin film while peeling it.