JPS62293246A - Method and apparatus for peeling cover film - Google Patents

Abstract

PURPOSE:To surely remove a cover film without generating mispeeling by abutting oscillation bodies upon the tip part of a substrate to float the cover film from a resist layer and injecting air into its interface to peel the cover film. CONSTITUTION:When a substrate 1 on which photosensitive dry film resist (DFR) is laminated is carried by a converyer 2 and stopped on a fixed position, air cylinders 3, 3' are driven to bring them into contact with the oscillation bodies 4, 4' fitted to the tip of a piston with the tip part of the substrate, the cover film is floated from the resist layer by the fine vibration of the oscillation bodies 4, 4' and air is entered into the interface to peel the cover film. When the substrate 1 is carried to the succeeding peeling process, the cover films (f, f) are stuck by adhering rollers 7, 7', air cylinders 6, 6' are driven and the substrate is restored to the original position. After checking the sufficient peeling of the cover film by sensors 8, 8' electromagnetic valves 9, 9' are opened and peeling air is brown out from slits or nozzles 11, 11'. Thus, the cover films (f, f) are peeled from the substrate 1 in accordance with the carrying procedure of the substrate.

Description

Detailed Description of the Invention 3. Detailed Description of the Invention [Field of Industrial Application] The present invention provides a method for peeling off a cover film of a photosensitive dry film resist (hereinafter sometimes abbreviated as DFR) in a printed circuit board manufacturing process. and its apparatus.

[Conventional technology]

Conventionally, this type of cover film has been peeled off manually or by adhesive peeling using a peeling adhesive tape provided under -L of the substrate transport path. but,
When peeling with adhesive tape, as a means to ensure peeling, as shown in Figures 4 to 6, as a pretreatment for peeling, the DFH laminated to the substrate is cut or otherwise damaged, and the cover film and resist layer are separated. There was a way to make it easier to peel off by letting air in between. The above-mentioned method of making the cuts is a method of making scratches on both sides of the substrate A using a rotary blade 30.30' having small irregularities 31 formed on the surface (see Fig. 4), and a method of making scratches on both sides of the substrate A with a rotary blade 32.32'. A method of making cuts 33 over the entire widthwise surface of both sides of the substrate A (see FIG. 5), and a method of pressing both sides of the substrate A with needle-shaped bodies 34, 34' are the method of making minute holes 35, 35. How to form...
(see Figure 6) was carried out.

[Problem that the invention seeks to solve]

As mentioned above, in the conventional DFR cover film peeling method, the method shown in FIGS.
The method shown in the figure was used, but this method ends up scratching the copper surface of the board, and if you have to redo it after passing through the peeling part due to development problems etc., the copper surface will be damaged. (Boards with an X are completely unusable, and
Due to a problem with the board position control sensor that stops the board at the specified position when the board is being transported, the board is not accurately stopped at the specified position, so the scratches caused by tools such as knives mentioned above are located within the pattern. In some cases, a completely unusable substrate may be obtained.

The object of the present invention is to eliminate the above-mentioned scratches and to remove the cover film reliably without peeling errors.

[Means for solving problems]

In order to achieve the above-mentioned object, the present invention provides a method in which a copper-clad laminate on which a photosensitive dry film resist is laminated is stopped at a predetermined position on a conveyance path, and then the copper-clad laminate is moved along the conveyance path. The air cylinder is equipped with a vibrating body at the tip of a rod that is installed symmetrically above and below the air cylinder. The apparatus for carrying out this method also has a means for stopping the copper-clad laminate on which the photosensitive dry film resist is laminated at a predetermined position on the conveyance path, and the apparatus is symmetrical above and below the stopping position. The present invention is characterized in that an air cylinder having a vibrating body attached to the tip of the rod is provided, and the vibrating body is configured to press against the tip of the stopped board.

[Effect]

The present invention involves stopping a copper-clad laminate on which a photosensitive dry film resist is laminated at a predetermined position on a conveyance path,
Next, when the vibrating body of an air cylinder, which has a vibrating body attached to the tip of a rod provided symmetrically above and below the conveyance path of the copper-clad laminate, comes into contact with the tip of the board that is stopped and vibrates. , the cover film floats away from the resist layer and air enters the interface, ensuring reliable peeling.

〔Example〕

The present invention will be described based on embodiments shown in the drawings. First, an apparatus for carrying out the method of the present invention will be described.

In the figure, 1 is a printed wiring board (hereinafter simply referred to as a board) laminated from the DFR, and conveyor 2
etc., and is stopped at a predetermined position by a fixed position control sensor (not shown). 3° 3' are air cylinders provided symmetrically above and below the stop position of the substrate 1 transport path, and vibrating bodies 4, 4' are attached to the piston rod tips of the air cylinders 3, 3', respectively. has been done.

Reference numeral 5 denotes a substrate detection sensor which detects that the substrate 1 conveyed from the previous process by the conveyor 2 or the like has reached a predetermined position, and stops the conhair 2 at the predetermined position.

Air cylinders 6.6' are provided symmetrically below the transport path of the substrate 1, and adhesive rollers 7.
7' is attached, and the air cylinder 6.6' is activated at the same time when the substrate detection sensor 5 detects the substrate 1, and the air cylinder 6.6' is activated to stop the adhesive roller 7.7' attached to the tip of the piston at the fixed position. It is crimped onto the tip of the substrate 1. By this pressure bonding, the cover films f, f of the DFR at the leading end of the substrate 1 are adhered to the adhesive roller 7.7', and after the adhesion, the air cylinder 6.6' is operated to return them to their original positions.

8.8' are sensors installed above and below the conveyance path of the substrate 1 in order to check whether the cover films f, f are completely peeled off;
The solenoid valves 10 and 10' provided above and below the conveyance path are pressure regulating valves that adjust the pressure of compressed air for peeling off the cover film, which is supplied to each of the solenoid valves 9 and 9'. 11° and 11' are the nozzles for blowing out the compressed air.

The direction of the cover fill J and the peeling compressed air blown out by the nozzles 11 and 11' is opposite to the conveyance direction of the substrate 1, and a pair of nip rollers 12 are provided to sandwich the substrate 1. 12' and the cover film f to be peeled off.

It is configured so that it is sprayed between f and the substrate 1.

Reference numeral 13.13' denotes a catch pan 13, which houses the peeled-off cover film and is installed behind the upper part of the nip roller 12.12'.
．． 13' has a suction duct 14.14', 15°1
5' are in communication, and the suction ducts H5 and 15' are also in communication with a suction blower 16 with a cutting blade. In the figure, 17 is a film cage, la is a substrate from which the cover film has been peeled off,
b indicates a photosensitive composition.

Since this embodiment is configured as described above, when the substrate 1 on which the DFR is laminated is transported by the conhair 2, detected by the fixed position control sensor, and stopped at a fixed position, the air cylinders 3 and 3' are activated. When the vibrating bodies 4, 4' attached to the tips of the pistons of the air cylinders 3, 3' are slightly pressed against the tips of the substrate 1, the vibrating bodies 4, 4'
Under the influence of the minute vibrations 4', the cover film floats from the resist layer and air enters the interface, causing the cover film to be peeled off not only in the width direction but also over the entire width. The time period for which the vibrating bodies 4, 4' are brought into contact with the tip of the substrate, the amplitude and the frequency of the vibrating bodies can be set arbitrarily, and after the vibrating bodies are brought into contact for a certain period of time, the air cylinder is turned on again. It operates to separate the vibrating body 4° 4' from the substrate 1.

At the same time as the vibrating body 4.4' separates from the substrate 1, the conveyor conhair 2 starts conveying again and is conveyed to the next peeling process, but when the substrate detection sensor 5 detects that the substrate 1 has reached a predetermined position. Conhair 2 is stopped and substrate 1 is stopped at a fixed position. When the substrate detection sensor 3 detects that the substrate 1 has reached a predetermined position, the air cylinder 6.6' is activated to stop the adhesive roller 7.7' attached to the tip of the piston at the predetermined position. The front end of the substrate 1 is pressed onto the cover films f, f which have been peeled off in the previous step, and the cover films f, f are adhered by the adhesive rollers 7 and 7', and then the air cylinder 6 .6
’ to return to the original position.

As mentioned above, the adhesive roller 7.7' adheres the cover films f, f whose tips were peeled off in the previous process, and returns to the original position by the operation of the air cylinder 6.6'. The sensor 8.8' confirms whether the cover films f and f to be removed have been sufficiently peeled off.

Cover film f by adhesive roller 7.7'.

f13<Sensor 6 indicates that the substrate has been sufficiently peeled off from the surface.
After confirming the detection at ゜6', open the solenoid valves 7 and 7' and direct the air for removing the cover film through the slit or nozzle 11゜11'.
More outburst. The cover films f, f peeled off by the adhesive roller 7.7' are each guided outward when the adhesive roller 7.7' returns to its original position by the operation of the air cylinder 6.6'; Films f and f are substrate 1
A pair of upper and lower roller rollers 1 are provided to sandwich the
2.12', and as the adhesive roller 7°7' returns to its original position, the cover film f.

At f, the adhesive is peeled off from the adhesive roller 7.7', leaving the end free. At this time, as described above, the air for removing the cover film is supplied to the pressure regulating valve 10.10', tl 61.
The spray is sprayed from nozzle ILII' via five valves 9, 9' onto the free cover films f, f.

After confirming that the adhesive rollers 7, 7' have returned to their original positions by the operation of the air cylinders 6.degree. 6', the conveyor belt 2 is operated to start conveying the substrate 1. Since the air for cover film peeling is sandwiched between the cover films f, f to be peeled off and the substrate 1 in the direction opposite to the transport direction of the substrate 1, and the nozzles 11 and 11',
As the substrate 1 is transported, the cover films f, f to be peeled off are peeled off from the substrate 1 by air blown out from a nozzle or the like.

When the cover films f and f are completely peeled off from the substrate 1, they are blown backward by the air blown from the nozzle 11.11' and enter the film catch pan 13.13'.
The peeled film is conveyed into the film catch pan 13.13' through a suction duct) 12.12'.

13. The suction blower 16 with a cutting blade is transported by suction at 13'.
leading to. The suction blower 16 with a cutting blade cuts the peeled cover film into pieces to facilitate subsequent transport processing, and transports the cut film to the film cage 17.

On the other hand, the substrate 1' from which the cover film has been removed is transferred to the next developing step by a conveyor. At the same time as the sensor 5 detects the rear end of the substrate 1', the solenoid valves 9, 9' are closed.

By repeating the above operations, the cover film on the board can be removed manually, and the copper plate will not be scratched as a pre-treatment for removing the cover film on the board, which is the case in the past, and there will be no mistakes in removing the cover film. This enables reliable removal of the cover film.

Note that the same effect can be obtained even if an air cylinder having the above-mentioned vibrating body attached to the tip of the piston rod is provided at the tip of the peeling section.

〔Effect of the invention〕

In the present invention, a vibrating body is brought into contact with the tip of a substrate in which DFR is laminated on a copper-clad laminate, and the cover film is lifted from the resist layer and air is introduced into the interface to cause the film to peel off. Since there is no damage to the copper-clad laminate due to the process, even if there is a mistake in the DFR development process, it can be redone, and there is no possibility of damage to the pattern area due to trouble with the board's position control sensor. This has the effect of significantly reducing the possibility that the board becomes unusable.

[Brief explanation of drawings]

The drawings show embodiments of the present invention; FIG. 1 is a cross-sectional explanatory diagram of the device, FIG. 2 is a cross-sectional view of a substrate laminated with DFR, and FIG. 3 is a cross-sectional view of the substrate after peeling off the cover film. Figure 4 (() (o), Figure 5 (G (Il+)) and Figure 6 (() (I+) are explanatory diagrams of conventional peeling pretreatment, respectively, and (A) in each figure is a cross-sectional view. , (rl)
shows a top view of the damaged substrate. 1: Substrate 3, 3', 6. 6': Work 7 cylinder 4.4': Vibrating body 7.7': Adhesive roller 9.9': Solenoid valve
11.11': Nozzle 12, 12': Cover film pressing roller f, f: Cover film

Claims (2)

[Claims] (1) The copper-clad laminate on which the photosensitive dry film resist is laminated is stopped at a predetermined position on the conveyance path, and then a vibrating body is placed at the tip of a rod that is symmetrically provided above and below the conveyance path of the copper-clad laminate. A method for peeling off a cover film, characterized in that the vibrating body of the attached air cylinder is brought into contact with the tip of the stationary substrate to apply vibration to peel the cover film from the resist. (2) An air cylinder having a means for stopping the copper-clad laminate on which the photosensitive dry film resist is laminated at a predetermined position on the conveyance path, and having a vibrating body attached to the tip of the rod symmetrically above and below the stopping position. A cover film peeling device characterized in that the vibrating body is configured to abut the tip of the stopped substrate.